CN107727302A - Pressure measurement cell and for coat and contact measuring unit carrier method - Google Patents
Pressure measurement cell and for coat and contact measuring unit carrier method Download PDFInfo
- Publication number
- CN107727302A CN107727302A CN201710679770.7A CN201710679770A CN107727302A CN 107727302 A CN107727302 A CN 107727302A CN 201710679770 A CN201710679770 A CN 201710679770A CN 107727302 A CN107727302 A CN 107727302A
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- carrier
- pressure
- measurement
- protective layer
- circuit
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0069—Electrical connection means from the sensor to its support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
- G01L19/0654—Protection against aggressive medium in general against moisture or humidity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/142—Multiple part housings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The present invention relates to pressure measurement cell (50) and for coating the method with the carrier (52) of contact measuring unit (50), and it is related to the pressure sensor mechanism with this pressure measurement cell (50), the pressure measurement cell has the carrier (52) for forming measurement film (52.1), the measurement film deforms in the presence of pressure to be detected, measurement structure (55) is wherein applied with carrier (52), measurement structure detection measurement film (52.1) deforms and produces at least one electrical output signal for representing detected pressure, the electrical output signal can be output by least one the first composition surface (56.3) contacted with closing line (58), wherein protective layer (57) is applied in measurement structure (55).Electrically and mechanically connected through protective layer and with corresponding first composition surface (56.3) on this protective layer (57) covering measurement structure (55) and at least one first composition surface (56.3) and closing line (58).
Description
Technical field
The present invention relates to a kind of pressure measurement cell of type according to independent claims or it is a kind of be used to coat and
The method of the carrier of contact measuring unit.The object of the present invention also includes the pressure sensing with this pressure measurement cell
Device mechanism.
Background technology
By the pressure sensor mechanism known in the art that constructed by multiple parts for pressure measxurement.Pressure is converted
Realized for electric signal by so-called pressure measurement cell.By means of different thin-film techniques on the carrier of pressure measurement cell
Apply measurement structure, measurement structure is preferably wheatstone measurement bridge.Pass through the meander of additional protective layer protection structure
To prevent pollution and humidity, because electric bridge or short circuit otherwise can be formed and measurement knot thus can be destroyed due to electrochemical corrosion
Structure.In by pressure measurement cell known in the art additional protective layer is produced by applying protective paint or gel.At this
Must be avoided in some known methods by the masking process of complexity for contact measurement structure composition surface or with it is corresponding
Engagement linear contact lay after can just pass through protective paint or gel and protect composition surface.
A kind of pre-assembled component for sensor mechanism and corresponding sensing as known to the A1 of DE 10 2,014 221 365
Device mechanism, the sensor mechanism, which has, is embodied as the measuring cell of pressure measurement cell, the sensor carrier of rotational symmetry and electricity
Road-load body.Measuring cell is connected with sensor carrier and circuit carrier has internal interface, internal interface collection measurement member
At least one electrical output signal of part.The matrix of circuit carrier is embodied as the hollow cylinder with interior bonds geometry,
The exterior contour of the interior bonds geometry and measuring cell matches and surrounds the measuring cell.In addition circuit carrier
Matrix is mechanically connected by clip connecting portion and sensor carrier.
The content of the invention
Pressure measurement cell with feature described in independent claims 1 has the following advantages that, i.e. the electricity in measurement structure
Contact is inexpensive before and simply applies more preferable so as to realize in a manufacturing process for the protective layer of protection structure
Protection.Pass through applied protective layer can advantageously protection structure element to prevent pollution and moist, so as to prevent
Short circuit and electrochemical corrosion.
Characteristic, such as thickness and the material of protective layer select as follows, you can measure structure by protective layer
Electrical contact.Protective layer is directly applied to by pressure measxurement by atmospheric plasma process when manufacturing pressure measurement cell
Low cost and simple manufacture can be advantageously carried out on the surface of unit or in measurement structure.It is preferred that protective layer is applied to pressure
In the whole surface of measuring unit or in whole measurement structure and protective layer is also surrounded and completely or at least partially protected simultaneously
At least one first composition surface of sheath covering.In addition atmospheric plasma process can be realized with enough protective effect applications
Relatively thin protective layer.By between protective effect and engageable property harmonious protection layer can be engaged advantageous by protective layer, from
Without reserving composition surface from protective layer.Current protective layer can not realize engagement, so as to for example logical when applying protective layer
Masking process is crossed to expose engaging zones or composition surface or protective layer is for example just applied for into gel after splicing.Because connecing
Touch or engagement just applies gel afterwards, so higher cleannes requirement is proposed to the manufacturing process of pressure measurement cell, because
For measurement structure until contact is unprotected.Therefore traditional pressure measurement cell manufactures under the conditions of ultra-clean chamber.
Embodiments of the present invention provide the pressure measurement cell with carrier, and the carrier forms measurement film, the measurement
Film deforms in the presence of pressure to be detected.Measurement structure is applied with carrier, the change of measurement structure detection measurement film
Shape and the electrical output signal for producing the detected pressure of at least one representative, the electrical output signal can be by least one with connecing
First composition surface of zygonema contact is output.In addition matcoveredn is applied in measurement structure.Measurement knot is covered in this protective layer
Structure and at least one first composition surface, and closing line electrically and mechanically connects through protective layer and with corresponding first composition surface
Connect.
In addition a kind of method for being used for coating and contact measuring unit carrier is proposed, the carrier forms measurement film.
Measurement structure is applied on the surface of carrier using at least one first composition surface, wherein at least one first composition surface with
Engage linear contact lay.In addition protective layer is applied in measurement structure.Applied herein by means of atmospheric plasma process and protected
Layer and protective layer cover measurement structure and at least one first composition surface, wherein closing line pass through protective layer quilt by joint technology
Print and electrically and mechanically connected with corresponding first composition surface.
Particular/special requirement is not proposed to environmental condition by using atmospheric plasma process, so that also can be in ultra-clean chamber
Outside manufacture pressure measurement cell on a production line.
Pressure measurement cell can be preferably used in the pressure sensor mechanism with protective case, be disposed with pressure wherein
Measuring unit, circuit carrier and connection and circuit arrangement and support with the circuit board perpendicular to circuit carrier surface layout
Mechanism, wherein circuit board are loaded with the electronic circuit with least one electronics and/or electrical equipment, and supporting mechanism is included with outer
The matrix of contouring and close protective case.Pressure measurement cell is connected with sensor carrier, and the sensor carrier, which has, to be carried
For the mounting flange of the join domain of protective case, the wherein matrix of circuit carrier is mechanically connected and had with sensor carrier
Internal interface, the internal interface gather at least one electrical output signal of pressure measurement cell and are applied to electronic circuit.Branch
The matrix of support mechanism forms the external interface with least one electric outside contact part, and electronics electricity can be gathered by the outside contact part
At least one output signal on road, wherein at least one outside contact part are electrically connected by electrical connection section with the corresponding contact of circuit board
Connect.
It can be advantageously improved in independent claims 1 by the measure listed in the dependent claims and improvement project
Illustrated pressure measurement cell and illustrated in independent claims 6 it is used to coat and contact measuring unit carrier
Method.
Particularly advantageously, protective layer can be made up of silica and can have the layer in 50nm to 200nm scopes
Thickness.It is this very durable in use like quartzy or glazed layer and be not affected by temperature and can be with given thickness
Enough protections to measurement structure are provided when spending and can be permeated by standard joint technology and closing line can be realized with being located at
The good electrically and mechanically connection on composition surface below.
In the favourable design of pressure measurement cell, can apply between measurement structure and carrier surface has
The insulating barrier of thickness degree in 0.5 μm to 10 μ ms.Element in measurement structure can advantageously be avoided by this insulating barrier
Between undesirable short circuit and be easy to the application of measurement structure.
In another favourable design of pressure measurement cell, measurement structure can have measuring bridge.Measuring bridge
It may include multiple electrical resistance tracks and the conduction that electrical resistance track and/or at least one first contact surface can be connected with each other by circuit
Trace.Measuring bridge is preferably implemented as Wheatstone bridge, and each resistance of wherein Wheatstone bridge can be configured to meander type.
For coating with the expedients scheme of the method for contact measuring unit carrier, hexamethyl two can be used
Siloxanes is as the precursor or raw material in atmospheric plasma process.Thus can be made simply and at low cost by silica
Into like quartzy or glazed protective layer.
, can before protective layer is applied using atmospheric pressure plasma beam in another favourable design of this method
Clean measurement structure.In addition it can harden protective layer after the application using atmospheric pressure plasma beam.
, can be before measurement structure be applied by means of atmos plasma in another favourable design of this method
Insulating barrier is applied on the surface of carrier by body technology.
Brief description of the drawings
Embodiments of the invention are shown in the drawings and explained in detail in the following description.Identical in the accompanying drawings
Reference represents to perform the part or element of same or similar function.Wherein：
Fig. 1 shows the schematic perspective top view of one embodiment of the pressure sensor mechanism according to the present invention.
Fig. 2 shows the schematic perspective view of the pressure measurement cell according to the present invention of Fig. 1 pressure sensor mechanism.
Fig. 3 shows the schematic perspective view of the sensor carrier before pressure measurement cell engages with sensor carrier,
The sensor carrier has the pressure of mounting flange and the pressure sensor mechanism according to the present invention for Fig. 1 according to the present invention
Power measuring unit.
Fig. 4 show after pressure measurement cell engages with sensor carrier during protective layer is applied sensor carrier
Schematic perspective view, the sensor carrier has the pressure measxurement according to the pressure sensor mechanism of the present invention for Fig. 1
Unit.
Fig. 5 shows before circuit carrier engages with sensor carrier sensor carrier and for Fig. 1 according to this hair
The schematic perspective view of the circuit carrier of bright pressure sensor mechanism.
Fig. 6 is shown after pressure measurement cell engagement and before protective case engagement for Fig. 1 according to the present invention
Pressure sensor mechanism pre-assembled component schematic perspective view.
Fig. 7 is shown during cleaning process according to one embodiment of the pressure measurement cell of the present invention in measurement film area
Schematic cross sectional views in domain.
Fig. 8 shows the pressure measurement cell of Fig. 7 during process is coated.
Fig. 9 shows the pressure measurement cell of Fig. 7 and Fig. 8 during hardening process.
Embodiment
Such as from Fig. 1 to Fig. 9, the embodiment of shown pressure measurement cell 50 includes the load for forming measurement film 52.1
Body 52.Measurement film 52.1 deforms in the presence of pressure P to be detected, wherein measurement structure 55 is applied with carrier 52, should
Measurement structure detection measurement film 52.1 deforms and produces at least one electrical output signal for representing detected pressure.Electricity is defeated
Going out signal can be output by the first composition surface 56.3 contacted with closing line 58.In addition protection is applied with measurement structure 55
Layer 57, its protection structure 55 is to prevent pollution and humidity.Measurement structure 55 and at least one first is covered in this protective layer 57
Composition surface 56.3, and closing line 58 electrically and mechanically connects through protective layer 57 and with corresponding first composition surface 56.3.The
The preferably complete protected seam 57 in one composition surface 56.3 covers.And it is also possible that particularly when the first composition surface 56.3 is arranged
In the outer edge of measurement structure 55 to be protected, the only local protected seam 57 in the first composition surface 56.3 covers.
Such as by Fig. 1 to Fig. 6 furthermore, it can be seen that measurement structure 55 has in the embodiment of shown pressure measurement cell 50
There is measuring bridge 56, it includes multiple electrical resistance tracks 56.1 and conductive trace 56.2.Conductive trace 56.2 is by electrical resistance track 56.1
And/or at least one first composition surface 56.3 is connected with each other by circuit.
By for coating the method with the carrier 52 of the composition measurement film 52.1 of contact measuring unit 50 using extremely
Measurement structure 55 is applied on the surface of carrier 52 by few first composition surface 56.3.By means of atmospheric plasma process
Protective layer 57 is applied in measurement structure 55, protective layer covering measurement structure 55 and at least one first composition surface 56.3.
In order to which contact measurement structure 55 passes through the compressive engagement line of protective layer 57 and closing line and the corresponding first engagement by joint technology
Face 56.3 electrically and mechanically connects.
Such as by Fig. 7 furthermore, it can be seen that cleaning measurement structure before protective layer 57 is applied using atmospheric pressure plasma beam
55, the plasma beam is flowed in measurement structure 55 from plasma nozzle 2.Fig. 8, which is shown, utilizes atmospheric pressure plasma work
Skill applies protective layer 57, wherein using HMDO in the embodiment illustrated as precursor or raw material.Such as by Fig. 9
Furthermore, it can be seen that harden protective layer 57 after the application using atmospheric pressure plasma beam.In the embodiment illustrated
Protective layer 57 is made up of silica and with the thickness degree in 50nm to 200nm scopes.Certainly can also be used with class
Like the other materials of characteristic, to generate protective layer 57.Characteristic, such as thickness and the material of protective layer 57 select as follows,
The electrical contact of structure 55 can be measured by protective layer 57 by joint technology.Applied by atmospheric plasma process and protected
Sheath, which can be realized, applies relatively thin protective layer 57 with enough protective effects.By coordinating between protective effect and engageable property
Protective layer 57 can engage advantageous by protective layer 57.
Such as from Fig. 7 to Fig. 9, it is applied between the surface of measurement structure 55 and carrier 52 with 0.5 μm to 10 μ
The insulating barrier 54 of thickness degree in m scopes.Insulating barrier 54 is equally applied to carrier 52 by means of atmospheric plasma process
Surface on.
Such as by Fig. 1 furthermore, it can be seen that the embodiment of shown pressure sensor mechanism 1 includes protective case 20, wherein
It is disposed with the company of pressure measurement cell 50, circuit carrier 60 and the circuit board 40 with the surface layout perpendicular to circuit carrier 60
Connect with circuit arrangement 3 and supporting mechanism 30, wherein circuit board be loaded with least one electronics and/or electrical equipment 44.1,
44.2 electronic circuit 44, supporting mechanism include the matrix 32 with exterior contour 37 and close protective case 20.Pressure measxurement
Unit 50 is connected with sensor carrier 10, and the sensor carrier has the fixation for carrying the join domain 16 for protective case 20
Orchid 12.The matrix 62 of circuit carrier 60 is mechanically connected with sensor carrier 10 and has internal interface 24, and the internal interface is adopted
Collect at least one electrical output signal of pressure measurement cell 50 and be applied on electronic circuit 44.The matrix 32 of supporting mechanism 30
The external interface 26 with least one electric outside contact part 34 is formed, electronic circuit 44 can be gathered extremely by the outside contact part
A few output signal.At least one outside contact part 34 is electrically connected by electrical connection section with the corresponding contact of circuit board 40.
Such as by Fig. 1 to Fig. 6 furthermore, it can be seen that in the embodiment illustrated measuring mechanism 9 include pressure measurement cell 50,
Sensor carrier 10 and circuit carrier 60 and form the pre-assembled component for pressure sensor mechanism 1.In shown reality
Measuring cell 50 in example is applied to mechanically connect with sensor carrier 10.Such as by Fig. 3 furthermore, it can be seen that as follows by pressure measxurement
Unit 50 is installed on the tubular carrier 11 of mounting flange 12, i.e., the measurement film 52.1 of pressure measurement cell 50 is according to be measured
Fluid pressure deforms.The deformation of measurement film 52.1 is detected by measuring bridge 56.Measuring bridge 56 and four the first composition surfaces 56.3
Connection, it is electrically connected by closing line 58 with the second composition surface 68 of circuit carrier 60 respectively.Second engagement of circuit carrier 60
Face 68 electrically connects with the first contact 66 of circuit carrier 50.Sensor carrier 10 is embodied as rotation pair in the embodiment illustrated
The turning part of title.
Such as by Fig. 1 to Fig. 6 furthermore, it can be seen that mounting flange 12 for example can be by means of self-locking connecting portion 18 and unshowned stream
Body block presses or connection.It is viscous being nearby provided with for the join domain 16 of compression or welding protection set 20 at flange surface 14
Contact, it can apply keep bonding agent 5 in this place, to prevent the matrix 62 of circuit carrier 60 from rotating.
Pressure measurement cell 50 and sensor carrier 10 are welded when manufacturing sensor mechanism 1.Herein can be in Welder
Before sequence or protective layer 57 is applied in measurement structure 55 after welding sequence.Such as by Fig. 4 furthermore, it can be seen that shown
Embodiment in protective layer 57 is applied in measurement structure 55 after welding sequence.Then it is such as visible by electricity by Fig. 5 and Fig. 6
Road-load body 60 mechanically connects with sensor carrier 10.The matrix 62 of circuit carrier 60 is embodied as with interior bonds geometry 65
Hollow cylinder, the exterior contour of itself and the matrix 52 of pressure measurement cell 50 matches and surrounds pressure measurement cell
50.Matrix 62 of the sensor carrier 10 with the first clip geometry and circuit carrier 10 second clip with corresponding to is several
What structure, its collective effect are connected with producing clip between sensor carrier 10 and circuit carrier 60.In shown implementation
The first clip geometry is incorporated into the mounting flange 12 of sensor carrier 10 as circular holding tank 17 in example, and the
Two clip geometries include multiple elastic lock arms 62.1 with detent rail, and it is installing the feelings of circuit carrier 60
It is plugged under condition in the circular holding tank 17 of sensor carrier 10 to locking.In pressure measxurement after the clamping of circuit carrier 60
Engagement is established between unit 50 and circuit carrier 60 to connect and measuring mechanism 9 is assembled into pre-assembled component.Then will bonding
Agent, which is applied to, to keep in adhesive spots 5, to prevent the rotation of circuit carrier.Keep being bonded by two in the embodiment illustrated
Point 5 fixes the circuit carrier 60 installed and locked with anti-rotation, keeps adhesive spots to be applied in respectively near lock arm 62.1
In the flange surface 14 of sensor carrier 10.In addition apply respectively in utensil receiving opening and keep adhesive spots 5, with fixing circuit board
40.Then compress protective case 20 and fixed if necessary using spot welding.
Such as by Fig. 1 furthermore, it can be seen that engagement geometry 42 and circuit carrier that the matrix 41 of circuit board 40 passes through machinery
60 couplings, wherein the engagement geometry 42 at the matrix 41 of circuit board 40 forms groove 42.1, it is in two opposite sides point
Arm 42.2 is not directed to limit.The external engagement that lead arm 42.2 is at least partially inserted into circuit carrier 60 under contact condition is several
In the respective slot of what structure 64.
Such as by Fig. 1 furthermore, it can be seen that circuit board 40 has contact surface in the region of lead arm 42.2, it forms second and touched
Put 46 and be connected by conductor rail 42.3 with electronic circuit 44.Second contact 46 carries with corresponding first contact 66 or in circuit
Contact surface in the region of external engagement geometry 64 at the matrix 62 of body 60 forms internal electrical interface 24.Circuit board 40 is inserted in
Guarantor is utilized in the groove or utensil receiving opening of external engagement geometry 64 at the matrix 62 of circuit carrier 60 and herein if necessary
Hold bonding agent 5 and electrically conducting adhesive 7 is fixed, to ensure being conductively connected between circuit carrier 60 and circuit board 40 and fix
Circuit board 40.Such as bonding agent 5 will be kept to be incorporated at the groove of circuit carrier 60 or the basal plane of utensil receiving opening and will for example be led
Electric bonding agent is applied on the second contact 46 of circuit board 40.Alternatively, first at the matrix 62 of circuit carrier 60 touches
Point 66 can be embodied as the contact element of elasticity, and the power vertical with the direction of insertion of circuit board 40 is applied to the of circuit board 40 by it
While the circuit board 40 for making to be inserted into the groove or utensil receiving opening of external engagement geometry 64 is fixed on two contacts 46, from
And it can save keep bonding agent 5 and electrically conducting adhesive 7 here.The carrier is carrier 42 of circuit board 40 has not at the other end
The contact being shown specifically, it is in contact with the corresponding contact of the matrix 32 of supporting mechanism 30.The matrix 32 of supporting mechanism 30 includes
Two half shells 32.1,32.2, it is embodied as plastic pressure injection part respectively in the embodiment illustrated, is embedded with punching press wherein
Grid, the punch grid form the contact 34 and plated-through hole and corresponding contact of external interface 26.
Claims (10)
1. pressure measurement cell (50), it has the carrier (52) for forming measurement film (52.1), and the measurement film is to be detected
Deformed in the presence of pressure, wherein measurement structure (55) is applied with the carrier (52), described in the measurement structure detection
Measurement film (52.1) deforms and produced at least one electrical output signal for representing detected pressure, the electrical output signal energy
Exported by least one first composition surface (56.3) contacted with closing line (58), wherein protective layer (57) is applied to the survey
Measure in structure (55), it is characterised in that the protective layer (57) covers the measurement structure (55) and described at least one first
Composition surface (56.3), and the closing line (58) is through the protective layer and electric with corresponding first composition surface (56.3)
Gas and mechanical connection.
2. pressure measurement cell according to claim 1, it is characterised in that the protective layer (57) is made up of silica
And with the thickness degree in 50nm to 200nm scope.
3. pressure measurement cell according to claim 1 or 2, it is characterised in that in the measurement structure (55) and described
Insulating barrier (54) is applied between the surface of carrier (52), the insulating barrier has the thickness degree between 0.5 μm to 10 μm.
4. pressure measurement cell according to any one of claim 1 to 3, it is characterised in that the measurement structure (55)
With measuring bridge (56).
5. pressure measurement cell according to claim 4, it is characterised in that the measuring bridge (56) includes multiple resistance
Trace (56.1) and conductive trace (56.2), the conductive trace is by the electrical resistance track (56.1) and/or described at least one
One composition surface (56.3) is connected with each other by circuit.
6. for coating the method with the carrier (52) of contact measuring unit (50), the carrier forms measurement film
(52.1), wherein measurement structure (55) to be applied to the surface of the carrier (52) using at least one first composition surface (56.3)
On, wherein making at least one first composition surface (56.3) be contacted with closing line (58), and protective layer (57) is applied to
On the measurement structure (55), it is characterised in that apply the protective layer (57) by means of atmospheric plasma process, and
The protective layer is set to cover the measurement structure (55) and at least one first composition surface (56.3), wherein being led to by joint technology
Cross the protective layer (57) and compress the closing line (58), and make the closing line and corresponding first composition surface (56.3)
Electrically and mechanically connect.
7. according to the method for claim 6, it is characterised in that using HMDO as in atmos plasma
Precursor in body technology.
8. the method according to claim 6 or 7, it is characterised in that applying the guarantor using atmospheric pressure plasma beam
The measurement structure (55) is cleaned before sheath (57), and makes the guarantor after the application using atmospheric pressure plasma beam
Sheath (57) hardens.
9. the method according to any one of claim 6 to 8, it is characterised in that apply the measurement structure (55) it
It is preceding that insulating barrier (54) is applied on the surface of the carrier (52) by means of atmospheric plasma process.
10. pressure sensor mechanism (1), it has protective case (20), is disposed with pressure measurement cell (50) wherein, circuit carries
Body (60), connection and circuit arrangement (3) and supporting mechanism (30), the connection and circuit arrangement have to be carried perpendicular to the circuit
The circuit board (40) of the surface layout of body (60), the circuit board are loaded with least one electronics and/or electrical equipment
The electronic circuit (44) of (44.1,44.2), the supporting mechanism include the matrix (32) with exterior contour (37) and closed
The protective case (20), wherein the pressure measurement cell (50) is connected with sensor carrier (10), the sensor carrier has
Mounting flange (12) with the join domain (16) for the protective case (20), wherein the matrix of the circuit carrier (60)
(62) mechanically connected with the sensor carrier (10) and there is internal interface (24), the internal interface gathers the pressure and surveyed
Measure at least one electrical output signal of unit (50) and be applied to the electronic circuit (44), wherein the supporting mechanism
(30) matrix (32) forms the external interface (26) with least one electric outside contact part (34), passes through the outside contact part energy
At least one output signal of the electronic circuit (44) is gathered, wherein at least one outside contact part (34) passes through electrical connection
Portion electrically connects with the corresponding contact of the circuit board (40), it is characterised in that according at least one structure in claim 1 to 5
Make the pressure measurement cell (50).
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016214946 | 2016-08-11 | ||
| DE102016214946.6 | 2016-08-11 | ||
| DE102016216974.2 | 2016-09-07 | ||
| DE102016216974.2A DE102016216974A1 (en) | 2016-08-11 | 2016-09-07 | Pressure measuring cell and method for coating and contacting a carrier of a pressure measuring cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107727302A true CN107727302A (en) | 2018-02-23 |
Family
ID=61018784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710679770.7A Pending CN107727302A (en) | 2016-08-11 | 2017-08-09 | Pressure measurement cell and for coat and contact measuring unit carrier method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107727302A (en) |
| DE (1) | DE102016216974A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114787603A (en) * | 2019-10-18 | 2022-07-22 | 微型金属薄膜电阻器有限公司 | Pressure sensor |
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| Publication number | Publication date |
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| DE102016216974A1 (en) | 2018-02-15 |
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Application publication date: 20180223 |