CN106546357B - Method and device for detecting environment temperature and electronic equipment - Google Patents
Method and device for detecting environment temperature and electronic equipment Download PDFInfo
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- CN106546357B CN106546357B CN201510611651.9A CN201510611651A CN106546357B CN 106546357 B CN106546357 B CN 106546357B CN 201510611651 A CN201510611651 A CN 201510611651A CN 106546357 B CN106546357 B CN 106546357B
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Abstract
The embodiment of the invention provides a method and a device for detecting ambient temperature and electronic equipment, wherein the method comprises the following steps: acquiring various working conditions of the electronic equipment, thermal resistance coefficients from a temperature test point to a heating device and an environment under each working condition, a temperature value of the temperature test point and an environment temperature; generating mapping logic according to the working condition, the thermal resistance coefficient, the temperature value of the temperature test point and the environment temperature; and calculating the current environment temperature of the electronic equipment through the mapping logic, wherein the environment temperature is used as a basis for controlling the electronic equipment. The problem of because the heat radiation effect of the inside device that generates heat of electronic equipment makes the ambient temperature detected signal produce the deviation and bring other a series of problems from this is solved, improve the accuracy that electronic equipment ambient temperature detected.
Description
Technical Field
The present invention relates to electronic device detection technologies, and in particular, to a method and an apparatus for detecting an ambient temperature, and an electronic device.
Background
Most electronic devices need to operate in a wide temperature range and adapt to various climatic environments, so that the temperature is a very important operating parameter, and too high or too low temperature can cause the performance of the electronic devices to be deteriorated and even damage the electronic devices. Therefore, with the change of the environmental temperature, the working state of the electronic devices must be adjusted to ensure that the electronic devices can work in a wide temperature range and simultaneously meet the reliability, and the premise for realizing the functions is to detect the environmental temperature of the electronic devices.
A commonly used method for detecting the ambient temperature is to place a temperature sensor at an air inlet of the electronic device to directly detect the ambient temperature, and obtain an electrical signal corresponding to the ambient temperature after the processing of a temperature detection circuit, and provide the electrical signal to a related circuit for corresponding control. The electronic equipment is required to be installed in an approximately fully-closed shell for safety and reliability reasons, the ambient temperature around the temperature sensor is increased due to the heat radiation of a heating device in the electronic equipment, and deviation is generated on an ambient temperature detection signal, so that the temperature sensor is required to be placed at a position as close to the air inlet as possible during product design.
The main problems of the prior art are as follows: due to the heat radiation effect of a heating device inside the electronic equipment on the temperature sensor, the temperature around the temperature sensor is increased, so that the ambient temperature detection signal generates deviation, and the detection signal cannot truly reflect the ambient temperature of the product in work;
therefore, the temperature sensor must be placed close to the air inlet, which causes the following problems in designing electronic products:
the heating device must be placed at a position far from the ambient temperature detection sensor because the measurement value of the temperature sensor is easily affected by the assembly position, and the measured temperature is higher than the actual temperature if the temperature sensor is close to the heating device;
a strict interference-resistant design is required, because the temperature sensor must be close to the air inlet, the wiring of the control circuit and the detection circuit is elongated, and a larger interference signal is introduced;
the structural design must be strictly considered, because the assembly position of the temperature sensor must not be shielded by any shielding to measure the real environment temperature, and the air inlet is easily covered by dust, which affects the testing precision.
Disclosure of Invention
The invention aims to provide a method and a device for detecting ambient temperature and electronic equipment, and solves the defect that in the prior art, due to the heat radiation effect of a heating device in the electronic equipment on a temperature sensor, an ambient temperature detection signal generates deviation.
To solve the above technical problem, an embodiment of the present invention provides a method for detecting an ambient temperature, which is applied to an electronic device, and the method includes: acquiring various working conditions of the electronic equipment, thermal resistance coefficients from a temperature test point to a heating device and an environment under each working condition, a temperature value of the temperature test point and an environment temperature; generating mapping logic according to the working condition, the thermal resistance coefficient, the temperature value of the temperature test point and the environment temperature; and calculating the current environment temperature of the electronic equipment through the mapping logic, wherein the environment temperature is used as a basis for controlling the electronic equipment.
In the method, the obtaining of various working conditions of the electronic equipment, the thermal resistance coefficient from the temperature test point to the heating device and the environment, the temperature value of each temperature test point and the environment temperature comprises the following steps: setting temperature test points at different positions in the electronic equipment, and placing temperature sensors at the temperature test points; under each working condition, acquiring thermal resistance coefficients from a temperature test point inside the electronic equipment to a heating device and the environment; acquiring temperature values detected by the temperature sensors; and calculating the accurate ambient temperature according to the thermal resistance coefficient and the temperature value.
In the method, obtaining the thermal resistance coefficients from the temperature test point in the electronic equipment to the heating device and the environment comprises the following steps: in a self-cooling system, a thermal resistance coefficient Rt from a first test point to a heating device and the environment is measured by adopting a thermal resistance test principle1Thermal resistivity Rt from the second test point to the heating device and environment2(ii) a Acquiring the temperature values detected by the respective temperature sensors includes: when the number of the temperature monitoring points is two, the temperature T of the first test point and the second test point of the electronic equipment under the current working condition is tested1And T2(ii) a Obtaining a first formula T according to a thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device; calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises: subtracting T from the first formula and the second formula1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation, substituting the equivalent power consumption into a first formula or a second formula, and calculating the accurate environment temperature
In the method, obtaining the thermal resistance coefficients from the temperature test point in the electronic equipment to the heating device and the environment comprises the following steps: in a self-cooling system, a thermal resistance coefficient Rt from each temperature test point to a heating device and the environment is measured by adopting a thermal resistance test principle1、Rt2，……，Rtn(ii) a Obtaining individual temperature sensingThe temperature values detected by the temperature sensors include: when the number n of the temperature test points is more than two, the temperature value T of each temperature test point of the electronic equipment under the current working condition is detected1，T2，……，Tn(ii) a Calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises: in self-cooling systems, the formula T for thermal resistance is used1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝(PRtn+Ta) To obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaAnd calculating to obtain the accurate ambient temperature by adopting a selected algorithm.
In the method, a plurality of obtained ambient temperatures T are usedaCalculating the exact ambient temperature using the selected algorithm includes, but is not limited to: removing the maximum and minimum values of the ambient temperature, and averaging the rest temperature values to obtain the accurate ambient temperature
Or the ambient temperature TaAveraging to obtain accurate ambient temperature
In the method, obtaining the thermal resistance coefficients from the temperature test point in the electronic equipment to the heating device and the environment comprises the following steps: testing thermal resistivity Rt under various working conditions1～Rtn(ii) a Acquiring the temperature values detected by the respective temperature sensors includes: measuring the temperature T of each temperature test point under various working conditions1，T2，……，TnCalculating the equivalent power consumption P of the heating device under the current working condition; in the air cooling system, the thermal resistance coefficient from a temperature test point to a heating device and the environment changes along with the change of the rotating speed of a fan, and the thermal resistance coefficient under different rotating speeds of the fan is Rt1＝f(f1)f(P1)，Rt2＝f(f2)f(P2)，……，Rtn＝f(fn)f(Pn)，f(fn) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point n, f (P)1) Is a function of the influence of the equivalent power consumption P on the thermal resistivity of the temperature test point 1, f (P)2) Is a function of the influence of the equivalent power consumption P on the thermal resistivity of the temperature test point 2, f (P)n) The equivalent power consumption P is a function of the influence of the equivalent power consumption P on the thermal resistance coefficient of the temperature test point n; calculating the accurate ambient temperature from the thermal resistivity and the temperature value includes: and calculating a functional relation Ta (F (omega) F (P) between the ambient temperature and the fan rotating speed and the equivalent power consumption under different working conditions, wherein F (omega) is a function of the influence of the fan rotating speed on the ambient temperature, and F (P) is a function of the influence of the equivalent power consumption on the ambient temperature.
An apparatus for sensing ambient temperature, comprising: the temperature detection unit is used for detecting the temperature value of each temperature test point and the ambient temperature under a working condition when the electronic equipment works under the working condition; the mapping logic unit is used for generating mapping logic by using the acquired various working conditions of the electronic equipment, the thermal resistance coefficients from the temperature test points to the heating device and the environment under each working condition, and the temperature values of the temperature test points acquired by the temperature detection unit and the environment temperature; and the ambient temperature operation processing unit is used for calculating the current ambient temperature of the electronic equipment through the mapping logic according to the working condition and the temperature value, and the ambient temperature is used as a basis for controlling the electronic equipment.
In the apparatus, the temperature detecting unit includes: the temperature sensors are used for setting temperature test points at different positions in the electronic equipment and respectively placing the temperature test points; the temperature acquisition module is used for acquiring temperature values of all temperature test points of the electronic equipment and converting the ambient temperature into signals for measurement; the mapping logic unit includes: the thermal resistance coefficient module is used for acquiring the thermal resistance coefficient from a temperature test point inside the electronic equipment to the heating device and the environment under each working condition; the ambient temperature arithmetic processing unit includes: and the environment temperature calculation module is used for calculating the accurate environment temperature according to the thermal resistance coefficient and the temperature value.
In the apparatus, the thermal resistivity module includes: a first sub-module of thermal resistance coefficient for measuring the thermal resistance coefficient Rt from the first test point to the heating device and environment in the self-cooling system by using the thermal resistance test principle1Thermal resistivity Rt from the second test point to the heating device and environment2(ii) a The temperature acquisition module includes: a first sub-module for testing the temperature T of the first test point and the second test point of the electronic device under the current working condition when the number of the temperature monitoring points is two1And T2(ii) a A first sub-module of the thermal resistance formula for obtaining a first formula T according to the thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device; the ambient temperature calculation module includes: a first submodule of equivalent power consumption for subtracting T from the first formula1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation
An ambient temperature first sub-module for coupling the equivalent power consumption
Substituting into the first formula or the second formula to calculate the ambient temperature
In the apparatus, the thermal resistivity module includes: a second sub-module for measuring thermal resistance coefficient Rt from each temperature test point to the heating device and environment in the self-cooling system by using thermal resistance test principle1、Rt2，……，Rtn(ii) a The temperature acquisition module includes: testing a second sub-module for a number n of temperature monitoring points greater than twoDetecting the temperature value T of each temperature test point of the electronic equipment under the current working condition1，T2，……，Tn(ii) a The ambient temperature calculation module includes: a second sub-module for ambient temperature, for use in a self-cooling system, according to the formula of thermal resistance T1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝PRtn+TaTo obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaCalculating to obtain accurate ambient temperature T by adopting selected algorithma。
In the apparatus, the ambient temperature calculation module includes: an environment temperature calculation submodule for removing the maximum value and the minimum value in the environment temperature and averaging the rest temperature values to obtain the accurate environment temperature
Or the ambient temperature TaAveraging to obtain accurate ambient temperature
In the device, the temperature acquisition module includes: a third testing submodule for testing the temperature T of each temperature testing point under various working conditions1，T2，……，TnCalculating the equivalent power consumption P of the heating device under the current working condition; the thermal resistivity module includes: a third submodule of thermal resistance coefficient for testing the thermal resistance coefficient Rt under various working conditions1、Rt2，……，Rtn(ii) a In the air cooling system, the thermal resistance coefficient from a temperature test point to a heating device and the environment changes along with the change of the rotating speed of a fan, and the thermal resistance coefficient under different rotating speeds of the fan is Rt1＝f(f1)f(P1)，Rt2＝f(f2)f(P2)，……，Rtn＝f(fn)f(Pn)，f(fn) Is a function of the influence of the fan speed on the thermal resistivity of the temperature test point n, f (P)n) The equivalent power consumption is a function of the influence of the equivalent power consumption on the thermal resistance coefficient of the temperature test point n;
in the apparatus, the ambient temperature calculation module includes: and the environment temperature third submodule is used for calculating the accurate environment temperature Ta ═ F (omega) F (P) under the current working condition, F (omega) is a function of the influence of the rotating speed of the fan on the environment temperature, and F (P) is a function of the influence of the equivalent power consumption on the environment temperature.
An electronic device includes means for detecting an ambient temperature.
The technical scheme of the invention has the following beneficial effects: the problem of because the heat radiation effect of the inside device that generates heat of electronic equipment makes the ambient temperature detected signal produce the deviation and bring other a series of problems from this is solved, improve the accuracy that electronic equipment ambient temperature detected.
Drawings
FIG. 1 is a flow chart of a method for detecting ambient temperature according to an embodiment of the present invention;
FIG. 2 shows a flow chart of a two-point test in an embodiment of the invention;
FIG. 3 shows a flow chart of multi-point testing in an embodiment of the invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments.
In view of the above-mentioned defect that the electronic device has a temperature sensor at the air inlet to directly measure the ambient temperature, an embodiment of the present invention provides a method for detecting the ambient temperature, where as shown in fig. 1, the method includes:
acquiring various working conditions of the electronic equipment, thermal resistance coefficients from the temperature test points to the heating device and the environment under each working condition, and generating mapping logic according to the working conditions, the thermal resistance coefficients, the temperature values of the temperature test points and the environment temperature;
when the electronic equipment works under a working condition, detecting the temperature value of each temperature test point under the working condition;
and calculating the current environment temperature of the electronic equipment through the mapping logic according to the working condition and the temperature value, wherein the environment temperature is used as a basis for controlling the electronic equipment.
By applying the provided technology, the problems that the temperature detection signal generates deviation and other problems caused by the deviation under the heat radiation action of the heating device in the electronic equipment are solved, and the accuracy of detecting the environmental temperature of the electronic equipment is improved.
In the embodiment of the invention, the working environment temperature of the electronic equipment is calculated by utilizing the heat conduction principle, so that temperature test points are arranged at different positions in the electronic equipment for facilitating understanding, and temperature sensors are respectively arranged at the temperature test points; the technique is first described in terms of placing two temperature test points on a circuit board of an electronic device, and then extended to a complex ambient temperature test environment.
As shown in FIG. 2, a first test point and a second test point with respective temperatures T are respectively disposed at positions close to and far from the heating device1And T2And, TaIs the ambient temperature and P is the equivalent power consumption of the heat generating device. In a preferred embodiment, the obtaining of various operating conditions of the electronic device and thermal resistivity from the temperature test point to the heat generating device and the environment under each operating condition includes:
as shown in fig. 2, under each working condition, the thermal resistivity from the temperature test point inside the electronic device to the heating device and the environment is obtained;
acquiring temperature values detected by the temperature sensors;
and calculating the accurate ambient temperature according to the thermal resistance coefficient and the temperature value. The precise ambient temperature means that the error between the measured ambient temperature and the actual ambient temperature should be less than a predetermined temperature error threshold.
In a preferred embodiment, obtaining the thermal resistivity from the temperature test point inside the electronic device to the heat generating device and the environment comprises:
in a self-cooling system, a thermal resistance coefficient Rt from a first test point to a heating device and the environment is measured by adopting a thermal resistance test principle1Thermal resistivity Rt from the second test point to the heating device and environment2；
Acquiring the temperature values detected by the respective temperature sensors includes:
when the number of the temperature monitoring points is two, the temperature T of the first test point and the second test point of the electronic equipment under the current working condition is tested1And T2；
Obtaining a first formula T according to a thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device;
calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises:
subtracting T from the first formula and the second formula1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation
Substituting the equivalent power consumption into a first formula or a second formula to calculate the ambient temperature
Therefore, only the Rt is tested in advance under various working conditions of the electronic equipment1、Rt2Value, and testing the T of the electronic device under the working condition1And T2The value can be calculated by an ambient temperature calculation formula to obtain the ambient temperature T of the electronic equipment under the working conditiona。
The described test principle is used to realize accurate environmental temperature detection in complex electronic equipment, and in a preferred embodiment, the obtaining of the thermal resistivity from the temperature test point inside the electronic equipment to the heating device and the environment includes:
in a self-cooling system, a thermal resistance coefficient Rt from each temperature test point to a heating device and the environment is measured by adopting a thermal resistance test principle1、Rt2，……，Rtn；
Acquiring the temperature values detected by the respective temperature sensors includes:
when the number n of the temperature test points is more than two, the temperature value T of each temperature test point of the electronic equipment under the current working condition is detected1，T2，……，Tn；
Calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises:
in self-cooling systems, the formula T for thermal resistance is used1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝(PRtn+Ta) To obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaAnd calculating to obtain the accurate ambient temperature by adopting a selected algorithm.
The algorithm is not limited to the following. In a preferred embodiment, a plurality of ambient temperatures T will be obtainedaCalculating the precise ambient temperature using the selected algorithm includes:
removing the maximum and minimum values of the ambient temperature, and averaging the rest temperature values to obtain the accurate ambient temperature
Or the ambient temperature TaAveraging to obtain accuracyAmbient temperature
The specific method used in designing the electronic equipment is determined according to the actual situation of the electronic equipment.
The method is also applicable to air-cooled systems. In the electronic equipment of the air cooling system, when the rotating speed of a fan changes, the thermal resistance coefficient between two temperature test points also changes correspondingly. In a preferred embodiment of the present invention,
the method for acquiring the thermal resistance coefficient from the temperature test point in the electronic equipment to the heating device and the environment comprises the following steps:
testing thermal resistivity Rt under various working conditions1～Rtn；
Acquiring the temperature values detected by the respective temperature sensors includes:
measuring the temperature T of each temperature test point under various working conditions1，T2，……，TnCalculating the equivalent power consumption P of the heating device under the current working condition;
in the air cooling system, the thermal resistivity from the temperature test point to the heating device and the environment changes along with the change of the rotating speed of the fan, and the thermal resistivity under different rotating speeds of the fan is
Rt1＝f(f1)f(P1)
Rt2＝f(f2)f(P2)
……
Rtn＝f(fn)f(Pn)，
f(f1) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point 1, f (f)2) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point 2, f (f)n) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point n, f (P)1) Is a function of the influence of the equivalent power consumption P on the thermal resistivity of the temperature test point 1, f (P)2) Is a function of the influence of the equivalent power consumption P on the thermal resistivity of the temperature test point 2, f (P)n) Is equal toThe effective power consumption P has a function of influencing the thermal resistance coefficient of the temperature test point n;
calculating the accurate ambient temperature from the thermal resistivity and the temperature value includes:
calculating the functional relation between the environment temperature and the fan rotating speed and the equivalent power consumption under different working conditions
Ta＝F(ω)F(P)
F (ω) is a function of the effect of fan speed on ambient temperature, and F (P) is a function of the effect of equivalent power consumption on ambient temperature.
The environment temperature detection algorithm is programmed and written into the application service logic, and when the environment temperature detection algorithm works, the accurate environment temperature can be calculated by the algorithm in the application service logic as long as the rotating speed of the fan and the working condition of the electronic equipment are known.
The embodiment of the invention provides a device for detecting ambient temperature, which comprises:
the temperature detection unit is used for detecting the temperature value of each temperature test point under a working condition when the electronic equipment works under the working condition;
the mapping logic unit is used for generating mapping logic by using the acquired various working conditions of the electronic equipment, the thermal resistance coefficients from the temperature test points to the heating device and the environment under each working condition, and the temperature values of the temperature test points acquired by the temperature detection unit and the environment temperature;
and the ambient temperature operation processing unit is used for calculating the current ambient temperature of the electronic equipment through the mapping logic according to the working condition and the temperature value, and the ambient temperature is used as a basis for controlling the electronic equipment.
By applying the provided technology, the problems that the temperature detection signal generates deviation under the action of the heat radiation of the heating device in the electronic equipment and other problems caused by the deviation are solved, and the accuracy of detecting the environmental temperature of the electronic equipment is improved.
In a preferred embodiment of the present invention,
the temperature detection unit includes:
the temperature sensors are arranged at different positions in the electronic equipment, and the temperature sensors are respectively arranged at the temperature test points;
the temperature acquisition module is used for acquiring temperature values of all temperature test points of the electronic equipment and converting the ambient temperature into signals for measurement;
the mapping logic unit includes:
the thermal resistance coefficient module is used for acquiring the thermal resistance coefficient from a temperature test point inside the electronic equipment to the heating device and the environment under each working condition;
the ambient temperature arithmetic processing unit includes:
and the environment temperature calculation module is used for calculating the accurate environment temperature according to the thermal resistance coefficient and the temperature value.
In a preferred embodiment of the present invention,
the thermal resistivity module includes:
a first sub-module of thermal resistance coefficient for measuring the thermal resistance coefficient Rt from the first test point to the heating device and environment in the self-cooling system by using the thermal resistance test principle1Thermal resistivity Rt from the second test point to the heating device and environment2；
The temperature acquisition module includes:
a first sub-module for testing the temperature T of the first test point and the second test point of the electronic device under the current working condition when the number of the temperature monitoring points is two1And T2；
A first sub-module of the thermal resistance formula for obtaining a first formula T according to the thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device;
the ambient temperature calculation module includes:
a first submodule of equivalent power consumption for subtracting T from the first formula1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation
An ambient temperature first sub-module for coupling the equivalent power consumption
Substituting into the first formula or the second formula to calculate the ambient temperature
In a preferred embodiment of the present invention,
the thermal resistivity module includes:
a second sub-module for measuring thermal resistance coefficient Rt from each temperature test point to the heating device and environment in the self-cooling system by using thermal resistance test principle1、Rt2，……，Rtn；
The temperature acquisition module includes:
a second testing submodule for detecting the temperature T of each temperature testing point of the electronic equipment under the current working condition when the number n of the temperature monitoring points is more than two1，T2，……，Tn；
The ambient temperature calculation module includes:
a second sub-module for ambient temperature, for use in a self-cooling system, according to the formula of thermal resistance T1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝PRtn+TaTo obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaCalculating to obtain accurate ambient temperature T by adopting selected algorithma。
In a preferred embodiment, the ambient temperature second sub-module includes:
the ambient temperature calculation module includes:
an environment temperature calculation submodule for removing the maximum value and the minimum value in the environment temperature and averaging the rest temperature values to obtain the accurate environment temperature
Or the ambient temperature TaAveraging to obtain accurate ambient temperature
In a preferred embodiment, the temperature acquisition module comprises:
a third testing submodule for testing the temperature T of each temperature testing point under various working conditions1，T2，……，TnCalculating the equivalent power consumption P of the heating device under the current working condition;
the thermal resistivity module includes:
a third submodule of thermal resistance coefficient for testing the thermal resistance coefficient Rt under various working conditions1、Rt2，……，Rtn；
In the air cooling system, the thermal resistivity from the temperature test point to the heating device and the environment changes along with the change of the rotating speed of the fan, and the thermal resistivity under different rotating speeds of the fan is
Rt1＝f(f1)f(P1)
Rt2＝f(f2)f(P2)
……
Rtn＝f(fn)f(Pn)，
f(f1) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point 1, f (f)2) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point 2, f (f)n) Is a function of the influence of the fan speed on the thermal resistivity of the temperature test point n, f (P)1) Is a function of the influence of the equivalent power consumption P on the thermal resistivity of the temperature test point 1, f (P)2) Is the thermal resistance coefficient of the equivalent power consumption P to the temperature test point 2Function producing influence, f (P)n) The equivalent power consumption is a function of the influence of the equivalent power consumption on the thermal resistance coefficient of the temperature test point n;
the ambient temperature calculation module includes:
a third sub-module for calculating the accurate ambient temperature under the current working condition
Ta ═ F (ω) F (p), F (ω) is a function of the effect of fan speed on ambient temperature, and F (p) is a function of the effect of equivalent power consumption on ambient temperature.
The embodiment of the invention provides electronic equipment which comprises a device for detecting the ambient temperature.
The advantages after adopting this scheme are: the environment temperature detection algorithm is programmed and written into software, and when the environment temperature detection algorithm works, the accurate environment temperature can be calculated through the algorithm as long as the working conditions of the electronic equipment are known.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A method for detecting ambient temperature is applied to electronic equipment, and is characterized in that the method comprises the following steps:
acquiring various working conditions of the electronic equipment, and under each working condition, the thermal resistance coefficient from each temperature test point to the environment where the heating device is located, the temperature value of the temperature test point and the environment temperature, wherein the acquiring comprises the following steps: setting temperature test points at different positions in the electronic equipment, and placing temperature sensors at the temperature test points; under each working condition, in a self-cooling system, a thermal resistance coefficient Rt from each temperature test point to the environment where the heating device is located is measured by adopting a thermal resistance test principle1、Rt2，……，Rtn(ii) a Acquiring temperature values detected by the temperature sensors; calculating accurate environment temperature according to each thermal resistance coefficient and the temperature value;
generating mapping logic according to the working condition, the thermal resistance coefficient, the temperature value of the temperature test point and the environment temperature;
calculating the current environment temperature of the electronic equipment through the mapping logic, wherein the current environment temperature is used as a basis for controlling the electronic equipment;
acquiring the temperature values detected by the respective temperature sensors includes:
when the number of the temperature test points is two, testing the temperature T of the first test point and the second test point of the electronic equipment under the current working condition1And T2；
Obtaining a first formula T according to a thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device;
calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises:
subtracting T from the first formula and the second formula1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation
The equivalent power consumption is reduced
Substituting into the first formula or the second formula to calculate the accurate ambient temperature
2. The method of claim 1, wherein obtaining the temperature values detected by the respective temperature sensors comprises:
when the number n of the temperature test points is more than two, the temperature value T of each temperature test point of the electronic equipment under the current working condition is detected1，T2，……，Tn；
Calculating an accurate ambient temperature from the thermal resistivity and the temperature value comprises:
in self-cooling systems, the formula T for thermal resistance is used1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝(PRtn+Ta) To obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaAnd calculating to obtain the accurate ambient temperature by adopting a selected algorithm.
3. Method according to claim 2, characterized in that a plurality of ambient temperatures T are obtainedaCalculating the precise ambient temperature using the selected algorithm includes:
removing
The maximum value and the minimum value of the ambient temperature, and the rest temperature values are averaged to obtain the accurate ambient temperature
Or will be
An ambient temperature TaAveraging to obtain accurate ambient temperature
4. The method of claim 1, wherein obtaining the temperature values detected by the respective temperature sensors comprises:
measuring the temperature T of each temperature test point under various working conditions1，T2，……，TnCalculating the equivalent power consumption P of the heating device under the current working condition;
in the air cooling system, the thermal resistivity from the temperature test point to the environment where the heating device is located changes along with the change of the rotating speed of the fan, and the thermal resistivity under different rotating speeds of the fan is
Rt1＝f(f1)f(P1)
Rt2＝f(f2)f(P2)
……
Rtn＝f(fn)f(Pn)，
f(fn) Is a function of the influence of the fan speed f on the thermal resistivity of the temperature test point n, f (P)n) The equivalent power consumption P is a function of the influence of the equivalent power consumption P on the thermal resistance coefficient of the temperature test point n;
calculating the accurate ambient temperature from the thermal resistivity and the temperature value includes:
calculating the functional relation between the environment temperature and the fan rotating speed and the equivalent power consumption under different working conditions
Ta＝F(ω)F(P)
F (ω) is a function of the effect of fan speed on ambient temperature, and F (P) is a function of the effect of equivalent power consumption on ambient temperature.
5. An apparatus for sensing ambient temperature, comprising:
the temperature detection unit is used for detecting the temperature value of each temperature test point and the ambient temperature under a working condition when the electronic equipment works under the working condition;
the mapping logic unit is used for generating mapping logic by using the acquired various working conditions of the electronic equipment, the thermal resistance coefficient from each temperature test point to the environment where the heating device is positioned under each working condition, and the temperature value of each temperature test point acquired by the temperature detection unit and the environment temperature;
the environment temperature operation processing unit is used for calculating the current environment temperature of the electronic equipment through the mapping logic according to the working condition, the thermal resistance coefficient and the temperature value of each temperature test point, and the current environment temperature is used as a basis for controlling the electronic equipment; wherein
The temperature detection unit includes:
the temperature sensors are used for setting temperature test points at different positions in the electronic equipment and respectively placing the temperature test points;
the temperature acquisition module is used for acquiring temperature values of all temperature test points of the electronic equipment and converting the ambient temperature into signals for measurement;
the mapping logic unit includes: the thermal resistance coefficient module is used for acquiring the thermal resistance coefficient from a temperature test point inside the electronic equipment to the environment where the heating device is located under each working condition; the thermal resistivity module includes: a second sub-module for measuring thermal resistance coefficient Rt from each temperature test point to the environment of the heating device in a self-cooling system by using the thermal resistance test principle1、Rt2，……，Rtn；
The ambient temperature arithmetic processing unit includes: the environment temperature calculation module is used for calculating accurate environment temperature according to the thermal resistance coefficient and the temperature value;
the temperature acquisition module includes:
a first sub-module for testing the temperatures T of the first test point and the second test point of the electronic device under the current working condition when the number of the temperature test points is two1And T2；
A first sub-module of the thermal resistance formula for obtaining a first formula T according to the thermal resistance formula1＝PRt1+TaSecond formula T2＝PRt2+Ta，TaIs the ambient temperature, and P is the equivalent power consumption of the heat generating device;
the ambient temperature calculation module includes:
a first submodule with equivalent power consumption for connecting the first formula and the second formulaDecreasing T1-T2＝(PRt1+Ta)-(PRt2+Ta)＝P(Rt1-Rt2) Obtaining equivalent power consumption after deformation
An ambient temperature first sub-module for coupling the equivalent power consumption
Substituting into the first formula or the second formula to calculate the ambient temperature
6. The apparatus of claim 5, wherein the temperature acquisition module comprises:
a second sub-module for detecting the temperature T of each temperature test point of the electronic device under the current working condition when the number n of the temperature test points is more than two1，T2，……，Tn；
The ambient temperature calculation module includes:
a second sub-module for ambient temperature, for use in a self-cooling system, according to the formula of thermal resistance T1＝PRt1+Ta，T2＝PRt2+Ta，……，Tn＝PRtn+TaTo obtain
Calculate out
An ambient temperature TaA plurality of ambient temperatures T to be obtainedaCalculating to obtain accurate ambient temperature T by adopting selected algorithma。
7. The apparatus of claim 6, wherein the ambient temperature calculation module comprises:
ambient temperature calculation submodule for removing
The maximum value and the minimum value of the ambient temperature, and the rest temperature values are averaged to obtain the accurate ambient temperature
Or will be
An ambient temperature TaAveraging to obtain accurate ambient temperature
8. The apparatus of claim 5, wherein the thermal resistivity module comprises:
a third submodule of thermal resistance coefficient for testing the thermal resistance coefficient Rt under various working conditions1、Rt2，……，Rtn；
In the air cooling system, the thermal resistivity from the temperature test point to the environment where the heating device is located changes along with the change of the rotating speed of the fan, and the thermal resistivity under different rotating speeds of the fan is
Rt1＝f(f1)f(P1)
Rt2＝f(f2)f(P2)
……
Rtn＝f(fn)f(Pn)，
f(fn) Is a function of the influence of the fan speed on the thermal resistivity of the temperature test point n, f (P)n) The equivalent power consumption is a function of the influence of the equivalent power consumption on the thermal resistance coefficient of the temperature test point n;
the ambient temperature calculation module includes:
a third sub-module for calculating the accurate ambient temperature under the current working condition
Ta ═ F (ω) F (p), F (ω) is a function of the effect of fan speed on ambient temperature, and F (p) is a function of the effect of equivalent power consumption on ambient temperature.
9. An electronic device comprising the apparatus for detecting an ambient temperature according to any one of claims 5 to 8.
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| CN201510611651.9A CN106546357B (en) | 2015-09-23 | 2015-09-23 | Method and device for detecting environment temperature and electronic equipment |
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| CN107806904A (en) * | 2017-10-31 | 2018-03-16 | 宝力马（苏州）传感技术有限公司 | Wall-mounted humiture transducer and installation wall humiture compensation method |
| JP7079955B2 (en) * | 2017-12-29 | 2022-06-03 | ナガノサイエンス株式会社 | Temperature characterization method |
| CN110193389A (en) * | 2018-02-27 | 2019-09-03 | 株式会社岛津制作所 | Heater box |
| US11428581B2 (en) * | 2018-04-25 | 2022-08-30 | Semiconductor Components Industries, Llc | Methods and apparatus for predictive modeling in an imaging system |
| CN108731846A (en) * | 2018-05-21 | 2018-11-02 | 出门问问信息科技有限公司 | A kind of environment temperature determines method and device, storage medium, electronic equipment |
| CN109028445A (en) * | 2018-06-19 | 2018-12-18 | 珠海格力电器股份有限公司 | Installation method, air conditioner and the control method of Temperature Humidity Sensor |
| CN109990440B (en) * | 2019-04-16 | 2020-08-14 | 珠海格力电器股份有限公司 | Controller temperature compensation method and device and controller |
| CN113138036B (en) * | 2020-01-19 | 2023-07-18 | 北京小米移动软件有限公司 | Temperature detection method and device and electronic equipment |
| CN113835948A (en) * | 2020-06-23 | 2021-12-24 | 华为技术有限公司 | Temperature detection method, temperature detection device and electronic equipment |
| CN113252197B (en) * | 2021-05-31 | 2024-05-24 | 东风商用车有限公司 | Oil temperature measuring method and measuring system for commercial vehicle gearbox |
| CN113720494A (en) * | 2021-08-09 | 2021-11-30 | Oppo广东移动通信有限公司 | Temperature detection method, device, equipment and storage medium |
| CN115020832B (en) * | 2022-06-08 | 2024-05-28 | 东莞新能安科技有限公司 | Cell arrangement method, device, equipment and computer storage medium |
| CN114968730B (en) * | 2022-08-02 | 2022-11-04 | 深圳比特微电子科技有限公司 | Method and device for determining temperature of cooling liquid, block chain server and storage medium |
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