CN107765163A - A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array - Google Patents
A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array Download PDFInfo
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- CN107765163A CN107765163A CN201710800700.2A CN201710800700A CN107765163A CN 107765163 A CN107765163 A CN 107765163A CN 201710800700 A CN201710800700 A CN 201710800700A CN 107765163 A CN107765163 A CN 107765163A
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- fiber
- temperature sensor
- optical grating
- circuit board
- grating temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K11/00—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00
- G01K11/32—Measuring temperature based upon physical or chemical changes not covered by groups G01K3/00, G01K5/00, G01K7/00 or G01K9/00 using changes in transmittance, scattering or luminescence in optical fibres
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The present invention relates to a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array, including fiber-optical grating temperature sensor array, fiber Bragg grating (FBG) demodulator, host computer, by determining test point, visual analysis, select fiber-optical grating temperature sensor, laying optical fiber grating temperature sensor, build optical fiber grating regulating system, temperature survey is carried out to component to be measured, carry out temperature comparisons and carry out fault location, remove sensor and chip is carried out to clear up several steps completion fault locating analysis, the present invention can carry out temperature detection to microsize component, reduce limitation of the device size to fault location precision, some unconspicuous components of heating can accurately be detected, improve the success rate of fault diagnosis.
Description
Technical field
The present invention relates to aircraft electrical plate field of fault detection, specifically one kind is based on fiber-optical grating temperature sensor
The Fault Diagnosis of Circuit Board method of array.
Background technology
Circuit board is the chief component of electronic product on machine, and the quality of circuit board performance directly affects electronics on machine
The quality of product.Nowadays, as microelectric technique enters the super large-scale integration epoch, the circuit in military secret is also increasingly
Complexity, multilayer board, the extensive use of surface mount, large scale integrated circuit so that the fault diagnosis of circuit board also becomes
It is increasingly difficult.According to Joule's law, electric current is dissipated circuit by that can produce heat at work, by the temperature for contrasting component
The position of fault element is can determine, people begin attempt to the Temperature Distribution by detecting its each component when circuit board works
The working condition of each component is judged with temperature change, so as to carry out fault location to circuit board.Presently the most common base
It is that to circuit board progress fault location, (patent discloses using thermal infrared imager in the Fault Diagnosis of Circuit Board method of component heating
Number CN103399248A), but the temperature resolution of thermal infrared imager and precision be not high, is only capable of the temperature progress to larger area
Rough measure, therefore temperature detection can not be carried out to the less component of some temperature changes at all, meanwhile, also can not be to some
Mini component enters the accurate detection of trip temperature, in addition, by carrying out voltage detecting to key point to carry out accident analysis
Method is only applicable to the circuit of known principle figure or circuit simple in construction is analyzed, to large scale integrated circuit plate and principle
Scheme unknown circuit board and carry out inefficient during accident analysis, do not possess reproducibility.
The content of the invention
The technical problems to be solved by the invention are that the fault detection method of circuit board in the prior art can not be to temperature
Change small element or the small element of volume carries out fault detect, it is impossible to which the large scale integrated circuit of unknown schematic diagram is carried out
Effective fault detect, propose a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array.
The technical problems to be solved by the invention are realized using following technical scheme：
A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array, search board failure point
Step includes：
S1 test point) is determined：By being analyzed circuit board or using other detection methods, being determined on failure plate
Doubtful failure component.If certain a part of component failure can not be navigated to, all components on plate can be examined
Survey；
S2) visual analysis：Observe whether component surface to be measured has three proofings coating.If there is coating on surface, need to use blow sand
The blanket cleaning devices such as machine are carried out to component surface except three proofings is handled, it is ensured that component surface cleaning to be measured；
S3 fiber-optical grating temperature sensor) is selected：The optical fiber of appropriate length is chosen according to the size of component to be measured
Grating temperature sensor, also fiber grating can be customized according to the distributing position of component, all fiber gratings are write into same light
On fibre, temperature information is transmitted by Transmission Fibers；
S4) laying optical fiber grating temperature sensor：After selecting suitable fiber-optical grating temperature sensor, first by each sensor
The element under test coding of the normal panel of faulty board and contrast is placed on, and sensor is brought into close contact as far as possible with component surface,
Try one's best thin in chip surface again and equably apply one layer of adhesive, adhesive is covered fiber grating, make sensor and chip list
Face secure rigid fitting；
S5 optical fiber grating regulating system) is built：Each fiber-optical grating temperature sensor is utilized into Transmission Fibers and fiber grating
(FBG) demodulator is connected, and fiber Bragg grating (FBG) demodulator can launch light wave and the reflection wavelength of fiber-optic grating sensor can be demodulated, and leads to
Cross network interface (FBG) demodulator is connected with host computer, at the wavelength signals for exporting (FBG) demodulator using the inspection software in host computer
Reason, real-time display and the changing rule for the temperature and time that each sensor measures can be preserved；
S6 temperature survey) is carried out to component to be measured：Two circuit boards point of fiber-optical grating temperature sensor will be laid
Test is not powered up, monitors the temperature change of the component to be measured on each plate respectively, and by the temperature of each component at any time
Between changing rule preserved on host computer；
S7 temperature comparisons) are carried out and carry out fault location：By the normal panel to record and faulty board in same position
Device temperature situation of change is contrasted, if corresponding to normal panel and a certain same position of faulty board device temperature change exist it is bright
Significant difference is different, then can determine whether the component failure on faulty board, determines so as to which the angle completed from component carries out failure to faulty board
Position；
S8) remove sensor and chip is cleared up：After the completion of test, organic solvent can be used to wipe sensor surface
Adhesive, adhesive is removed sensor after melting and is properly preserved, in case next time uses, while by the glue of each chip surface
Stick is removed clean.
The beneficial effects of the invention are as follows：The fiber-optical grating temperature sensor of the present invention can be carried out to microsize component
Temperature detection, reduce limitation of the device size to fault location precision；Fiber-optical grating temperature sensor have temperature measurement accuracy it is high,
The advantages that high resolution, some unconspicuous components of heating can accurately be detected, improve the success of fault diagnosis
Rate.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the hardware structure diagram of the present invention；
Fig. 2 is the step flow chart of the present invention；
Embodiment
In order that the technical means, the inventive features, the objects and the advantages of the present invention are easy to understand, below it is right
The present invention is expanded on further.
Hardware structure diagram as shown in Figure 1：
Its hardware configuration includes fiber-optical grating temperature sensor array, fiber Bragg grating (FBG) demodulator and host computer.
Fiber-optical grating temperature sensor belongs to one kind of fibre optical sensor, and the sensing process based on fiber grating is by outer
Modulation of boundary's physical parameter to bragg wavelength obtains heat transfer agent, is a kind of wavelength modulation fiber sensor, its feature
It is small volume (0.125mm*3mm), temperature resolution is high (up to 0.1 DEG C), and precision is high (up to 0.5 DEG C), and geometry is plastic,
It is not easy, by electromagnetic interference, good insulation preformance, to be particularly suitable for applications in the accurate temperature measurement of circuit board component, can be to plate
On microsize (0.125mm*3mm) device carry out more accurate temperature survey, multiple fiber-optic grating sensors are formed
Fiber Bragg Grating Sensor Array be attached to circuit-under-test plate surface, and connect fiber Bragg grating (FBG) demodulator, fiber Bragg grating (FBG) demodulator
Light wave can be launched and the reflection wavelength to each fiber-optical grating temperature sensor is demodulated, so as to show that whole circuit board covers
The temperature distribution information in region, (FBG) demodulator is connected with host computer by network interface, using the inspection software of host computer to (FBG) demodulator
The wavelength signals of output are handled, and real-time display and can preserve the changing rule of the temperature and time that each sensor measures.
Step flow chart as shown in Figure 2：
The accident analysis of one piece of circuit board is completed, it is necessary to prepare one piece of normal intact circuit board, is aligned in the same area
Normal plate and faulty board covering fiber-optical grating temperature sensor array, Temperature Distribution is read under two pieces of circuit board working conditions simultaneously
Information, because fault element is generally placed upon short circuit or open circuit, corresponding temperature shows as temperature anomaly height or temperature anomaly is low, carries out
Comparative analysis Temperature Distribution, trouble point can be accurately positioned.One complete failure detection steps includes：
S1 test point) is determined：By being analyzed circuit board or using other detection methods, such as infrared radiation thermometer and
Key point voltage detection method, the doubtful failure component on failure plate is primarily determined that, if certain a part of first device can not be navigated to
Part failure, all components on plate can be detected；
S2) visual analysis：Observe whether component surface to be measured has three proofings coating, because coating typically insulate, and have one
Fixed insulation effect, the temperature transmission of element surface is influenceed, make in test process that temperature performance is unstable, and measurement is inaccurate, if
There is coating on surface, the blanket cleaning devices such as sand blowing machine need to be used to be carried out to component surface except three proofings is handled, it is ensured that first device to be measured
Part surface cleaning, it is ensured that elements heat is directly conducted to fiber-optical grating temperature sensor；
S3 fiber-optical grating temperature sensor) is selected：The optical fiber of appropriate length is chosen according to the size of component to be measured
Grating temperature sensor, also fiber grating can be customized according to the distributing position of component, all fiber gratings are write into same light
On fibre, temperature information is transmitted by Transmission Fibers, the minimum volume of fiber-optical grating temperature sensor is in 0.125mm*3mm, therefore
The Minimum Area resolution ratio that can be measured is in 0.125mm*3mm, that is, can measure minimum area in the micro- of 0.125mm*3mm
Small element fault, which greatly enhances the accuracy of the localization of faults；
S4) laying optical fiber grating temperature sensor：After selecting suitable fiber-optical grating temperature sensor, first by each sensor
The element under test coding of the normal panel of faulty board and contrast is placed on, and sensor is brought into close contact as far as possible with component surface,
Try one's best thin in chip surface again and equably apply one layer of adhesive (such as 502 glue), adhesive is covered fiber grating, make sensing
Device is bonded with chip surface secure rigid；
S5 optical fiber grating regulating system) is built：Each fiber-optical grating temperature sensor is utilized into Transmission Fibers and fiber grating
(FBG) demodulator is connected, and fiber Bragg grating (FBG) demodulator can launch light wave and the reflection wavelength of fiber-optic grating sensor can be demodulated, and leads to
Cross network interface (FBG) demodulator is connected with host computer, at the wavelength signals for exporting (FBG) demodulator using the inspection software in host computer
Reason, real-time display and the changing rule for the temperature and time that each sensor measures can be preserved；
S6 temperature survey) is carried out to component to be measured：Two circuit boards point of fiber-optical grating temperature sensor will be laid
Test is not powered up, monitors the temperature change of the component to be measured on each plate respectively, and by the temperature of each component at any time
Between changing rule preserved on host computer；
S7 temperature comparisons) are carried out and carry out fault location：By the normal panel to record and faulty board in same position
Device temperature situation of change is contrasted, if corresponding to normal panel and a certain same position of faulty board device temperature change exist it is bright
Significant difference is different, and usual faulty board component temperature performance is relatively low, can determine whether not work for open circuit, element, and faulty board element temperature
Degree performance is higher, can determine whether that for element short, heat dissipation is excessive, faulty board is carried out so as to the angle completed from component therefore
Barrier positioning；
S8) remove sensor and chip is cleared up：After the completion of test, organic solvent can be used to wipe sensor surface
Adhesive, adhesive is removed sensor after melting and is properly preserved, in case next time uses, while by the glue of each chip surface
Stick is removed clean.
General principle, principal character and the advantages of the present invention of the present invention has been shown and described above.The technology of the industry
For personnel it should be appreciated that the present invention is not limited to the above embodiments, that described in above-described embodiment and specification is the present invention
Principle, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these change and
Improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent
Thing defines.
Claims (5)
- A kind of 1. Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array, it is characterised in that：Including following Step：S1 test point) is determined；S2) visual analysis；S3 fiber-optical grating temperature sensor) is selected；S4) laying optical fiber grating temperature sensor；S5 optical fiber grating regulating system) is built；S6 temperature survey) is carried out to component to be measured；S7 temperature comparisons) are carried out and carry out fault location；S8) remove sensor and chip is cleared up.
- 2. a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array according to claim 1, It is characterized in that：The step S3) in choose appropriate length fiber-optical grating temperature sensor, also may customize fiber grating.
- 3. a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array according to claim 1, It is characterized in that：Described step S4) in first by each sensor be placed on faulty board and contrast normal panel element under test compile Code, and make sensor as far as possible be brought into close contact with component surface, then chip surface try one's best it is thin and equably apply one layer of adhesive, Adhesive is set to cover fiber grating.
- 4. a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array according to claim 1, It is characterized in that：Described step S5) in each fiber-optical grating temperature sensor utilized into Transmission Fibers and fiber Bragg grating (FBG) demodulator It is connected, (FBG) demodulator is connected with host computer by network interface, the wavelength exported using the inspection software in host computer to (FBG) demodulator is believed Number handled.
- 5. a kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array according to claim 1, It is characterized in that：Described step S7) in normal panel and faulty board are powered up simultaneously, pass through the normal panel and faulty board to record Contrasted in the device temperature situation of change of same position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710800700.2A CN107765163A (en) | 2017-09-07 | 2017-09-07 | A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710800700.2A CN107765163A (en) | 2017-09-07 | 2017-09-07 | A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array |
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| CN201710800700.2A Pending CN107765163A (en) | 2017-09-07 | 2017-09-07 | A kind of Fault Diagnosis of Circuit Board method based on fiber-optical grating temperature sensor array |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110686798A (en) * | 2019-11-28 | 2020-01-14 | 中国空气动力研究与发展中心设备设计及测试技术研究所 | Device and method for testing surface temperature uniformity of bottom plate of wind tunnel test section |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844905A (en) * | 2005-07-29 | 2006-10-11 | 华为技术有限公司 | Method and system for detection of circuit board contamination |
| CN102818962A (en) * | 2012-09-07 | 2012-12-12 | 江苏有能电力自动化有限公司 | Online monitoring system of all-fiber grating power transformer |
| CN203250006U (en) * | 2013-05-24 | 2013-10-23 | 温州大学 | A large-power motor fault comprehensive monitoring system based on fiber grating sensing technology |
| CN103364658A (en) * | 2013-06-28 | 2013-10-23 | 国网电力科学研究院武汉南瑞有限责任公司 | Method for predicting service life of transformer based on fiber grating temperature measurement system |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
| CN106410307A (en) * | 2016-10-13 | 2017-02-15 | 江汉大学 | Lithium battery safety real-time monitoring system |
| CN106404066A (en) * | 2016-10-10 | 2017-02-15 | 山东大学 | Externally pasted fiber grating sensor for diaphragm filter plate, and detection system and method |
| CN106841954A (en) * | 2017-03-31 | 2017-06-13 | 国网江苏省电力公司电力科学研究院 | A kind of GIS hot-spot fault simulation experimental provisions based on fiber grating real time temperature measurement |
-
2017
- 2017-09-07 CN CN201710800700.2A patent/CN107765163A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1844905A (en) * | 2005-07-29 | 2006-10-11 | 华为技术有限公司 | Method and system for detection of circuit board contamination |
| CN102818962A (en) * | 2012-09-07 | 2012-12-12 | 江苏有能电力自动化有限公司 | Online monitoring system of all-fiber grating power transformer |
| CN203250006U (en) * | 2013-05-24 | 2013-10-23 | 温州大学 | A large-power motor fault comprehensive monitoring system based on fiber grating sensing technology |
| CN103364658A (en) * | 2013-06-28 | 2013-10-23 | 国网电力科学研究院武汉南瑞有限责任公司 | Method for predicting service life of transformer based on fiber grating temperature measurement system |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
| CN106404066A (en) * | 2016-10-10 | 2017-02-15 | 山东大学 | Externally pasted fiber grating sensor for diaphragm filter plate, and detection system and method |
| CN106410307A (en) * | 2016-10-13 | 2017-02-15 | 江汉大学 | Lithium battery safety real-time monitoring system |
| CN106841954A (en) * | 2017-03-31 | 2017-06-13 | 国网江苏省电力公司电力科学研究院 | A kind of GIS hot-spot fault simulation experimental provisions based on fiber grating real time temperature measurement |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110686798A (en) * | 2019-11-28 | 2020-01-14 | 中国空气动力研究与发展中心设备设计及测试技术研究所 | Device and method for testing surface temperature uniformity of bottom plate of wind tunnel test section |
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Application publication date: 20180306 |