CN107745180A - A kind of method and apparatus of micro- part continuous stamping - Google Patents
A kind of method and apparatus of micro- part continuous stamping Download PDFInfo
- Publication number
- CN107745180A CN107745180A CN201710930661.8A CN201710930661A CN107745180A CN 107745180 A CN107745180 A CN 107745180A CN 201710930661 A CN201710930661 A CN 201710930661A CN 107745180 A CN107745180 A CN 107745180A
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- Prior art keywords
- micro
- strip
- absorbed layer
- cavity plate
- metallic film
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Links
- 238000000034 method Methods 0.000 title claims abstract description 19
- 230000007723 transport mechanism Effects 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 6
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 210000003720 plasmablast Anatomy 0.000 claims description 3
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 14
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims 1
- 240000006909 Tilia x europaea Species 0.000 claims 1
- 235000011941 Tilia x europaea Nutrition 0.000 claims 1
- 239000004571 lime Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 abstract description 14
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005264 electron capture Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of method and apparatus of micro- part continuous stamping.The laser blast wave induced by the laser irradiation of high power density, the short pulse of nanosecond in absorbed layer, blanking tool is served not only as, while metallic film is acted on as pressure-pad-force, the zero clearance for realizing micro- part is punched in high precision；The distance between jacking block and briquetting t are set between thickness of metal film t2With the thickness t of strip1Between, namely t2<t<t1It can ensure that micro- part has separated with metallic film after punching terminates, but still do not separated by the absorbed layer of laser blast wave effect partial with strip, so that micro- part continues to be bonded in strip after punching terminates, in the presence of transport mechanism, the continuous stamping of micro- part can be achieved.
Description
Technical field
The present invention relates to micro manufacturing field, specifically refers to a kind of method and apparatus of micro- part continuous stamping.
Background technology
MEMS (MEMS, Micro-Electro-Mechanical System), is in microelectric technique basis
Grow up, merged the technologies such as photoetching, burn into film, LIGA, silicon micromachined, non-silicon micromachined and precision optical machinery processing
The high-tech electronic mechanical devices of making.Wherein micro- part is MEMS core, in order to ensure MEMS system high reliability and
High accuracy is, it is necessary to which the various micro- parts for forming system have the characteristics that mechanical property is good, form and dimensional precision is high and in work
In industry application, micro- part needs to realize high-volume continuous production.
Chinese patent ZL201010505882.9 proposes indirect stroke after a kind of loading film flying using laser blast wave
The method of workpiece material.Film flying obtains energy and moved downward after laser-impact, motion a period of time and workpiece generation in die cavity
Collision, now obtains maximal rate, and the workpiece being put in when impact pressure exceedes the dynamic yield strength of material on mould occurs
Light deformation.But this method can only cause the Light deformation of part can not realize that what is often needed in production thrusts, and more difficult reality
The Continuous maching process of existing micro- part.Chinese patent ZL201510048737.5 puts forward a kind of micro- punching based on laser blast wave
Device is cut out, the knife edge die hole shape class of absorbed layer, mask and moisture film, mask aperture and die plate insert is sequentially placed on metallic film
Seemingly, laser beam transparent moisture film is irradiated on mask and absorbed layer respectively, in contoured shock wave and the knife edge die of die plate insert
Under the effect of hole, metallic film and jacking block are moved downward simultaneously, and metallic film is cut off, while acquisition one has given shape
Smooth micro- part, but the invention can not realize the continuous stamping to micro- part.
The content of the invention
The present invention is directed to the deficiency of above technology, there is provided a kind of method and apparatus of micro- part continuous stamping, is being punched
During, can be that is, real by controlling the distance between jacking block and briquetting between thickness of metal film and the thickness of strip
Micro- part is separated with metallic film after being now once punched, but absorbed layer is not broken, and micro- part still glues with absorbed layer
Knot, so as to realize continuous stamping.
A kind of method of micro- part continuous stamping, it is characterised in that comprise the following steps：
Step 1, the strip by glue bonding absorbed layer together and metallic film is integrally passed using transport mechanism
Operating position is delivered to, then strip is pressed on to the upper surface of cavity plate using pinch roller.
Step 2, high energy pulse laser light moisture film are irradiated on absorbed layer, are produced plasma blast, are utilized plasma
Shock wave caused by blast is in metallic film, under the cutting edge of cavity plate and the collective effect of jacking block, metallic film and top
The contact area of block continues to obtain micro- part of given shape up to being kept completely separate with metallic film toward moved beneath.
Step 3, after laser blast wave effect terminates, jacking block is resetted under the action of the spring, and micro- part is ejected into cavity plate, sent
The micro- part being bonded at still through glue on absorbed layer is taken away operating position by material mechanism, while feed mechanism will also pass through glue
The absorbed layer and the strip of metallic film being bonded together are sent to next station；
Step 4, repeat step two and step 3 are until whole strip handles completion completely；
Step 5, the strip being disposed is placed in acetone soln and is cleaned by ultrasonic, make to be bonded at micro- on absorbed layer
Part and strip separation, obtain micro- part.
A kind of described micro- part continuous stamping device, absorbed layer are covered on metallic film, absorbed layer and metallic film
Between be bonded with glue；The strip being made up of absorbed layer, glue and metallic film is covered on cavity plate, the lower surface of metallic film
With the upper surface of cavity plate；Moisture film is covered in the upper surface of absorbed layer；Laser beam transparent moisture film irradiates the upper table in absorbed layer
Face；Jacking block is arranged in cavity plate by cylindrical mating surface and the cylindrical mating surface of cavity plate, when jacking block is in upper extreme position,
Alignd with the upper surface of cavity plate the upper surface of jacking block；The external cylindrical surface of briquetting passes through in the lower inner cylinder face of external screw thread and cavity plate
Screw thread, which coordinates, to be arranged in cavity plate；Spring is arranged between jacking block and briquetting；When spring is in its fully unfolded position, jacking block
Clearance t being present between lower surface and the upper surface of briquetting, the gap is more than the thickness t2 of metallic film, and less than the thickness of strip
T1, i.e. t2<t<T1, pad are arranged between the regulation face of briquetting and the regulation face of cavity plate；The cutting edge of laser beam face cavity plate；Pressure
The strip being made up of absorbed layer, glue and metallic film is treated that blanking portion is pressed on cavity plate upper surface by wheel；By absorbed layer, glue
It is arranged on the strip of metallic film composition on feed mechanism, to realize the transmission of strip；The diameter d of laser beam is more than cavity plate sword
3 times of mouth maximum radial dimension d1, i.e. d>3*d1.
Described laser beam is the pulse laser beam after focusing on, and its light source is neodymium glass-YAG laser, pulsewidth 10-
100ns, pulse energy 0.1-100J, the spot diameter of laser beam is 2~4mm；
Described water film thickness is about 0.8~1mm；
The material of described absorbed layer is pitch-dark, and thickness is 50~200 μm；
The thickness of described glue is 5~10 μm；
The thickness of described metallic film is 10-150 μm；
The pretightning force scope that described spring can provide is 0.1~2N；
The present invention principle be：Strip installation is formed on the transfer mechanism by absorbed layer, glue and metallic film, is used in combination
Pinch roller is pressed on molding surface；The laser light restraint layer irradiation of high power density, short pulse after focusing is absorbing layer surface
When, absorbed layer absorbs laser energy and gasifies rapidly and be formed substantially simultaneously a large amount of dense high temperature, high pressure plasma, Gai Dengli
Daughter continues to absorb the expansion of laser energy steep temperature rise, and then blast forms high impact wave and acts on metal film surfaces,
The pressure of the shock wave is much larger than the upward holding power that jacking block provides, and metallic film and jacking block move downward compression spring simultaneously
Until reach minimum point；Because the distance between jacking block and briquetting t are between thickness of metal film t2With the thickness t of strip1Thickness
Between, namely t2<t<t1, it is ensured that micro- part has separated with metallic film after punching terminates, but is rushed by laser
The absorbed layer for hitting ripple effect partial does not still separate with strip, so that micro- part continues to be bonded in strip after punching terminates
On；Meanwhile laser blast wave, when acting on blanking area, the part outside blanking area is also made by laser blast wave
With the shock wave provides a thrust agreed with completely with being punched micro- External Shape, because the diameter d of laser beam is more than recessed
Mould edge mouth maximum radial dimension d13 times, that is, d>3*d1, ensure that the reliability of the thrust in micro- blanking process；Upper
Strip and micro- part are integrally transported out of into operating position using transport mechanism after once punching is completed, and are moved to next work
Position is punched next time, realizes the continuous stamping of micro- part, until whole strip punching finishes, will be punched what is finished afterwards
Strip is positioned over to be cleaned by ultrasonic in acetone soln, all micro- parts is separated with strip.
The beneficial effects of the practice of the present invention is：When micro- part moves downward, due to the supporting role of jacking block, ensure micro- punching
Sanction can obtain smooth micro- part；Because the diameter d of laser beam is more than cutting edge of die maximum radial dimension d13 times, by etc.
A laser blast wave part for ion blast is used for being punched micro- part, and another part is used as reliable pressure-pad-force, realized
The zero clearance punching of micro- part, the punching precision of micro- part can be increased substantially；The distance between jacking block and briquetting t are between metal
Film thickness t2With strip thickness t1Between, i.e. t2<t<t1, it is ensured that punching terminate after micro- part with metal foil
UF membrane, but still do not separated by the absorbed layer of laser blast wave effect partial with strip, so that micro- part is being punched
Continue to be bonded in strip after end, and continuous stamping is realized by transport mechanism；The thickness of adjusting gasket, it can be used for adjusting
The distance between jacking block and briquetting t, so that the punching of micro- part of the suitable different-thickness of the present invention.
Brief description of the drawings
Fig. 1：The method and apparatus of micro- part continuous stamping.
Figure includes, 1 laser beam, 2 moisture films, 3 absorbed layers, 4 glue, 5 metallic films, 6 jacking blocks, 7 springs, 8 pads, 9 pressures
Block, 10 cavity plates, 11 transport mechanisms, 12 pinch rollers.
Fig. 2：Jacking block schematic diagram.
Figure includes, 61 jacking block upper surfaces, 62 jacking block cylinder mating surfaces, 63 jacking block lower surfaces
Fig. 3：Briquetting schematic diagram.
Figure includes, 91 briquetting upper surfaces, 92 briquettings regulation face, 93 briquetting external cylindrical surfaces, 94 briquetting lower surfaces.
Fig. 4：Cavity plate schematic diagram.
Figure includes, interior under 101 cavity plate upper surfaces, 102 cavity plate cylinder mating surfaces, 103 cavity plates regulation face, 104 cavity plates
The face of cylinder, 105 cavity plate lower surfaces；Cutting edge of die (106).
Embodiment
Preferably to illustrate the implementation detail of the present invention, below in conjunction with the accompanying drawings to a kind of micro- part continuous stamping of the present invention
Method and apparatus be described in detail.
A kind of method and apparatus of micro- part continuous stamping of the present invention, including laser beam 1, moisture film 2, absorbed layer 3, glue
4th, metallic film 5, jacking block 6, spring 7, pad 8, briquetting 9, cavity plate 10, transport mechanism 11, pinch roller 12；Specific action process is such as
Under：The strip of the absorbed layer 3 being bonded together by glue 4 and metallic film 5 is integrally transported into working position with transport mechanism 11
Put and compressed with pinch roller 12；Laser beam 1 is irradiated on the surface of absorbed layer 3 through moisture film 2；Absorbed layer 3 absorbs the energy of laser beam 1
Plasma blast is produced under the constraint of moisture film 2, forms shock wave, metallic film 5 and jacking block 6 start compression spring 7 and transported downwards
It is dynamic, when reaching minimum point because of the distance between jacking block 6 and briquetting 9 between the thickness of metallic film 5 and the thickness of strip, institute
Separated with being once punched micro- part afterwards with metallic film 5, but absorbed layer 3 is not broken, and micro- part and absorbed layer 3
Still it is bonded；Micro- part that once punching will be remained bound on absorbed layer 3 after terminating by transport mechanism 11 by glue 4
Operating position is taken away, while strip is also sent to next station and is punched by transport mechanism, is so repeated until whole band
Material punching finishes；The strip that finishes will be punched afterwards and be positioned over and be cleaned by ultrasonic in acetone soln, make all micro- parts with
Strip separates, and obtains the micro- part of batch..
Embodiment one：
The pulsewidth of laser beam 1 described in this example is 10ns, pulse energy 5J, and spot diameter is 2mm after focusing；Absorbed layer
3 be the black polyester adhesive tape that thickness is 100 μm；Metallic film 5 is A304 stainless steel films, and thickness is 60 μm, and glue thickness is
10μm；The material of jacking block 6 is 20Cr steel, and the distance of jacking block lower surface and briquetting upper surface is 80 μm；The pretightning force that spring 7 provides
For 1.2N, the material of pad 8 is stainless steel F1, and the thickness of pad is 75 μm, and the material of briquetting 9 is 20Cr steel, the material of cavity plate 10
Matter is T7 steel, and cutting edge of die is shaped as circle, a diameter of 200 μm.
After method and apparatus using a kind of micro- part continuous stamping of the present invention, successfully prepare large batch of
A304 stainless steels thickness is 60 μm, the micro- part of a diameter of 200 μm of circles.
Embodiment two：
The pulsewidth of laser beam 1 described in this example is 10ns, pulse energy 5J, and spot diameter is 3mm after focusing；Absorbed layer
3 be the black polyester adhesive tape that thickness is 150 μm；Metallic film 5 is H62 brass films, and thickness is 100 μm, and glue thickness is 10 μ
m；The material of jacking block 6 is 20Cr steel, and the distance of jacking block lower surface and briquetting upper surface is 120 μm；Spring 7 provide pretightning force be
1.2N, the material of pad 8 are stainless steel F1, and the thickness of pad is 115 μm, and the material of briquetting 9 is 20Cr steel, the material of cavity plate 10
For T7 steel, cutting edge of die is shaped as gear, external diameter 1mm.
After method and apparatus using a kind of micro- part continuous stamping of the present invention, successfully prepare large batch of
H62 brass external diameter is 1mm, and thickness is 100 μm of micro-cell electron capture detector.
Embodiment three：
The pulsewidth of laser beam 1 described in this example is 10ns, pulse energy 5J, and spot diameter is 4mm after focusing；Absorbed layer
3 be the black polyester adhesive tape that thickness is 200 μm；Metallic film 5 is T2 red copper films, and thickness is 150 μm, and glue thickness is 10 μ
m；The material of jacking block 6 is 20Cr steel, and the distance of jacking block lower surface and briquetting upper surface is 170 μm；Spring 7 provide pretightning force be
1.2N, the material of pad 8 is stainless steel F1, and the thickness of pad is 165 μm；The material of briquetting 9 is 20Cr steel, the material of cavity plate 10
For T7 steel, cutting edge of die is shaped as the square that the length of side is 300 μm.
After method and apparatus using a kind of micro- part continuous stamping of the present invention, large batch of side has successfully been prepared
A length of 300 μm, the micro- part of T2 red coppers square that thickness is 150 μm.
Claims (6)
- A kind of 1. device of micro- part continuous stamping, it is characterised in that：Described device includes moisture film, absorbed layer, glue, metal foil Film, jacking block, spring, pad, briquetting, cavity plate, transport mechanism, pinch roller；Absorbed layer is covered on metallic film, absorbed layer and metal It is bonded between film with glue；The strip being made up of absorbed layer, glue and metallic film is covered on cavity plate, under metallic film Surface and the upper surface of cavity plate；Moisture film is covered in the upper surface of absorbed layer；Laser beam transparent moisture film is irradiated in absorbed layer Upper surface；Jacking block is arranged in cavity plate by cylindrical mating surface and the cylindrical mating surface of cavity plate, and jacking block is in limes superiors position When putting, the upper surface of jacking block is alignd with the upper surface of cavity plate；The external cylindrical surface of briquetting passes through external screw thread and the lower interior cylinder of cavity plate The screw-internal thread fit in face is arranged in cavity plate；Spring is arranged between jacking block and briquetting；When spring is in its fully unfolded position, Clearance t be present between the lower surface of jacking block and the upper surface of briquetting, the gap is more than the thickness t2 of metallic film, and is less than strip Thickness t1, i.e. t2<t<T1, pad are arranged between the regulation face of briquetting and the regulation face of cavity plate；Laser beam face cavity plate Cutting edge；The strip being made up of absorbed layer, glue and metallic film is treated that blanking portion is pressed on cavity plate upper surface by pinch roller；By absorbing The strip of layer, glue and metallic film composition is arranged on feed mechanism, to realize the transmission of strip.
- A kind of 2. device of micro- part continuous stamping as claimed in claim 1, it is characterised in that：The diameter d of laser beam is more than 3 times of cutting edge of die maximum radial dimension d1, i.e. d>3*d1.
- A kind of 3. device of micro- part continuous stamping as claimed in claim 1, it is characterised in that：Described laser beam is focusing Pulse laser beam afterwards, its light source are neodymium glass-YAG laser, pulsewidth 10-100ns, pulse energy 0.1-100J, are swashed The spot diameter of light beam is 2~4mm.
- A kind of 4. device of micro- part continuous stamping as claimed in claim 1, it is characterised in that：Described water film thickness is about 0.8~1mm；The material of described absorbed layer is pitch-dark, and thickness is 50~200 μm；The thickness of described glue is 5~10 μm； The thickness of described metallic film is 10-150 μm.
- A kind of 5. device of micro- part continuous stamping as claimed in claim 1, it is characterised in that：What described spring can provide Pretightning force scope is 0.1~2N.
- 6. implement the method for micro- part continuous stamping using device as claimed in claim 1, it is characterised in that in accordance with the following steps Carry out：Step 1, the strip by glue bonding absorbed layer together and metallic film is integrally sent to using transport mechanism Operating position, then strip is pressed on to the upper surface of cavity plate using pinch roller；Step 2, high energy pulse laser light moisture film are irradiated on absorbed layer, are produced plasma blast, are exploded using plasma Caused shock wave is in metallic film, under the cutting edge of cavity plate and the collective effect of jacking block, metallic film and jacking block Contact area continues to obtain micro- part of given shape up to being kept completely separate with metallic film toward moved beneath；Step 3, after laser blast wave effect terminates, jacking block is resetted under the action of the spring, and micro- part is ejected into cavity plate, feeder The micro- part being bonded at still through glue on absorbed layer is taken away operating position by structure, while feed mechanism will also pass through glue bonding Absorbed layer and the strip of metallic film together is sent to next station；Step 4, repeat step two and step 3 are until whole strip handles completion completely；Step 5, the strip being disposed is placed in acetone soln and is cleaned by ultrasonic, make to be bonded at micro- part on absorbed layer Separated with strip, obtain micro- part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710930661.8A CN107745180B (en) | 2017-10-09 | 2017-10-09 | A kind of method and apparatus of micro- part continuous stamping |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710930661.8A CN107745180B (en) | 2017-10-09 | 2017-10-09 | A kind of method and apparatus of micro- part continuous stamping |
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| CN107745180A true CN107745180A (en) | 2018-03-02 |
| CN107745180B CN107745180B (en) | 2019-08-02 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108676999A (en) * | 2018-04-12 | 2018-10-19 | 江苏大学 | A kind of laser-impact device of automatically replaceable glass restraint layer |
| CN110116157A (en) * | 2019-05-30 | 2019-08-13 | 广东工业大学 | A kind of induced with laser blanking and piercing with combination tool device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201677140U (en) * | 2009-09-29 | 2010-12-22 | 深圳市沃尔核材股份有限公司 | Full-automatic laser cutting machine |
| CN104841751A (en) * | 2015-01-30 | 2015-08-19 | 江苏大学 | Micro blanking device based on laser shock |
| CN104841750B (en) * | 2015-01-30 | 2017-07-18 | 江苏大学 | A kind of micro- blanking apparatus based on laser blast wave |
-
2017
- 2017-10-09 CN CN201710930661.8A patent/CN107745180B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201677140U (en) * | 2009-09-29 | 2010-12-22 | 深圳市沃尔核材股份有限公司 | Full-automatic laser cutting machine |
| CN104841751A (en) * | 2015-01-30 | 2015-08-19 | 江苏大学 | Micro blanking device based on laser shock |
| CN104841750B (en) * | 2015-01-30 | 2017-07-18 | 江苏大学 | A kind of micro- blanking apparatus based on laser blast wave |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108676999A (en) * | 2018-04-12 | 2018-10-19 | 江苏大学 | A kind of laser-impact device of automatically replaceable glass restraint layer |
| CN110116157A (en) * | 2019-05-30 | 2019-08-13 | 广东工业大学 | A kind of induced with laser blanking and piercing with combination tool device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107745180B (en) | 2019-08-02 |
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