CN107747922A - A kind of sub-surface based on laser-ultrasound lacks the measuring method of buried depth - Google Patents
A kind of sub-surface based on laser-ultrasound lacks the measuring method of buried depth Download PDFInfo
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- CN107747922A CN107747922A CN201710920102.9A CN201710920102A CN107747922A CN 107747922 A CN107747922 A CN 107747922A CN 201710920102 A CN201710920102 A CN 201710920102A CN 107747922 A CN107747922 A CN 107747922A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/07—Analysing solids by measuring propagation velocity or propagation time of acoustic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
- G01N2021/1706—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/011—Velocity or travel time
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Abstract
The invention discloses a kind of measuring method of the subsurface defect buried depth based on laser-ultrasound.Its step is：1) laser probe is installed on displacement platform；2) pulse laser probe and ultrasonic probe are individually positioned in the both sides of workpiece subsurface defect；3) pulse laser sends pulse laser and ultrasonic wave is motivated on workpiece, and ultrasonic probe measures through surface wave signal R and with being reflected back signal PR after defect interaction respectively；4) command displacement platform moves, and pulse laser is scanned n (n >=2) individual point in the side of subsurface defect with a certain distance, delta d, and ultrasonic probe receives direct wave and reflection echo in every scanning one；5) the obtained direct-path signal of each scanning element and the arrival time of flaw echoes is received by ultrasonic probe, calculates the buried depth of subsurface defect.The detection for the subsurface defect buried depth that the present invention can be used in the particular surroundings such as Ultra-precision Turning detection in place and some other HTHP.
Description
Technical field
The present invention relates to field of non destructive testing, more particularly to a kind of subsurface defect buried depth based on laser-ultrasound
Non-destructive measuring method.
Background technology
Subsurface defect, it is that size is at several microns to tens of micro- under the surface between several microns to hundreds of microns
Crackle and impression between rice, it is the caused microdefect during the Ultra-precision Turnings such as fine grinding, polishing.In making for part
During, subsurface defect can reduce the intensity and service life of part, and the safe operation to equipment, which produces, greatly to be threatened,
Immeasurable consequence is possibly even caused, gently then equipment fault, heavy then security incident and serious economic loss etc..Cause
This, subsurface defect must be removed in follow-up process.But because subsurface defect has, surface is invisible,
Depth as shallow, feature, the conventional methods such as size is small be not easy to detect, quantitative detection is let alone carried out to its depth.It is therefore, many
The method that more scholars are directed to research detection subsurface defect.
In existing research, Balogun et al. develops a set of full optical scanner ultrasound based on picosecond laser ultrasound
Microscopic system, the system motivate the ultrasonic longitudinal wave that frequency is up to GHz using picosecond laser, have detection and quantitatively detect micro-
The ability of small superficial defect.But because compressional wave only carries out single-point detection, so needing to mix scanning system.Meanwhile excitation and
GHz ultrasound in reception, also cause system complex and it is expensive.Kromine et al. proposes one kind and is based on line source laser scanning skill
Art detects subsurface defect, and this method is by line source laser pumping SAW, surface in online source laser scanning process
Ripple echo can be had greatly changed, and subsurface defect is detected by the change of this signal.This method being capable of quick detection
Positioned to subsurface defect and to it, but the measurement for the buried depth of subsurface defect is helpless.Cho leads to
The rayleigh waves inspection that point of use source laser excites bonding quality is crossed, while is scanned by mechanical scanner, it is horizontal to sub-surface
Positioned to defect, this method equally can not carry out quantitative measurment to subsurface defect buried depth.Other Non-Destructive Testings
Method, thermal wave imaging method and X-ray detection method etc., also applied in the detection of subsurface defect.But heat wave into
Picture technology is insensitive for tiny flaw, and can not carry out quantitative detection.Although X ray method comparative maturity, equipment into
This height, and ray is harmful, it is impossible to it is applied to well in on-position measure.
In field of non destructive testing, detect defect and quantitative detection no less important carried out to flaw size, for accurate and
Caused subsurface defect is even more so in Ultra-precision Turning.The buried depth of subsurface defect removes defect for following process
Layer is an important parameter.It is few the buried depth of subsurface defect to be carried out in existing lossless detection method
Quantitative measurment.The present invention can fast and accurately detect subsurface defect and carry out quantitative measurment to its buried depth.If
Using laser interferometer detecting ultrasonic, this method can be also used for on-position measure, or for extreme environments such as HTHPs
The defects of detect.
The content of the invention
The present invention is to detect accurate and Ultra-precision Turning material caused subsurface defect in process
Buried depth, to instruct following process that defect is got rid of, and propose a kind of sub-surface based on Laser thermo-elastic generated surface acoustic waves
The measuring method of defect buried depth.Its concrete scheme is as follows：
A kind of measuring method of the subsurface defect buried depth based on laser-ultrasound, comprises the following steps：
1) pulse laser probe is arranged on displacement movement platform, the direction of motion and sub-surface of displacement movement platform
The length direction of defect is vertical；
2) pulse laser probe and ultrasonic probe are individually positioned in the both sides of subsurface defect, and pulse laser is popped one's head in
It is vertical with subsurface defect with the line of ultrasonic probe to be radiated at the laser facula on workpiece；
3) laser facula that pulse laser probe is radiated on workpiece goes out ultrasonic wave on the surface of workpiece and internal motivation,
Measure surface wave signal R respectively using ultrasonic probe1With the ultrasonic signal PR returned from defect reflection1, then obtain surface wave letter
Number R1Reach the time t of ultrasonic probeR1And the ultrasonic signal PR returned from defect reflection1Reach the time t of ultrasonic probePR1；
4) command displacement motion platform is to defect movement displacement d, repeat step 3), obtain surface wave signal R2Reach super
The time t of sonic probeR2And the ultrasonic signal PR returned from defect reflection2Reach the time t of ultrasonic probePR2, control bit movement
Moving platform continues, to defect movement Δ d distances, then to obtain surface wave signal R3Reach the time t of ultrasonic probeR3And from lack
Fall into the ultrasonic signal PR being reflected back3Reach the time t of ultrasonic probePR3, the like, n (n >=2) individual point is scanned altogether；
5) by step 3) and 4) in the obtained direct-path signal of ultrasonic probe measurement and flaw echoes arrival time,
Calculate the buried depth h of subsurface defect.
Preferably, the exciting method of described supersonic source is point dynamite source, i.e.,：Pulse laser probe sends pulse and swashed
Light is focused into a source laser by biconvex lens, is radiated at workpiece surface and motivates ultrasonic wave.
Preferably, the exciting method of described supersonic source can excite for line source, i.e.,：Pulse laser probe sends arteries and veins
Impulse light, into line source laser, is radiated at workpiece surface and motivates ultrasonic wave by post lens focus；Can also be point dynamite source,
I.e.：Pulse laser probe sends pulse laser and passes through condenser lens by Laser Focusing into a source laser, is radiated at workpiece surface
And motivate ultrasonic wave.
Further, described subsurface defect is cylindrical defect, and described line source laser and subsurface defect
Length direction is parallel.
Preferably, the buried depth h calculation formula of subsurface defect are in described step 5)：
Wherein d be step 3) in the distance between laser facula and subsurface defect, vRFor surface acoustic wave within the workpiece
Spread speed, vPFor the spread speed of compressional wave within the workpiece, vSFor the spread speed of shear wave within the workpiece.
Further, the calculation formula of angle, θ is in above-mentioned formula：
θ=arcsin (vS/vP)
Having the beneficial effect that relative to prior art of the invention：First, in the situation using interferometer measurement ultrasonic vibration
Under, the present invention can carry out on-position measure.Secondary clamping is not needed, you can material Asia table after on-position measure precision and ultra-precision machining
Planar defect, to remove defect during following process.Second, precision and ultra-precision machining subsurface defect is small, buries
Depth as shallow, if using compressional wave C-scan detection method, it is necessary to high frequency ultrasound so that equipment is complicated, and detection speed is slow.This hair
Bright method is simple, and cost is relatively low, and measuring speed is fast, and precision is high.
Brief description of the drawings
Fig. 1 is a kind of detection view of the measuring method of the subsurface defect buried depth based on laser-ultrasound；
Fig. 2 is measuring method point source laser and the sensing point signal of the subsurface defect buried depth based on laser-ultrasound
Figure；
In figure, workpiece 1, two-dimension moving platform 2, pulse laser probe 3, ultrasonic probe 4, oscillograph 5, subsurface defect
6th, laser facula 7.
Embodiment
The present invention is illustrated with reference to the accompanying drawings and examples.
Embodiments of the invention are related to a kind of detection method of the subsurface defect buried depth based on laser-ultrasound, the party
Method produces ultrasonic wave using the pulse laser for being focused into point source in workpiece surface, and ultrasonic wave runs into subsurface defect and produces scattering
Echo-signal, by the reception and analysis to scattered signal, so as to realize the detection to workpiece subsurface defect buried depth.
The detection method basic principle and Summary of the subsurface defect width based on laser-ultrasound of the present invention
Unanimously, comprise the following steps that：
1) tape pulse laser probe 3 is placed on two-dimension moving platform 2, and makes two-dimension moving platform 2 wherein
One direction of motion is parallel with workpiece long side, and another direction of motion is vertical with workpiece surface；Then pulse is placed respectively to swash
Light device probe 3 and ultrasonic probe 4 are the both sides of workpiece subsurface defect 6 (as shown in Figure 1), and ultrasonic probe 4 and laser facula 7
Line it is vertical with the length direction of subsurface defect 6 (as shown in Figure 2)；
2) pulse laser probe 3 sends pulse laser, some source laser hot spots 7 is focused into by condenser lens, in work
The surface actuator of part 1 goes out ultrasonic wave, and ultrasonic probe 4 measures direct-path signal R1With the ripple signal PR returned from defect scattering1, and show
In oscillograph 5, direct-path signal R is obtained1Reach the time t of ultrasonic probe 4R1, and the ripple signal PR returned from defect scattering1Arrive
Up to the time t of ultrasonic probe 4PR1；
3) command displacement motion platform 2 is to defect movement displacement d=1mm, repeat step 3), obtain surface wave signal R2
Reach the time t of ultrasonic probe 4R2And the ultrasonic signal PR returned from defect scattering2Reach the time t of ultrasonic probe 4PR2, control
Displacement movement platform processed continues, to defect movement Δ d distances, then to obtain surface wave signal R3Reach the time t of ultrasonic probe 4R3
And the ultrasonic signal PR returned from defect reflection3Reach the time t of ultrasonic probe 4PR3, the like, 8 points are scanned altogether；
4) by step 2) and 4) in ultrasonic probe 4 measure obtained direct-path signal and when flaw echoes reach
Between, the buried depth h of subsurface defect is calculated, calculation formula is as follows：
Angle, θ is determined by below equation：
θ=arcsin (vS/vP)
Wherein d is the initial distance between laser facula 7 and subsurface defect 6, v in step 2)RIt is surface acoustic wave in work
Spread speed in part 1, vPFor spread speed of the compressional wave in workpiece 1, vSFor spread speed of the shear wave in workpiece 1.
Method described above detects to certain medium carbon steel subsurface defect buried depth, long 100mm, the width of its bloom
50mm, thick 5mm, obtain subsurface defect buried depth by the use of KEYENCE VHX-600 measurements and be used as reference.Bloom is placed on sample
On product platform, and excited and received with the both sides of pulse laser probe and the ultrasonic probe subsurface defect on bloom respectively
Table ultrasonic wave, ultrasonic probe will successively receive the ultrasonic wave R directly reached from excitaton source and the ultrasonic wave returned from defect scattering
The signal detected is transferred to oscillograph by PR, ultrasonic probe, and data are preserved and read on computers, so that follow-up calculating makes
With.Two-dimension moving platform of the control equipped with pulse laser probe scans 8 points to subsurface defect, and the same ultrasonic probe that records connects
The ultrasonic signal received, sonication times are obtained, for calculating subsurface defect buried depth.
The measurement result and its relative error of final embodiment are as shown in the table：
As can be seen from the table, the present invention has very high essence for the testing result of material subsurface defect buried depth
Degree, and this detection method has used contact PZT to pop one's head in, and reduces the condition and equipment cost using this method.Letter of the invention
It is single fast and effective, it is put into area to be measured unlike being measured microscopically to need to remove testing sample from processing.The present invention also may be used simultaneously
Supersonic sounding is carried out using interferometer, to realize detection in place, improves detection efficiency.
Embodiment described above is a kind of preferable scheme of the present invention, and so it is not intended to limiting the invention.Have
The those of ordinary skill of technical field is closed, without departing from the spirit and scope of the present invention, various changes can also be made
Change and modification.For example, laser facula can both use spot light, line source can also be used, i.e.,：Pulse laser probe is sent
Pulse laser passes through post lens by Laser Focusing into line source laser, is radiated at workpiece surface and motivates ultrasonic wave.Therefore it is all to adopt
The technical scheme for taking the mode of equivalent substitution or equivalent transformation to be obtained, all falls within protection scope of the present invention.
Claims (5)
1. a kind of sub-surface based on laser-ultrasound lacks the measuring method of buried depth, it is characterised in that comprises the following steps：
Pulse laser is popped one's head in into (3) on displacement movement platform (2), the direction of motion and sub-surface of displacement movement platform
The length direction of defect (6) is vertical；
2) pulse laser probe (3) and ultrasonic probe (4) are individually positioned in the both sides of subsurface defect (6), and pulse laser
The laser facula (7) that device probe is radiated on workpiece (1) is vertical with subsurface defect with the line of ultrasonic probe (4)；
3) pulse laser probe (3) is radiated at laser facula (7) on workpiece (1) in the surface of workpiece (1) and internal motivation
Go out ultrasonic wave, surface wave signal R is measured respectively using ultrasonic probe (4)1With the ultrasonic signal PR returned from defect reflection1, then
Obtain surface wave signal R1Reach the time t of ultrasonic probe (4)R1And the ultrasonic signal PR returned from defect reflection1Reach super
The time t of sonic probe (4)PR1；
4) command displacement motion platform (2) is to defect movement displacement d, repeat step 3), obtain surface wave signal R2Reach ultrasound
The time t of probe (4)R2And the ultrasonic signal PR returned from defect reflection2Reach the time t of ultrasonic probe (4)PR2, control bit
Movement moving platform continues, to defect movement Δ d distances, then to obtain surface wave signal R3Reach the time t of ultrasonic probe (4)R3With
And the ultrasonic signal PR returned from defect reflection3Reach the time t of ultrasonic probe (4)PR3, the like, n point is scanned altogether,
Wherein n >=2；
5) by step 3) and 4) in ultrasonic probe (4) the obtained direct-path signal of measurement and flaw echoes arrival time,
Calculate the buried depth h of subsurface defect.
2. the method as described in claim 1, it is characterised in that：The exciting method of supersonic source is point dynamite source, i.e.,：Pulse laser
Device probe (3) sends pulse laser and is focused into a source laser by biconvex lens, is radiated at workpiece (1) surface and motivates ultrasound
Ripple.
3. the method as described in claim 1, it is characterised in that：The exciting method of supersonic source excites for line source, i.e.,：Pulse laser
Device probe (3) sends pulse laser and passes through post lens by Laser Focusing into line source laser, is radiated at workpiece (1) surface and motivates
Ultrasonic wave.
4. method as claimed in claim 3, it is characterised in that：Described subsurface defect (6) is cylindrical defect, and described
Line source laser it is parallel with the length direction of subsurface defect (6).
5. the method as described in claim 1, it is characterised in that：The buried depth h of subsurface defect in described step 5)
Calculation formula is：
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Wherein d be step 3) in the distance between laser facula (7) and subsurface defect (6), vRIt is surface acoustic wave in workpiece (1)
In spread speed, vPFor spread speed of the compressional wave in workpiece (1), vSFor spread speed of the shear wave in workpiece (1)；Wherein
Angle, θ calculation formula is：θ=arcsin (vS/vP)。
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