CN107731352A - Flexible electronic glass transparent conductive oxide film circuit preparation method - Google Patents
Flexible electronic glass transparent conductive oxide film circuit preparation method Download PDFInfo
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- CN107731352A CN107731352A CN201710573171.7A CN201710573171A CN107731352A CN 107731352 A CN107731352 A CN 107731352A CN 201710573171 A CN201710573171 A CN 201710573171A CN 107731352 A CN107731352 A CN 107731352A
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- flexible
- transparent conductive
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- oxide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
The invention discloses a kind of flexible electronic glass transparent conductive oxide film circuit preparation method, plated film matrix for covering required for 25 100 microns of plastic circuit template thickness can pitch of the laps bending glass, transparent conductive oxide raw material is transparent conductive oxide plane or cylinder rotary magnetron sputtering target material, such as indium tin oxide (ITO), aluminium-doped zinc oxide (AZO), fluorine tin-oxide (FTO), Ga-doped zinc oxide (GZO), indium Ga-doped zinc oxide (IGZO), antimony tin oxide (STO) etc., this method includes：The cleaning of flexible glass, plastic circuit template are fitted in flexible glass；Vacuum plasma volume to volume (R2R) magnetron sputtering atomic deposition, temperature modifier treatment, thickness and quality testing, protect pad pasting.The transparent oxide film thickness is 50 500 nanometers；Conductive sheet resistance is 5 500 ohms/squares；Light transmittance 75 95%.
Description
Technical field
The present invention relates to flexible electronic transparent conductive oxide film circuit and its technology of preparing, especially a kind of flexible electrical
Sub- glass transparent conductive oxide film circuit preparation method.
Background technology
Flexible electronic is exactly the emerging electricity being produced on electronic device on flexible Drawability plastics, glass or thin metal matrix plate
Sub- technology, with its unique flexibility, ductility and efficient, inexpensive manufacturing process, led in information, the energy, medical treatment, national defence etc.
Domain has wide application prospect, such as flexible electronic displays, thin-film solar cell panel, electronics surface mount.Flexible electrical
Son have it is soft, deformable, light, portable, can the characteristic such as large-area applications, and by widely applying new material and new technology to produce
A large amount of new opplications are born, including RFID, Flexible Displays, OLED are luminous, sensor, flexible photovoltaic, logical AND store, flexible electrical
Pond.In future, " paster " is pasted on the back of the hand with regard to that can detect ultraviolet degree of illumination；Pacemaker no longer changes battery；
Battery can directly wind production simultaneously.In recent years, this new branch of science of flexible electronic caused domestic and international scientific and technological circle with
The extensive concern of industrial quarters, the R＆D process that numerous companies put into this sciemtifec and technical sphere is attract, accelerate flexible electronic
Practical product exploitation and commercialization process.In development in science and technology " 13 " planning, country passes through policy guide and money
Gold, which is helped, to promote the flexible research and industrialization with printed electronic of China energetically.China is electronic industry big country, but is not skill
Art is made the country prosperous, and flexible electronic is the chance that China strives for electronic industry great-leap-forward development.Flexible electronic has broad mass market, market rule
Mould is expanded rapidly, can turn into national pillar industry.
Flexible electronic transparent conductive film is exactly that caused film is not only conductive with more the transparency, is flexible
Thin film solar, display screen, electroluminescent device, thin film transistor (TFT), electric capacity and electric resistance touch screen, transparent heater etc. it is important
Material.Compared with rigid substrate transparent conductive film, it also with flexibility and may extend away in addition to the conductive and transparency
Property, it is the important materials for developing flexible electronic device.
The content of the invention
Goal of the invention：A kind of flexible electronic glass conductive transparent oxide thin film circuit is provided, and further provides for volume pair
Magnetron sputtering template atomic deposition film plating process is rolled up, basic flexible glass transparent is provided led for the development of flexible electronic device
Electroxidation thing templated films circuit production method.
Technical scheme：The present invention uses following technical scheme：A kind of flexible electronic glass transparent conductive oxide film electricity
Road preparation method, described transparent conductive oxide film electric circuit deposition in the flexible flexible glass of 25-100 microns rather than
On current nonbreakable glass；
Preparation method comprises the following steps：
Step 1. is cleaned by ultrasonic to flexible flexible glass matrix, dried；Vacuum volume to volume magnetic control is put into splash
Penetrate and plasma cleaning is carried out in coating machine；
Step 2. will be attached in flexible glass with circuit plastic formwork with volume to volume laminator；
The flexible glass for posting circuit plastic formwork is put into unreeling for vacuum volume to volume magnetron sputtering coater by step 3.
On device, an end of flexible glass is connected on coiler；
Step 4. is evacuated down to 10-6To 10-8Torr；According to the characteristic of different transparent oxides, power 10- is regulated
30Kw, argon gas 30-100SCCM is filled with, keeps vacuum 2-50mTorr, magnetic control is carried out with planar targets or cylinder rotary target material
Sputtered atom plated film；
The flexible glass for being coated with transparent oxide circuit pattern is carried out quenched place by step 5. at a temperature of 120-180 DEG C
Reason；
Step 6. carries out thickness to the transparent conductive oxide circuit in flexible glass, sheet resistance carries out quality；
Step 7. takes out winding flexible glass in vacuum magnetic-control sputtering machine and removes circuit plastic formwork and carry out surface inspection
Looking into ensures no slight crack, then carries out protection pad pasting；
Step 8. makes a four line touch panels with hollow template and silk-screen printing；Print between silver electrode and point
Every by top panel and lower panel, carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument.
Further, the transparent conductive oxide film circuit thickness is 50-500 nanometers；Conductive sheet resistance is 5-500 Europe
Nurse/；Light transmittance 75-95%.
Further, transparent conductive oxide raw material is transparent conductive oxide plane or cylinder rotary magnetron sputtering target
Material, such as indium tin oxide, aluminium-doped zinc oxide, fluorine tin-oxide, Ga-doped zinc oxide, indium Ga-doped zinc oxide, the oxidation of antimony tin
Thing.
Beneficial effect：The present invention is compared with prior art：
(1) the transparent oxide film circuit of flexible glass, the development for flexible electronic device are directly formed；
(2) electronic circuit formed is flexible and extends；Performance is suitable with the thin film circuit performance on nonbreakable glass.
(3) compared with flexible electronic Method of printing, this volume to volume magnetron sputtering atomic deposition plated film circuit impurity low resistance
It is small, it is reproducible, it is highly reliable.
(4) this method is applied to the production of large area thin film circuits, and speed is fast, high yield rate.
Embodiment
A kind of flexible electronic glass transparent conductive oxide film circuit preparation method, described transparent conductive oxide are thin
Film electric circuit deposition is in the flexible flexible glass of 25-100 microns rather than on current nonbreakable glass；The transparent conductive oxide
Thin film circuit thickness is 50-500 nanometers；Conductive sheet resistance is 5-500 ohms/；Light transmittance 75-95%；Transparent conductive oxide
Raw material is transparent conductive oxide plane or cylinder rotary magnetron sputtering target material, such as indium tin oxide, aluminium-doped zinc oxide, fluorine tin
Oxide, Ga-doped zinc oxide, indium Ga-doped zinc oxide or antimony tin oxide, but it is not limited only to such, what is listed is only preferred
Material.
Volume to volume magnetron sputtering atomic deposition transparent conductive oxide film circuit methods step of the present invention is as follows：
Step 1. is cleaned by ultrasonic to flexible flexible glass matrix, dried；It is put into vacuum volume to volume (R2R)
Plasma cleaning is carried out in magnetron sputtering coater.
Step 2. attaches to circuit plastic formwork in flexible glass with volume to volume laminator.
The flexible glass for posting plastic formwork is put into the unreeling on device of vacuum volume to volume magnetron sputtering coater by step 3.,
One end of flexible glass is connected on coiler.
Step 4. is evacuated down to 10-6To 10-8Torr；According to the characteristic of different transparent oxides, power 10- is regulated
30Kw, argon gas 30-100SCCM is filled with, keeps vacuum 2-50mTorr, magnetic control is carried out with planar targets or cylinder rotary target material
Sputtered atom plated film.
The flexible glass for being coated with transparent oxide master die is carried out modifier treatment by step 5. at a temperature of 120-180 DEG C
Step 6. carries out thickness to the transparent conductive oxide circuit in flexible glass, sheet resistance carries out quality
Step 7. takes out that winding flexible glass removes plastic formwork and to carry out surface inspection true in vacuum magnetic-control sputtering machine
No slight crack is protected, then carries out protection pad pasting.
Step 8. makes a four line touch panels with hollow template and silk-screen printing；Print between silver electrode and point
Every by top panel and lower panel, carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument.
Embodiment 1
(1) flexible 25 microns of flexible glass matrix is cleaned by ultrasonic, dried；It is put into vacuum volume to volume
(R2R) plasma cleaning is carried out in magnetron sputtering coater.
(2) circuit plastic formwork is attached in flexible glass with volume to volume laminator.
(3) flexible glass for posting plastic formwork is put into the unreeling on device of vacuum volume to volume magnetron sputtering coater, it is soft
One end of property glass is connected on coiler.
(4) 10 are evacuated down to-6Torr；Carry out transparent sull circuit to prepare, power 30Kw, be filled with flow
30SCCM argon gas, vacuum 2mTorr is kept, magnetron sputtering atom plated film is carried out with ITO cylinders rotary target material.
(5) flexible glass for being coated with transparent oxide film circuit is subjected to modifier treatment at a temperature of 120 DEG C
(6) thickness is carried out to the transparent conductive oxide film circuit in flexible glass, sheet resistance carries out quality；Thickness
500 nanometers；The ohms/square of sheet resistance 5 (7) takes out winding flexible glass in vacuum magnetic-control sputtering machine and removes pattern plastic and carry out
Surface inspection ensures no slight crack, sticks PE diaphragms.
(8) a four line touch panels are made with hollow template and silk-screen printing；Print silver electrode and point is spaced, will
Carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument for top panel and lower panel.
Embodiment 2
(1) flexible 50 microns of flexible glass matrix is cleaned by ultrasonic, dried；It is put into vacuum volume to volume
(R2R) plasma cleaning is carried out in magnetron sputtering coater.
(2) plastic formwork is attached in flexible glass with volume to volume laminator.
(3) device is unreeled by what the flexible glass for posting circuit plastic formwork was put into vacuum volume to volume magnetron sputtering coater
On, an end of flexible glass is connected on coiler.
(4) 10 are evacuated down to-7Torr；Carry out AZO transparent oxide films circuit to prepare, power 20Kw, be filled with flow
50SCCM argon gas, vacuum 25mTorr is kept, magnetron sputtering atom plated film is carried out with AZO planar targets.
(5) flexible glass for being coated with transparent oxide film circuit is subjected to modifier treatment at a temperature of 150 DEG C
(6) thickness is carried out to the AZO transparent conductive oxide films circuit in flexible glass, sheet resistance carries out quality；Thickness
200 nanometers；The ohms/square of sheet resistance 100 (7) is taken out winding flexible glass removal plastic formwork in vacuum magnetic-control sputtering machine and gone forward side by side
Row surface inspection ensures no slight crack, sticks PE diaphragms.
(8) a four line touch panels are made with hollow template and silk-screen printing；Print silver electrode and point is spaced, will
Carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument for top panel and lower panel.
Embodiment 3
(1) flexible 100 microns of flexible glass matrix is cleaned by ultrasonic, dried；It is put into vacuum volume to volume
(R2R) plasma cleaning is carried out in magnetron sputtering coater.
(2) will be attached to circuit pattern plastics with volume to volume laminator in flexible glass.
(3) flexible glass with circuit pattern plastic adhesive film is put into unreeling for vacuum volume to volume magnetron sputtering coater
On device, an end of flexible glass is connected on coiler.
(4) 10 are evacuated down to-8Torr；Carry out FTO transparent oxide films circuit to prepare, power 25Kw, be filled with flow
50SCCM argon gas, vacuum 50mTorr is kept, magnetron sputtering atom plated film is carried out with FTO cylinders rotary target material.
(5) flexible glass for being coated with transparent oxide film circuit is subjected to modifier treatment at a temperature of 180 DEG C
(6) thickness is carried out to the FTO transparent conductive oxide films circuit in flexible glass, sheet resistance carries out quality；Thickness
400 nanometers；The ohms/square of sheet resistance 16 (7) is taken out winding flexible glass removal pattern plastic in vacuum magnetic-control sputtering machine and gone forward side by side
Row surface inspection ensures no slight crack, sticks PE diaphragms.
(8) a four line touch panels are made with hollow template and silk-screen printing；Print silver electrode and point is spaced, will
Carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument for top panel and lower panel.
Embodiment 4
(1) flexible 80 microns of flexible glass matrix is cleaned by ultrasonic, dried；It is put into vacuum volume to volume
(R2R) plasma cleaning is carried out in magnetron sputtering coater.
(2) circuit plastic formwork is attached in flexible glass with volume to volume laminator.
(3) device is unreeled by what the flexible glass for posting circuit plastic formwork was put into vacuum volume to volume magnetron sputtering coater
On, an end of flexible glass is connected on coiler.
(4) it is evacuated down to 5x10-7Torr；Carry out GZO transparent oxide films circuit to prepare, power 15Kw, be filled with flow
80SCCM argon gas, vacuum 30mTorr is kept, magnetron sputtering atom plated film is carried out with GZO planar targets.
(5) flexible glass for being coated with GZO transparent oxide film circuits is subjected to modifier treatment at a temperature of 160 DEG C
(6) thickness is carried out to the GZO transparent conductive oxide films circuit in flexible glass, sheet resistance carries out quality；Thickness
250 nanometers；The ohms/square of sheet resistance 30 (7) is taken out winding flexible glass removal plastic formwork in vacuum magnetic-control sputtering machine and gone forward side by side
Row surface inspection ensures no slight crack, sticks PE diaphragms.
(8) a four line touch panels are made with hollow template and silk-screen printing；Print silver electrode and point is spaced, will
Carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument for top panel and lower panel.
Embodiment 5
(1) flexible 60 microns of flexible glass matrix is cleaned by ultrasonic, dried；It is put into vacuum volume to volume
(R2R) plasma cleaning is carried out in magnetron sputtering coater.
(2) circuit plastic formwork is attached in flexible glass with volume to volume laminator.
(3) device is unreeled by what the flexible glass for posting circuit pattern plastics was put into vacuum volume to volume magnetron sputtering coater
On, an end of flexible glass is connected on coiler.
(4) it is evacuated down to 9x 10-8Torr；Carry out STO transparent oxide films circuit to prepare, power 10Kw.
Claims (3)
1. a kind of flexible electronic glass transparent conductive oxide film circuit preparation method, it is characterised in that described transparent to lead
Oxide film electric circuit deposition is in the flexible flexible glass of 25-100 microns rather than on current nonbreakable glass；
Preparation method comprises the following steps：
Step 1. is cleaned by ultrasonic to flexible flexible glass matrix, dried；It is put into vacuum volume to volume magnetron sputtering
Plasma cleaning is carried out in film machine；
Step 2. will be attached in flexible glass with circuit plastic formwork with volume to volume laminator；
The flexible glass for posting circuit plastic formwork is put into the unreeling on device of vacuum volume to volume magnetron sputtering coater by step 3.,
One end of flexible glass is connected on coiler；
Step 4. is evacuated down to 10-6To 10-8Torr；According to the characteristic of different transparent oxides, power 10-30Kw is regulated, is filled
Enter argon gas 30-100SCCM, keep vacuum 2-50mTorr, magnetron sputtering atom is carried out with planar targets or cylinder rotary target material
Plated film；
The flexible glass for being coated with transparent oxide circuit pattern is carried out modifier treatment by step 5. at a temperature of 120-180 DEG C；
Step 6. carries out thickness to the transparent conductive oxide circuit in flexible glass, sheet resistance carries out quality；
Step 7. takes out that winding flexible glass removes circuit plastic formwork and to carry out surface inspection true in vacuum magnetic-control sputtering machine
No slight crack is protected, then carries out protection pad pasting；
Step 8. makes a four line touch panels with hollow template and silk-screen printing；Print silver electrode and point is spaced, will
Carefully assembling forms transparent conductive oxide flexible touch screen electronic instrument for top panel and lower panel.
2. flexible electronic glass transparent conductive oxide film circuit preparation method according to claim 1, its feature exist
In the transparent conductive oxide film circuit thickness is 50-500 nanometers；Conductive sheet resistance is 5-500 ohms/；Light transmittance 75-
95%.
3. flexible electronic glass transparent conductive oxide film circuit preparation method according to claim 1, its feature exist
In, transparent conductive oxide raw material be transparent conductive oxide plane or cylinder rotary magnetron sputtering target material, such as indium tin oxide,
Aluminium-doped zinc oxide, fluorine tin-oxide, Ga-doped zinc oxide, indium Ga-doped zinc oxide, antimony tin oxide.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710573171.7A CN107731352B (en) | 2017-07-14 | 2017-07-14 | Flexible electronic glass transparent conductive oxide film circuit preparation method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710573171.7A CN107731352B (en) | 2017-07-14 | 2017-07-14 | Flexible electronic glass transparent conductive oxide film circuit preparation method |
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| CN107731352A true CN107731352A (en) | 2018-02-23 |
| CN107731352B CN107731352B (en) | 2019-10-18 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417313A (en) * | 2018-03-14 | 2018-08-17 | 中南大学 | A kind of flexibility roll-to-roll wet etching of indium tin oxide transparent conducting film and patterned method |
| CN110205867A (en) * | 2019-06-14 | 2019-09-06 | 陕西科技大学 | A kind of multi-functional paper base flexible sensing material and its preparation method and application |
| CN110928012A (en) * | 2019-12-06 | 2020-03-27 | 深圳市康盛光电科技有限公司 | Anti-electric breakdown preparation method of ITO conductive film for light modulation film |
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| EP1431414A1 (en) * | 2001-09-27 | 2004-06-23 | Idemitsu Kosan Co., Ltd. | Sputtering target and transparent electroconductive film |
| JP2010183083A (en) * | 2009-02-06 | 2010-08-19 | Zylum Beteiligungs Gmbh & Co Patente Ii Kg | Method for manufacturing photovoltaic thin film device and the same |
| CN102899624A (en) * | 2012-09-20 | 2013-01-30 | 上海大学 | Preparation method of transparent conductive oxide composite film material |
| CN104651791A (en) * | 2015-02-18 | 2015-05-27 | 南京汇金锦元光电材料有限公司 | Energy-saving flexible transparent conducting film and preparation method thereof |
| CN106158144A (en) * | 2016-06-23 | 2016-11-23 | 无锡格菲电子薄膜科技有限公司 | A kind of preparation method of ultra-thin super Flexible graphene conductive film |
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2017
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1431414A1 (en) * | 2001-09-27 | 2004-06-23 | Idemitsu Kosan Co., Ltd. | Sputtering target and transparent electroconductive film |
| JP2010183083A (en) * | 2009-02-06 | 2010-08-19 | Zylum Beteiligungs Gmbh & Co Patente Ii Kg | Method for manufacturing photovoltaic thin film device and the same |
| CN102899624A (en) * | 2012-09-20 | 2013-01-30 | 上海大学 | Preparation method of transparent conductive oxide composite film material |
| CN104651791A (en) * | 2015-02-18 | 2015-05-27 | 南京汇金锦元光电材料有限公司 | Energy-saving flexible transparent conducting film and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417313A (en) * | 2018-03-14 | 2018-08-17 | 中南大学 | A kind of flexibility roll-to-roll wet etching of indium tin oxide transparent conducting film and patterned method |
| CN110205867A (en) * | 2019-06-14 | 2019-09-06 | 陕西科技大学 | A kind of multi-functional paper base flexible sensing material and its preparation method and application |
| CN110928012A (en) * | 2019-12-06 | 2020-03-27 | 深圳市康盛光电科技有限公司 | Anti-electric breakdown preparation method of ITO conductive film for light modulation film |
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| CN107731352B (en) | 2019-10-18 |
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