CN203293679U - Spot-spraying apparatus for PCB solder paste jet printing - Google Patents
Spot-spraying apparatus for PCB solder paste jet printing Download PDFInfo
- Publication number
- CN203293679U CN203293679U CN2013202360407U CN201320236040U CN203293679U CN 203293679 U CN203293679 U CN 203293679U CN 2013202360407 U CN2013202360407 U CN 2013202360407U CN 201320236040 U CN201320236040 U CN 201320236040U CN 203293679 U CN203293679 U CN 203293679U
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- screw rod
- paste
- pcb
- spot
- pressure chamber
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Abstract
The utility model discloses a spot-spraying apparatus for PCB solder paste jet printing. The spot-spraying apparatus comprises a pressure bar, a screw rod and a pressure cabin, wherein a spring is sleeved to the lower portion of the pressure bar, the screw rod is arranged at the side edge of the pressure bar, the pressure cabin is arranged under the pressure bar, and the PCB is arranged under the pressure cabin. The screw of the screw rod points at the pressure cabin. Scolding tin from the welding nozzle may not be too much, thereby preventing waste of solder paste. Scolding process is rapid, and work efficiency is high.
Description
Technical field
The utility model relates to a kind of some spray apparatus, more particularly, is a kind of spray apparatus of point for PCB solder(ing) paste spray printing.
Background technology
Surface installation technique (SMT) has been penetrated into every field as Electronic Assemblies technology of new generation, SMT development rapidly, be widely used, replaced traditional Electronic Assemblies technology fully in a lot of fields.SMT, with the characteristics and advantages of self, makes the Electronic Assemblies technology produce basic, revolutionary change, and in application process, constantly develops perfect.
Solder-Paste Printing is the first operation in the SMT production technology, and output and quality that SMT is produced all can have vital impact, the demand of producing for adapting to present SMT, and Solder-Paste Printing equipment has following developing direction at present:
1. novel mould printing equipment just develops towards two-way delivery board print direction;
2. novel mould printing equipment just develops towards intelligent direction;
3. the soldering paste working environment is developed to sealing by open;
4. by biting, to spray printing, develop.
Yet on market, the some spray apparatus of a lot of PCB solder(ing) paste spray printings easy tip solder(ing) paste out in the scolding tin process causes the waste of solder(ing) paste too much, and the scolding tin process is slow simultaneously, and efficiency is not high enough.
The utility model content
The purpose of this utility model is to provide a kind of little waste for PCB solder(ing) paste spray printing high efficiency some spray apparatus.
For achieving the above object, the utility model has adopted following technical scheme:
A kind of spray apparatus of point for PCB solder(ing) paste spray printing is characterized in that: mainly depression bar, screw rod and pressure chamber, consist of, described depression bar bottom cover has spring, screw rod to be located at the depression bar side, and the depression bar below is provided with pressure chamber, and the pressure chamber below is pcb board.
The screw of described screw rod points to pressure chamber.
The utlity model has following beneficial effect:
(1) tip scolding tin out can be not too many, thereby prevent from causing the waste of solder(ing) paste;
(2) the scolding tin process is than very fast, and operating efficiency is higher.
The accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein, 1-depression bar, 2-screw rod, 3-pressure chamber, 4-PCB plate, 5-scolding tin, 6-spring.
The specific embodiment
As shown in Figure 1, a kind of spray apparatus of point for PCB solder(ing) paste spray printing, it is characterized in that: mainly by depression bar 1, screw rod 2 and pressure chamber 3, formed, described depression bar 1 bottom cover has spring 6, spring 6 plays the effect of supporting depression bar 1, and screw rod 2 is located at depression bar 1 side, and depression bar 1 below is provided with pressure chamber 3, in pressure chamber 3, store scolding tin, pressure chamber 3 belows are pcb board 4.
Further, the screw of screw rod 2 points to pressure chamber 3, and it is optimum state that screw rod 2 is miter angle with pressure chamber 3.
In traditional Solder-Paste Printing process, it is the major reason that causes printing defects that soldering paste is exposed under open environment for a long time, and this spray apparatus of point for PCB solder(ing) paste spray printing is sealing extrusion formula print head, can effectively address the above problem.From soldering paste, in open environment, roll different, the soldering paste here is installed in the pressure chamber 3 of sealing, only has the perforate soldering paste just with pcb board 4, to contact, and standard solder paste encapsulation depression bar 1 constantly carrys out the filling soldering paste by pressure, and dynamic pressure is provided, make soldering paste enter perforate.This technology has fundamentally been eliminated the maximum Variable Factors that affects Solder-Paste Printing, makes the user without considering that printing time is had a rest or the situation such as machine working time, and tip scolding tin out can be not too many, thereby prevent from causing the waste of solder(ing) paste; The scolding tin process is than very fast, and operating efficiency is higher, thereby obtains satisfied effect.
Claims (2)
1. spray apparatus of the point for PCB solder(ing) paste spray printing, it is characterized in that: by depression bar (1), screw rod (2) and pressure chamber (3), formed, described depression bar (1) bottom cover has spring (6), screw rod (2) is located at depression bar (1) side, depression bar (1) below is provided with pressure chamber (3), and pressure chamber (3) below is pcb board (4).
2. a kind of spray apparatus of point for PCB solder(ing) paste spray printing according to claim 1, is characterized in that: the screw sensing pressure chamber (3) of described screw rod (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202360407U CN203293679U (en) | 2013-05-03 | 2013-05-03 | Spot-spraying apparatus for PCB solder paste jet printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013202360407U CN203293679U (en) | 2013-05-03 | 2013-05-03 | Spot-spraying apparatus for PCB solder paste jet printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203293679U true CN203293679U (en) | 2013-11-20 |
Family
ID=49569717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013202360407U Expired - Fee Related CN203293679U (en) | 2013-05-03 | 2013-05-03 | Spot-spraying apparatus for PCB solder paste jet printing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203293679U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107743342A (en) * | 2017-10-18 | 2018-02-27 | 广东生益科技股份有限公司 | PCB surface treatment method and equipment |
| CN108819493A (en) * | 2018-06-01 | 2018-11-16 | 深圳市容大感光科技股份有限公司 | A kind of method and apparatus of isochronous printing and photocuring |
-
2013
- 2013-05-03 CN CN2013202360407U patent/CN203293679U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107743342A (en) * | 2017-10-18 | 2018-02-27 | 广东生益科技股份有限公司 | PCB surface treatment method and equipment |
| CN108819493A (en) * | 2018-06-01 | 2018-11-16 | 深圳市容大感光科技股份有限公司 | A kind of method and apparatus of isochronous printing and photocuring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20140503 |