CN107746695B - High-temperature Resistance Adhesives - Google Patents

High-temperature Resistance Adhesives Download PDF

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Publication number
CN107746695B
CN107746695B CN201711227557.9A CN201711227557A CN107746695B CN 107746695 B CN107746695 B CN 107746695B CN 201711227557 A CN201711227557 A CN 201711227557A CN 107746695 B CN107746695 B CN 107746695B
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parts
zinc oxide
temperature resistance
potassium feldspar
powder
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CN107746695A (en
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蒋茵荣
黄桂彬
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Guangxi Zhongchang Resin Co Ltd
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Guangxi Zhongchang Resin Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/02—Organic and inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The present invention discloses a kind of high-temperature Resistance Adhesives, belongs to adhesive technology field.The present invention is made by the raw material of following parts by weight: 30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts of ethyl acetate, 5 parts~10 parts of rosin resin, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part of potassium feldspar, 0.4 part~0.8 part of silica, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinone and 1 part~5 parts of deionized water.The present invention is by being added zinc oxide, potassium feldspar, silica, and its dosage of considered critical and particle size, make products therefrom adhesive under the premise of keeping has higher high temperature resistance, with preferable shear strength, to solve the problem of that although existing high-temperature Resistance Adhesives have preferable high temperature resistance but the requirement under the critical conditions of part is also not achieved in its shear strength under the high temperature conditions.

Description

High-temperature Resistance Adhesives
Technical field
The invention belongs to adhesive technology field more particularly to a kind of high-temperature Resistance Adhesives.
Background technique
Adhesive: sticking and the effects of cohesion, two or more product or material connection can be made by interface Natural or synthesis a, organic or inorganic substance together, is referred to as adhesive, is called binder, traditionally Referred to as glue.In brief, adhesive is exactly to pass through adhesive effect, can make to be sticked the combined substance of object." adhesive " It is general standard terminology, also includes some other glue, clay, rubber cement, glue cream etc..
Normal temperature cured type, intermediate temperature setting type and hot setting type adhesive can be then divided into according to its solidification temperature；And from The use temperature range of adhesive can then be classified as high temperature resistant, the adhesive that low temperature resistant and room temperature uses.
Wherein, high-temperature Resistance Adhesives can be used in quartz heating-pipe, and quartz heating-pipe plates white coating, and infrared heating fluorescent tube is anti- Penetrate a layer coating, high-temperaure coating, the cartridge type heater of infrared heating, converter heater, stainless steel heater etc., in infrared ray Wave heating pipe, infrared ray shortwave heating tube and the twin pipe of infrared ray single tube, infrared ray, carbon heating tube, the pink outer tube of plating etc., In addition to this various high temperature resistant equipment, heat insulation device etc. can also be widely used in.
Although however, currently, in the market most high-temperature Resistance Adhesives all have preferable high temperature resistance, its The requirement under the critical conditions of part is also not achieved in shear strength under hot conditions.
Summary of the invention
A kind of high-temperature Resistance Adhesives provided by the present invention, although so that solving existing high-temperature Resistance Adhesives has preferably High temperature resistance, but asking for the requirement under the critical conditions of part is also not achieved in its shear strength under the high temperature conditions Topic.
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that:
It is made by the raw material of following parts by weight:
30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts, 5 parts of rosin resin of ethyl acetate ~10 parts, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part, 0.4 part of silica of potassium feldspar ~0.8 part, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinone and 1 part~5 parts of deionized water.
In above-mentioned technical proposal, more specific technical solution be may also is that including following preparation method:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into that partial size is Nano grade respectively Grain, obtains nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder, spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol, deionized water and step A, nanoscale potassium feldspar powder, nanoscale titanium dioxide Si powder is put into reaction kettle, is first heated to 50 DEG C~60 DEG C, and stir evenly at such a temperature；Then be again heated to 85 DEG C~ 105 DEG C, stirring, reaction 10 minutes~60 minutes.
Due to the adoption of the above technical scheme, the invention has the following beneficial effects:
The present invention makes institute by the way that zinc oxide, potassium feldspar, silica, and its dosage of considered critical and particle size is added Product adhesive is obtained under the premise of keeping has higher high temperature resistance, there is preferable shear strength, to solve existing Although high-temperature Resistance Adhesives have preferable high temperature resistance, part is also not achieved in its shear strength under the high temperature conditions The problem of requirement under critical conditions.
Specific embodiment
Below in conjunction with specific example, the invention will be further described:
Embodiment 1 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 30kg, chlorinated polypropylene 25kg, ethyl acetate 15kg, rosin resin 5kg, phenolic resin 5kg, zinc oxide 0.1kg, potassium feldspar 0.3kg, silica 0.4kg, triethylamine 5kg, hydroquinone 1kg and deionized water 1kg；
Preparation method includes the following steps:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into that partial size is Nano grade respectively Grain, obtains nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder, spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol, deionized water and step A, nanoscale potassium feldspar powder, nanoscale titanium dioxide Si powder is put into reaction kettle, is first heated to 50 DEG C, and stir evenly at such a temperature；Then 85 DEG C are again heated to, stirs, is anti- It answers 60 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.00MPa.
Embodiment 2 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 32kg, chlorinated polypropylene 27kg, ethyl acetate 17kg, rosin resin 7kg, phenolic resin 7kg, zinc oxide 0.3kg, potassium feldspar 0.4kg, silica 0.5kg, triethylamine 7kg, hydroquinone 3kg and deionized water 3kg；
Preparation method includes the following steps:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into that partial size is Nano grade respectively Grain, obtains nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder, spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol, deionized water and step A, nanoscale potassium feldspar powder, nanoscale titanium dioxide Si powder is put into reaction kettle, is first heated to 54 DEG C, and stir evenly at such a temperature；Then 95 DEG C are again heated to, stirs, is anti- It answers 30 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.50MPa.
Embodiment 3 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 34kg, chlorinated polypropylene 28kg, ethyl acetate 18kg, rosin resin 8kg, phenolic resin 8kg, zinc oxide 0.4kg, potassium feldspar 0.6kg, silica 0.7kg, triethylamine 8kg, hydroquinone 4kg and deionized water 4kg；
Preparation method includes the following steps:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into that partial size is Nano grade respectively Grain, obtains nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder, spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol, deionized water and step A, nanoscale potassium feldspar powder, nanoscale titanium dioxide Si powder is put into reaction kettle, is first heated to 58 DEG C, and stir evenly at such a temperature；Then 100 DEG C are again heated to, stir, Reaction 20 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.60MPa.
Embodiment 4 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 35kg, chlorinated polypropylene 30kg, ethyl acetate 20kg, rosin resin 10kg, phenolic resin 10kg, oxidation Zinc 0.5kg, potassium feldspar 0.7kg, silica 0.8kg, triethylamine 10kg, hydroquinone 5kg and deionized water 5kg；
Preparation method includes the following steps:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into that partial size is Nano grade respectively Grain, obtains nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder, spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol, deionized water and step A, nanoscale potassium feldspar powder, nanoscale titanium dioxide Si powder is put into reaction kettle, is first heated to 60 DEG C, and stir evenly at such a temperature；Then 105 DEG C are again heated to, stir, Reaction 10 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.70MPa.
Comparative example 1 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 30kg, chlorinated polypropylene 25kg, ethyl acetate 15kg, rosin resin 5kg, phenolic resin 5kg, triethylamine 5kg, hydroquinone 1kg and deionized water 1kg；
Preparation method includes the following steps:
According to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene Diphenol, deionized water are put into reaction kettle, are first heated to 50 DEG C, and stir evenly at such a temperature；Then 85 DEG C are again heated to, Stirring, reaction 60 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 3.00MPa.
Comparative example 2 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 32kg, chlorinated polypropylene 27kg, ethyl acetate 17kg, rosin resin 7kg, phenolic resin 7kg, potassium feldspar 0.4kg, silica 0.5kg, triethylamine 7kg, hydroquinone 3kg and deionized water 3kg；
Preparation method includes the following steps:
A. according to the above ratio, potassium feldspar, silica are first ground into the particle that partial size is Nano grade respectively, obtained Nanoscale potassium feldspar powder, nanometer grade silica powder, it is spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nanoscale potassium feldspar powder, nanometer grade silica powder made from benzenediol deionized water and step A are put into reaction kettle, 54 DEG C are first heated to, and is stirred evenly at such a temperature；Then 95 DEG C are again heated to, stirring, reaction 30 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 4.00MPa.
Comparative example 3 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 34kg, chlorinated polypropylene 28kg, ethyl acetate 18kg, rosin resin 8kg, phenolic resin 8kg, zinc oxide 0.4kg, silica 0.7kg, triethylamine 8kg, hydroquinone 4kg and deionized water 4kg；
Preparation method includes the following steps:
A. according to the above ratio, zinc oxide, silica are first ground into the particle that partial size is Nano grade respectively, obtained Nano-level zinc oxide powder, nanometer grade silica powder, it is spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol deionized water and step A, nanometer grade silica powder are put into reaction kettle, 58 DEG C are first heated to, and is stirred evenly at such a temperature；Then 100 DEG C are again heated to, stirring, reaction 20 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 4.20MPa.
Comparative example 4 --- high-temperature Resistance Adhesives
It uses following raw material:
Styrene 35kg, chlorinated polypropylene 30kg, ethyl acetate 20kg, rosin resin 10kg, phenolic resin 10kg, oxidation Zinc 0.5kg, potassium feldspar 0.7kg, triethylamine 10kg, hydroquinone 5kg and deionized water 5kg；
Preparation method includes the following steps:
A. according to the above ratio, first by zinc oxide, potassium feldspar, respectively be ground into partial size be Nano grade particle, received Nanoscale zinc oxide powder, nanoscale potassium feldspar powder, it is spare；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, right Nano-level zinc oxide powder made from benzenediol deionized water and step A, nanoscale potassium feldspar powder are put into reaction kettle, first 60 DEG C are heated to, and is stirred evenly at such a temperature；Then 105 DEG C are again heated to, stirring, reaction 10 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 3.70MPa.

Claims (1)

1. a kind of high-temperature Resistance Adhesives, it is characterised in that:
It is made by the raw material of following parts by weight:
30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts of ethyl acetate, rosin resin 5 parts~10 Part, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part of potassium feldspar, silica 0.4 part~0.8 Part, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinone and 1 part~5 parts of deionized water；
It includes following preparation method:
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that partial size is Nano grade respectively, obtained It is spare to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two Nano-level zinc oxide powder made from phenol, deionized water and step A, nanoscale potassium feldspar powder, nanometer grade silica powder End is put into reaction kettle, is first heated to 50 DEG C~60 DEG C, and stir evenly at such a temperature；Then 85 DEG C~105 are again heated to DEG C, stirring, reaction 10 minutes~60 minutes.
CN201711227557.9A 2017-11-29 2017-11-29 High-temperature Resistance Adhesives Active CN107746695B (en)

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CN107746695B true CN107746695B (en) 2019-05-17

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715352A (en) * 2005-07-29 2006-01-04 湖北大学 Modified chlorinated polypropylene adhesive
CN101974300A (en) * 2010-10-28 2011-02-16 苏州凯康化工科技有限公司 Water-based complex membrane sealing rubber and preparation method thereof
CN102746472A (en) * 2012-04-20 2012-10-24 苏州兴业材料科技股份有限公司 Modified polypropylene special resin and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715352A (en) * 2005-07-29 2006-01-04 湖北大学 Modified chlorinated polypropylene adhesive
CN101974300A (en) * 2010-10-28 2011-02-16 苏州凯康化工科技有限公司 Water-based complex membrane sealing rubber and preparation method thereof
CN102746472A (en) * 2012-04-20 2012-10-24 苏州兴业材料科技股份有限公司 Modified polypropylene special resin and preparation method thereof

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