CN107734916B

CN107734916B - Liquid cooling type heat dissipation system

Info

Publication number: CN107734916B
Application number: CN201610653575.2A
Authority: CN
Inventors: 黄顺治; 毛黛娟; 宁广博
Original assignee: Giga Byte Technology Co Ltd
Current assignee: Giga Byte Technology Co Ltd
Priority date: 2016-08-11
Filing date: 2016-08-11
Publication date: 2020-04-28
Anticipated expiration: 2036-08-11
Also published as: CN107734916A

Abstract

The present invention discloses a liquid-cooled heat dissipation system, which includes a liquid-cooling row, a liquid-cooling head, a plurality of flow tubes and an air adsorption device. The liquid-cooling head is in thermal contact with at least one heat source. The flow tube is connected between the liquid-cooling head and the liquid-cooling row to form a circuit for circulating the coolant with the liquid-cooling head and the liquid-cooling row. The air adsorption device is connected to the circuit to adsorb air in the coolant. The liquid-cooled heat dissipation system disclosed in the present invention is designed to be connected to the liquid-cooling circuit through the air adsorption device, which can absorb the air entering the circuit, which can not only prevent the air in the circuit from affecting the heat dissipation efficiency, but also maintain the smooth operation of the pump, avoid the pump from inhaling air and generating operating noise, and extend the service life of the pump.

Description

Liquid cooling type heat dissipation system

Technical Field

The present disclosure relates to heat dissipation systems, and particularly to a heat dissipation system for an electronic device.

Background

Many high-power electronic components, such as a cpu or an image processor, are provided in the existing electronic device. These electronic devices have excellent data processing performance, but generate remarkable heat during operation, and if the heat is not removed by a proper heat dissipation mechanism, the heat will cause the electronic devices to exceed their safe operating temperature, thereby reducing the operation performance, and even causing the entire electronic device to be down due to overheating.

With the progress of heat dissipation technology, liquid-cooled heat dissipation systems are becoming one of the mainstream heat dissipation of electronic devices. The liquid cooling type heat dissipation is a heat dissipation medium using liquid. Traditionally, liquid-cooled heat dissipation systems have been a cycle consisting essentially of a plurality of flow tubes connecting a liquid-cooled header in series with a liquid-cooled drain. The circulation is filled with a cooling liquid, and the cooling liquid can be driven by a pump (pump) arranged in the liquid cooling head to continuously flow in the circulation so as to carry out heat removal.

However, the coolant in the circulation may evaporate outward while flowing through the flow tube. Statistics show that under the use environment of about 60 ℃, the amount of the cooling liquid which is evaporated outwards through the flow pipe per year is about 8-10 grams. Seriously, during the evaporation of the cooling liquid, small molecular gas in the air, such as helium, is dissolved in the cooling liquid by displacing the pipe material through the flow pipe into the circulation, and when the solution is saturated, the air exists in the circulation in the form of bubbles. In addition to the influence of the bubbles on the heat dissipation performance due to the disturbance of the liquid cooling cycle, in the liquid cooling system equipped with the pump, when the bubbles are sucked into the pump through the cycle, the bubbles can interfere with the rotation of the paddle, which not only influences the performance of the pump, but also causes the noise generated when the pump rotates. Even, the bubbles will cause the paddle to shake during rotation, causing damage to the bearing of the paddle, and further affecting the life of the entire liquid cooling system. That is, as the air is used year by year, the air entering the liquid cooling heat dissipation system is more and more, which not only reduces the heat dissipation efficiency of the heat dissipation system, but also has the potential problem of pump damage.

Disclosure of Invention

The present invention is directed to a liquid cooling system, which solves the problems of the conventional liquid cooling system, such as the reduction of heat dissipation efficiency and the damage of pump due to the air in the circulation.

The invention discloses a liquid cooling type heat dissipation system which comprises a liquid cooling row, a liquid cooling head, a plurality of flow pipes and an air adsorption device. The liquid cooling head is in thermal contact with at least one heat source. The flow pipe is communicated between the liquid cooling head and the liquid cooling bar to form a loop for communicating and circulating the cooling liquid with the liquid cooling head and the liquid cooling bar. The air adsorption device is communicated with the loop to absorb air in the cooling liquid.

The liquid cooling type heat dissipation system disclosed by the invention can absorb the air entering the loop by the design that the air adsorption device is communicated with the liquid cooling loop, thereby not only preventing the air from influencing the heat dissipation efficiency in the loop, but also maintaining the smooth operation of the pump, avoiding the operation noise generated by the air sucked by the pump and further prolonging the service life of the pump.

The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the spirit and principles of the present invention and to provide further explanation of the scope of the present invention.

Drawings

Fig. 1 is a schematic diagram of a liquid-cooled heat dissipation system according to a first embodiment of the invention.

Fig. 2 is a partially enlarged sectional view of fig. 1.

Fig. 3 is a schematic diagram of a liquid-cooled heat dissipation system according to a second embodiment of the invention.

Fig. 4 is a schematic view of an air adsorbing device in a liquid-cooled heat dissipating system according to a second embodiment of the present invention.

Wherein the reference numerals are as follows:

1a, 1b liquid cooling heat dissipation system

8 pump

9 Heat source

10 liquid cooling head

10a first interface

10b second interface

10s hollow cavity

20 liquid cooling row

20a third interface

20b fourth interface

31 first flow pipe

32 second flow tube

33 third flow pipe

34 fourth flow tube

35 fifth flow tube

40 air adsorption device

50 variable volume cavity

50a third opening

50b fourth opening

410 main cavity

410a first opening

410b second opening

420 adsorption unit

51 liquid separating path

52 slidable piston

53 branch

54 opening

Loop A

F bubbles

Detailed Description

The embodiment of the invention provides a liquid-cooled heat dissipation system which comprises a liquid-cooled radiator, a liquid-cooled head, a plurality of flow pipes and an air adsorption device. The liquid cooling head is in thermal contact with at least one heat source. The flow pipe is communicated between the liquid cooling head and the liquid cooling bar to form a loop for communicating and circulating the cooling liquid with the liquid cooling head and the liquid cooling bar. The air adsorption device is communicated with the loop to adsorb air in the cooling liquid. The design that the air adsorption device is communicated with the liquid cooling loop can absorb air entering the loop, so that the influence of the air on the heat dissipation efficiency in the loop can be prevented, the smooth operation of the pump can be maintained, the operation noise caused by the air suction of the pump is avoided, and the service life of the pump can be prolonged.

In one embodiment, the liquid-cooled heat dissipation system is additionally provided with a variable volume cavity on the loop, because the variable volume cavity is made of a material without deformation restoring force, such as a shrinkable and non-elastic water ball. Therefore, the pressure change caused by the air adsorption device adsorbing the air bubbles can be balanced.

The detailed features and advantages of the present invention are described in detail below with reference to specific embodiments, which are sufficient for anyone skilled in the art to understand the technical content of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by anyone skilled in the art from the disclosure of the present specification, the claims and the accompanying drawings. The following examples further illustrate aspects of the present invention in detail, but are not intended to limit the scope of the present invention in any way.

It should be noted that the drawings in the present specification are simplified schematic diagrams, and only the basic structure of the present invention is illustrated in a schematic manner. Therefore, only the elements relevant to the present invention are shown in the drawings, and the illustrated elements are not drawn in terms of actual implementation numbers, shapes, size ratios, etc., and the actual implementation specifications are an alternative design, and the layout of the elements may be more complicated.

First, referring to fig. 1-2, fig. 1 is a schematic diagram of a liquid-cooled heat dissipation system according to a first embodiment of the invention, and fig. 2 is a partially enlarged sectional diagram of fig. 1.

In the present embodiment, a liquid-cooled heat dissipation system 1a is provided, which is suitable for dissipating heat from an electronic device. The electronic device may be, for example, a desktop computer, but the invention is not limited thereto.

Specifically, in the present embodiment, the liquid-cooled heat dissipation system 1a includes a liquid cooling head 10, a liquid cooling drain 20, a first flow pipe 31, a second flow pipe 32, a third flow pipe 33, and an air adsorption device 40.

The liquid cooling head 10 may be in thermal contact with at least one heat source 9. The heat source 9 may be an electronic device that generates a large amount of heat energy when operating, such as a Central Processing Unit (CPU) or a Graphics Processing Unit (GPU) in the electronic device, but the invention is not limited thereto. The liquid cooling head 10 has a hollow cavity 10s, and a first interface 10a and a second interface 10b communicated with the hollow cavity 10 s.

The liquid cooling bar 20 may be, for example, composed of a plurality of heat dissipating fins (not shown) and a duct (not shown) passing through the heat dissipating fins. The liquid cooling bar 20 has a third port 20a and a fourth port 20b, which are openings at two ends of the conveying pipe.

The air adsorption device 40 includes a main cavity 410 and a plurality of adsorption units 420 accommodated in the main cavity 410. The main cavity 410 has a first opening 410a and a second opening 410b on two sides thereof.

Two ends of the first flow pipe 31 are directly connected to the first interface 10a of the liquid cooling head 10 and the first opening 410a of the air adsorbing device 40, two ends of the second flow pipe 32 are directly connected to the second opening 410b of the air adsorbing device 40 and the third interface 20a of the liquid cooling bar 20, and two ends of the third flow pipe 33 are directly connected to the second interface 10b of the liquid cooling head 10 and the fourth interface 20b of the liquid cooling bar 20. Therefore, the liquid cooling head 10, the first flow pipe 31, the air adsorbing device 40, the second flow pipe 32, the liquid cooling unit 20, and the third flow pipe 33 form a circuit a through which the cooling liquid circulates.

In operation, the circuit a formed by the liquid-cooled heat dissipation system 1a is filled with a cooling liquid. In addition, in the embodiment, a pump 8 is installed in the hollow cavity 10s of the liquid cooling head 10 for driving the flow of the cooling liquid. When the electronic device is in operation, the heat energy generated by the heat source 9 is directly transferred to the liquid cooling head 10 to heat the cooling liquid in the liquid cooling head 10, and the pump 8 can transport the high-temperature cooling liquid in the liquid cooling head 10 to the liquid cooling bar 20 through the first flow pipe 31, the air adsorption device 40 and the second flow pipe 32 for heat dissipation and temperature reduction, and then the high-temperature cooling liquid is brought back to the liquid cooling head 10 through the third flow pipe 33 to complete the liquid cooling circulation.

The flow tube is usually made of Teflon (Teflon), and the chain length between the polymers allows a small amount of coolant to pass through and evaporate to the external environment through the tube. In the process of evaporation, the pressure in the flow tube is reduced, so that smaller air molecules (such as helium) in the outside air are sucked into the flow tube through the tube and dissolved in the cooling liquid. If the dissolved air is saturated, it will exist as bubbles. These bubbles F exist in the coolant, not only can improve the flow resistance and influence the radiating efficiency, and more seriously, if these bubbles F get into pump 8 through the liquid cooling circulation, can receive the striking of the paddle of pump 8 and produce the noise, and can disturb the rotation of pump paddle and influence the efficiency of pump 8, and even more seriously, the bubbles can let the paddle excessively rock when rotatory and cause the bearing damage of paddle, and then let pump 8 stop the operation and shortened the life of whole liquid cooling system.

In order to avoid the above problem, the liquid-cooled heat dissipation system 1a of the present embodiment is provided with an air adsorption device 40. The air adsorbing device 40 has a plurality of adsorbing units 420, and each adsorbing unit 420 is a porous structure with super-hydrophilic-super-hydrophobic characteristics, for example, a super-hydrophobic-super-hydrophilic conversion structure with super-hydrophobic surface, which has the characteristic of not wetting with the cooling liquid. A superhydrophobic surface refers to a surface where a drop of water exhibits a large contact angle (e.g., greater than 150 degrees) on the surface. Therefore, when air bubbles F (fig. 2) exist in the cooling liquid flowing through the air adsorbing device 40 or air is dissolved in the cooling liquid, the air can easily replace the liquid in the holes, i.e., the air is absorbed into the tiny holes. That is, the adsorption unit 420 may absorb and contain such air to ensure that the cooling fluid flowing out of the air adsorption device 40 is not contaminated with air bubbles. Therefore, the air bubbles in the cooling liquid can be prevented from affecting the heat dissipation efficiency, and the air can be prevented from entering the pump to generate noise or damage the pump. In one embodiment, the adsorption unit having the super hydrophilic-super hydrophobic property may be filled with a cooling liquid such as water therein, and adsorption occurs when air in the water path contacts the adsorption unit. Wherein, the mode of filling the inside of the adsorption unit with water may be: in one implementation, a superhydrophobic-superhydrophilic material is used, and the two states of hydrophilicity and hydrophobicity can be mutually switched by changing external conditions (such as light or a magnetic field), and when water needs to be injected, the material is adjusted to be in the hydrophilic state; after the water injection is finished, the water is converted into a hydrophobic state; or in another implementation, a hydrophobic material is used and a solute is provided in association therewith, the hydrophobic material being compatible with water in which a concentration of the solute is dissolved; when the water injection is complete, this solute concentration is reduced by, for example, chemical reaction or dilution, while ensuring the circuit is free of bubbles.

It should be noted that the present invention is not limited to the connection mode and the connection position between the air adsorbing device 40 and the circuit a. For example, in other embodiments, the air adsorbing device 40 may be located outside the loop a, and only one opening is connected to the loop a.

Next, referring to fig. 3, fig. 3 is a schematic diagram of a liquid-cooled heat dissipation system according to a second embodiment of the invention. The present embodiment proposes a liquid-cooled heat dissipation system 1b, but since the liquid-cooled heat dissipation system 1b of the present embodiment is similar to the liquid-cooled heat dissipation system 1a of the previous embodiment, only the differences will be described below.

The difference from the previous embodiment is that the liquid-cooled heat dissipation system 1b further includes a variable volume cavity 50. And the second flow tube 32 is replaced with a fourth flow tube 34 and a fifth flow tube 35. As shown, the variable volume chamber 50 has a third opening 50a and a fourth opening 50b on opposite sides thereof. Both ends of the fourth flow pipe 34 are directly connected to the second opening 410b of the air adsorbing device 40 and the third opening 50a of the variable volume chamber 50, respectively, and both ends of the fifth flow pipe 35 are directly connected to the fourth opening 50b of the variable volume chamber 50 and the third interface 20a of the liquid cooling drain 20, respectively. It will be appreciated that in this embodiment, the variable volume chamber 50 is located on circuit a.

In one implementation, the variable volume chamber 50 may be shaped like a water ball and may be constructed of a material that does not have the force of deformation recovery. In the process that the amount of the cooling liquid in the liquid cooling system is reduced by the evaporation of the cooling liquid in the variable volume chamber 50, the variable volume chamber 50 is collapsed and collapsed along with the reduction of the cooling liquid, and the pressure change generated to the loop a when the air absorption device 40 absorbs the air bubbles is balanced.

In another specific implementation, the variable volume cavity 50 may also be implemented by using a piston, that is, the spherical variable volume cavity 50 shown in fig. 3 is replaced by a branch 53 as shown in fig. 4, wherein one end of the branch 53 (i.e., the liquid separating path 51) is connected to the loop, the other end is provided with an opening 54 directly connected to the outside atmosphere, a slidable piston 52 is arranged between the liquid separating path 51 and the opening 54, and when the pressure in the loop is different from the outside atmosphere, the piston 52 moves due to the pressure until the inside and outside pressures of the loop are balanced.

Therefore, in the liquid-cooled heat dissipation system disclosed by the invention, the design that the air adsorption device is communicated with the liquid-cooled loop can absorb the air entering the loop, so that the influence of the air on the heat dissipation efficiency in the loop can be prevented, the smooth operation of the pump can be maintained, the operation noise caused by the air sucked by the pump is avoided, and the service life of the pump can be prolonged.

Although the present invention has been described with reference to the above embodiments, it is not intended to limit the invention. All changes and modifications that come within the spirit and scope of the invention are desired to be protected. With regard to the scope of protection defined by the present invention, reference should be made to the appended claims.

Claims

1. A liquid-cooled heat dissipation system, characterized in that, comprising:

liquid cooling row;

a liquid cooling head, thermally in contact with at least one heat source;

a plurality of flow pipes connected between the liquid-cooling head and the liquid-cooling row to form a circuit with the liquid-cooling head and the liquid-cooling row for the communication and circulation of the cooling liquid; and

Air adsorption device, communicated with the circuit, to absorb the air in the cooling liquid;

The air adsorption device includes a main cavity and a plurality of adsorption units accommodated in the main cavity, and each adsorption unit is a superhydrophilic-superhydrophobic switching structure with a superhydrophobic surface.

2 . The liquid-cooled heat dissipation system according to claim 1 , further comprising a variable volume cavity connected to the circuit for balancing the pressure change caused by the air adsorption device absorbing air. 3 .

3 . The liquid-cooled heat dissipation system according to claim 2 , wherein the variable volume cavity is made of a material without deformation restoring force. 4 .

4. The liquid-cooled heat dissipation system according to claim 2, wherein the variable volume cavity has a liquid separation path, a slidable piston and an opening, the liquid separation path communicates with the circuit, and the opening directly communicates with the outside world, The slidable piston is located between the liquid separation path and the opening, and the slidable piston is used for sliding when the pressure of the circuit is different from the outside until the pressure inside and outside the circuit is balanced.

5 . The liquid-cooled heat dissipation system of claim 1 , wherein one end of the air adsorption device is connected to the circuit, and the rest is located outside the circuit so that the air adsorption unit and the circuit no longer form another loop.

6. The liquid-cooled heat dissipation system of claim 1, wherein the air adsorption device is formed as a part of the circuit.