CN107746695A - High-temperature Resistance Adhesives - Google Patents
High-temperature Resistance Adhesives Download PDFInfo
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- CN107746695A CN107746695A CN201711227557.9A CN201711227557A CN107746695A CN 107746695 A CN107746695 A CN 107746695A CN 201711227557 A CN201711227557 A CN 201711227557A CN 107746695 A CN107746695 A CN 107746695A
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- zinc oxide
- potassium feldspar
- powder
- silica
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention discloses a kind of high-temperature Resistance Adhesives, belongs to adhesive technical field.The present invention is made by the raw material of following parts by weight：1 part~5 parts of 30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts of ethyl acetate, 5 parts~10 parts of rosin resin, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part of potassium feldspar, 0.4 part~0.8 part of silica, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinones and deionized water.The present invention is by adding zinc oxide, potassium feldspar, silica, and its dosage of considered critical and particle size, make products therefrom adhesive on the premise of keeping that there is higher resistance to elevated temperatures, with preferable shear strength, although there is preferable resistance to elevated temperatures so as to solve existing high-temperature Resistance Adhesives, the problem of its shear strength under the high temperature conditions does not reach the requirement under the critical conditions of part also.
Description
Technical field
The invention belongs to adhesive technical field, more particularly to a kind of high-temperature Resistance Adhesives.
Background technology
Adhesive：Acted on by sticking for interface with cohesion etc., two or more product or material connection can be made
Natural or synthesis, organic or inorganic a kind of material together, is referred to as adhesive, is called binder, traditionally
Referred to as glue.In brief, adhesive is exactly to pass through adhesive effect, can make the material for being sticked thing and being combined together." adhesive "
It is general standard terminology, also including some other glue, clay, rubber cement, glue cream etc..
Normal temperature cured type, intermediate temperature setting type and hot setting type adhesive can be then divided into according to its solidification temperature；And from
The use temperature range of adhesive, then it can be classified as high temperature resistant, the adhesive that low temperature resistant and normal temperature uses.
Wherein, high-temperature Resistance Adhesives can be used in quartz heating-pipe, and quartz heating-pipe plates white coating, and infrared heating fluorescent tube is anti-
Penetrate a layer coating, high-temperaure coating, the cartridge type heater of infrared heating, converter heater, stainless steel heater etc., in infrared ray
Wave heating pipe, infrared ray shortwave heating tube and the twin pipe of infrared ray single tube, infrared ray, carbon heating tube, the pink outer tube of plating etc.,
In addition various high temperature resistant equipment, heat insulation device etc. can also be widely used in.
However, at present, although the most high-temperature Resistance Adhesives of in the market all have preferable resistance to elevated temperatures, its
Shear strength under hot conditions does not reach the requirement under the critical conditions of part also.
The content of the invention
A kind of high-temperature Resistance Adhesives provided by the present invention, although having preferably so as to solve existing high-temperature Resistance Adhesives
Resistance to elevated temperatures, but its shear strength under the high temperature conditions does not reach asking for the requirement under the critical conditions of part also
Topic.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：
It is made by the raw material of following parts by weight：
30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts of ethyl acetate, rosin resin 5 parts~10
Part, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part of potassium feldspar, silica 0.4 part~0.8
Part, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinones and 1 part~5 parts of deionized water.
In above-mentioned technical proposal, more specifically technical scheme can also be：Including following preparation method：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 50 DEG C~60 DEG C, and stir at such a temperature；Then 85 DEG C~105 are again heated to
DEG C, stirring, reaction 10 minutes~60 minutes.
Due to being had the advantages that using above-mentioned technical proposal, the present invention：
The present invention produces gained by adding zinc oxide, potassium feldspar, silica, and its dosage of considered critical and particle size
Thing adhesive has preferable shear strength, so as to solve existing resistance to height on the premise of keeping having higher resistance to elevated temperatures
Although warm adhesive has preferable resistance to elevated temperatures, it is harsh that its shear strength under the high temperature conditions does not reach part also
Under the conditions of requirement the problem of.
Embodiment
Below in conjunction with instantiation, the invention will be further described：
Embodiment 1 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 30kg, chlorinated polypropylene 25kg, ethyl acetate 15kg, rosin resin 5kg, phenolic resin 5kg, zinc oxide
0.1kg, potassium feldspar 0.3kg, silica 0.4kg, triethylamine 5kg, hydroquinones 1kg and deionized water 1kg；
Its preparation method comprises the following steps：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 50 DEG C, and stir at such a temperature；Then 85 DEG C are again heated to, stirring, reaction 60
Minute.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.00MPa.
Embodiment 2 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 32kg, chlorinated polypropylene 27kg, ethyl acetate 17kg, rosin resin 7kg, phenolic resin 7kg, zinc oxide
0.3kg, potassium feldspar 0.4kg, silica 0.5kg, triethylamine 7kg, hydroquinones 3kg and deionized water 3kg；
Its preparation method comprises the following steps：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 54 DEG C, and stir at such a temperature；Then 95 DEG C are again heated to, stirring, reaction 30
Minute.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.50MPa.
Embodiment 3 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 34kg, chlorinated polypropylene 28kg, ethyl acetate 18kg, rosin resin 8kg, phenolic resin 8kg, zinc oxide
0.4kg, potassium feldspar 0.6kg, silica 0.7kg, triethylamine 8kg, hydroquinones 4kg and deionized water 4kg；
Its preparation method comprises the following steps：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 58 DEG C, and stir at such a temperature；Then 100 DEG C are again heated to, stirring, reaction
20 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.60MPa.
Embodiment 4 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 35kg, chlorinated polypropylene 30kg, ethyl acetate 20kg, rosin resin 10kg, phenolic resin 10kg, zinc oxide
0.5kg, potassium feldspar 0.7kg, silica 0.8kg, triethylamine 10kg, hydroquinones 5kg and deionized water 5kg；
Its preparation method comprises the following steps：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 60 DEG C, and stir at such a temperature；Then 105 DEG C are again heated to, stirring, reaction
10 minutes.
High-temperature Resistance Adhesives made from the present embodiment are under the conditions of 200 DEG C, shear strength 6.70MPa.
Comparative example 1 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 30kg, chlorinated polypropylene 25kg, ethyl acetate 15kg, rosin resin 5kg, phenolic resin 5kg, triethylamine 5kg,
Hydroquinones 1kg and deionized water 1kg；
Its preparation method comprises the following steps：
According to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water are put into reactor, are first heated to 50 DEG C, and stir at such a temperature；Then 85 DEG C are again heated to, is stirred
Mix, react 60 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 3.00MPa.
Comparative example 2 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 32kg, chlorinated polypropylene 27kg, ethyl acetate 17kg, rosin resin 7kg, phenolic resin 7kg, potassium feldspar
0.4kg, silica 0.5kg, triethylamine 7kg, hydroquinones 3kg and deionized water 3kg；
Its preparation method comprises the following steps：
A. according to the above ratio, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtain nanometer
Level potassium feldspar powder, nanometer grade silica powder, it is standby；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Nanoscale potassium feldspar powder, nanometer grade silica powder are put into reactor made from phenol deionized water and step A, are first added
Heat stirs at such a temperature to 54 DEG C；Then 95 DEG C are again heated to, stirring, reaction 30 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 4.00MPa.
Comparative example 3 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 34kg, chlorinated polypropylene 28kg, ethyl acetate 18kg, rosin resin 8kg, phenolic resin 8kg, zinc oxide
0.4kg, silica 0.7kg, triethylamine 8kg, hydroquinones 4kg and deionized water 4kg；
Its preparation method comprises the following steps：
A. according to the above ratio, zinc oxide, silica are first ground into the particle that particle diameter is Nano grade respectively, obtain nanometer
Level Zinc oxide powder, nanometer grade silica powder, it is standby；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Nano-level zinc oxide powder, nanometer grade silica powder are put into reactor made from phenol deionized water and step A, are first added
Heat stirs at such a temperature to 58 DEG C；Then 100 DEG C are again heated to, stirring, reaction 20 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 4.20MPa.
Comparative example 4 --- high-temperature Resistance Adhesives
It uses following raw material：
Styrene 35kg, chlorinated polypropylene 30kg, ethyl acetate 20kg, rosin resin 10kg, phenolic resin 10kg, zinc oxide
0.5kg, potassium feldspar 0.7kg, triethylamine 10kg, hydroquinones 5kg and deionized water 5kg；
Its preparation method comprises the following steps：
A. according to the above ratio, first by zinc oxide, potassium feldspar, be ground into respectively particle diameter be Nano grade particle, obtain nanoscale
Zinc oxide powder, nanoscale potassium feldspar powder, it is standby；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Nano-level zinc oxide powder, nanoscale potassium feldspar powder are put into reactor made from phenol deionized water and step A, are first heated
To 60 DEG C, and stir at such a temperature；Then 105 DEG C are again heated to, stirring, reaction 10 minutes.
High-temperature Resistance Adhesives made from this comparative example are under the conditions of 200 DEG C, shear strength 3.70MPa.
Claims (2)
1. a kind of high-temperature Resistance Adhesives, it is characterised in that be made by the raw material of following parts by weight：
30 parts~35 parts of styrene, 25 parts~30 parts of chlorinated polypropylene, 15 parts~20 parts of ethyl acetate, rosin resin 5 parts~10
Part, 5 parts~10 parts of phenolic resin, 0.1 part~0.5 part of zinc oxide, 0.3 part~0.7 part of potassium feldspar, silica 0.4 part~0.8
Part, 5 parts~10 parts of triethylamine, 1 part~5 parts of hydroquinones and 1 part~5 parts of deionized water.
2. high-temperature Resistance Adhesives according to claim 1, it is characterised in that including following preparation method：
A. according to the above ratio, zinc oxide, potassium feldspar, silica are first ground into the particle that particle diameter is Nano grade respectively, obtained
It is standby to nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder；
B. according to the above ratio, by styrene, chlorinated polypropylene, ethyl acetate, rosin resin, phenolic resin, triethylamine, to benzene two
Phenol, deionized water and nano-level zinc oxide powder, nanoscale potassium feldspar powder, nanometer grade silica powder made from step A
End is put into reactor, is first heated to 50 DEG C~60 DEG C, and stir at such a temperature；Then 85 DEG C~105 are again heated to
DEG C, stirring, reaction 10 minutes~60 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711227557.9A CN107746695B (en) | 2017-11-29 | 2017-11-29 | High-temperature Resistance Adhesives |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711227557.9A CN107746695B (en) | 2017-11-29 | 2017-11-29 | High-temperature Resistance Adhesives |
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| Publication Number | Publication Date |
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| CN107746695A true CN107746695A (en) | 2018-03-02 |
| CN107746695B CN107746695B (en) | 2019-05-17 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1715352A (en) * | 2005-07-29 | 2006-01-04 | 湖北大学 | Modified chlorinated polypropylene adhesive |
| CN101974300A (en) * | 2010-10-28 | 2011-02-16 | 苏州凯康化工科技有限公司 | Water-based complex membrane sealing rubber and preparation method thereof |
| CN102746472A (en) * | 2012-04-20 | 2012-10-24 | 苏州兴业材料科技股份有限公司 | Modified polypropylene special resin and preparation method thereof |
-
2017
- 2017-11-29 CN CN201711227557.9A patent/CN107746695B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1715352A (en) * | 2005-07-29 | 2006-01-04 | 湖北大学 | Modified chlorinated polypropylene adhesive |
| CN101974300A (en) * | 2010-10-28 | 2011-02-16 | 苏州凯康化工科技有限公司 | Water-based complex membrane sealing rubber and preparation method thereof |
| CN102746472A (en) * | 2012-04-20 | 2012-10-24 | 苏州兴业材料科技股份有限公司 | Modified polypropylene special resin and preparation method thereof |
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| CN107746695B (en) | 2019-05-17 |
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