CN107750098A - A kind of laminating mechanism of the circuit board with clamping device - Google Patents
A kind of laminating mechanism of the circuit board with clamping device Download PDFInfo
- Publication number
- CN107750098A CN107750098A CN201711085696.2A CN201711085696A CN107750098A CN 107750098 A CN107750098 A CN 107750098A CN 201711085696 A CN201711085696 A CN 201711085696A CN 107750098 A CN107750098 A CN 107750098A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- generating means
- clamping
- clamping device
- laminating mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
Disclose a kind of laminating mechanism of the circuit board with clamping device, including operating platform casing, electric controling assembly, heating pressurization generating means, clamping is put down, clamping body, pass through the operational control of HTHP, realize the accurate control of bonding processes, process for pressing quality greatly improves, it ensure that harmomegathus stability of the multi-layer sheet after HTHP pressing, it is effectively prevented multiple-plate interlayer dislocation, the mechanism is additionally provided with clamping platform and clamping body simultaneously, effectively the position of plate is controlled, prevent overall deflection, avoid the phenomenon scrapped of circuit board, low manufacture cost, dissection significantly increases, also overall high efficiency and the reliability of operation are substantially increased.
Description
Technical field
The present invention relates to the pressing field of circuit board, more particularly, is related to a kind of circuit board with clamping device
Laminating mechanism.
Background technology
Circuit board is a carrier for carrying integrated circuit, has considerable effect.Circuit board is generally divided into individual layer
Plate and multi-layer sheet, at present multilayer circuit board more widely use, its pressing working procedure is the production process in multilayer circuit board
In an essential procedure, have direct influence to the performance quality of circuit board.In the bonding processes of current technology,
Structure is considerably complicated on the whole, and the unstable phenomenon of pressing often occurs, and presses interlayer Aligning degree and also be difficult to control, this meeting
The quality of circuit board, which is produced, directly to be influenceed.Therefore, for this present situation, there is an urgent need to develop a kind of pressing machine of circuit board
Structure, to meet the needs of actual use.
The content of the invention
Therefore, in view of the shortcomings of the prior art, the example for providing the present invention is led with substantially solving due to related
One or more problems, safety and reliability increase substantially caused by the limitation in domain and shortcoming, effectively play guarantor
Protect the effect of equipment.
According to technical scheme provided by the invention, including operating platform casing, electrical control is provided with operating platform casing
Component, operating platform casing are provided with clamping platform, and clamping platform is provided with clamping body, support is additionally provided with operating platform casing
Frame, support frame top are provided with loading plate, hydraulic cylinder are fixed with loading plate, and the piston rod end of hydraulic cylinder is provided with control panel, control
Platen is provided with below disk processed, clamping platform surface is provided with multiple shrinkage pools, and clamping body is L-shaped, and clamping body bottom is provided with bull stick, turns
Bar can be rotatably assorted with recess, and the upper surface of clamping body is provided with ellipse screw, and adjusting screw rod is combined with ellipse screw,
Adjusting screw rod is locked by adjusting nut, and vacuum suction generating means is provided with control panel and heats pressurization generating means, on platen
Provided with the vacuum suction through hole being connected with vacuum suction generating means, heating pressurization generating means heats to platen.
Further, vacuum suction generating means and electrically connected with electric controling assembly, the both sides of operating platform casing 1 difference
Provided with the vacuum suction generating means stated and the starting switch of heating pressurization generating means.
Further, operating platform casing is provided with hydraulic cylinder starting switch and exceptional reset switchs.
Preferably, platen is made up of highly thermally conductive insulating materials, and both sides are additionally provided with blowing thermal vias.
Preferably, the programming rate of heating pressurization generating means is more than 18 DEG C/min, and maximum heating temperature is 380 DEG C, pressure
Force value is 0.3-1.3GPa.
Particularly, clamping body surface face is covered with diaphragm.
Further, electric controling assembly includes pressure and temperature control unit.
The present invention realizes the accurate control of bonding processes, process for pressing quality is big by the operational control of HTHP
It is big to improve, harmomegathus stability of the multi-layer sheet after HTHP pressing is ensure that, is effectively prevented multiple-plate interlayer dislocation,
The mechanism is additionally provided with clamping platform and clamping body simultaneously, and effectively the position of plate is controlled, it is therefore prevented that overall deflection,
The phenomenon scrapped of circuit board, low manufacture cost are avoided, dissection significantly increases, and also substantially increases overall high efficiency
With the reliability of operation.
Brief description of the drawings
Fig. 1 is the structural representation of punch mechanism of the present invention.
Fig. 2 is the structural representation of clamping means for circuit board of the present invention.
Embodiment
With reference to specific embodiment, the invention will be further described.
Below with reference to embodiment shown in the drawings, the present invention will be described in detail.But these embodiments are simultaneously
The present invention is not limited, structure that one of ordinary skill in the art is made according to these embodiments, method or functionally
Conversion is all contained in protection scope of the present invention.
Below in conjunction with the accompanying drawings and specific embodiment is further described to the application principle of the present invention.Such as accompanying drawing 1 to accompanying drawing
Shown in 2, including operating platform casing 1, operating platform casing 1 is interior to be provided with electric controling assembly, and operating platform casing 1 is provided with dress
Platform 2 is pressed from both sides, clamping platform 2 is provided with clamping body 2-1, and support frame 3 is additionally provided with operating platform casing 1, and the top of support frame 3 is provided with
Loading plate 4, hydraulic cylinder 5 is fixed with loading plate 4, the piston rod end of hydraulic cylinder 5 is provided with control panel 6, and the lower section of control panel 6 is provided with
Platen 7, the surface of clamping platform 2 are provided with multiple shrinkage pools, and clamping body 2-1 is L-shaped, and clamping body 2-1 bottoms are provided with bull stick, bull stick energy
Enough to be rotatably assorted with recess, clamping body 2-1 upper surface is provided with ellipse screw, and adjusting screw rod is combined with ellipse screw,
Adjusting screw rod is locked by adjusting nut, and vacuum suction generating means and heating pressurization generating means, platen 7 are provided with control panel 6
The vacuum suction through hole being connected with vacuum suction generating means is provided with, heating pressurization generating means heats to platen 7.
Vacuum suction generating means and electrically connected with electric controling assembly, the both sides of operating platform casing 1 are respectively equipped with what is stated
The starting switch of vacuum suction generating means and heating pressurization generating means.Operating platform casing 1 is provided with the starting switch of hydraulic cylinder 5
Switched with exceptional reset.
Platen 7 is made up of highly thermally conductive insulating materials, and both sides are additionally provided with blowing thermal vias.
The programming rate of heating pressurization generating means is more than 18 DEG C/min, and maximum heating temperature is 380 DEG C, and pressure value is
0.3-1.3GPa。
Clamping body 2-1 surfaces are covered with diaphragm.
Electric controling assembly includes pressure and temperature control unit.
The use step of the mechanism is as follows:
A)Checking whole mechanism, it is ensured that all parts are normal,
B)Clamping body is rotated, adjusts the position of clamping body, by circuit board substrate 8 as on clamping platform, clamping body is rotated, adjusts
The position of clamping body, clamping is carried out to circuit board substrate 8, after clamping, manipulate adjusting nut, clamping body is finely adjusted,
C)Hydraulic cylinder starting switch is opened, controls to adjust control panel and platen to the suitable position of circuit board to be pressed,
D)The starting switch of vacuum suction generating means and heating pressurization generating means, vacuum suction through hole is adsorbed in by copper foil,
The position adjustment of copper foil is good,
E)Control hydraulic cylinder piston rod is moved down, and copper foil is covered to substrate, is disconnected vacuum suction generating means switch, is adjusted
Save to suitable temperature, press 40-60min, complete the pressing of copper foil,
F)Said process is repeated, completes the pressing of copper coated foil plate and prepreg,
G)After the completion of pressing, by all member resets, all switches are closed,
H)Clamping body is adjusted, circuit board is taken out, checks the pressing situation of circuit board, judge whether to meet the requirements.
For those skilled in the art, it is clear that the invention is not restricted to the details of above-mentioned one exemplary embodiment, and do not carrying on the back
In the case of spirit or essential attributes from the present invention, the present invention can be realized in other specific forms.Therefore, no matter from which
From the point of view of a bit, embodiment all should be regarded as exemplary, and be nonrestrictive, the scope of the present invention will by appended right
Ask rather than described above limits, it is intended that all changes in the implication and scope of the equivalency of claim will be fallen
Include in the present invention.Any reference in claim should not be considered as to the involved claim of limitation.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each embodiment is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that those skilled in the art should for clarity
Using specification as an entirety, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
It is appreciated that other embodiment.
Claims (7)
1. a kind of laminating mechanism of the circuit board with clamping device, including operating platform casing 1, described operating platform casing
Electric controling assembly is provided with 1, described operating platform casing 1 is provided with clamping platform 2, and described clamping platform 2 is provided with
Clamping body 2-1, support frame 3 is additionally provided with described operating platform casing 1, and the described top of support frame 3 is provided with loading plate 4, institute
Hydraulic cylinder 5 is fixed with the loading plate 4 stated, the piston rod end of described hydraulic cylinder 5 is provided with control panel 6, described control panel 6
Lower section is provided with platen 7, it is characterised in that the described surface of clamping platform 2 is provided with multiple shrinkage pools, and described clamping body 2-1 is in " L "
Shape, described clamping body 2-1 bottoms are provided with bull stick, and described bull stick can be rotatably assorted with described recess, described clamping
Body 2-1 upper surface is provided with ellipse screw, is combined with adjusting screw rod in described ellipse screw, described adjusting screw rod by
Adjusting nut is locked, and vacuum suction generating means and heating pressurization generating means, described platen are provided with described control panel 6
7 are provided with the vacuum suction through hole being connected with vacuum suction generating means, and described heating pressurization generating means enters to platen 7
Row heating.
2. the laminating mechanism of a kind of circuit board with clamping device according to claim 1, it is characterised in that described
Vacuum suction generating means and heating pressurization generating means electrically connect with described electric controling assembly, described operating platform case
The both sides of body 1 are respectively equipped with the starting switch of the vacuum suction generating means stated and heating pressurization generating means.
A kind of 3. laminating mechanism of circuit board with clamping device according to claim 1 or 2, it is characterised in that institute
The operating platform casing 1 stated is provided with the described starting switch 10 of hydraulic cylinder 5 and exceptional reset switch 11.
A kind of 4. laminating mechanism of circuit board with clamping device according to claim 1 or 2, it is characterised in that institute
The platen 7 stated is made up of highly thermally conductive insulating materials, and both sides are additionally provided with blowing thermal vias.
5. the laminating mechanism of a kind of circuit board with clamping device according to claim 1, it is characterised in that described
The programming rate of heating pressurization generating means is more than 18 DEG C/min, and maximum heating temperature is 380 DEG C, pressure value 0.3-
1.3GPa。
6. the laminating mechanism of a kind of circuit board with clamping device according to claim 2, it is characterised in that described
Clamping body 2-1 surfaces are covered with diaphragm.
7. the laminating mechanism of a kind of circuit board with clamping device according to claim 1, it is characterised in that described
Electric controling assembly includes pressure and temperature control unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711085696.2A CN107750098A (en) | 2017-11-07 | 2017-11-07 | A kind of laminating mechanism of the circuit board with clamping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711085696.2A CN107750098A (en) | 2017-11-07 | 2017-11-07 | A kind of laminating mechanism of the circuit board with clamping device |
Publications (1)
Publication Number | Publication Date |
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CN107750098A true CN107750098A (en) | 2018-03-02 |
Family
ID=61252097
Family Applications (1)
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CN201711085696.2A Pending CN107750098A (en) | 2017-11-07 | 2017-11-07 | A kind of laminating mechanism of the circuit board with clamping device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108346988A (en) * | 2018-03-30 | 2018-07-31 | 安徽金环电气设备有限责任公司 | A kind of starting cabinet processing holder and its application method |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908087A (en) * | 1985-09-20 | 1990-03-13 | Hitachi, Ltd. | Method of forming a multilayer printed circuit board and apparatus therefor |
CN101194547A (en) * | 2005-06-20 | 2008-06-04 | 松下电器产业株式会社 | Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method |
CN102476487A (en) * | 2010-11-25 | 2012-05-30 | 联茂电子股份有限公司 | Substrate stitching device, stitching method and substrate groupware thereof |
CN103552351A (en) * | 2013-11-04 | 2014-02-05 | 昆山美连德电子科技有限公司 | Copper foil sticking machine |
CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
CN105188268A (en) * | 2015-09-30 | 2015-12-23 | 上海朗华科贸有限公司 | Vacuum quick pressing machine |
CN105196680A (en) * | 2015-10-30 | 2015-12-30 | 浙江安浦科技有限公司 | Copper-clad plate overlapping and transferring machine |
CN106659109A (en) * | 2017-01-13 | 2017-05-10 | 尹乐琼 | Combining arrangement device for multiple kinds of boards |
CN106695276A (en) * | 2016-12-12 | 2017-05-24 | 广东长盈精密技术有限公司 | Automatic pressing and extracting equipment |
-
2017
- 2017-11-07 CN CN201711085696.2A patent/CN107750098A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908087A (en) * | 1985-09-20 | 1990-03-13 | Hitachi, Ltd. | Method of forming a multilayer printed circuit board and apparatus therefor |
CN101194547A (en) * | 2005-06-20 | 2008-06-04 | 松下电器产业株式会社 | Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method |
CN102476487A (en) * | 2010-11-25 | 2012-05-30 | 联茂电子股份有限公司 | Substrate stitching device, stitching method and substrate groupware thereof |
CN103552351A (en) * | 2013-11-04 | 2014-02-05 | 昆山美连德电子科技有限公司 | Copper foil sticking machine |
CN103747634A (en) * | 2013-12-27 | 2014-04-23 | 昆山迈致治具科技有限公司 | PCB thermal insulation stroke-limiting hot-pressing clamping jig |
CN105188268A (en) * | 2015-09-30 | 2015-12-23 | 上海朗华科贸有限公司 | Vacuum quick pressing machine |
CN105196680A (en) * | 2015-10-30 | 2015-12-30 | 浙江安浦科技有限公司 | Copper-clad plate overlapping and transferring machine |
CN106695276A (en) * | 2016-12-12 | 2017-05-24 | 广东长盈精密技术有限公司 | Automatic pressing and extracting equipment |
CN106659109A (en) * | 2017-01-13 | 2017-05-10 | 尹乐琼 | Combining arrangement device for multiple kinds of boards |
Non-Patent Citations (1)
Title |
---|
刘东等: "高多层板压合起皱的原理与解决办法", 《印制电路信息》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108346988A (en) * | 2018-03-30 | 2018-07-31 | 安徽金环电气设备有限责任公司 | A kind of starting cabinet processing holder and its application method |
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