CN107743342A - PCB surface treatment method and equipment - Google Patents
PCB surface treatment method and equipment Download PDFInfo
- Publication number
- CN107743342A CN107743342A CN201710970523.2A CN201710970523A CN107743342A CN 107743342 A CN107743342 A CN 107743342A CN 201710970523 A CN201710970523 A CN 201710970523A CN 107743342 A CN107743342 A CN 107743342A
- Authority
- CN
- China
- Prior art keywords
- pcb
- coordinate
- solder
- nozzle
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004381 surface treatment Methods 0.000 title claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 51
- 239000007921 spray Substances 0.000 claims abstract description 20
- 238000005516 engineering process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000007747 plating Methods 0.000 abstract description 4
- 238000007654 immersion Methods 0.000 abstract description 2
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Image Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to PCB technical fields, a kind of PCB surface treatment method and equipment are specifically disclosed, and PCB surface treatment method comprises the following steps：Position coated with solder by the way of a spray to needing to be covered by solder on PCB.PCB provided by the invention surface treatment method and equipment, replace traditional immersion plating to be surface-treated by using a spray, it is possible to prevente effectively from the problems such as white point and layering occurs in process of production in PCB, improve PCB reliability.
Description
Technical field
The present invention relates to the surface treatment method and equipment of PCB technical fields, more particularly to a kind of PCB.
Background technology
PCB (Printed Circuit Board, abbreviation PCB), Chinese is printed circuit board, also known as printed wire
Plate, it is important electronic unit, is the supporter of electronic component, is the carrier of electronic component electrical connection.Because it is
Made using electron printing, therefore be referred to as " printing " circuit board.
Traditional PCB production technologies generally comprise pressing, drilling, plating, outer-layer circuit graphic making and surface treatment etc.
Process, however, many problems such as occurring comprising white point and be layered by PCB made of above-mentioned operation.
Therefore, it is badly in need of a kind of PCB handling process, it is possible to prevente effectively from white point and layering occurs in process of production in PCB
The problems such as, improve PCB reliability.
The content of the invention
It is an object of the present invention to：A kind of PCB surface treatment method is provided, it is possible to prevente effectively from PCB is being produced
During there is the problems such as white point and layering, improve PCB reliability.
It is another object of the present invention to：A kind of PCB surface processing equipment is provided, it is possible to prevente effectively from PCB is in life
Occur the problems such as white point and layering during production, improve PCB reliability.
For up to this purpose, on the one hand, the present invention provides a kind of PCB surface treatment method, comprises the following steps：
Position coated with solder by the way of a spray to needing to be covered by solder on PCB.
Preferably, the solder is tin cream.
Specifically, by research for a long time, inventor summarizes to obtain：Traditional process of surface treatment is to cause PCB
The main reason for producing white point and layering.Traditional surface treatment method is to put PCB in electroplating pool into electroplated, electroplating pool
In temperature of electroplating solution it is higher, PCB is excessively heated in the electroplate liquid of high temperature, just generates the flaw such as white point and layering, reduces
The reliability of product.Therefore, the present invention provides a kind of process of surface treatment for putting spray formula, avoids monoblock PCB in the electricity of high temperature
Soaked in plating solution, so as to effectively avoid PCB from producing the problems such as white point is with being layered, so as to improve PCB reliability.This programme
The thermal stress being subject to except PCB can be reduced, moreover it is possible to save the energy, reduce solder loss etc..
As a preferred embodiment, the step：To being needed on PCB by solder covering by the way of a spray
Position coated with solder is specially：
Using coated with solder on metal layer on the pad and/or hole wall of PCB surface by the way of a spray.
Specifically, coated with solder on the metal layer on the pad and/or hole wall of PCB surface, later stage weldering can be improved
The combined with firmness of scolding tin and copper foil when connecing component, it can also reduce welding difficulty.
As a preferred embodiment, the step：To being needed on PCB by solder covering by the way of a spray
It is further comprising the steps of before the coated with solder of position：
Determine to need on PCB by the accurate coordinates of the position of solder covering, and moving nozzle makes described in the nozzle alignment
Accurate coordinates.
Specifically, due to being surface-treated using a spray formula, so being accurately positioned just to pad and plated through-hole etc.
Seem particularly significant.
As a preferred embodiment, the step：Determine to need on PCB by the accurate seat of the position of solder covering
Mark, and moving nozzle comprises the following steps accurate coordinates described in the nozzle alignment：
Made and the PCB identicals sample by object of reference of the PCB；
After the sample is fixed on into predeterminated position, recording needs the coordinate by the position of solder covering to believe on the sample
Breath, is designated as the first coordinate；
The PCB is fixed on the predeterminated position, then determines to need on PCB in opening position corresponding to the first coordinate
By the accurate coordinates of the position of solder covering, the second coordinate is designated as；
Moving nozzle simultaneously makes the second coordinate described in the nozzle alignment.
Specifically, the size dimension of sample and related line pattern information are first determined, these information are inputted and controlled
Device, because sample and PCB are identicals, fixed position is also identical, even if so slightly error, PCB is fixed on
Needed after on predeterminated position, on PCB by solder covering position also should the coordinate of distance first it is not far.Video identification device is moved
Move to after the first nearby coordinates, open video identification device, by video identification device carry out target location (needed on PCB by
Solder covering position) be accurately positioned, the coordinate of target location is designated as the second coordinate.After being accurately positioned, so that it may so that spray
Mouth alignment needs the position covered by solder, then carries out spray tin.During a spray is carried out, it can also be identified by image
Device is monitored in real time, corrects the coordinate of target location and the position of nozzle at any time.
As a preferred embodiment, the step：After the sample is fixed on into predeterminated position, the sample is recorded
Need, by the coordinate information of the position of solder covering, to be designated as before the first coordinate on product, it is further comprising the steps of：
Rectangular coordinate system is established as reference by location coordinate.
As a preferred embodiment, the step：The PCB is fixed on the predeterminated position, Ran Hou
Opening position corresponding to first coordinate determines to need on PCB by the accurate coordinates of the position of solder covering, and it is specific to be designated as the second coordinate
For：
The PCB is fixed on the predeterminated position, then identified in opening position corresponding to the first coordinate by image
Technology identifies the position for needing to be covered on PCB by solder, and the result identified according to image calculates the second coordinate.
On the other hand, the present invention provides a kind of PCB surface processing equipment, for performing any of the above-described kind of PCB surface
Processing method,
Including alignment system and for a nozzle for surfacing material；
The alignment system is used to move the nozzle and makes to need on PCB described in the nozzle alignment by solder covering
Position.
As a preferred embodiment, the alignment system includes control device, performs device and image identification dress
Put, the performs device is electrically connected with video identification device with control device；
The control device is used for the graphical information and positional information for receiving sample, and North Korea's material covering will be needed on sample
The first coordinate of position be sent to performs device；
The performs device is used for according to the first coordinate movable image identification device received from the control device, and makes
The video identification device is directed at first coordinate；
The video identification device is used to identify the position for needing to be covered on PCB by solder, and by acquired information
Send to control device；
The control device is additionally operable to determine the second coordinate according to the information received from the video identification device, and will
Second coordinate is sent to performs device；
The performs device is additionally operable to according to the second coordinate moving nozzle received from the control device, and is made described
Second coordinate described in nozzle alignment.
Preferably, the performs device is mechanical arm.
As a preferred embodiment, the video identification device is arranged on the nozzle.
Specifically, video identification device is arranged on nozzle, it is possible to realize that video identification device is synchronous with nozzle
It is mobile, it is more beneficial for being monitored the position of nozzle.
Beneficial effects of the present invention are：A kind of PCB surface treatment method and equipment is provided, replaces passing by using a spray
The immersion plating of system is surface-treated, it is possible to prevente effectively from the problems such as white point and layering occurs in process of production in PCB, is carried
High PCB reliability.
Brief description of the drawings
The present invention is described in further detail below according to drawings and examples.
Fig. 1 is the surface treatment method block diagram for the PCB that embodiment one provides；
Fig. 2 is the schematic diagram of the surface processing equipment for the PCB that embodiment two provides.
In figure：
1st, control device；
2nd, performs device；
3rd, nozzle；
4th, video identification device；
5、PCB。
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
Embodiment one
As shown in figure 1, the present embodiment provides a kind of PCB surface treatment method, including step S10~S20.
S10：Determine to need on PCB 5 by the accurate coordinates of the position of solder covering, and moving nozzle 3 is directed at nozzle 3
Accurate coordinates.
Specifically, S10 comprises the following steps：
S101：Rectangular coordinate system is established as reference by location coordinate；
S102：It is that object of reference makes and the identical samples of PCB 5 with the PCB 5；
S103：After the sample is fixed on into predeterminated position, recording needs on the sample by the position of solder covering
Coordinate information, it is designated as the first coordinate；
S104：The PCB 5 is fixed on the predeterminated position, then determined in opening position corresponding to the first coordinate
Need, by the accurate coordinates of the position of solder covering, to be designated as the second coordinate on PCB 5；
Preferably, the position covered by solder can be recognized the need for by image recognition technology, is identified according to image
As a result the second coordinate is calculated.Preferably, the position covered by solder, root can also be recognized the need for by infrared detection technique
The second coordinate is calculated according to the result of infrared acquisition.
S105：Moving nozzle 3 simultaneously makes the nozzle 3 be directed at second coordinate.
S20：Position (the second coordinate) coated with solder by the way of a spray to needing to be covered by solder on PCB 5.
Specifically, carry out a spray primarily directed to the metal layer on the pad and/or hole wall on the surfaces of PCB 5 to operate, line
Road part can operate without a spray.
Embodiment two
As shown in Fig. 2 the present embodiment provides a kind of PCB surface processing equipment, for performing the surface in embodiment one
Processing method, including alignment system and for a nozzle for surfacing material 3；The alignment system is used to the nozzle 3 being moved to
Needed on alignment PCB 5 by the place of the position of solder covering.
The alignment system includes control device 1, performs device 2 (can be the transport establishments such as mechanical arm) and image identification
Device 4 (can be the picture pick-up devices such as camera), the performs device 2 electrically connects with video identification device 4 with control device 1
Connect；The control device 1 is first used for the graphical information for receiving sample and positional information (can be manually into control device 1
The relevant informations such as the first coordinate of input sample, the relevant information of sample can also be obtained by influenceing identification technology), and by the
One coordinate (being needed on sample by the coordinate of the position of solder covering) is sent to performs device 2；The performs device 2 is first used for
Video identification device 4 is moved to by position corresponding with the first coordinate according to the information that control device 1 sends over, knows image
Other device 4 is located at the first nearby coordinates, and is directed at first coordinate；The video identification device 4 is used to identify PCB 5
The position covered by solder is needed, and acquired information is sent to control device 1；The control device 1 is additionally operable to basis
The information that video identification device 4 sends over determines the second coordinate, and the second coordinate is sent into performs device 2；The execution
Device 2 is additionally operable to that nozzle 3 is moved into position corresponding with the second coordinate according to the second coordinate that control device 1 sends over,
Nozzle 3 is set to be directed at the second coordinate.
Specifically, after sample being fixed on into predeterminated position, by the relevant informations such as the size dimension of sample and line pattern (bag
Include the first coordinate) be input to control system, control system according to these information control performs device 2 by video identification device 4 or
Person's infrared equipment is moved to the first nearby coordinates, then by video identification device 4 or infrared equipment in the first nearby coordinates
Determine to need on PCB 5 by the coordinate of the position of solder covering, it is possible to obtain comparing the coordinate (i.e. the of accurately target location
Two coordinates).At this time performs device 2 again by nozzle 3 be moved to alignment the second coordinate place carry out spray tin.
In the present embodiment, the video identification device 4 is arranged on the nozzle 3.Certainly, video identification device 4
It can be arranged in performs device 2.
In the present embodiment, infrared equipment can also be used to replace video identification device 4 to carry out pad and plated through-hole
It is accurately positioned.
" first " herein, " second " etc. in description just for the sake of being distinguish between, not special implication.
Statement is additionally needed, each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (9)
1. a kind of PCB surface treatment method, it is characterised in that comprise the following steps：To being needed on PCB by the way of a spray
The position coated with solder covered by solder.
2. PCB according to claim 1 surface treatment method, it is characterised in that the step：By the way of a spray
To needing the position coated with solder by solder covering to be specially on PCB：
Using coated with solder on metal layer on the pad and/or hole wall of PCB surface by the way of a spray.
3. the surface treatment method of the PCB according to any one of claim 1 or 2, it is characterised in that the step：Using
Point spray mode to needed on PCB by solder covering position coated with solder before, it is further comprising the steps of：
Determine to need on PCB by the accurate coordinates of the position of solder covering, and moving nozzle makes described in the nozzle alignment accurately
Coordinate.
4. PCB according to claim 3 surface treatment method, it is characterised in that the step：Determine to need on PCB
By the accurate coordinates of the position of solder covering, and moving nozzle comprises the following steps accurate coordinates described in the nozzle alignment：
Made and the PCB identicals sample by object of reference of the PCB；
After the sample is fixed on into predeterminated position, recording needs on the sample by the coordinate information of the position of solder covering,
It is designated as the first coordinate；
The PCB is fixed on the predeterminated position, then determines to need to be welded on PCB in opening position corresponding to the first coordinate
Expect the accurate coordinates of the position of covering, be designated as the second coordinate；
Moving nozzle simultaneously makes the second coordinate described in the nozzle alignment.
5. PCB according to claim 4 surface treatment method, it is characterised in that the step：The sample is fixed
After predeterminated position, record needs, by the coordinate information of the position of solder covering, to be designated as before the first coordinate, also on the sample
Comprise the following steps：
Rectangular coordinate system is established as reference by location coordinate.
6. PCB according to claim 4 surface treatment method, it is characterised in that the step：The PCB is fixed
On the predeterminated position, then determine to need on PCB by the essence of the position of solder covering in opening position corresponding to the first coordinate
True coordinate, being designated as the second coordinate is specially：
The PCB is fixed on the predeterminated position, then passes through image recognition technology in opening position corresponding to the first coordinate
The position for needing to be covered on PCB by solder is identified, and the result identified according to image calculates the second coordinate.
7. a kind of PCB surface processing equipment, the surface treatment side of the PCB described in 1~6 any one is required for perform claim
Method, it is characterised in that
Including alignment system and for a nozzle for surfacing material；
The alignment system is used to move the nozzle and makes to need the position covered by solder described in the nozzle alignment on PCB
Put.
8. PCB according to claim 7 surface processing equipment, it is characterised in that
The alignment system includes control device, performs device and video identification device, and the performs device fills with image identification
Put and be electrically connected with control device；
The control device is used for the graphical information and positional information for receiving sample, and will be needed on sample by the position of solder covering
The first coordinate put is sent to performs device；
The performs device is used for according to the first coordinate movable image identification device received from the control device, and makes described
Video identification device is directed at first coordinate；
The video identification device is used to identify the position for needing to be covered on PCB by solder, and acquired information is sent
To control device；
The control device is additionally operable to determine the second coordinate according to the information that receives from the video identification device, and by second
Coordinate is sent to performs device；
The performs device is additionally operable to according to the second coordinate moving nozzle received from the control device, and makes the nozzle
It is directed at second coordinate.
9. PCB according to claim 8 surface processing equipment, it is characterised in that the video identification device is arranged on
On the nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970523.2A CN107743342B (en) | 2017-10-18 | 2017-10-18 | The surface treatment method and equipment of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710970523.2A CN107743342B (en) | 2017-10-18 | 2017-10-18 | The surface treatment method and equipment of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107743342A true CN107743342A (en) | 2018-02-27 |
| CN107743342B CN107743342B (en) | 2019-11-12 |
Family
ID=61236877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710970523.2A Expired - Fee Related CN107743342B (en) | 2017-10-18 | 2017-10-18 | The surface treatment method and equipment of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107743342B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100487829C (en) * | 2003-06-20 | 2009-05-13 | 塔工程有限公司 | Paste dispenser and method for controlling the same |
| CN102281749A (en) * | 2010-06-10 | 2011-12-14 | 世成电子(深圳)有限公司 | Mounting method, mounting system and mounting machine |
| CN203293679U (en) * | 2013-05-03 | 2013-11-20 | 广东轻工职业技术学院 | Spot-spraying apparatus for PCB solder paste jet printing |
| CN104551301A (en) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | Full-automatic intelligent-welding assembly line |
| CN204954115U (en) * | 2015-08-14 | 2016-01-13 | 长沙金诺自动化技术有限公司 | Selectivity scaling powder spraying device |
| CN107042346A (en) * | 2016-02-05 | 2017-08-15 | 中芯国际集成电路制造(上海)有限公司 | Soldered ball forming apparatus and soldered ball forming method |
| CN206472378U (en) * | 2016-10-09 | 2017-09-05 | 东莞新友智能科技有限公司 | One kind spray tin cream and patch combination equipment |
| CN206474774U (en) * | 2017-02-16 | 2017-09-08 | 厦门力巨自动化科技有限公司 | Automatic tin welding machine |
-
2017
- 2017-10-18 CN CN201710970523.2A patent/CN107743342B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100487829C (en) * | 2003-06-20 | 2009-05-13 | 塔工程有限公司 | Paste dispenser and method for controlling the same |
| CN102281749A (en) * | 2010-06-10 | 2011-12-14 | 世成电子(深圳)有限公司 | Mounting method, mounting system and mounting machine |
| CN203293679U (en) * | 2013-05-03 | 2013-11-20 | 广东轻工职业技术学院 | Spot-spraying apparatus for PCB solder paste jet printing |
| CN104551301A (en) * | 2014-12-30 | 2015-04-29 | 东莞市合易自动化科技有限公司 | Full-automatic intelligent-welding assembly line |
| CN204954115U (en) * | 2015-08-14 | 2016-01-13 | 长沙金诺自动化技术有限公司 | Selectivity scaling powder spraying device |
| CN107042346A (en) * | 2016-02-05 | 2017-08-15 | 中芯国际集成电路制造(上海)有限公司 | Soldered ball forming apparatus and soldered ball forming method |
| CN206472378U (en) * | 2016-10-09 | 2017-09-05 | 东莞新友智能科技有限公司 | One kind spray tin cream and patch combination equipment |
| CN206474774U (en) * | 2017-02-16 | 2017-09-08 | 厦门力巨自动化科技有限公司 | Automatic tin welding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107743342B (en) | 2019-11-12 |
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Granted publication date: 20191112 |