CN107709488A - The manufacture method of bonding film and the manufacture method of polarizer - Google Patents

The manufacture method of bonding film and the manufacture method of polarizer Download PDF

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Publication number
CN107709488A
CN107709488A CN201680037412.XA CN201680037412A CN107709488A CN 107709488 A CN107709488 A CN 107709488A CN 201680037412 A CN201680037412 A CN 201680037412A CN 107709488 A CN107709488 A CN 107709488A
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China
Prior art keywords
manufacture method
bonding film
film
polarizer
resin
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CN201680037412.XA
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Chinese (zh)
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CN107709488B (en
Inventor
八重樫将宽
仲井宏太
大濑雄基
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Nitto Denko Corp
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Nitto Denko Corp
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Priority to CN202110956436.8A priority Critical patent/CN113667418B/en
Priority claimed from PCT/JP2016/067729 external-priority patent/WO2016208464A1/en
Publication of CN107709488A publication Critical patent/CN107709488A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • G02B5/3025Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3033Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state in the form of a thin sheet or foil, e.g. Polaroid
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/18Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components

Abstract

There is provided it is a kind of properly use make to object it is predetermined partially selectively handle when surface protection film the manufacture method of bonding film and the manufacture method for the polarizer for having used such bonding film.The manufacture method of the bonding film of the present invention includes:Prepare layered product (10), the layered product (10) have resin base material (11), be arranged at resin base material (11) a face adhesive phase (12) and temporarily anchor to adhesive phase (12) adhesive surface separator (13);And the through hole for integratedly penetrating separator (13), adhesive phase (12) and resin base material (11) is cut and formed from separator (13) side of layered product (10).

Description

The manufacture method of bonding film and the manufacture method of polarizer
Technical field
The present invention relates to the manufacture method of bonding film and the manufacture method of polarizer.More specifically, the present invention relates to tool There is the manufacture method of the bonding film of through hole and used the manufacture method of the polarizer with unpolarized portion of the bonding film.
Background technology
Bonding film excellent in workability simultaneously can assign diversified characteristic, therefore, be used in extensive purposes.It is desired Be as example to object it is predetermined partially selectively handle when surface protection film utilization.
But, the image display device existed in mobile phone, notebook personal computer (PC) etc. is equipped with photograph The situation of the internal electron parts such as machine.For the purpose of the raising of camera performance by such image display device etc., carry out Various researchs (such as, patent document 1~6).But, it is fast due to the board-like information processor of smart mobile phone, touch surface The popularization of speed, it may be desirable to the further raising of camera performance etc..In addition, in order to tackle the shape of image display device Variation and high performance, it is desirable to the partly polarization plates with polarization property.
Prior art literature
Patent document
Patent document 1:Japanese Unexamined Patent Publication 2011-81315 publications
Patent document 2:Japanese Unexamined Patent Publication 2007-241314 publications
Patent document 3:No. 2004/0212555 specification of U.S. Patent Application Publication No.
Patent document 4:Japanese Unexamined Patent Publication 2012-137738 publications
Patent document 5:KR published patent 10-2012-0118205 publications
Patent document 6:No. 2014/0118826 specification of U.S. Patent Application Publication No.
The content of the invention
Problems to be solved by the invention
The present invention made to solve the problems, such as above-mentioned conventional, and its main purpose is that providing one kind properly uses Make to object (such as, polarizer) it is predetermined partially selectively handle when surface protection film bonding film. Another object of the present invention is to provide a kind of multifunction and high performance that can realize the electronic devices such as image display device Polarizer.
The solution used to solve the problem
The manufacture method of the bonding film of the present invention includes:Prepare layered product, the layered product has resin base material, is arranged at this The adhesive phase in one face of resin base material and temporarily anchor to the adhesive phase adhesive surface separator;And from the layer The separator lateral incision of stack is cut and is formed and integratedly penetrate passing through for above-mentioned separator, above-mentioned adhesive phase and above-mentioned resin base material Through hole.
In 1 embodiment, formed in the state of abutting material is abutted to the resin base material side of above-mentioned layered product Above-mentioned through hole.
In 1 embodiment, it is cut into the midway of above-mentioned abutting material from above-mentioned separator surface and forms above-mentioned pass through Through hole.
In 1 embodiment, above-mentioned abutting material is glue bound in above-mentioned layered product.
In 1 embodiment, the manufacture method of above-mentioned bonding film is also included above-mentioned abutting material from above-mentioned layered product The step of removing.
In 1 embodiment, the formation of above-mentioned through hole is carried out by the cutting of cutting knife.
In 1 embodiment, the formation of above-mentioned through hole is carried out by laser irradiation.
According to another technical scheme of the present invention, there is provided a kind of manufacture method of film.In the method, by by above-mentioned system The bonding film for making method acquisition is bonded in film, and the partially selectively implementation corresponding with above-mentioned through hole to the film is handled.
According to the another technical scheme of the present invention, there is provided a kind of manufacture method of polarizer.The manufacture method of the polarizer Including:Above-mentioned separator is peeled off from the bonding film obtained using above-mentioned manufacture method;It is and viscous after above-mentioned separator by peeling off Close film and be bonded in the resin film containing dichroic substance, formed at the position corresponding with the through hole of bonding film of the resin film Unpolarized portion.
In 1 embodiment, peeling off the bonding film after above-mentioned separator has resin base material and is arranged at the resin base The adhesive phase in one face of material, and the through hole for integratedly penetrating the resin base material and adhesive phase is formed, the through hole The periphery of adhesive phase side is formed as arc surface.
In 1 embodiment, the manufacture method of above-mentioned polarizer is additionally included in form above-mentioned unpolarized portion after, from Resin film containing above-mentioned dichroic substance peels off the step of above-mentioned bonding film.
In 1 embodiment, by making alkaline solution be contacted with the resin film containing above-mentioned dichroic substance, in formation State unpolarized portion.
In 1 embodiment, above-mentioned alkaline solution contains the hydroxide of alkali metal and/or alkaline-earth metal.
In 1 embodiment, the manufacture method of above-mentioned polarizer is additionally included in be contacted with what above-mentioned alkaline solution contacted The step of reducing the alkali metal contained by above-mentioned resin film and/or alkaline-earth metal in portion.
In 1 embodiment, keeping above-mentioned bonding film being adhered to the resin film containing above-mentioned dichroic substance Under state, reduce above-mentioned alkali metal and/or alkaline-earth metal.
The effect of invention
According to 1 embodiment of the present invention, using the teaching of the invention it is possible to provide one kind, which properly uses, to be made to object (such as, polarizer) It is predetermined partially selectively handled when surface protection film bonding film., can by using such bonding film The unpolarized portion with desired shape is formed well.The polarizer obtained using the present invention can realize the more of electronic device Functionalization and high performance, are rightly used in electronic device.In addition, the polarizer obtained using the present invention can not only be appropriate Ground is used in the reception type electronic device of image, monitoring etc., also can rightly be used in the hair such as LED, infrared ray sensor Send type electronic device and ensure image display device relative to the permeability of naked eyes and the straight trip of light.
Brief description of the drawings
Fig. 1 is the sectional view of the layered product of 1 embodiment of the present invention.
Fig. 2 is the top view of the polarizer of 1 embodiment of the present invention.
Fig. 3 is the sectional view of the polarizing film stack of 1 embodiment of the present invention.
The bonding film of embodiment is adhered to the observation photo of the state of polarizer by Fig. 4 (a), and Fig. 4 (b) is to compare The bonding film of example is adhered to the observation photo of the state of polarizer.
Embodiment
Hereinafter, embodiments of the present invention are illustrated, but the present invention is not limited to these embodiments.
The manufacture method of the bonding film of the present invention includes:Prepare layered product, the layered product has resin base material, is arranged at this The adhesive phase in one face of resin base material and temporarily anchor to the adhesive phase adhesive surface separator;And above-mentioned Layered product forms through hole.
A. layered product
Fig. 1 is the sectional view of the layered product of 1 embodiment of the present invention.Layered product 10 has:Resin base material 11;Bonding Oxidant layer 12, it is arranged at a face of resin base material 11;Separator 13, it temporarily anchors to the adhesive surface of adhesive phase 12.Layer Stack is set to such as lengthwise shape.In this manual, " lengthwise shape " refers to length relative to the sufficiently long elongated shape of width, bag Include such as length relative to width be more than 10 times, preferably more than 20 times of elongated shape.In this case, it is laminated physical efficiency winding Into web-like.
Resin base material can play function as the base material of the bonding film obtained.Preferred resin base material be hardness (such as, bullet Property modulus) higher film.The reason is that the deformation of through hole can be prevented.Specifically, the reason is that even in use When the bonding film obtained (such as, conveying and/or bonding when) apply tension force, can also prevent the deformation of through hole.
As the formation material of resin base material, can include the fat such as PET series resin system resin, The olefin-based resins such as the cyclenes such as norbornene resin system resin, polypropylene, polyamide series resin, polycarbonate-based resin, it Copolymer resin etc..Preferably fat system resin (especially, PET series resin).As long as this The material of sample, there is modulus of elasticity is sufficiently high, be difficult to produce above-mentioned through hole deformation it is such the advantages of.
The thickness of resin base material is typically 20 μm~250 μm, preferably 30 μm~150 μm.As long as such thickness Degree, there is the advantages of deformation for being difficult to produce above-mentioned through hole is such.
The modulus of elasticity of resin base material is preferably 2.2kN/mm2~4.8kN/mm2.As long as the modulus of elasticity of resin base material is Such scope, there is the advantages of deformation for being difficult to produce above-mentioned through hole is such.In addition, modulus of elasticity is according to Japanese industry mark Quasi- JIS K 6781 are determined.
The tensile elongation of resin base material is preferably 90%~170%.As long as the tensile elongation of resin base material is so Scope, just have for example be difficult to be broken the advantages of such in conveying.In addition, tensile elongation is according to Japanese Industrial Standards JIS K 6781 are determined.
As long as above-mentioned adhesive phase obtains the effect of the present invention, can just be formed by arbitrary appropriate adhesive.As viscous The matrix resin of mixture, can include for example, acrylic resin, phenylethylene resin series, silicon-type resin.For being obtained Bonding film chemical resistance and bonded body between adaptation (such as, for preventing dipping when treatment fluid entrance Adaptation), consider relative to viewpoints such as the frees degree of bonded body, preferred acrylic resin.It can contain as adhesive Crosslinking agent, can include for example, isocyanate compound, epoxide, aziridine cpd.Adhesive can also contain example Such as silane coupler.The cooperation prescription of adhesive can rightly be set according to purpose.
Adhesive phase can be formed by arbitrary appropriate method.As concrete example, it can include and be applied on resin base material Apply binder solution and make the method for its drying, the adhesive phase formed in advance on separator is laminated in resin base material Method etc..As coating process, can include for example, reverse rolling method, spin-coating method, silk screen coating process, the bottom such as coating, gravure coating Coating, infusion process, gunite.
The thickness of adhesive phase is preferably 1 μm~60 μm, more preferably 3 μm~30 μm.If thickness is excessively thin, cohesive becomes Must be insufficient, that bubble etc. enters adhesive interface be present.If thickness is blocked up, it is easy to produce the bad feelings such as adhesive spilling Condition.
Above-mentioned separator can be protected to the protection materials until being provided in practical application as by adhesive phase (bonding film) Play function.In addition, by using separator, bonding film can be coiled into web-like well.As separator, can include Such as formed by the coating of the remover surfaces such as silicon-type remover, fluorine system remover, chain alkyl acrylate series stripping agent Plastics (such as, polyethylene terephthalate (PET), polyethylene, polypropylene) film, non-woven fabrics or paper etc..Separator Thickness can be set to arbitrary appropriate thickness according to mesh.The thickness of separator is such as 10 μm~100 μm.
Above-mentioned stacking physical efficiency is made by arbitrary appropriate method.Specifically, can also be by the way that separator be laminated Made in the adhesive phase formed in resin base material, can also be by the way that resin base material be laminated in into the bonding formed in separator Oxidant layer makes.
B. the formation of through hole
Then, through hole is formed in above-mentioned layered product.Specifically, using arbitrary appropriate cutting method come to stacking Body is cut, and forms the through hole for integratedly penetrating above-mentioned resin base material, adhesive phase and separator.It is used as cutting side Method, it can include for example, using Thomson knife, pinnacle knife (Japanese:ピ Na Network Le sword) etc. cutting knife (blanking die), high pressure waterjet etc. To carry out the method for machine cuts, irradiation laser the method cut.
For example in the case where layered product forms multiple through holes, the cutting of above-mentioned cutting knife can be rightly used.Cutting knife Cutting can utilize arbitrarily appropriate pattern progress.It can also use and for example be configured with rushing for multiple cutting knifes in a predetermined pattern Device is cut out to carry out, carries out using device as XY plotters cutting knife movement.So, can by cutting knife with The mode corresponding with the predetermined position of layered product is moved to be cut, therefore, it is possible in the desired position of layered product Put and through hole is formed with high accuracy.In 1 embodiment, can the layered product of lengthwise shape is carried out volume conveying, and meanwhile with The conveying rightly links to carry out the cutting of cutting knife.More specifically, by considering the transporting velocity of layered product come rightly Adjustment cutting at the time of and/or cutting knife translational speed, can layered product desired position formed through hole.In addition, Above-mentioned blanking apparatus both can be the mode (rotation) of reciprocating manner (hammer out) or rotation.
As above-mentioned laser, as long as above-mentioned layered product can be cut, arbitrary appropriate laser can be just used.Preferably It is that use can radiate the laser of the light of the wavelength in the range of 193nm~10.6 μm.As concrete example, CO can be included2Swash The gas lasers such as light device, excimer laser;The solid state lasers such as YAG laser;Semiconductor laser.It is preferred that use CO2 Laser.
The irradiation condition of laser can be set to arbitrary appropriate condition according to for example used laser.Using CO2In the case of laser, power condition is such as 0.1W~250W.
When being cut to layered product, abutting material is preferably set to be connected to the one side of layered product.Specifically, make to Connect the layered product surface that material is connected to cut direction end side.By using material is abutted, shelled after dicing from layered product From when abutting material, perforation chip can also remove simultaneously.Specifically, the state of abutting material can be attached in perforation chip Under, material will be abutted and peeled off from layered product.In addition, by using material is abutted, the layered product as caused by cutting can be suppressed Deformation.In the case of using for example cutting knife is cut, it is particular enable to suppress the deformation of adhesive phase.
In a preferred embodiment, it is cut into from layered product surface and abuts the midway of material and form above-mentioned through hole. According to such form, the insertion for integratedly penetrating above-mentioned resin base material, adhesive phase and separator can be formed well Hole.In addition, when it will abut material and be peeled off from layered product, perforation chip can be removed well.
As above-mentioned abutting material, preferably using polymeric membrane.As polymeric membrane, can use and above-mentioned resin base material it is same The film of sample.Moreover, soft as can also using polyolefin (such as, polyethylene) film (such as, modulus of elasticity relatively low) Film.In 1 embodiment, as polymeric membrane, preferably using the higher film of hardness (such as, modulus of elasticity).Its reason exists In the deformation of the layered product as caused by cutting can be suppressed well.The thickness of polymeric membrane is preferably 20 μm~100 μm.
Preferably, material is abutted to be glue bound in layered product.Layered product is bonded in by the way that material will be abutted, can Prevent from abutting a problem that material deviates when cutting.In addition, when it will abut material and be peeled off from layered product, can be well Remove perforation chip.The adhesive of material is abutted as bonding, material is abutted as long as there is that can be peeled off after dicing from layered product Bonding force, can just use arbitrarily appropriate adhesive.In 1 embodiment, material is being abutted formed with bonding in advance Oxidant layer.1 μm~50 μm are preferably in the thickness for abutting the adhesive phase that material is formed.
In 1 embodiment, preferably make the shape of abutting material corresponding with the shape of layered product.In such as layered product In the case of being lengthwise shape, the abutting material of lengthwise shape is used.According to such shape, peeled off material will be abutted from layered product When, perforation chip can be removed well.In addition, in the case where multiple through holes are formed at layered product, can continuously go Except perforation chip, productivity ratio can be extraordinarily improved.
When through hole is formed, cut from the separator side of layered product.By being cut from separator side, energy Enough suppress by cutting and the influence of the adhesive tape of the bonding film to being obtained.Specifically, cut using cutting knife In the case of, the adhesive phase of layered product can follow cutting knife and deform.If being cut from resin base material side, adhesive phase exists The bonding surface side expansion of the bonding film obtained, bellying is formed in the periphery of through hole.If the as a result, bonding that will be obtained Film is bonded in bonded body, then can produce bubble on the periphery of through hole.Another side, if being cut from separator side, glue Mixture layer can follow cutting knife and deform, but the periphery of the bonding surface side of the through hole of the bonding film obtained is smooth state (such as, arc surface), even if being bonded in bonded body, can also prevent the generation of bubble.In addition, by being cut from separator side Cut, in the case where having used abutting material, peeled off after dicing from layered product when abutting material, perforation can be removed well Chip.
The plan view shape of through hole can be according to purpose using arbitrary appropriate shape.As concrete example, circle can be included Shape, ellipse, square, rectangle, rhombus.In 1 embodiment, the plan view shape of through hole have with polarization described later The corresponding shape of the shape in desired unpolarized portion in the manufacture of piece.Specifically, make illustrated example polarizer (after State) in the case of, the vertical view shape of through hole is set to small circular.By rightly forming the formation part of through hole, can be formed Through hole with desired plan view shape., can in the case of the device as using blanking apparatus or XY plotters Form the through hole of the plan view shape corresponding with the shape of cutting knife (blanking die).
C. use example
The bonding film of the present invention can properly use the predetermined part selection of such as object (typically, being film) of opposing Surface protection film when being handled to property.The alternatively processing of property, can include for example, decolourize, be coloring, perforation, aobvious Shadow, etching, patterning (such as, the formation of active energy ray curable resin bed), the modification of chemistry, heat treatment.Hereinafter, make For concrete example, the manufacture method of the polarizer with unpolarized portion is illustrated.
C-1. polarizer
Fig. 2 is the top view of the polarizer of 1 embodiment of the present invention.Polarizer 1 is by the tree containing dichroic substance Adipose membrane is formed.Polarizer (resin film) 1 has unpolarized portion 2.Preferably, unpolarized portion 2 is set to the content of dichroic substance The low concentration portion lower than the content of the dichroic substance at other positions 3.According to such structure, and mechanically (using making Mechanical blanking method is carried out with such as icking tool punching, plotter, the high pressure waterjet) situation that forms through hole compares, avoids The problem of crackle, layering (splitting), paste expose etc. in quality.In addition, the dichroic substance in low concentration portion itself contains Measure relatively low, therefore, with decomposing dichroic substance using laser etc. compared with forming the situation in unpolarized portion, maintain well non- The transparency in polarization portion.
In illustrated example, the unpolarized portion 2 of small circular is formed at the upper end central portion of polarizer 1, but unpolarized portion Quantity, configuration, shape, size etc. can be appropriately designed.Can be according to the position of the camera section of the image display device for example carried Put, the design such as shape, size.Specifically, be designed to unpolarized portion not with addition to the camera of image display device Part (such as, image displaying part) it is corresponding.
Unpolarized portion transmitance (such as, 23 DEG C when the transmitance that arrives of the light measurement using wavelength as 550nm) preferably More than 50%, more than 60% is more preferably, is further preferred that more than 75%, particularly preferably more than 90%.As long as so Transmitance, it becomes possible to ensure the desired transparency.For example make unpolarized portion and the camera section phase of image display device In the case of corresponding, the harmful effect of the shooting performance to camera can be prevented.
Preferably, polarizer (in addition to unpolarized portion) is presented in the range of wavelength is 380nm~780nm and absorbed Dichroism.The singleton transmittance (Ts) of polarizer (in addition to unpolarized portion) is preferably more than 39%, more preferably 39.5% More than, it is further preferred that more than 40%, particularly preferably more than 40.5%.In addition, the theoretic upper limit of singleton transmittance It is 50%, the upper limit of practical application is 46%.In addition, singleton transmittance (Ts) is 2 using Japanese Industrial Standards JIS Z8701 Degree visual field (illuminant-C) measure and carried out visibility correction Y value, can use for example, micro-spectral system (Co., Ltd. ラ System ダ PVC ジ ョ Application systems, LVmicro) it is measured.The degree of polarization of polarizer (in addition to unpolarized portion) is preferably 99.8% More than, more preferably more than 99.9%, it is further preferred that more than 99.95%.
The thickness of polarizer (resin film) can be set to arbitrary appropriate value.Thickness be typically more than 0.5 μm and Less than 80 μm.The thickness of polarizer is preferably less than 30 μm, more preferably less than 25 μm, is further preferred that less than 18 μm, spy You Xuanshi not be less than 12 μm, more preferably less than 8 μm.Another side, thickness are preferably more than 1 μm.Thickness is thinner, then above-mentioned low concentration Portion can be formed more well.Specifically, during being contacted with destainer described later, can be formed in shorter time low dense Degree portion.It additionally, there are the situation of the thickness of thin of the thickness ratio other parts of the part after making destainer contact.By thickness compared with It is thin, the contact site that is contacted with destainer can be reduced with the thickness difference between other positions, can be carried out well and diaphragm Deng the bonding between other member of formation.
As above-mentioned dichroic substance, can include such as iodine, organic dyestuff.For these materials, can be used alone Or it can be applied in combination two or more.It is preferred that use iodine.The reason is that by being contacted with alkaline solution described later, can be well Form low concentration portion.
Above-mentioned low concentration portion is the content of the dichroic substance portion lower than the content of the dichroic substance at other above-mentioned positions Point.The content of the dichroic substance in low concentration portion is preferably below 1.0 weight %, more preferably below 0.5 weight %, further Preferably below 0.2 weight %.As long as the content of the dichroic substance in low concentration portion is such scope, it becomes possible to low concentration Portion fully assigns the desired transparency.For example make the low concentration portion feelings corresponding with the camera section of image display device Under condition, from the point of view of brightness and tone the two viewpoints, very excellent shooting performance can be realized.Another side, low concentration portion The lower limit of the content of dichroic substance is typically below detection limits.In addition, using feelings of the iodine as dichroic substance Under condition, for content of iodine, for example, using the standard curve being fabricated in advance using standard specimen, and penetrated according to using fluorescence X X-ray intensity that line analysis determines is tried to achieve.
The difference of the content of dichroic substance in other positions and the content of the dichroic substance in low concentration portion is preferably More than 0.5 weight %, it is further preferred that more than 1 weight %.
As the resin for forming above-mentioned resin film, arbitrary appropriate resin can be used.It is preferred that use polyethenol series tree Fat (hereinafter referred to as " PVA systems resin ").As PVA systems resin, such as polyvinyl alcohol, ethylene-vinyl alcohol copolymer can be included. Polyvinyl alcohol to polyvinyl acetate by carrying out saponification to obtain.Ethylene-vinyl alcohol copolymer is by ethene-second Vinyl acetate copolymer carries out saponification and obtained.The saponification degree of PVA systems resin is typically that 85 moles of % rub less than 100 You are %, preferably 95.0 moles of %~99.95 mole %, is further preferred that 99.0 moles of %~99.93 mole %.Saponification degree It can be obtained according to Japanese Industrial Standards JIS K 6726-1994., can by using the PVA systems resin of such saponification degree Obtain the polarizer of excellent in te pins of durability.In the case where saponification degree is too high, it is possible to gelation.
The average degree of polymerization of PVA systems resin can rightly select according to purpose.Average degree of polymerization is typically 1000~ 10000, preferably 1200~4500, are further preferred that 1500~4300.In addition, average degree of polymerization can be according to Japanese industry Standard JIS K 6726-1994 are obtained.
C-2. the manufacture method of polarizer
Above-mentioned polarizer includes:Bonding film after stripping separator is bonded in containing the resin film of dichroic substance and obtained Obtain polarizing film stack;And form unpolarized portion at the position corresponding with the through hole of bonding film of above-mentioned resin film.
C-2-1. polarizing film stack
From forming through hole in above-mentioned layered product and the bonding film that obtains peels off separator, by the bonding film be bonded in containing The resin film of dichroic substance and obtain polarizing film stack.Fig. 3 is the polarizing film stack of 1 embodiment of the present invention Sectional view.Polarizing film stack 100 has:Resin film (polarizer) 20 containing dichroic substance;Bonding film 10a, it is configured To a surface side (being upper surface side in illustrated example) for resin film 20;Diaphragm 30 and surface protection film 40, it is configured to resin Another surface side (being lower face side in illustrated example) of film 20.Bonding film 10a is bonded in resin film 20 by its adhesive phase 12. Using the through hole 14 formed in bonding film 10a, have resin film 20 to a surface side of polarizing film stack 100 (in illustrated example In, it is upper surface side) exposed portion 21 that exposes.
The shape of resin film 20 of the bonding film 10a shape preferably with being bonded is corresponding.It is vertical in such as resin film 20 In the case of long shape, bonding film 10a is set to lengthwise shape.In such a situation it is preferred that the stacking between resin film and bonding film passes through Volume to volume is carried out." volume to volume " refers to the film for conveying web-like while making mutual longitudinally consistent and being laminated.Lengthwise The bonding film 10a of shape width dimensions can be designed to substantially the same or wider than resin film 20 with the width dimensions of resin film 20 It is big to spend size.
In the case where resin film and bonding film are laminated with volume to volume or, from by the bonding film roll of lengthwise shape The bonding deflector roll for taking into web-like rolls out bonding film, and be laminated in resin film or, through hole is being formed into above-mentioned layered product And after obtaining bonding film, continuously (bonding film is not batched for the time being) be laminated in resin film.
In the case where bonding film 10a is lengthwise shape, through hole 14 can be along bonding film 10a longitudinally and/or width Direction is spent (i.e., in a predetermined pattern) to be formed at predetermined intervals.The formation pattern of through hole 14 can rightly be set according to purpose It is fixed.Typically by through hole 14 be formed in order to polarizer 20 is installed on to the image display device of preliminary dimension and severing Into photograph with the image display device when preliminary dimension (such as, the cutting along longitudinally and/or width, punching) The corresponding position of camera section.
C-2-2. the formation in unpolarized portion
It is as described above, it is preferred to lower than the content of the dichroic substance at other positions by the content for forming dichroic substance Low concentration portion, to form unpolarized portion.Low concentration portion is for example, by making arbitrary appropriate destainer and containing dichroism thing The resin film of matter contacts to be formed.As destainer, it is preferred that use alkaline solution.Iodine is being used as dichroism thing In the case of matter, by making the desired location contacts of alkaline solution and resin film, it can contain easily the iodine of contact site Amount is reduced.Specifically, by contact, alkaline solution can be to resin film internal penetration.Iodo-complexes quilt contained by resin film Alkali reduction contained by alkaline solution, turns into iodide ion.Iodide ion is reduced into by iodo-complexes, the saturating of contact site can be improved Cross rate.Also, moved as the iodine of iodide ion from resin film into the solvent of alkaline solution.The low concentration portion being achieved in that can be good The transparency is maintained well.Specifically, destroy iodo-complexes in the case of improving transmitance, remain in resin film Interior iodine forms iodo-complexes again and can reduce transmitance with the use of polarizer, but in the feelings for reducing content of iodine Under condition, the problem of such is prevented.
As above-mentioned alkali compounds, arbitrary appropriate alkali compounds can be used.As alkali compounds, can arrange Enumerate for example, the hydrogen of the alkaline-earth metal such as the hydroxide of the alkali metal such as sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide The organic alkali metal such as the inorganic alkaline metal salts such as oxide, sodium carbonate, sodium acetate salt, ammoniacal liquor etc..In these, it is also preferred that using alkali The hydroxide of metal and/or alkaline-earth metal, further preferably using sodium hydroxide, potassium hydroxide, lithium hydroxide.Two can be made Color physical efficiency ionizes well, can more be simply forming low concentration portion.These alkali compounds both can individually make With can also be applied in combination two or more.
As the solvent of alkaline solution, arbitrary appropriate solvent can be used.Specifically, can enumerate water outlet, ethanol, The alcohol such as methanol, ether, benzene, chloroform and their mixed solvent.In these, for the dichroic substance energy of ionization From the viewpoint of being shifted well to solvent, preferably using water, alcohol.
The concentration of alkaline solution is such as 0.01N~5N, preferably 0.05N~3N, more preferably 0.1N~2.5N.As long as Concentration is such scope, can form desired low concentration portion well.
The liquid temperature of alkaline solution is such as 20 DEG C~50 DEG C.Time of contact of alkaline solution can according to for example, resin film The species of alkali compounds contained by thickness, alkaline solution, concentration setting.Time of contact is such as 5 seconds~30 minutes, excellent Choosing is 5 seconds~5 minutes.
As the contact method of destainer, arbitrary appropriate method can be used.It can include for example to resin film (exposure Portion) drip, be coated with, spraying destainer method, resin film (polarizing film stack) is impregnated in the method for destainer.By making With above-mentioned bonding film, it can prevent destainer from being contacted with the part in addition to desired position.As a result, can be well Form the unpolarized portion with desired shape.
In illustrated example, a surface side of resin film 20 is protected using bonding film 10a, utilizes diaphragm 30 and surface protection film 40 another surface sides of protection.When unpolarized portion is thusly-formed, preferably also another one side of resin film is protected (to be configured without bonding The side of film).Diaphragm can be directly used as the diaphragm of polarizer.Surface protection film is temporarily used in the manufacture of polarizer 's.Thus, bonding film 10a can be used as surface protection film to play function.In illustrated example, diaphragm 30 and surface protection film are utilized The one side of 40 protection resin films 20, but any one can also be used only to protect.Alternatively, it is also possible to be come using photoresist etc. Substitute diaphragm, surface protection film.In addition, illustrate the details of diaphragm in subsequent paragraph.
Preferably, when unpolarized portion is formed, resin film is set to can serve as the state of polarizer.Specifically, it is excellent Choosing be carried out swelling treatment, stretch processing, the dyeing processing carried out by above-mentioned dichroic substance, crosslinking Treatment, cleaning treatment, The various processing such as drying process.In addition it is also possible to be, when various processing are implemented, resin film is the tree formed on base material Lipid layer.The layered product of base material and resin bed can for example, by by the coating liquid of the formation material containing above-mentioned resin film to base material The method of coating, obtain in method of base material laminated resin film etc..
Above-mentioned dyeing processing is typically by carrying out dichroic substance absorption.As the adsorption method, can enumerate Go out for example to make resin film to be impregnated in the method for the dyeing liquor containing dichroic substance, be coated with to resin film the dyeing liquor method, Method that the dyeing liquor is sprayed to resin film etc..The method for preferably making resin film be impregnated in dyeing liquor.The reason is that Dichroic substance can be adsorbed well.
In the case where using iodine as dichroic substance, as above-mentioned dyeing liquor, preferably using iodine aqueous solution.Relative to The water of 100 parts by weight, the use level of iodine are preferably the parts by weight of 0.04 parts by weight~5.0.In order to improve dissolving of the iodine relative to water Degree, preferably by iodide mixture in iodine aqueous solution.As iodide, preferably using KI.Relative to the water of 100 parts by weight, It is preferred that the use level of iodide is the parts by weight of 0.3 parts by weight~15.
In above-mentioned stretch processing, resin film is typically stretched to 3 times~7 times by single shaft.In addition, draw direction can be with The absorption direction of principal axis of the polarizer obtained is corresponding.
By above-mentioned various processing, resin film can contain boric acid.When for example above-mentioned stretch processing, crosslinking Treatment, lead to Cross and contacted with boric acid solution (such as, boric acid aqueous solution), resin film can contain boric acid.The boric acid content of resin film is such as 10 weights Measure the weight % of %~30.In addition, the boric acid content in the contact site contacted with alkaline solution is the weight of such as 5 weight %~12 Measure %.
C-2-3. other
Above-mentioned polarizing film stack (resin film) can implement arbitrary other appropriate processing.As other processing, can arrange Enumerate the reduction of such as alkali metal and/or alkaline-earth metal.Specifically, after being contacted with above-mentioned alkaline solution, molten with alkalescence Reduce the alkali metal contained by resin film and/or alkaline-earth metal in contact site after liquid contact.By making alkali metal and/or alkali Earth metal is reduced, and can obtain the unpolarized portion of excellent in dimensional stability.Specifically, under humidified ambient, also can The shape by contacting the low concentration portion to be formed with alkaline solution is maintained as former state.
By making alkaline solution be contacted with resin film, the hydroxide of alkali metal and/or alkaline-earth metal can remain in contact Portion.In addition, by making alkaline solution be contacted with resin film, the metal salt of alkali metal and/or alkaline-earth metal can be generated in contact site. These can generate hydroxyl ion, the hydroxyl ion generated to be present in around contact site dichroic substance (such as, iodine be complexed Thing) work (decomposition-reduction), and unpolarized region (low concentration region) can be widened.It is therefore believed that:By making alkali metal And/or alkaline-earth metal is reduced, and can be suppressed unpolarized region and be passed through over time and broaden, can maintain desired unpolarized portion's shape Shape.
As the metal salt that can generate above-mentioned hydroxyl ion, such as borate can be included.Borate is contained by resin film Some boric acid is neutralized and generated with alkaline solution (solution of the hydroxide of alkali metal and/or the hydroxide of alkaline-earth metal). In addition, borate (metaborate) is for example, by polarizer is placed under humidified ambient as shown in following formula by hydrolyzable And hydroxyl ion can be generated.
[changing 1]
(in formula, X represents alkali metal or alkaline-earth metal)
Preferably, the content of the alkali metal in contact site and/or alkaline-earth metal is made to be reduced to below 3.6 weight %, more Preferably, it is reduced to below 2.5 weight %, it may further be preferable that being reduced to below 1.0 weight %.Slip is preferably More than 10%, more preferably more than 40%, are further preferred that more than 80%.In addition, as described above, alkali metal and/or alkali Earth metal can exist in contact site with the state of such as metallic compound (hydroxide, metal salt), but for above-mentioned content, The standard curve being fabricated to using standard specimen can be utilized, and is penetrated according to the X being for example measured to using x-ray fluorescence analysis Line strength is obtained.
In addition, by implementing the various processing for forming polarizer to resin film, alkali metal and/or alkali can be contained in advance Earth metal.Specifically, by being contacted with the solution of the iodide such as KI, resin film can be made to contain alkali metal and/or alkaline earth Metal.So, it is generally recognized that alkali metal and/or alkaline-earth metal contained by polarizer do not give the dimensionally stable in above-mentioned unpolarized portion Property brings harmful effect.
As above-mentioned reduction method, it is preferred that contacted using the contact site for making treatment fluid be contacted with same alkaline solution Method.According to such method, alkali metal and/or alkaline-earth metal can be made to be shifted from resin film to treatment fluid, subtract its content It is few.
As the contact method for the treatment of fluid, arbitrary appropriate method can be used.Can include for example to alkaline solution The contact site of contact drips, is coated with, the method for spray treatment liquid, the contact site that makes to contact with alkaline solution are impregnated in treatment fluid Method.Furthermore it is preferred that make treatment fluid contact (especially in treatment fluid in the state of bonding film to be adhered to resin film for holding In the case that temperature is more than 50 DEG C).According to such form, the portion in addition to the contact site except being contacted with alkaline solution Position, can prevent the reduction of the polarization characteristic as caused by treatment fluid.
Above-mentioned processing liquid energy contains arbitrary appropriate solvent.As solvent, can include for example, water, ethanol, methanol etc. Alcohol, ether, benzene, chloroform and their mixed solvent.In these, also for making alkali metal and/or alkaline-earth metal efficient From the viewpoint of ground transfer, preferred water, alcohol are used.As water, arbitrary appropriate water can be used.It can include for example, certainly Water, pure water, deionized water etc..
The temperature for the treatment of fluid during contact is such as more than 20 DEG C, preferably more than 50 DEG C, more preferably more than 60 DEG C, is entered One step is preferably more than 70 DEG C.As long as such temperature, it becomes possible to make alkali metal and/or alkaline-earth metal to treatment fluid efficiently Transfer.Specifically, significantly improve the swelling ratio of resin film, can be by the alkali metal and/or alkaline-earth metal in resin film Reason ground removes.On the other hand, the temperature of water is substantially less than 95 DEG C.
Time of contact can be according to contact method, the appropriate adjustment such as thickness of the species for the treatment of fluid, temperature, resin film.In example In the case of being such as impregnated in warm water (more than 50 DEG C), time of contact is preferably 10 seconds~30 minutes, more preferably 30 seconds~ 15 minutes, it is further preferred that 60 seconds~10 minutes.
In 1 embodiment, above-mentioned treatment fluid is used as using acid solution.By using acid solution, to remaining in The alkali metal of resin film and/or the hydroxide of alkaline-earth metal are neutralized, and can chemically remove the alkali metal in resin film And/or alkaline-earth metal.
As the acid compound contained by acid solution, arbitrary appropriate acid compound can be used.As acid Property compound, can include for example, inorganic acid, formic acid, oxalic acid, citric acid, the vinegar such as hydrochloric acid, sulfuric acid, nitric acid, hydrogen fluoride, boric acid Organic acids such as acid, benzoic acid etc..Acid compound contained by acid solution is preferably inorganic acid, be further preferred that hydrochloric acid, Sulfuric acid, nitric acid.These acid compounds both may be used alone, can also be used in combination two or more.
Preferably, as above-mentioned acid compound, rightly using the acidity acid compound stronger than the acidity of boric acid. The reason is that it can also act on the metal salt (borate) of above-mentioned alkali metal and/or alkaline-earth metal.Specifically, can make Boric acid is free from borate and chemically removes the alkali metal in resin film and/or alkaline-earth metal.
As the index of above-mentioned acidity, such as acid dissociation constant (pKa) can be included, preferably using pKas of the pKa than boric acid (9.2) small acid compound.Specifically, pKa is preferably smaller than 9.2, more preferably less than 5.PKa can both use arbitrary Appropriate measure device can also be compiled with reference to chemical brief guide basis and ordered 5 editions (Japanization association, which compiles, ball is kind publishes) etc. to determine Value described in document.In addition, in the acid compound of multistage dissociation, in each stage pKa value can change.Using this In the case of the acid compound of sample, the acidification that is in using any one in the pKa in each stage value in above-mentioned scope Compound.In addition, in this manual, pKa be value in 25 DEG C of the aqueous solution.
The pKa of acid compound and the pKa of boric acid difference are such as more than 2.0, preferably 2.5~15, more preferably 2.5 ~13.As long as such scope, it becomes possible to make alkali metal and/or alkaline-earth metal efficiently be shifted to treatment fluid.
As the acid compound that can meet above-mentioned pKa, can include for example, hydrochloric acid (pKa:- 3.7), sulfuric acid (pK2: 1.96), nitric acid (pKa:- 1.8), hydrogen fluoride (pKa:3.17), formic acid (pKa:3.54), oxalic acid (pK1:1.04、pK2:3.82)、 Citric acid (pK1:3.09、pK2:4.75、pK3:6.41), acetic acid (pKa:4.8), benzoic acid (pKa:4.0) etc..
In addition, the solvent of acid solution (treatment fluid) is as described above, using this form of acid solution as treatment fluid In, it can also cause the removal of the physics of alkali metal and/or alkaline-earth metal in above-mentioned resin film.
The concentration of acid solution is such as 0.01N~5N, preferably 0.05N~3N, more preferably 0.1N~2.5N.
The liquid temperature of above-mentioned acid solution is such as 20 DEG C~50 DEG C.The time of contact of acid solution can according to for example, resin The species of acid compound contained by the thickness of film, acid solution, concentration setting.Time of contact is such as 5 seconds~30 points Clock.
As another example of other above-mentioned processing, the removal of above-mentioned alkaline solution and/or treatment fluid can be included.Make For the concrete example of minimizing technology, cleaning can be included, by rag (Japanese:ウ エ ス) etc. progress wiping remove, suction remove, Natural drying, heat drying, air-supply are dried, are dried under reduced pressure.Cleaning fluid used in cleaning can include such as water (pure water), The alcohol such as methanol, ethanol and their mixed liquor etc..It is preferred that use water.Wash number is not particularly limited, can also be multiple Carry out.In the case of using dry be removed, its drying temperature is such as 20 DEG C~100 DEG C.
Above-mentioned bonding film after forming above-mentioned unpolarized portion it is arbitrary appropriately at the time of by from resin film (polarizer) Peel off.In the case where for example carrying out the reduction of above-mentioned alkali metal and/or alkaline-earth metal, preferably after the reduction by bonding film from Resin film is peeled off.
C-3. polarization plates
The polarization plates of the present invention have above-mentioned polarizer.Above-mentioned polarizer is typically at least its unilateral stacked guard film To use.As the formation material of diaphragm, can include for example, diacetyl cellulose, Triafol T etc. it is cellulose-based Olefin-based resin, the polyethylene terephthalates such as resin, (methyl) acrylic resin, cyclic olefine resin, polypropylene It is the fat such as resin system resin, polyamide series resin, polycarbonate-based resin, their copolymer resin etc..
Can also, in the face of the not laminated polarizing piece of diaphragm, as surface-treated layer, be implemented with hard conating, counnter attack Penetrate processing, the processing for the purpose of diffusion or anti-glazing.
The thickness of diaphragm is preferably 10 μm~100 μm.Diaphragm typically (specifically, is bonded by adhesive linkage Oxidant layer, adhesive phase) it is laminated in polarizer.Bond layer is typically glued by PVA systems bonding agent, active energy ray curable Connect dosage form into.Adhesive phase is typically formed by acrylic adhesive.
Embodiment
[embodiment 1]
Prepared with fat mesentery (thickness is 38 μm)/adhesive phase (thickness is 5 μm)/separator (thickness is 25 μm) The layered product (surface protection film) of the lengthwise shape of structure.There to be fat mesentery (thickness is 38 μm)/adhesive phase (thickness is 5 μm) The carrier film of structure be bonded in the fat mesentery face of the layered product, made the layered product with carrier film.
Next, cut the stacking with carrier film from separator face by the cutting knife that depth is 80 μm using blanking apparatus Body, in a manner of not penetrating carrier film hemisection be cut into a diameter of 2.4mm circle.
Next, peeling off carrier film from layered product, bonding film is obtained.
[embodiment 2]
Except using laser cutter (CO2Laser, wavelength:9.4 μm, power:Blanking apparatus 10W) is substituted to carry out Hemisect (depth of cut:80 μm) beyond, bonding film is obtained similarly to Example 1.
[comparative example 1]
Except carrier film to be adhered to the separator face of layered product and has carried out hemisection from fat mesentery (resin base material) face Beyond cutting, bonding film is obtained similarly to Example 1.
Following evaluation has been carried out for Examples 1 and 2 and comparative example 1.
1. chip of perforating
To being confirmed by cutting the perforation chip formed and whether being removed when the stripping of carrier film.
2. the bonding outward appearance of bonding film
Separator is peeled off and bonding film is bonded in polarizer on the market, its outward appearance is carried out using microscope Observation.
In Examples 1 and 2, when carrier film is peeled off, due to hemisect, caused perforation chip is completely removed .In contrast, in comparative example 1, when carrier film is peeled off, perforation chip is not completely removed.Specifically, only layer The separator part of stack is removed.
The bonding film obtained is bonded in polarizer, the tacky state between polarizer and bonding film is seen Examine.In addition, on comparative example 1, remove bonding film is adhered to polarizer after perforation chip in advance.
In Examples 1 and 2, not confirming bubble between polarizer and bonding film as shown in Fig. 4 (a) It is mixed into, but in comparative example 1, gas has been mixed between polarizer and bonding film on through hole periphery as shown in Fig. 4 (b) Bubble.
[table 1]
Cutting method Cut direction Bond outward appearance
Embodiment 1 Blanking apparatus Separator side There is no bubble to be mixed into
Embodiment 2 Laser irradiates Separator side There is no bubble to be mixed into
Comparative example 1 Blanking apparatus Resin base material side There is bubble to be mixed into
[embodiment 3]
(making of polarization plates)
As base material, amorphous M-phthalic acid that lengthwise shape and water absorption rate are 0.75%, Tg is 75 DEG C has been used to be total to Poly- polyethylene terephthalate (IPA is copolymerized PET) film (thickness:100μm).Sided corona treatment is implemented to the one side of base material, The sided corona treatment face, will be with 9:The ratio between 1 contains polyvinyl alcohol (degree of polymerization 4200, saponification degree are 99.2 moles of %) and acetyl second (degree of polymerization 1200, acetoacetyl modified degree are 4.6% to acyl modified PVA, saponification degree is 99.0 moles of more than %, Japan Synthetic chemical industry Co. Ltd. system, trade name " go ー セ Off ァ イ マ ー Z200 ") the aqueous solution with 25 DEG C apply and carry out Dry, and form the PVA resins that thickness is 11 μm, made layered product.
By the layered product obtained in 120 DEG C of drying machine between the different roller of peripheral speed along longitudinal direction (length direction) from By end uniaxial tension to 2.0 times (aerial assisting tensions).
Next, it is 30 DEG C of insoluble bath (by the borate complex of 4 parts by weight in 100 weights layered product is impregnated into liquid temperature Measure the water of part and the boric acid aqueous solution that obtains) 30 seconds (insoluble processing).
Next, while by make polarization plates turn into predetermined transmitance in a manner of iodine concentration, dip time are adjusted, While polarization plates are made to be impregnated into the dye bath that liquid temperature is 30 DEG C.In the present embodiment, make it be impregnated in iodine aqueous solution 60 seconds (to contaminate Color processing), the iodine aqueous solution is the water that the iodine of 0.2 parts by weight is coupled to 100 parts by weight, and coordinates the iodate of 1.5 parts by weight Potassium and obtain.
Next, it is impregnated into the crosslinking bath that liquid temperature is 30 DEG C (is matched with 100 parts by weight by the KI of 3 parts by weight Water, and coordinate the boric acid of 3 parts by weight and the boric acid aqueous solution that obtains) 30 seconds (crosslinking Treatment).
Afterwards, make layered product while be impregnated in liquid temperature be 70 DEG C boric acid aqueous solution (by the borate complex of 4 parts by weight in The water of 100 parts by weight and the aqueous solution for coordinating the KI of 5 parts by weight and obtaining), while along vertical between the different roller of peripheral speed To (length direction) uniaxial tension (being stretched in water) has been carried out in a manner of total stretching ratio turns into 5.5 times.
Afterwards, layered product is impregnated into the cleaner bath that liquid temperature is 30 DEG C and (KI of 4 parts by weight is matched with 100 weight Part water and the aqueous solution that obtains) (cleaning treatment).
Next, by PVA systems resin aqueous solution (the Nippon Synthetic Chemical Industry Co., Ltd's system, trade name " ゴ ー セ Off ァ イ マ ー (registration mark) Z-200 ", resin concentration:3 weight %) it is coated on the PVA resins surface of layered product and bonds guarantor Cuticula (thickness is 25 μm), is heated 5 minutes using the drying machine to 60 DEG C is maintained to it.Afterwards, by base material from PVA resins Peel off, obtain polarization plates (polarizer (transmitance 42.3%, thickness are 5 μm)/diaphragm).
(formation of hyalomere)
Separator is peeled off and the bonding film obtained in embodiment 1 is bonded in the polarizer of obtained polarization plates Side, obtain polarizing film stack.
By the sodium hydrate aqueous solution (1.0mol/L (1.0N)) of normal temperature being laminated from the polarizing coating obtained to polarizer The part that the bonding film of body exposes is dripped, and placed 60 seconds.Afterwards, dripped sodium hydroxide water is being removed using rag Bonding film is peeled off after solution, obtains the polarization plates (polarizer) formed with hyalomere.
[embodiment 4]
In addition to using the bonding film obtained in example 2, obtain similarly to Example 3 formed with hyalomere Polarization plates (polarizer).
[comparative example 2]
In addition to using the bonding film obtained in comparative example 1, obtain similarly to Example 3 formed with hyalomere Polarization plates (polarizer).In addition, on the bonding film obtained in comparative example 1, glued after removing perforation chip in advance Close.
The hyalomere of polarizer for being obtained in embodiment 3 and 4 and comparative example 2 has carried out following measure.
1. transmitance (Ts)
Surveyed using spectrophotometer (Murakami K. K.'s dye technology studies made ProductName " DOT-3 ") It is fixed.Transmitance (T) is to have carried out visibility correction using Japanese Industrial Standards JlS Z 8701-1982 2 degree of visual fields (illuminant-C) Obtained from Y value.
2. content of iodine
Using x-ray fluorescence analysis, the content of iodine come in the hyalomere of polarizer is obtained.Specifically, using making in advance The standard curve made of standard specimen, and obtain according to the X-ray intensity being measured to using following conditions the iodine of polarizer Content.
Analytical equipment:Electric machine industry fluorescent x-ray analyzer (XRF) of science, ProductName " ZSX100e "
To negative electrode:Rhodium
Light splitting crystallization:Lithium fluoride
Excitation light energy:40kV-90mA
Iodine assay line:I-LA
Sizing technique:FP methods
2 θ horn values:(103.078deg iodine)
Minute:40 seconds
It is that 93%~94%, content of iodine is hyalomere below 0.15 weight % all formed with transmitance in any one, These can be used as unpolarized portion to play function.The shape in unpolarized portion and the through hole of bonding film of the polarizer of embodiment 3 and 4 Shape be accordingly a diameter of 2.4mm circle, in contrast, sodium hydrate aqueous solution penetrate into be mixed into polarizer with it is viscous The bubble between film is closed, therefore, the shape in the unpolarized portion of the polarizer of comparative example 2 can not obtain the through hole phase with bonding film Corresponding shape (not being circular).
In embodiment 3, (after sodium hydrate aqueous solution is eliminated with rag), will not after foring hyalomere Bonding film is peeled off, and just the hydrochloric acid (1.0mol/L (1.0N)) of normal temperature drips to the contact site contacted with sodium hydrate aqueous solution, It placed 30 seconds.Afterwards, the hydrochloric acid to drip down is eliminated with rag.The contact of the hydrochloric acid is obtained using x-ray fluorescence analysis The sodium content of front and rear hyalomere.Specifically, using the standard curve being fabricated in advance using standard specimen, and according to profit The X-ray intensity being measured to following conditions obtains the sodium content of hyalomere.
Analytical equipment:Electric machine industry fluorescent x-ray analyzer (XRF) ProductName " ZSX100e " of science
To negative electrode:Rhodium
Light splitting crystallization:Lithium fluoride
Excitation light energy:40kV-90mA
Sodium determination line:Na-KA
Sizing technique:FP methods
Minute:40 seconds
The sodium content of hyalomere is 4.0 weight % before hydrochloric acid contact, is 0.04 weight % after hydrochloric acid contact.In addition, Polarization plates formed with hyalomere placed 500 hours in the environment of 65 DEG C/90%RH, as a result, contacted with hydrochloric acid The size of hyalomere has almost no change before and after humidification is tested, without becoming large-sized into about for the hyalomere that is contacted with hydrochloric acid 1.3 again.
Industrial applicability
The bonding film obtained using the manufacture method of the present invention, which can properly use, to be made to select the predetermined part of object Surface protection film when being handled to property.The polarizer obtained using the manufacture method of the present invention is rightly used in intelligence Image display device (liquid crystal display device, organic EL with camera such as the mobile phones such as mobile phone, notebook type PC, tablet PC Device).
Description of reference numerals
1st, polarizer (resin film);2nd, unpolarized portion;10th, layered product;10a, bonding film;11st, resin base material;12nd, bond Oxidant layer;13rd, separator;14th, through hole;20th, resin film;21st, exposed portion;30th, diaphragm;40th, surface protection film;100th, polarize Film laminated body.

Claims (15)

1. a kind of manufacture method of bonding film, it includes:
Prepare layered product, the layered product has:Resin base material;Adhesive phase, it is arranged at a face of the resin base material;And Separator, it temporarily anchors to the adhesive surface of the adhesive phase;
Cut from the separator lateral incision of the layered product and formed and integratedly penetrate the separator, described adhesive layer and described The through hole of resin base material.
2. the manufacture method of bonding film according to claim 1, wherein,
The through hole is formed in the state of abutting material and abutting to the resin base material side of the layered product.
3. the manufacture method of bonding film according to claim 2, wherein,
The midway of the abutting material is cut into from the surface of the separator and forms the through hole.
4. the manufacture method of the bonding film according to Claims 2 or 3, wherein,
The abutting material is glue bound in the layered product.
5. the manufacture method of the bonding film according to any one of claim 2~4, wherein,
The manufacture method of the bonding film also include make it is described abutting material from the layered product remove the step of.
6. according to the manufacture method of bonding film according to any one of claims 1 to 5, wherein,
The formation of the through hole is carried out using the cutting of cutting knife.
7. according to the manufacture method of bonding film according to any one of claims 1 to 5, wherein,
The formation of the through hole is irradiated using laser to carry out.
8. a kind of manufacture method of film, wherein,
The bonding film obtained using the manufacture method any one of claim 1~7 is bonded in film, to the film and institute State the corresponding partially selectively implementation processing of through hole.
9. a kind of manufacture method of polarizer, wherein, the manufacture method of the polarizer includes:
The separator is peeled off from the bonding film obtained using the manufacture method any one of claim 1~7;
And be bonded in the resin film containing dichroic substance by the bonding film after the separator is peeled off, the resin film with The position that the through hole of bonding film is corresponding forms unpolarized portion.
10. the manufacture method of polarizer according to claim 9, wherein,
The formation of the through hole is carried out using the cutting of cutting knife,
Peeling off the bonding film after the separator has:Resin base material;And adhesive phase, it is arranged at the one of the resin base material Individual face, the bonding film after the separator is peeled off formed with the through hole for integratedly penetrating the resin base material and the adhesive phase, The periphery of the adhesive phase side of the through hole is formed as arc surface.
11. the manufacture method of the polarizer according to claim 9 or 10, wherein,
The manufacture method of the polarizer, which is additionally included in, forms the unpolarized portion afterwards from the tree containing the dichroic substance Adipose membrane peels off the step of bonding film.
12. the manufacture method of the polarizer according to any one of claim 9~11, wherein,
By making alkaline solution be contacted with the resin film containing the dichroic substance, to form the unpolarized portion.
13. the manufacture method of polarizer according to claim 12, wherein,
The alkaline solution contains the hydroxide of alkali metal and/or alkaline-earth metal.
14. the manufacture method of the polarizer according to claim 12 or 13, wherein,
The manufacture method of the polarizer also comprises the following steps:
At the contact site contacted with the alkaline solution, subtract the alkali metal contained by the resin film and/or alkaline-earth metal It is few.
15. the manufacture method of polarizer according to claim 14, wherein,
In the state of keeping the bonding film being adhered to the resin film containing the dichroic substance, make the alkali metal And/or alkaline-earth metal is reduced.
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