CN107734916A - Liquid-cooled radiating system - Google Patents
Liquid-cooled radiating system Download PDFInfo
- Publication number
- CN107734916A CN107734916A CN201610653575.2A CN201610653575A CN107734916A CN 107734916 A CN107734916 A CN 107734916A CN 201610653575 A CN201610653575 A CN 201610653575A CN 107734916 A CN107734916 A CN 107734916A
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- China
- Prior art keywords
- liquid
- loop
- air
- radiating system
- cooled radiating
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of liquid-cooled radiating system, and it includes the cold row of liquid, liquid cold head, multiple flow tubes and air adsorption device.Liquid cold head, thermally contact in an at least thermal source.Flow tube is communicated between liquid cold head and the cold row of liquid, to form the loop that circulation is connected for coolant with liquid cold head, the cold row of liquid.Air adsorption device is communicated in loop to adsorb the air in coolant.Liquid-cooled radiating system disclosed in this invention connects the design of liquid cooling loop by air adsorption device, it can absorb into the air in entry loop, influence of the air in the loop to heat dissipation can not only be prevented, can also pump be maintained smoothly to operate, avoid pumping from entering air and produce running noise, can more extend the service life of pump.
Description
Technical field
The present invention relates to a kind of liquid-cooled radiating system, more particularly to a kind of liquid-cooled suitable for electronic installation radiating to dissipate
Hot systems.
Background technology
Many high-power electronic components, such as central processing unit or image processor are set in existing electronic installation.
These electronic components have excellent data processing efficiency, but can produce surprising heat energy in the running, if not by appropriate
Cooling mechanism exclude heat energy, heat energy can allow these electronic components to exceed its safe operating temperature and reduce operational effectiveness, very
To the machine so that whole electronic installation is delayed because of overheat.
With the progress of heat dissipation technology, liquid-cooled radiating system is increasingly becoming one of main flow of electronic installation radiating.It is so-called
Liquid cooling type radiation, it is that heat dissipation vehicle is used as using liquid.Traditionally, liquid-cooled radiating system mainly by a plurality of flow tube by liquid cold head
The formed circulation of row's series winding cold with liquid.Coolant is filled with the cycle, and coolant can be by the pump installed in liquid cold head
(pump) drive and constantly flow in the cycle antipyretic to carry out.
However, the coolant in the circulation can outwards evapotranspire when flowing through flow tube.Statistics display, at about 60 degrees Celsius
Under use environment, the amount for the coolant outwards evapotranspired via flow tube every year is about 8~10 grams.The serious is in coolant
Outwards evapotranspire during, the gas of air small molecular, such as helium, will via flow tube tubing displacement enter the circulation in and
It is dissolved in coolant, after saturation is dissolved, air will be present in the circulation in a manner of bubble.These bubbles are except interference
Liquid SAPMAC method and influence outside heat dissipation, in the liquid cooling system of pump is configured with, when these bubbles through circulation be sucked into pump when, meeting
The rotation of blade is disturbed, the efficiency of pump is not only influenceed, can also allow pump to produce noise when rotated.Even, bubble will make blade exist
Produce and rock during rotation, cause the bearing damage of blade, and then influence the life-span of whole liquid cooling system.That is, with by
The use in year, the air into liquid-cooled radiating system is more and more, except making the heat dissipation of cooling system more and more lower, also
Have the potential problems of pump damage.
The content of the invention
It is an object of the invention to provide a kind of liquid-cooled radiating system, to solve traditional liquid-cooled radiating system because following
There is air is caused reduce heat dissipation, even damage the problems such as pump in ring.
Liquid-cooled radiating system disclosed in this invention, filled comprising the cold row of liquid, liquid cold head, multiple flow tubes and air adsorption
Put.Liquid cold head, thermally contact in an at least thermal source.Flow tube is communicated between liquid cold head and the cold row of liquid, with liquid cold head, the cold row's shape of liquid
Into the loop for coolant connection circulation.Air adsorption device is communicated in loop to absorb the air in coolant.
Liquid-cooled radiating system disclosed in this invention, the design of liquid cooling loop is connected by air adsorption device, can be inhaled
The air in entry loop is taken in, influence of the air in the loop to heat dissipation can be not only prevented, can also maintain pump smoothly to transport
Turn, avoid pumping from entering air and produce running noise, can more extend the service life of pump.
The explanation of the content of the invention and the explanation of implementation below above with respect to the present invention are to demonstrate and explain this
The spirit and principle of invention, and the patent claim for providing the present invention is further explained.
Brief description of the drawings
Fig. 1 is for the schematic diagram of the liquid-cooled radiating system according to depicted in the first embodiment of the present invention.
Fig. 2 is the enlarged local section schematic diagram for Fig. 1.
Fig. 3 is for the schematic diagram of the liquid-cooled radiating system according to depicted in the second embodiment of the present invention.
Fig. 4 is for the air adsorption device in the liquid-cooled radiating system according to depicted in the second embodiment of the present invention
Schematic diagram.
Wherein, description of reference numerals is as follows：
1a, 1b liquid cooling heat radiation system
8 pumps
9 thermals source
10 liquid cold heads
10a first interfaces
10b second interfaces
10s hollow reservoirs
The cold row of 20 liquid
The interfaces of 20a the 3rd
The interfaces of 20b the 4th
31 first flow tubes
32 second flow tubes
33 the 3rd flow tubes
34 fourth flow tubes
35 the 5th flow tubes
40 air adsorption devices
50 variable volume cavitys
50a the 3rd is open
50b the 4th is open
410 main cavities
410a first is open
410b second is open
420 absorbing units
51 liquid separation roads
52 slidably pistons
53 branch roads
54 openings
A loops
F bubbles
Embodiment
Embodiment of the present invention provides a kind of liquid-cooled radiating system, includes the cold row of liquid, liquid cold head, multiple flow tubes and sky
Aspiration adsorption device.Liquid cold head is thermally contacted in an at least thermal source.Flow tube is communicated between liquid cold head and the cold row of liquid, with liquid cold head,
The cold row of liquid forms the loop for coolant connection circulation.Air adsorption device is communicated in loop to adsorb the air in coolant.
Due to the design of air adsorption device connection liquid cooling loop, it can absorb into the air in entry loop, can not only prevents air from returning
It to the influence of heat dissipation in road, can also maintain pump smoothly to operate, avoid pumping from entering air and produce running noise, can more prolong
The service life of long pump.
In a kind of example, liquid-cooled radiating system is also additionally equipped with variable volume cavity on loop, due to variable volume
Cavity is formed by the material without deformation restoring force, water polo that is for example, collapsible and not having elasticity.Therefore, can balance
Caused pressure change after air adsorption device absorption bubble.
Describe the detailed features and advantage of the present invention in detail below by way of specific embodiment, its content is enough to make any
Art personnel understand the technology contents of the present invention and implemented according to this, and are wanted according to content disclosed in this specification, right
Ask and accompanying drawing, it is any skilled person readily understands that related purpose and advantage of the invention.Following embodiment is
The viewpoint of the present invention is further described, but it is non-anyways to limit scope of the invention.
It is noted that description of the invention accompanying drawing is simplified schematic diagram, only illustrate the present invention's in a schematic way
Basic structure.Therefore, the element relevant with the present invention is only indicated in Figure of description, and shown element is not with reality
Number, shape, dimension scale during implementation etc. are drawn, and the specification that it is actual when implementing is actually a kind of selective to be set
Meter, and its component placement form is likely more complexity, first give chat it is bright.
First, Fig. 1~2 is refer to, Fig. 1 is for the liquid-cooled radiating system according to depicted in the first embodiment of the present invention
Schematic diagram, and Fig. 2 is the enlarged local section schematic diagram for Fig. 1.
In the present embodiment, it is proposed that a kind of liquid-cooled radiating system 1a, suitable for being radiated to electronic installation.Electronic installation
Can be such as desktop computer, but the present invention is not so limited.
Specifically, in the present embodiment, liquid-cooled radiating system 1a includes liquid cold head 10, the cold row 20 of liquid, the first flow tube
31st, the second flow tube 32, the 3rd flow tube 33 and air adsorption device 40.
Liquid cold head 10 can be used to thermally contact in an at least thermal source 9.Thermal source 9 can be the center in such as aforementioned electronic
Processor (Central Processing Unit, CPU), graphics processor (Graphics Processing Unit, GPU)
Deng the electronic component that a large amount of heat energy can be produced when operating, but the present invention is not so limited.Liquid cold head 10 has hollow reservoir
10s, and it is communicated in the hollow reservoir 10s first interface 10a and second interface 10b.
The cold row 20 of liquid can be for example by multiple radiating fins (not illustrating) and through the delivery pipe in these radiating fins (not
Illustrate) formed.The cold row 20 of liquid has the 3rd interface 20a and the 4th interface 20b, is respectively the opening at the delivery pipe both ends.
Air adsorption device 40 includes main cavity 410 and the multiple absorbing units 420 being placed in main cavity 410.And lead
There is the first opening 410a and the second opening 410b respectively on the both sides of cavity 410.
The both ends of first flow tube 31 are directly connected in the first interface 10a and air adsorption device 40 of liquid cold head 10 respectively
First opening 410a, the both ends of the second flow tube 32 be directly connected in respectively air adsorption device 40 the second opening 410b and liquid it is cold
Row 20 the 3rd interface 20a, and the both ends of the 3rd flow tube 33 be directly connected in respectively liquid cold head 10 second interface 10b and liquid it is cold
The 4th interface 20b of row 20.Therefore, liquid cold head 10, the first flow tube 31, air adsorption device 40, the second flow tube 32, the cold row 20 of liquid
The loop A of cooling but liquid circulation cycle is formed with the 3rd flow tube 33.
In operating, coolant is filled with the loop A that liquid-cooled radiating system 1a is formed.In addition, in the present embodiment
In, a pump 8 is equiped with the hollow reservoir 10s of liquid cold head 10, can be used to drive the flowing of coolant.When electronic installation is operating
When, heat energy caused by thermal source 9 can be directly conducted to the coolant allowed in liquid cold head 10 in liquid cold head 10 and heat up, and pump 8 can incite somebody to action
The coolant of high temperature is delivered to the cold row 20 of liquid via the first flow tube 31, air adsorption device 40, the second flow tube 32 in liquid cold head 10
After making radiating and cooling, then via the 3rd flow tube 33 liquid cold head 10 is taken back to complete liquid SAPMAC method.
Wherein, formed by the material of flow tube typically uses Teflon (Teflon), the link between its polymer
Length can allow a small amount of coolant by evapotranspiring to external environment via tubing.And during evapotranspiring, the pressure in flow tube
Good general declines and allows less air molecule (such as helium) in outside air to be drawn into flow tube and dissolve via tubing in the lump
In coolant.If the saturation of the air of dissolving, can exist in a manner of bubble.These bubbles F is present in coolant, not only can
Improve flow resistance and influence heat dissipation, more seriously, can be by the oar of pump 8 if these bubbles F enters pump 8 through liquid SAPMAC method
The shock of leaf and produce noise, and the rotation of pump blade can be disturbed and influence the efficiency of pump 8, even, bubble can allow blade revolving
Excessively rocked when turning and cause the bearing damage of blade, and then allow pump 8 to decommission and shorten the use of whole liquid cooling system
Life-span.
In order to avoid the problem of foregoing occurs, the liquid-cooled radiating system 1a of the present embodiment is configured with air adsorption device
40.There are multiple absorbing units 420 in air adsorption device 40, each absorbing unit 420 has super hydrophilic-superhydrophobic characteristic for one
Loose structure, for example, be super-hydrophobic-super hydrophilic transformational structure with super hydrophobic surface, it has does not occur with coolant
The characteristic of infiltration phenomenon.Super hydrophobic surface refers to that the surface of big contact angle (being greater than 150 degree) is presented in water droplet on the surface.Cause
This, when the coolant for flowing through air adsorption device 40 has an air bubble F (such as Fig. 2), or during dissolved with air, air can take easily
For the liquid in hole, i.e. air can be rapidly absorbed into these small holes.That is, absorbing unit 420 is absorbable
And these air are accommodated, to ensure to flow out that in the coolant of air adsorption device 40 air bubble will not be adulterated.Therefore, except can
Prevent there is air bubble in coolant and influences outside heat dissipation, can also prevent air from entering pump and producing noise, or make
The problem of being damaged into pump.In one embodiment, the foregoing absorbing unit with super hydrophilic-superhydrophobic characteristic can be in it
Portion is full of coolant such as water, when having air contact in water route above, then adsorbs.Wherein, make to be full of inside absorbing unit
The mode of water can be：In one implementation, using super-hydrophobic-super hydrophilic material, by changing external condition (such as illumination or magnetic
), it can mutually be changed under hydrophilic-hydrophobic two states, it is necessary to during water filling, material is adjusted to hydrophily；Water filling is complete
Cheng Hou, then it is converted into hydrophobic state；Or in a further implementation, using hydrophobic material, and provide a kind of matched
Solute, hydrophobic material can be affine with the water dissolved with this certain density solute；After the completion of water filling, ensureing that loop do not have bubble
In the case of, reduce this solute concentration for example, by chemically reacting or diluting.
In addition, it need to state, connected mode and connection of the present invention not between air adsorption device 40 and loop A
Position be limited.Such as in other embodiment, air adsorption device 40 can also be located at outside the A of loop, only with an open communication
In loop A.
Then, referring to Fig. 3, Fig. 3 is for the liquid-cooled radiating system according to depicted in the second embodiment of the present invention
Schematic diagram.The present embodiment proposes a kind of liquid-cooled radiating system 1b, but the liquid-cooled radiating system 1b due to the present embodiment with
The liquid-cooled radiating system 1a of previous embodiment is similar, therefore below only for being illustrated at difference.
It is with the difference of previous embodiment, liquid-cooled radiating system 1b also includes variable volume cavity 50.And second
Flow tube 32 is substituted for the flow tube 35 of fourth flow tubes 34 and the 5th.As illustrated, the both sides of variable volume cavity 50 have the 3rd to open respectively
The openings of mouth 50a and the 4th 50b.The both ends of fourth flow tubes 34 are directly connected in the second opening 410b of air adsorption device 40 respectively
It is open 50a with the 3rd of variable volume cavity 50, and the both ends of the 5th flow tube 35 are directly connected in variable volume cavity 50 respectively
The 4th opening 50b and the cold row 20 of liquid the 3rd interface 20a.Understand, in this embodiment, variable volume cavity 50 is located at loop
On A.
One kind is in the specific implementation, the profile of variable volume cavity 50 can be such as water polo, and be by recovering without deformation
The material of power is formed.During variable volume cavity 50 evapotranspires and reduced in coolant, coolant in liquid cooling system
Amount can reduce, variable volume cavity 50 can be recessed with the reduction of coolant it is flat collapse, contribute to equilibrium air adsorbent equipment 40
To pressure change caused by the A of loop when absorbing bubble.
Another kind is in the specific implementation, variable volume cavity 50 can also be realized using piston mode, i.e., by ball shown in Fig. 3
Shape variable volume cavity 50 is replaced with as shown in figure 4, increasing one end (i.e. liquid separation road 51) of branch road 53, wherein branch road 53 in loop
Connected loop, the other end directly connect ambient atmosphere provided with opening 54, slidably piston are provided between liquid separation road 51 and opening 54
52, when the pressure in loop and external atmosphere pressure are variant, piston 52 can be movable because being under pressure, until external pressure in loop
Dynamic balance.
From the foregoing, in liquid-cooled radiating system disclosed in this invention, it is cold that liquid is connected by air adsorption device
The design in loop, it can absorb into the air in entry loop, can not only prevents influence of the air in the loop to heat dissipation, may be used also
Maintain pump smoothly to operate, avoid pumping from entering air and produce running noise, can more extend the service life of pump.
Although the present invention is disclosed as above with foregoing embodiment, but it is not limited to the present invention.This is not being departed from
In the spirit and scope of invention, the variation and retouching done, belong to scope of patent protection of the invention.Defined on the present invention
Protection domain refer to appended claims.
Claims (9)
1. a kind of liquid-cooled radiating system, it is characterised in that include：
The cold row of liquid；
Liquid cold head, thermally contact in an at least thermal source；
Multiple flow tubes, it is communicated between the liquid cold head and the cold row of the liquid, to be formed and connected for coolant with the liquid cold head, the cold row of the liquid
The loop of logical circulation；And
Air adsorption device, the loop is connected, to absorb the air in coolant.
2. liquid-cooled radiating system as claimed in claim 1, it is characterised in that the air adsorption device includes main cavity with holding
It is placed in multiple absorbing units of the main cavity.
3. liquid-cooled radiating system as claimed in claim 2, it is characterised in that each absorbing unit is with hydrophobic property
Loose structure.
4. liquid-cooled radiating system as claimed in claim 3, it is characterised in that the absorbing unit is with super hydrophobic surface
Super hydrophilic-super-hydrophobic transformational structure.
5. liquid-cooled radiating system as claimed in claim 1, it is characterised in that also comprising variable volume cavity, connect this time
Road, to balance the pressure change brought after the air adsorption device absorption air.
6. liquid-cooled radiating system as claimed in claim 5, it is characterised in that the variable volume cavity is extensive without deformation
The material of multiple power is formed.
7. liquid-cooled radiating system as claimed in claim 5, it is characterised in that the variable volume cavity has liquid separation road, can
Sliding plunger and opening, the liquid separation road connect the loop, and the opening directly connects the external world, and slidably piston is located at the liquid separation road for this
Between the opening, this slidably piston to the pressure in the loop with it is extraneous variant when slide until external pressure in the loop
Dynamic balance.
8. liquid-cooled radiating system as claimed in claim 1, it is characterised in that one end of the air adsorption device connects this time
Road, remainder is located at outside the loop so that the air adsorption unit does not re-form another loop with the loop.
9. liquid-cooled radiating system as claimed in claim 1, it is characterised in that the air adsorption device is formed as the loop
A part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653575.2A CN107734916B (en) | 2016-08-11 | 2016-08-11 | Liquid cooling type heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610653575.2A CN107734916B (en) | 2016-08-11 | 2016-08-11 | Liquid cooling type heat dissipation system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107734916A true CN107734916A (en) | 2018-02-23 |
| CN107734916B CN107734916B (en) | 2020-04-28 |
Family
ID=61200239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610653575.2A Active CN107734916B (en) | 2016-08-11 | 2016-08-11 | Liquid cooling type heat dissipation system |
Country Status (1)
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| CN (1) | CN107734916B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212551A (en) * | 2020-01-31 | 2020-05-29 | 张方明 | Heat dissipation type server rack breathes in |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601731A (en) * | 2003-09-25 | 2005-03-30 | 株式会社日立制作所 | Cooling module |
| CN1610009A (en) * | 2003-10-17 | 2005-04-27 | 株式会社日立制作所 | Cooling device and electronic apparatus building in the same |
| CN2847817Y (en) * | 2005-12-06 | 2006-12-13 | 讯凯国际股份有限公司 | Water cool heat radiation system |
| CN101122302A (en) * | 2006-08-11 | 2008-02-13 | 富准精密工业(深圳)有限公司 | Pump |
| CN103096689A (en) * | 2011-11-08 | 2013-05-08 | 财团法人工业技术研究院 | Heat dissipation device and heat dissipation system |
| CN105676574A (en) * | 2016-03-31 | 2016-06-15 | 海信集团有限公司 | Liquid cooling heat dissipation system and laser projection device |
-
2016
- 2016-08-11 CN CN201610653575.2A patent/CN107734916B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1601731A (en) * | 2003-09-25 | 2005-03-30 | 株式会社日立制作所 | Cooling module |
| CN1610009A (en) * | 2003-10-17 | 2005-04-27 | 株式会社日立制作所 | Cooling device and electronic apparatus building in the same |
| CN2847817Y (en) * | 2005-12-06 | 2006-12-13 | 讯凯国际股份有限公司 | Water cool heat radiation system |
| CN101122302A (en) * | 2006-08-11 | 2008-02-13 | 富准精密工业(深圳)有限公司 | Pump |
| CN103096689A (en) * | 2011-11-08 | 2013-05-08 | 财团法人工业技术研究院 | Heat dissipation device and heat dissipation system |
| CN105676574A (en) * | 2016-03-31 | 2016-06-15 | 海信集团有限公司 | Liquid cooling heat dissipation system and laser projection device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212551A (en) * | 2020-01-31 | 2020-05-29 | 张方明 | Heat dissipation type server rack breathes in |
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| Publication number | Publication date |
|---|---|
| CN107734916B (en) | 2020-04-28 |
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