CN107745180B - A kind of method and apparatus of micro- part continuous stamping - Google Patents
A kind of method and apparatus of micro- part continuous stamping Download PDFInfo
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- CN107745180B CN107745180B CN201710930661.8A CN201710930661A CN107745180B CN 107745180 B CN107745180 B CN 107745180B CN 201710930661 A CN201710930661 A CN 201710930661A CN 107745180 B CN107745180 B CN 107745180B
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- absorbed layer
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000007723 transport mechanism Effects 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 18
- 238000005520 cutting process Methods 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 238000004880 explosion Methods 0.000 claims description 6
- 230000013011 mating Effects 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000035939 shock Effects 0.000 claims description 6
- 229910052779 Neodymium Inorganic materials 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 14
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims 1
- 240000006909 Tilia x europaea Species 0.000 claims 1
- 235000011941 Tilia x europaea Nutrition 0.000 claims 1
- 239000004571 lime Substances 0.000 claims 1
- 238000004080 punching Methods 0.000 abstract description 17
- 229910000831 Steel Inorganic materials 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005264 electron capture Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of method and apparatus of micro- part continuous stamping.The laser blast wave induced by high power density, the laser irradiation of the short pulse of nanosecond in absorbed layer, serves not only as blanking tool, while acting on metallic film as pressure-pad-force, and the zero clearance high-precision for realizing micro- part is punched；The distance between jacking block and briquetting t are set between thickness of metal film t2With the thickness t of strip1Between namely t2<t<t1It can guarantee that micro- part has been separated with metallic film after punching terminates, but the absorbed layer by laser blast wave effect partial is not still separated with strip, to make micro- part continue to be bonded in strip after punching,, it can be achieved that the continuous stamping of micro- part under the action of transport mechanism.
Description
Technical field
The present invention relates to micro manufacturing field, the method and apparatus for specifically referring to a kind of micro- part continuous stamping.
Background technique
MEMS (MEMS, Micro-Electro-Mechanical System), is in microelectric technique basis
Grow up, has merged the technologies such as photoetching, burn into film, LIGA, silicon micromachined, non-silicon micromachined and precision machinery processing
The high-tech electronic mechanical devices of production.Wherein micro- part is the core of MEMS, in order to ensure MEMS system high reliability and
In high precision, the various micro- parts for needing to form system have the characteristics that mechanical property is good, form and dimensional precision is high and in work
In industry application, micro- part needs to realize high-volume continuous production.
Chinese patent ZL201010505882.9 proposes a kind of indirect stroke after utilizing laser blast wave load film flying
The method of workpiece material.Film flying obtains energy and moves downward after laser-impact, occurs in type intracavitary movement a period of time with workpiece
Collision, obtains maximum speed at this time, and the workpiece being put on mold when impact pressure is more than the dynamic yield strength of material occurs
Light deformation.But this method can only cause the Light deformation of part to can not achieve thrusting of often needing in production, and more difficult reality
The Continuous maching process of existing micro- part.Chinese patent ZL201510048737.5 puts forward a kind of micro- punching based on laser blast wave
Device is cut out, is sequentially placed absorbed layer, exposure mask and moisture film, the knife edge die hole shape class of mask aperture and die plate insert on metallic film
Seemingly, laser beam irradiates on exposure mask and absorbed layer respectively through moisture film, in the knife edge die of contoured shock wave and die plate insert
Under the effect of hole, metallic film and jacking block move downward simultaneously, and metallic film is cut off, while acquisition one has specific shape
Smooth micro- part, but the invention can not achieve the continuous stamping to micro- part.
Summary of the invention
The present invention is directed to the deficiency of the above technology, provides a kind of method and apparatus of micro- part continuous stamping, is being punched
It in the process, can be by control the distance between jacking block and briquetting between thickness of metal film and the thickness of strip, i.e., in fact
Now micro- part is separated with metallic film after primary punching, but absorbed layer is not broken, and micro- part is still viscous with absorbed layer
Knot, to realize continuous stamping.
A kind of method of micro- part continuous stamping, it is characterised in that the following steps are included:
Step 1 is integrally passed the strip of the absorbed layer being bonded together by glue and metallic film using transport mechanism
It send to operating position, then strip is pressed on to the upper surface of cavity plate using pinch roller.
Step 2, high energy pulse laser light moisture film irradiate on absorbed layer, generate plasma explosion, utilize plasma
The shock wave that explosion generates is in metallic film, under the cutting edge of cavity plate and the collective effect of jacking block, metallic film and top
The contact area of block continues to obtain micro- part of specific shape up to being kept completely separate with metallic film toward moved beneath.
Step 3, after laser blast wave acts on, jacking block resets under the action of the spring, and micro- part is ejected cavity plate, is sent
Material mechanism will be sticked to micro- part on absorbed layer still through glue and take away operating position, while feeding mechanism will also pass through glue
The strip of the absorbed layer and metallic film that are bonded together is transmitted to next station；
Step 4 repeats step 2 and step 3 until entire strip handles completion completely；
The strip being disposed is placed in acetone soln and is cleaned by ultrasonic by step 5, makes to be sticked to micro- on absorbed layer
Part and strip separation, obtain micro- part.
A kind of micro- part continuous stamping device, absorbed layer are covered on metallic film, absorbed layer and metallic film
Between be bonded with glue；It is covered on cavity plate by the strip that absorbed layer, glue and metallic film form, the lower surface of metallic film
It is contacted with the upper surface of cavity plate；Moisture film is covered on the upper surface of absorbed layer；Laser beam irradiates the upper table in absorbed layer through moisture film
Face；Jacking block is mounted in cavity plate by the cylindrical mating surface of cylindrical mating surface and cavity plate, when jacking block is in upper limit position,
The upper surface of jacking block is aligned with the upper surface of cavity plate；The external cylindrical surface of briquetting is interior by the lower inner cylinder face of external screw thread and cavity plate
It is threadedly engaged and is mounted in cavity plate；Spring is mounted between jacking block and briquetting；When spring is in fully unfolded position, jacking block
There are clearance t between lower end surface and the upper surface of briquetting, which is greater than the thickness t2 of metallic film, and is less than the thickness of strip
T1, i.e. t2 < t < t1, gasket are mounted between the adjusting face of briquetting and the adjusting face of cavity plate；The cutting edge of laser beam face cavity plate；Pressure
The strip being made of absorbed layer, glue and metallic film is waited for that blanking portion is pressed on cavity plate upper surface by wheel；By absorbed layer, glue
It is mounted on feeding mechanism with the strip of metallic film composition, to realize the transmission of strip；The diameter d of laser beam is greater than cavity plate sword
3 times of mouth maximum radial dimension d1, i.e. d > 3*d1.
The laser beam is the pulse laser beam after focusing, and light source is neodymium glass-YAG laser, pulsewidth 10-
100ns, pulse energy 0.1-100J, the spot diameter of laser beam are 2~4mm；
The water film thickness is about 0.8~1mm；
The material of the absorbed layer be it is pitch-dark, with a thickness of 50~200 μm；
The glue with a thickness of 5~10 μm；
The metallic film with a thickness of 10-150 μm；
The pretightning force range that the spring can provide is 0.1~2N；
The principle of the present invention are as follows: strip installation is formed on the transfer mechanism by absorbed layer, glue and metallic film, is used in combination
Pinch roller is pressed on molding surface；The laser light restraint layer irradiation of high power density, short pulse after focusing is absorbing layer surface
When, absorbed layer absorbs laser energy and gasifies rapidly and be formed substantially simultaneously a large amount of dense high temperature, high pressure plasma, this it is equal from
Daughter continues to absorb the expansion of laser energy steep temperature rise, and then explosion forms high impact wave and acts on metal film surfaces,
The pressure of the shock wave is much larger than the upward holding power that jacking block provides, and metallic film and jacking block move downward compressed spring simultaneously
Until reaching minimum point；Since the distance between jacking block and briquetting t are between thickness of metal film t2With the thickness t of strip1Thickness
Between namely t2<t<t1, it is ensured that micro- part has been separated with metallic film after punching terminates, but is rushed by laser
The absorbed layer for hitting wave effect partial is not still separated with strip, so that micro- part be made to continue to be bonded in strip after punching
On；Meanwhile laser blast wave, when acting on blanking area, the part outside blanking area is also by the work of laser blast wave
With the shock wave provides the pressing force agreed with completely with the micro- External Shape of punching, since the diameter d of laser beam is greater than recessed
Mould edge mouth maximum radial dimension d13 times, that is, d > 3*d1, ensure that the reliability of the pressing force in micro- blanking process；Upper
Strip and micro- part are integrally transported out of into operating position using transport mechanism after primary punching completion, and are moved to next work
Position is punched next time, realizes the continuous stamping of micro- part, until entire strip punching finishes, is later finished punching
Strip is placed in be cleaned by ultrasonic in acetone soln, separates all micro- parts with strip.
The beneficial effects of the practice of the present invention are as follows: when micro- part moves downward, due to the supporting role of jacking block, guarantee micro- punching
Sanction can obtain smooth micro- part；Since the diameter d of laser beam is greater than cutting edge of die maximum radial dimension d13 times, by etc.
Laser blast wave a part of ion explosion is used to be punched micro- part, and another part is used as reliable pressure-pad-force, realized
The zero clearance of micro- part is punched, and can increase substantially the punching precision of micro- part；The distance between jacking block and briquetting t are between metal
Film thickness t2With strip thickness t1Between, i.e. t2<t<t1, it is ensured that after punching terminates micro- part with metal foil
UF membrane, but the absorbed layer by laser blast wave effect partial is not still separated with strip, so that micro- part be made to be punched
After continue to be bonded in strip, and continuous stamping is realized by transport mechanism；The thickness of adjusting gasket can be used to adjust
The distance between jacking block and briquetting t, to make the punching of micro- part of the suitable different-thickness of the present invention.
Detailed description of the invention
Fig. 1: the method and apparatus of micro- part continuous stamping.
It include 1 laser beam, 2 moisture films, 3 absorbed layers, 4 glue, 5 metallic films, 6 jacking blocks, 7 springs, 8 gaskets, 9 pressures in figure
Block, 10 cavity plates, 11 transport mechanisms, 12 pinch rollers.
Fig. 2: jacking block schematic diagram.
It include 61 jacking block upper surfaces, 62 jacking block cylinder mating surfaces, 63 jacking block lower end surfaces in figure
Fig. 3: briquetting schematic diagram.
It include that 91 briquetting upper surfaces, 92 briquettings adjust face, 93 briquetting external cylindrical surfaces, 94 briquetting lower end surfaces in figure.
Fig. 4: cavity plate schematic diagram.
It include that 101 cavity plate upper surfaces, 102 cavity plate cylinder mating surfaces, 103 cavity plates are adjusted under face, 104 cavity plates in figure
Cylindrical surface, 105 cavity plate lower end surfaces；Cutting edge of die (106).
Specific embodiment
Preferably to illustrate implementation detail of the invention, with reference to the accompanying drawing to a kind of micro- part continuous stamping of the invention
Method and apparatus be described in detail.
A kind of method and apparatus of micro- part continuous stamping of the invention, including laser beam 1, moisture film 2, absorbed layer 3, glue
4, metallic film 5, jacking block 6, spring 7, gasket 8, briquetting 9, cavity plate 10, transport mechanism 11, pinch roller 12；Specific action process is such as
Under: the strip of the absorbed layer 3 and metallic film 5 that are bonded together by glue 4 is integrally transported into working position with transport mechanism 11
It sets and pinch roller 12 is used to compress；Laser beam 1 is irradiated through moisture film 2 on the surface of absorbed layer 3；The energy of the absorption laser beam 1 of absorbed layer 3
Plasma explosion is generated under the constraint of moisture film 2, forms shock wave, and metallic film 5 and jacking block 6 start compressed spring 7 and transport downwards
It is dynamic, when reaching minimum point because of the distance between jacking block 6 and briquetting 9 between 5 thickness of metallic film and the thickness of strip, institute
It has been separated with metallic film 5 with being once punched micro- part later, but absorbed layer 3 is not broken, and micro- part and absorbed layer 3
Still it is bonded；Micro- part that primary punching will be remained bound on absorbed layer 3 after terminating by transport mechanism 11 by glue 4
Operating position is taken away, while strip is also transmitted to next station and is punched by transport mechanism, so repeated until entire band
Material punching finishes；The strip that finishes of punching is placed in later and is cleaned by ultrasonic in acetone soln, make all micro- parts with
Strip separation obtains the micro- part of batch.
Embodiment one:
1 pulsewidth of laser beam described in this example is 10ns, pulse energy 5J, and spot diameter is 2mm after focusing；Absorbed layer
3 be the black polyester adhesive tape with a thickness of 100 μm；Metallic film 5 is A304 stainless steel film, with a thickness of 60 μm, glue with a thickness of
10μm；The material of jacking block 6 is 20Cr steel, and jacking block lower surface is 80 μm at a distance from briquetting upper surface；The pretightning force that spring 7 provides
For 1.2N, the material of gasket 8 is stainless steel F1, gasket with a thickness of 75 μm, the material of briquetting 9 is 20Cr steel, the material of cavity plate 10
Matter is T7 steel, and the shape of cutting edge of die is circle, and diameter is 200 μm.
After method and apparatus using a kind of micro- part continuous stamping of the invention, successfully prepare large batch of
For A304 stainless steel with a thickness of 60 μm, diameter is 200 μm of micro- parts of circle.
Embodiment two:
1 pulsewidth of laser beam described in this example is 10ns, pulse energy 5J, and spot diameter is 3mm after focusing；Absorbed layer
3 be the black polyester adhesive tape with a thickness of 150 μm；Metallic film 5 is H62 brass film, and with a thickness of 100 μm, glue is with a thickness of 10 μ
m；The material of jacking block 6 is 20Cr steel, and jacking block lower surface is 120 μm at a distance from briquetting upper surface；Spring 7 provide pretightning force be
1.2N, the material of gasket 8 are stainless steel F1, gasket with a thickness of 115 μm, the material of briquetting 9 is 20Cr steel, the material of cavity plate 10
For T7 steel, the shape of cutting edge of die is gear, outer diameter 1mm.
After method and apparatus using a kind of micro- part continuous stamping of the invention, successfully prepare large batch of
H62 brass outer diameter is 1mm, with a thickness of 100 μm of micro-cell electron capture detector.
Embodiment three:
1 pulsewidth of laser beam described in this example is 10ns, pulse energy 5J, and spot diameter is 4mm after focusing；Absorbed layer
3 be the black polyester adhesive tape with a thickness of 200 μm；Metallic film 5 is T2 red copper film, and with a thickness of 150 μm, glue is with a thickness of 10 μ
m；The material of jacking block 6 is 20Cr steel, and jacking block lower surface is 170 μm at a distance from briquetting upper surface；Spring 7 provide pretightning force be
1.2N, the material of gasket 8 are stainless steel F1, gasket with a thickness of 165 μm；The material of briquetting 9 is 20Cr steel, the material of cavity plate 10
For T7 steel, cutting edge of die shape is the square that side length is 300 μm.
After method and apparatus using a kind of micro- part continuous stamping of the invention, large batch of side has successfully been prepared
A length of 300 μm, with a thickness of 150 μm of the micro- part of T2 red copper square.
Claims (6)
1. a kind of device of micro- part continuous stamping, it is characterised in that: described device includes moisture film, absorbed layer, glue, metal foil
Film, jacking block, spring, gasket, briquetting, cavity plate, transport mechanism, pinch roller；Absorbed layer is covered on metallic film, absorbed layer and metal
It is bonded between film with glue；It is covered on cavity plate by the strip that absorbed layer, glue and metallic film form, under metallic film
Surface is contacted with the upper surface of cavity plate；Moisture film is covered on the upper surface of absorbed layer；Laser beam is irradiated through moisture film in absorbed layer
Upper surface；Jacking block is mounted in cavity plate by the cylindrical mating surface of cylindrical mating surface and cavity plate, and jacking block is in limes superiors position
When setting, the upper surface of jacking block is aligned with the upper surface of cavity plate；The external cylindrical surface of briquetting passes through the lower interior cylinder of external screw thread and cavity plate
The screw-internal thread fit in face is mounted in cavity plate；Spring is mounted between jacking block and briquetting；When spring is in fully unfolded position, top
There are clearance t between the lower end surface of block and the upper surface of briquetting, which is greater than the thickness t2 of metallic film, and is less than strip
Thickness t1, i.e. t2 < t < t1, gasket are mounted between the adjusting face of briquetting and the adjusting face of cavity plate；The sword of laser beam face cavity plate
Mouthful；The strip being made of absorbed layer, glue and metallic film is waited for that blanking portion is pressed on cavity plate upper surface by pinch roller；By absorbing
The strip of layer, glue and metallic film composition is mounted on feeding mechanism, to realize the transmission of strip.
2. a kind of device of micro- part continuous stamping as described in claim 1, it is characterised in that: the diameter d of laser beam is greater than
3 times of cutting edge of die maximum radial dimension d1, i.e. d > 3*d1.
3. a kind of device of micro- part continuous stamping as described in claim 1, it is characterised in that: the laser beam is to focus
Pulse laser beam afterwards, light source are neodymium glass-YAG laser, and pulsewidth 10-100ns, pulse energy 0.1-100J swash
The spot diameter of light beam is 2~4mm.
4. a kind of device of micro- part continuous stamping as described in claim 1, it is characterised in that: the water film thickness is
0.8~1mm；The material of the absorbed layer be it is pitch-dark, with a thickness of 50~200 μm；The glue with a thickness of 5~10 μm；
The metallic film with a thickness of 10-150 μm.
5. a kind of device of micro- part continuous stamping as described in claim 1, it is characterised in that: what the spring can provide
Pretightning force range is 0.1~2N.
6. implementing the method for micro- part continuous stamping using device as described in claim 1, which is characterized in that in accordance with the following steps
It carries out:
The strip of the absorbed layer being bonded together by glue and metallic film is integrally sent to by step 1 using transport mechanism
Then strip is pressed on the upper surface of cavity plate by operating position using pinch roller；
Step 2, high energy pulse laser light moisture film irradiate on absorbed layer, generate plasma explosion, are exploded using plasma
The shock wave of generation is in metallic film, under the cutting edge of cavity plate and the collective effect of jacking block, metallic film and jacking block
Contact area continues to obtain micro- part of specific shape up to being kept completely separate with metallic film toward moved beneath；
Step 3, after laser blast wave acts on, jacking block resets under the action of the spring, and micro- part is ejected cavity plate, feeder
Structure will be sticked to micro- part on absorbed layer still through glue and take away operating position, while feeding mechanism will also be bonded by glue
The strip of absorbed layer and metallic film together is transmitted to next station；
Step 4 repeats step 2 and step 3 until entire strip handles completion completely；
The strip being disposed is placed in acetone soln and is cleaned by ultrasonic by step 5, makes to be sticked to micro- part on absorbed layer
It is separated with strip, obtains micro- part.
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| CN201710930661.8A CN107745180B (en) | 2017-10-09 | 2017-10-09 | A kind of method and apparatus of micro- part continuous stamping |
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| CN201710930661.8A CN107745180B (en) | 2017-10-09 | 2017-10-09 | A kind of method and apparatus of micro- part continuous stamping |
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| CN107745180B true CN107745180B (en) | 2019-08-02 |
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| CN108676999B (en) * | 2018-04-12 | 2019-10-01 | 江苏大学 | A kind of laser-impact device of automatically replaceable glass restraint layer |
| CN110116157A (en) * | 2019-05-30 | 2019-08-13 | 广东工业大学 | A kind of induced with laser blanking and piercing with combination tool device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201677140U (en) * | 2009-09-29 | 2010-12-22 | 深圳市沃尔核材股份有限公司 | Full-automatic laser cutting machine |
| CN104841751A (en) * | 2015-01-30 | 2015-08-19 | 江苏大学 | Micro blanking device based on laser shock |
| CN104841750B (en) * | 2015-01-30 | 2017-07-18 | 江苏大学 | A kind of micro- blanking apparatus based on laser blast wave |
-
2017
- 2017-10-09 CN CN201710930661.8A patent/CN107745180B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201677140U (en) * | 2009-09-29 | 2010-12-22 | 深圳市沃尔核材股份有限公司 | Full-automatic laser cutting machine |
| CN104841751A (en) * | 2015-01-30 | 2015-08-19 | 江苏大学 | Micro blanking device based on laser shock |
| CN104841750B (en) * | 2015-01-30 | 2017-07-18 | 江苏大学 | A kind of micro- blanking apparatus based on laser blast wave |
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