CN107708324B - Anti-welding nail bed of printed circuit board and preparation method thereof - Google Patents
Anti-welding nail bed of printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN107708324B CN107708324B CN201710908066.4A CN201710908066A CN107708324B CN 107708324 B CN107708324 B CN 107708324B CN 201710908066 A CN201710908066 A CN 201710908066A CN 107708324 B CN107708324 B CN 107708324B
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- nail bed
- bottom plate
- nail
- support frame
- bed bottom
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention provides anti-welding nail bed of printed circuit board and preparation method thereof, the anti-welding nail bed of printed circuit board include support frame, the first nail bed bottom plate carried by support frame as described above, be located on the support frame frame plate of outer peripheral surface at the top of the first nail bed bottom plate, the second nail bed bottom plate being set up at the top of the support frame frame plate, the absorbent module being located between the first nail bed bottom plate and the second nail bed bottom plate, set on the second nail bed backplate surface several PIN nail and and absorbent module electric connection circuit system.Above structure can solve nail bed board and PIN nail quickly, be iteratively repeated utilization, production nail bed is not required to drilling machine, drilling, adhesive tape, quick Fabrication goes out to follow closely bed, nail bed material cost, cost of manufacture and management cost are saved simultaneously, reduce the parking space of nail bed bottom plate, management difficulty is reduced simultaneously, it is easy to use, it improves work efficiency.
Description
Technical field
The present invention relates to printed circuit board production technical field more particularly to a kind of anti-welding nail bed of printed circuit board and its systems
Make method.
Background technique
Printed circuit board, also known as printed circuit board, printed wiring board, abbreviation printed board, English abbreviation PCB (printed
Circuit board) or PWB (printed wiring board), using insulation board as substrate, it is cut into certain size, up to
Have a conductive pattern less, and be furnished with hole (such as component hole, fastener hole, plated through-hole), is used to replace previous device electronics
The chassis of component, and realize the interconnection between electronic component.Since this plate is made of electron printing,
Therefore referred to as " print " circuit board.It is inapt that habit " printed wiring board ", which is referred to as " printed circuit ", because in printed board
It is only routed there is no " printed element ".
Printed circuit board, also known as printed circuit board are the suppliers of electronic component electrical connection.Its development is existing
More than 100 years history；Its design is mainly layout design；Major advantage using circuit board is to greatly reduce wiring and dress
The mistake matched improves the gentle productive labor rate of Automated water.
PCB manufacturing industry has jack process, silk screen printed on both sides hard baking, and the needs such as text double face printing process make
PCB quality requirements are just able to satisfy with nail bed.
All without location hole and nail hole on PCB commonly used in the prior art nail bed bottom plate, by being fixed with adhesive tape when use
Locating pin and silk-screen nail support the PCB to complete printing, but this mode is easy to appear fixed silk-screen nail to loosen or shift,
Cause prick PCB；Though and have location hole on dedicated PCB in the prior art nail its bottom plate of bed, on dedicated PCB nail bed bottom plate
Location hole is that three location holes one-to-one correspondence in four location holes with pcb board plate face is positioned, thus each special nail
The pcb board that bed can only print same style needs to process different nail beds for the pcb board of different styles, this is bound to cause nail
Bed processing cost is high, and nail bed parking space is big, and management difficulty is big, and working efficiency is in addition, for pcb board similar in style in nail bed
Trouble is found when use, is easy error.
Therefore, it is necessary to provide a kind of new anti-welding nail bed of printed circuit board and preparation method thereof.
Summary of the invention
The present invention provides a kind of anti-welding nail bed of printed circuit board and preparation method thereof for solving above-mentioned technical problem.
The present invention provides a kind of anti-welding nail bed of printed circuit board, and the anti-welding nail bed of printed circuit board includes support frame, leads to
It crosses the first nail bed bottom plate of support frame as described above carrying, be located on the braced frame of outer peripheral surface at the top of the first nail bed bottom plate
Plate, second be set up at the top of the support frame frame plate follow closely bed bottom plate, are located in the first nail bed bottom plate and second nail
Absorbent module between bed bottom plate, several PIN nail and and absorbent module electrical property set on the second nail bed backplate surface
The circuit system of connection, the first nail bed bottom plate and support frame as described above are welded and fixed, and the support frame frame plate is set to described the
Four sides of one nail bed bottom plate, and four sides of the first nail bed bottom plate are welded and fixed, and the top of the support frame frame plate includes
Several ceramic whiteware pieces along support frame frame plate extending direction setting, the ceramic whiteware piece is embedded in the support frame frame plate and institute
State the top end surface that ceramic whiteware piece surface is lower than the support frame frame plate, the institute of the second nail the bed bottom plate and the support frame frame plate
It states the opposite place in ceramic whiteware piece position and is equipped with several suckers, the height after the sucker suction is equal to the ceramic whiteware piece top end surface distance
The difference in height of the top end surface of the support frame frame plate, the ceramic whiteware piece be it is rectangular, the sucker be circle, the ruler of the sucker
The very little inscribed circle size no more than the ceramic whiteware piece, the absorbent module include it is several be set to the support frame frame plate be enclosed
In the range of, and the sub- absorbent module being set in the clearance space of the first nail bed bottom plate and the second nail bed bottom plate, institute
Sub- absorbent module is stated to include the pedestal abutted positioned at bottom and the first nail bed bottom plate, set on the base top and pass through institute
Telescopic rod, the silicon steel set on the damping elastic slice of the telescopic rod top end and set on damping elastic slice top for stating pedestal support
Piece, it is described second nail bed bottom plate be transparent toughened glass plate, it is described second nail bed bottom plate with a thickness of 0.5 ~ 1.5 centimetre, it is described
Second nail bed backplate surface stamp has the horizontal wire and munnion line of black and parallel interval setting, two cross of arbitrary neighborhood
The spacing of wire and the horizontal wire, the munnion line and the munnion line is 1 centimetre, and the PIN nail includes that PIN follows closely ontology
And the iron plate set on PIN nail body bottom portion end face, the iron plate and PIN nail ontology are fixed by PP glue sticking, institute
State iron plate with a thickness of 1.0 ~ 1.5mm；The circuit system includes solenoid driver circuit, and the solenoid driver circuit includes
Current-limiting resistance, IRL3803 pipe, first diode, the second diode and the external power supply of electric connection.
Preferably, the absorbent module is made of four tandems arranged in parallel and equidistantly, is followed successively by from left to right
One tandem, the second tandem, third tandem and the 4th tandem, each tandem are equipped with 4-9 sub- absorbent modules, and described first is vertical
The spacing of the adjacent two sub- absorbent module in row, second tandem, the third tandem and the 4th tandem is homogeneous
Together, PIN nail is made of four tandems arranged in parallel and equidistantly, be followed successively by from left to right the first tandem, the second tandem,
Third tandem and the 4th tandem, each tandem are equipped with PIN nail identical with the sub- absorbent module quantity, and described first is vertical
The spacing of the adjacent two PIN nail in row, second tandem, the third tandem and the 4th tandem is all the same,
The PIN nail of same position and the central axis of the sub- absorbent module are located at same straight line.
Preferably, further include liquid crystal screen display, multiple weighing and sensings are uniformly installed on the second nail bed bottom plate
Device, each weighing sensor are connected with a signal processor, and the output end of each signal processor is connected to LCD screen
On display, which includes single-chip microcontroller, amplifier circuit, memory, local display and keyboard, amplifier circuit
Input terminal be connected with weighing sensor, the output end of amplifier circuit is connected with single-chip microcontroller and large screen display, should
Single-chip microcontroller is connected by I/O interface with memory, local display and keyboard, and the quantity of the weighing sensor is ten,
The quantity of corresponding signal processor is ten, and the liquid crystal screen display is made of the independent display channel of multichannel, each
Display channel is made of 15 groups of LED backlight plates, driving circuit, driving powers, and the stress condition of printed circuit board is finally with 15 grades
Step LED backlight board group at column figure show, the memory be power down nonvolatile storage for store set
Determine parameter and sensing data.
Preferably, the sensor of different location can acquire the printed circuit board being placed on the anti-welding nail bed of printed circuit board
Prevent each site pressure signal, is sent into signal processor and amplifies Shape correction, due to printed circuit board each section stress
Difference, therefore by selecting different size sensor that can reach maximum sensitivity and keep display effect more preferable, at ten signals
The output end of reason device is connected on liquid crystal screen display, which is made of the independent display channel in 10 tunnels,
Each channel is made of 15 groups of LED backlight plates, driving circuit, driving powers, and the anti-stress condition of printed circuit board is finally with 15
Grade step LED backlight board group at column figure show；Each signal processor includes single-chip microcontroller, transport and placing device IC2, amplifier
Device IC3, transport and placing device IC6, memory IC 4, local display and keyboard；Single-chip microcontroller is internally integrated A/D converter and RAM storage
Device, single-chip microcontroller are connected with memory, local display, memory, keyboard, and the differential input end of transport and placing device IC2 connects weighing
Sensor, transport and placing device IC2 output end connect transport and placing device IC3 input terminal, and the output end of transport and placing device IC3 is connected with single-chip microcontroller, by
A/D conversion module inside single-chip microcontroller converts analog signals into digital signal feeding local display and shows, and to sensor
Parameter is modified, and the output end of transport and placing device IC3 is also connected with transport and placing device IC6, and signal amplification is output to long-range by transport and placing device IC6
Liquid crystal screen display on, keyboard include 16 operation buttons be connected with single-chip microcontroller, sensor parameters can be carried out
It sets and calibration calibration is carried out to sensor；Memory IC 4 is using power down nonvolatile storage for storing setup parameter and biography
Sensor data.
Preferably, the support frame frame plate has first side, second side, third side and a four side, and described the
A side and the length of third side are 560mm, and second side and the length of four side are 650mm, first side
The angle of side and second side is 90 °.
Preferably, the first nail bed bottom plate is iron plate, and the pedestal of the sub- absorbent module is truncated cone-shaped and sectional dimension
Big end face and the first nail bed bottom plate abut, and the pedestal is magnet, by the suction adsorption of magnet in first nail
Bed backplate surface.
Preferably, the first nail bed bottom plate is iron plate, and the pedestal tool of the sub- absorbent module is there are three supporting leg, three
The bottom end of the supporting leg is equipped with flat thin magnet, and the flat thin magnet and the first nail bed bottom plate are abutted, inhaled by the suction of magnet
Invest the first nail bed backplate surface.
A kind of production method of the anti-welding nail bed of printed circuit board, includes the following steps:
Support frame is provided, the first nail bed bottom plate carried by support frame as described above, is located on the first nail bed base top
The support frame frame plate of portion's outer peripheral surface is followed closely set on several PIN of the second nail bed backplate surface, by first nail bed bottom
Plate and support frame as described above are welded and fixed, and the support frame frame plate is set to four sides of the first nail bed bottom plate, and described first
Four sides of nail bed bottom plate are welded and fixed；
On the top of the support frame frame plate, several ceramic whiteware pieces along support frame frame plate extending direction setting, institute are set
It states ceramic whiteware piece and is embedded at the top end surface that in the support frame frame plate and ceramic whiteware piece surface is lower than the support frame frame plate, institute
The opposite place in ceramic whiteware piece position for stating the second nail bed bottom plate and the support frame frame plate is equipped with several suckers, the sucker suction
Height afterwards is equal to the difference in height of top end surface of the ceramic whiteware piece top end surface apart from the support frame frame plate, the ceramic whiteware piece
To be rectangular, the sucker is circle, and the size of the sucker is not more than the inscribed circle size of the ceramic whiteware piece；
The absorbent module being located between the first nail bed bottom plate and the second nail bed bottom plate, the absorption group are provided
Part include it is several be set in the range of the support frame frame plate is enclosed, and be set to the first nail bed bottom plate and described second
The sub- absorbent module in the clearance space of bed bottom plate is followed closely, the sub- absorbent module includes positioned at bottom and the first nail bed bottom plate
The pedestal of abutting, set on the base top and supported by the pedestal telescopic rod, subtracting set on the telescopic rod top end
Shake elastic slice and the silicon steel sheet set on damping elastic slice top；
The second nail bed bottom plate being set up at the top of the support frame frame plate is provided, the second nail bed bottom plate is transparent tempering
Glass plate, the second nail bed bottom plate with a thickness of 0.5 ~ 1.5 centimetre, the second nail bed backplate surface stamp has black and flat
The horizontal wire and munnion line of row interval setting, the horizontal wire of two of arbitrary neighborhood and the horizontal wire, the munnion line and
The spacing of the munnion line is 1 centimetre, and the PIN nail includes PIN nail ontology and follows closely body bottom portion end face set on the PIN
Iron plate, the iron plate and the PIN nail ontology fixed by PP glue sticking, the iron plate with a thickness of 1.0 ~ 1.5mm；
The circuit system being electrically connected with the absorbent module is provided, the circuit system includes solenoid driver circuit,
The solenoid driver circuit include be electrically connected current-limiting resistance, IRL3803 pipe, first diode, the second diode and outside
Connect power supply.
Preferably, further include following steps:
Liquid crystal screen display is provided,
Multiple weighing sensors, each weighing sensor and a signal are uniformly installed on the second nail bed bottom plate
Processor is connected, and the output end of each signal processor is connected on liquid crystal screen display；
Wherein, the signal processor includes single-chip microcontroller, amplifier circuit, memory, local display and keyboard, amplification
The input terminal of device circuit is connected with weighing sensor, output end and single-chip microcontroller and the liquid crystal screen display phase of amplifier circuit
Connection, the single-chip microcontroller are connected by I/O interface with memory, local display and keyboard, the quantity of the weighing sensor
It is ten, the quantity of corresponding signal processor is ten, and the liquid crystal screen display is by the independent display channel group of multichannel
At each display channel is made of 15 groups of LED backlight plates, driving circuit, driving powers, and the stress condition of printed circuit board is most
Eventually with 15 grades of step LED backlight board groups at column figure show, the memory be power down nonvolatile storage use
In storage setup parameter and sensing data.
Compared with the relevant technologies, anti-welding nail bed of printed circuit board provided by the invention and preparation method thereof has and has as follows
Beneficial effect:
The present invention provides a kind of anti-welding nail bed of printed circuit board and preparation method thereof, the anti-welding nail bed packet of printed circuit board
It includes support frame, the first nail bed bottom plate carried by support frame as described above, be located on outer peripheral edge table at the top of the first nail bed bottom plate
The support frame frame plate in face, second be set up at the top of the support frame frame plate follow closely bed bottom plate, are located in the first nail bed bottom plate
It is described second nail bed bottom plate between absorbent module, set on it is described second nail bed backplate surface several PIN nail and and it is described
The circuit system that absorbent module is electrically connected.Above structure can solve nail bed board and PIN nail quickly, be iteratively repeated utilizations, production
Nail bed is not required to drilling machine, drilling, adhesive tape, and quick Fabrication goes out to follow closely bed, while saving nail bed material cost, cost of manufacture and management
Cost, reduces the parking space of nail bed bottom plate, while reducing management difficulty, easy to use, improves work efficiency.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of the anti-welding nail bed preferred embodiment of printed circuit board provided by the invention；
Fig. 2 is a kind of structural schematic diagram of the absorbent module of the anti-welding nail bed of printed circuit board provided by the invention；
Fig. 3 is a kind of circuit diagram of the circuit system of the anti-welding nail bed of printed circuit board provided by the invention；
Fig. 4 is a kind of circuit diagram of the signal processor of the anti-welding nail bed of printed circuit board provided by the invention.
Specific embodiment
The invention will be further described with embodiment with reference to the accompanying drawing.
Referring to Fig. 1, for a kind of structural representation of the anti-welding nail bed preferred embodiment of printed circuit board provided by the invention
Figure.The anti-welding nail bed 100 of printed circuit board includes support frame 1, the first nail the bed bottom plate 2, ring carried by support frame as described above 1
Set on first nail, 2 top peripheral edge surface of bed bottom plate support frame frame plate 3, be set up in 3 top of the support frame frame plate
Second nail bed bottom plate 4, is set to the absorbent module 5 being located between the first nail bed bottom plate 2 and the second nail bed bottom plate 4
The circuit system and LCD screen that several PIN nail 6 and the absorbent module 5 on second nail, 4 surface of bed bottom plate are electrically connected
Display.
The first nail bed bottom plate 2 and support frame as described above 1 are welded and fixed, and the support frame frame plate 3 is set to first nail
Four sides of bed bottom plate 2, and four sides of the first nail bed bottom plate 2 are welded and fixed, if the top of the support frame frame plate 3 includes
The dry ceramic whiteware piece 31 being arranged along 3 extending direction of support frame frame plate, the ceramic whiteware piece 31 are embedded in the support frame frame plate 3
And 31 surface of ceramic whiteware piece is lower than the top end surface of the support frame frame plate 3.
The opposite place in 31 position of ceramic whiteware piece of the second nail bed bottom plate 4 and the support frame frame plate 3 is equipped with several suctions
Disk 41, the height after the sucker 41 adsorbs are equal to top of 41 top end surface of ceramic whiteware piece apart from the support frame frame plate 3
The difference in height on surface, the ceramic whiteware piece 31 be it is rectangular, the sucker 41 is circle, and the size of the sucker 41 is no more than described white
The inscribed circle size of tile 31.
It is described second nail bed bottom plate 4 be transparent toughened glass plate, it is described second nail bed bottom plate 4 with a thickness of 0.5 ~ 1.5 li
Rice, the horizontal wire and munnion line that second nail, 4 surface of bed bottom plate stamp has black and parallel interval is arranged, the two of arbitrary neighborhood
The spacing of horizontal wire described in item and the horizontal wire, the munnion line and the munnion line is 1 centimetre.
The PIN nail 6 includes PIN nail ontology 61 and the iron plate 62 set on PIN nail 61 bottom end face of ontology, the iron
Piece 62 and the PIN nail ontology 61 fixed by PP glue sticking, the iron plate 62 with a thickness of 1.0 ~ 1.5mm.
Specifically, the support frame frame plate 3 has first side, second side, third side and a four side, described the
A side and the length of third side are 560mm, and second side and the length of four side are 650mm, first side
The angle of side and second side is 90 °.
Referring to Fig. 2, the structural representation of the absorbent module for the anti-welding nail bed of a kind of printed circuit board provided by the invention
Figure.The absorbent module 5 include it is several be set in the range of the support frame frame plate 3 is enclosed, and be set to first nail
Sub- absorbent module in the clearance space of bed bottom plate 2 and the second nail bed bottom plate 4, the sub- absorbent module includes being located at bottom
It is supported with the pedestal 51 of the first nail abutting of bed bottom plate 2, set on 51 top of pedestal and by the pedestal 51 flexible
Bar 52, the silicon steel sheet 54 set on the damping elastic slice 53 on 52 top of telescopic rod and set on 53 top of damping elastic slice.
In the present embodiment, the first nail bed bottom plate 2 is iron plate, the pedestal 51 of the sub- absorbent module be truncated cone-shaped and
The big end face of sectional dimension and the first nail bed bottom plate 2 abut, and the pedestal 51 is magnet, by the suction adsorption of magnet in
First nail, 2 surface of bed bottom plate.
Preferably, there are three supporting legs, the bottom end of three supporting legs to be equipped with magnetic for the pedestal tool of the sub- absorbent module
Iron plate, the flat thin magnet and the first nail bed bottom plate abut, by the suction adsorption of magnet in the first nail bed bottom plate table
Face.
Further, the absorbent module 5 is made of four tandems arranged in parallel and equidistantly, is followed successively by from left to right
First tandem, the second tandem, third tandem and the 4th tandem, each tandem are equipped with 5 sub- absorbent modules, and described first is vertical
The spacing of the adjacent two sub- absorbent module in row, second tandem, the third tandem and the 4th tandem is homogeneous
Together.
Four tandems of the PIN nail 6 by arranging in parallel and equidistantly form, and are followed successively by the first tandem, the from left to right
Two tandems, third tandem and the 4th tandem, each tandem is equipped with PIN nail 6 identical with the sub- absorbent module quantity, described
The spacing of the adjacent two PIN nail 6 in first tandem, second tandem, the third tandem and the 4th tandem is equal
Identical, the PIN nail 6 of same position and the central axis of the sub- absorbent module are located at same straight line.
Referring to Fig. 3, the circuit diagram of the circuit system for the anti-welding nail bed of a kind of printed circuit board provided by the invention.Institute
Stating circuit system includes solenoid driver circuit, and the solenoid driver circuit includes the current-limiting resistance being electrically connected, IRL3803
Pipe, first diode, the second diode and external power supply.
R1 is current-limiting resistance, and IRL3803 pipe is connected；D1 is steering diode, provides correct voltage to IRL3803 pipe
Polarity；Diode D2 shields, and avoids damaging proportion electro-magnet when over-voltage, and the external power supply is that 24 V voltages directly supply
Electricity.
According to behind the position of the good absorbent module 5 of the size adjusting set and PIN nail 6, power on, it is to be printed
The printed circuit board process completes, and closes power supply, printed circuit board is transferred to next station.
Referring to Fig. 4, the circuit for a kind of signal processor of the anti-welding nail bed of printed circuit board provided by the invention is former
Reason figure.Multiple weighing sensors, each weighing sensor and a signal processing are uniformly installed on the second nail bed bottom plate 4
Device is connected, and the output end of each signal processor is connected on liquid crystal screen display, the signal processor include single-chip microcontroller,
The input terminal of amplifier circuit, memory, local display and keyboard, amplifier circuit is connected with weighing sensor, amplification
The output end of device circuit is connected with single-chip microcontroller and large screen display, which passes through I/O interface and memory, local
Display screen is connected with keyboard, and the quantity of the weighing sensor is ten, and the quantity of corresponding signal processor is ten, institute
It states liquid crystal screen display to be made of the independent display channel of multichannel, each display channel is by 15 groups of LED backlight plates, driving electricity
Road, driving power constitute, the stress condition of printed circuit board finally with 15 grades of step LED backlight board groups at column graphical display
Out, the memory is power down nonvolatile storage for storing setup parameter and sensing data.
The sensor of different location can acquire be placed in printed circuit board it is anti-welding nail bed on printed circuit board prevent it is each
Site pressure signal is sent into signal processor and amplifies Shape correction, since printed circuit board each section stress is different, because
This by selecting different size sensor that can reach maximum sensitivity and keep display effect more preferable, ten signal processors it is defeated
Outlet is connected on liquid crystal screen display, which is made of the independent display channel in 10 tunnels, each channel
It is made of 15 groups of LED backlight plates, driving circuit, driving powers, the anti-stress condition of printed circuit board is finally with 15 grades of steps
LED backlight board group at column figure show；Each signal processor include single-chip microcontroller, transport and placing device IC2, transport and placing device IC3,
Transport and placing device IC6, memory IC 4, local display and keyboard；Single-chip microcontroller is internally integrated A/D converter and RAM memory, single
Piece machine is connected with memory, local display, memory, keyboard, and the differential input end of transport and placing device IC2 connects weighing and sensing
Device, transport and placing device IC2 output end connect transport and placing device IC3 input terminal, and the output end of transport and placing device IC3 is connected with single-chip microcontroller, by monolithic
A/D conversion module inside machine converts analog signals into digital signal feeding local display and shows, and to sensor parameters
It is modified, the output end of transport and placing device IC3 is also connected with transport and placing device IC6, and signal amplification is output to long-range liquid by transport and placing device IC6
On brilliant screen display, keyboard includes that 16 operation buttons are connected with single-chip microcontroller, can be set to sensor parameters
Calibration calibration is carried out with to sensor；Memory IC 4 is using power down nonvolatile storage for storing setup parameter and sensor
Data.
The present invention also provides a kind of production methods of the anti-welding nail bed of printed circuit board, include the following steps:
Support frame is provided, the first nail bed bottom plate carried by support frame as described above, is located on the first nail bed base top
The support frame frame plate of portion's outer peripheral surface is followed closely set on several PIN of the second nail bed backplate surface, by first nail bed bottom
Plate and support frame as described above are welded and fixed, and the support frame frame plate is set to four sides of the first nail bed bottom plate, and described first
Four sides of nail bed bottom plate are welded and fixed；
On the top of the support frame frame plate, several ceramic whiteware pieces along support frame frame plate extending direction setting, institute are set
It states ceramic whiteware piece and is embedded at the top end surface that in the support frame frame plate and ceramic whiteware piece surface is lower than the support frame frame plate, institute
The opposite place in ceramic whiteware piece position for stating the second nail bed bottom plate and the support frame frame plate is equipped with several suckers, the sucker suction
Height afterwards is equal to the difference in height of top end surface of the ceramic whiteware piece top end surface apart from the support frame frame plate, the ceramic whiteware piece
To be rectangular, the sucker is circle, and the size of the sucker is not more than the inscribed circle size of the ceramic whiteware piece；
The absorbent module being located between the first nail bed bottom plate and the second nail bed bottom plate, the absorption group are provided
Part include it is several be set in the range of the support frame frame plate is enclosed, and be set to the first nail bed bottom plate and described second
The sub- absorbent module in the clearance space of bed bottom plate is followed closely, the sub- absorbent module includes positioned at bottom and the first nail bed bottom plate
The pedestal of abutting, set on the base top and supported by the pedestal telescopic rod, subtracting set on the telescopic rod top end
Shake elastic slice and the silicon steel sheet set on damping elastic slice top；
The second nail bed bottom plate being set up at the top of the support frame frame plate is provided, the second nail bed bottom plate is transparent tempering
Glass plate, the second nail bed bottom plate with a thickness of 0.5 ~ 1.5 centimetre, the second nail bed backplate surface stamp has black and flat
The horizontal wire and munnion line of row interval setting, the horizontal wire of two of arbitrary neighborhood and the horizontal wire, the munnion line and
The spacing of the munnion line is 1 centimetre, and the PIN nail includes PIN nail ontology and follows closely body bottom portion end face set on the PIN
Iron plate, the iron plate and the PIN nail ontology fixed by PP glue sticking, the iron plate with a thickness of 1.0 ~ 1.5mm；
The circuit system being electrically connected with the absorbent module is provided, the circuit system includes solenoid driver circuit,
The solenoid driver circuit include be electrically connected current-limiting resistance, IRL3803 pipe, first diode, the second diode and outside
Connect power supply.
Liquid crystal screen display is provided,
Multiple weighing sensors, each weighing sensor and a signal are uniformly installed on the second nail bed bottom plate
Processor is connected, and the output end of each signal processor is connected on liquid crystal screen display；
Wherein, the signal processor includes single-chip microcontroller, amplifier circuit, memory, local display and keyboard, amplification
The input terminal of device circuit is connected with weighing sensor, output end and single-chip microcontroller and the liquid crystal screen display phase of amplifier circuit
Connection, the single-chip microcontroller are connected by I/O interface with memory, local display and keyboard, the quantity of the weighing sensor
It is ten, the quantity of corresponding signal processor is ten, and the liquid crystal screen display is by the independent display channel group of multichannel
At each display channel is made of 15 groups of LED backlight plates, driving circuit, driving powers, and the stress condition of printed circuit board is most
Eventually with 15 grades of step LED backlight board groups at column figure show, the memory be power down nonvolatile storage use
In storage setup parameter and sensing data.
Compared with the relevant technologies, the anti-welding nail bed of the printed circuit board provided by the invention with manipulator and its production side
Method has the following beneficial effects:
The present invention provides a kind of anti-welding nail bed of printed circuit board and preparation method thereof, the anti-welding nail bed packet of printed circuit board
It includes support frame, the first nail bed bottom plate carried by support frame as described above, be located on outer peripheral edge table at the top of the first nail bed bottom plate
The support frame frame plate in face, second be set up at the top of the support frame frame plate follow closely bed bottom plate, are located in the first nail bed bottom plate
It is described second nail bed bottom plate between absorbent module, set on it is described second nail bed backplate surface several PIN nail and and it is described
The circuit system that absorbent module is electrically connected.Above structure can solve nail bed board and PIN nail quickly, be iteratively repeated utilizations, production
Nail bed is not required to drilling machine, drilling, adhesive tape, and quick Fabrication goes out to follow closely bed, while saving nail bed material cost, cost of manufacture and management
Cost, reduces the parking space of nail bed bottom plate, while reducing management difficulty, easy to use, improves work efficiency.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (9)
1. a kind of anti-welding nail bed of printed circuit board, which is characterized in that the anti-welding nail bed of printed circuit board includes support frame, passes through
First nail bed bottom plate of support frame as described above carrying, the braced frame for being located on outer peripheral surface at the top of the first nail bed bottom plate
Plate, second be set up at the top of the support frame frame plate follow closely bed bottom plate, are located in the first nail bed bottom plate and second nail
Absorbent module between bed bottom plate, several PIN nail and and absorbent module electrical property set on the second nail bed backplate surface
The circuit system of connection, the first nail bed bottom plate and support frame as described above are welded and fixed, and the support frame frame plate is set to described the
Four sides of one nail bed bottom plate, and four sides of the first nail bed bottom plate are welded and fixed, and the top of the support frame frame plate includes
Several ceramic whiteware pieces along support frame frame plate extending direction setting, the ceramic whiteware piece is embedded in the support frame frame plate and institute
State the top end surface that ceramic whiteware piece surface is lower than the support frame frame plate, the institute of the second nail the bed bottom plate and the support frame frame plate
It states the opposite place in ceramic whiteware piece position and is equipped with several suckers, the height after the sucker suction is equal to the ceramic whiteware piece top end surface distance
The difference in height of the top end surface of the support frame frame plate, the ceramic whiteware piece be it is rectangular, the sucker be circle, the ruler of the sucker
The very little inscribed circle size no more than the ceramic whiteware piece, the absorbent module include it is several be set to the support frame frame plate be enclosed
In the range of, and the sub- absorbent module being set in the clearance space of the first nail bed bottom plate and the second nail bed bottom plate, institute
Sub- absorbent module is stated to include the pedestal abutted positioned at bottom and the first nail bed bottom plate, set on the base top and pass through institute
Telescopic rod, the silicon steel set on the damping elastic slice of the telescopic rod top end and set on damping elastic slice top for stating pedestal support
Piece, it is described second nail bed bottom plate be transparent toughened glass plate, it is described second nail bed bottom plate with a thickness of 0.5 ~ 1.5 centimetre, it is described
Second nail bed backplate surface stamp has the horizontal wire and munnion line of black and parallel interval setting, two cross of arbitrary neighborhood
The spacing of wire and the horizontal wire, the munnion line and the munnion line is 1 centimetre, and the PIN nail includes that PIN follows closely ontology
And the iron plate set on PIN nail body bottom portion end face, the iron plate and PIN nail ontology are fixed by PP glue sticking, institute
State iron plate with a thickness of 1.0 ~ 1.5mm；The circuit system includes solenoid driver circuit, and the solenoid driver circuit includes
Current-limiting resistance, IRL3803 pipe, first diode, the second diode and the external power supply of electric connection.
2. the anti-welding nail bed of printed circuit board according to claim 1, which is characterized in that the absorbent module is by parallel and wait
Four tandems of spacing arrangement form, and are followed successively by the first tandem, the second tandem, third tandem and the 4th tandem from left to right, often
One tandem is equipped with 4-9 sub- absorbent modules, first tandem, second tandem, the third tandem and the described 4th
The spacing of the adjacent two sub- absorbent module in tandem is all the same, and the PIN nail is vertical by four arranged in parallel and equidistantly
Row's composition, is followed successively by the first tandem, the second tandem, third tandem and the 4th tandem, each tandem is equipped with and institute from left to right
State the identical PIN nail of sub- absorbent module quantity, first tandem, second tandem, the third tandem and the described 4th
The spacing of the adjacent two PIN nail in tandem is all the same, and the first tandem, the second tandem, third tandem are identical with the 4th tandem
The PIN nail of position and the central axis of the sub- absorbent module are located at same straight line.
3. the anti-welding nail bed of printed circuit board according to claim 1, which is characterized in that it further include liquid crystal screen display,
Multiple weighing sensors are uniformly installed on the second nail bed bottom plate, each weighing sensor is connected with a signal processor
It connects, the output end of each signal processor is connected on liquid crystal screen display, which includes single-chip microcontroller, amplifier
The input terminal of circuit, memory, local display and keyboard, amplifier circuit is connected with weighing sensor, amplifier circuit
Output end be connected with single-chip microcontroller and large screen display, the single-chip microcontroller by I/O interface and memory, local display and
Keyboard is connected, and the quantity of the weighing sensor is ten, and the quantity of corresponding signal processor is ten, the liquid crystal display
Curtain display is made of the independent display channel of multichannel, and each display channel is by 15 groups of LED backlight plates, driving circuit, driving electricity
Source constitute, the stress condition of printed circuit board finally with 15 grades of step LED backlight board groups at column figure show, it is described
Memory be power down nonvolatile storage for storing setup parameter and sensing data.
4. the anti-welding nail bed of printed circuit board according to claim 3, which is characterized in that the sensor of different location can be adopted
The printed circuit board that collection is placed on the anti-welding nail bed of printed circuit board prevents each site pressure signal, be sent into signal processor into
Row amplification Shape correction, since printed circuit board each section stress is different, by selecting different size sensor that can reach
To maximum sensitivity and keep display effect more preferable, the output end of ten signal processors is connected on liquid crystal screen display, should
Liquid crystal screen display is made of the independent display channel in 10 tunnels, and each channel is by 15 groups of LED backlight plates, driving circuit, drivings
Electric power generating composition, the stress condition of printed circuit board finally with 15 grades of step LED backlight board groups at column figure show；Often
A signal processor includes single-chip microcontroller, transport and placing device IC2, transport and placing device IC3, transport and placing device IC6, memory IC 4, local display and key
Disk；Single-chip microcontroller is internally integrated A/D converter and RAM memory, single-chip microcontroller and memory, local display, memory, keyboard
It is connected, the differential input end of transport and placing device IC2 connects weighing sensor, and transport and placing device IC2 output end connects transport and placing device IC3 input
End, the output end of transport and placing device IC3 are connected with single-chip microcontroller, are converted analog signals by the A/D conversion module inside single-chip microcontroller
Digital signal is sent into local display and is shown, and is modified to sensor parameters, and the output end of transport and placing device IC3 is also connected with amplifier
Signal amplification is output on long-range liquid crystal screen display by device IC6, transport and placing device IC6, and keyboard includes that 16 operations are pressed
Key is connected with single-chip microcontroller, can carry out setting to sensor parameters and carry out calibration calibration to sensor；Memory IC 4 is adopted
With power down nonvolatile storage for storing setup parameter and sensing data.
5. the anti-welding nail bed of printed circuit board according to claim 3, which is characterized in that the support frame frame plate has first
The length of side, second side, third side and four side, the first side and third side is 560mm, second side
The length of Bian Yu four side is 650mm, and the angle of the first side and second side is 90 °.
6. the anti-welding nail bed of printed circuit board according to claim 1, which is characterized in that the first nail bed bottom plate is iron
Plate, the pedestal of the sub- absorbent module is truncated cone-shaped and the big end face of sectional dimension and the first nail bed bottom plate abut, described
Pedestal is magnet, by the suction adsorption of magnet in the first nail bed backplate surface.
7. the anti-welding nail bed of printed circuit board according to claim 1, which is characterized in that the first nail bed bottom plate is iron
Plate, for the pedestal tool of the sub- absorbent module there are three supporting leg, the bottom end of three supporting legs is equipped with flat thin magnet, the magnet
Piece and the first nail bed bottom plate abut, by the suction adsorption of magnet in the first nail bed backplate surface.
8. a kind of production method of the anti-welding nail bed of printed circuit board, which comprises the steps of:
Offer support frame, is located on outside the first nail bed bottom plate top the first nail bed bottom plate carried by support frame as described above
The support frame frame plate of peripheral edge surface, set on several PIN nail of the second nail bed backplate surface, described first will follow closely bed bottom plate and described
Support frame is welded and fixed, and the support frame frame plate is set to four sides of the first nail bed bottom plate, and the first nail bed bottom plate
Four sides be welded and fixed；
On the top of the support frame frame plate, several ceramic whiteware pieces along support frame frame plate extending direction setting are set, it is described white
Tile is embedded at the top end surface that in the support frame frame plate and ceramic whiteware piece surface is lower than the support frame frame plate, and described the
The opposite place in the ceramic whiteware piece position of two nail bed bottom plates and the support frame frame plate is equipped with several suckers, after the sucker suction
Height is equal to the difference in height of top end surface of the ceramic whiteware piece top end surface apart from the support frame frame plate, and the ceramic whiteware piece is side
Shape, the sucker are circle, and the size of the sucker is not more than the inscribed circle size of the ceramic whiteware piece；
The absorbent module being located between the first nail bed bottom plate and the second nail bed bottom plate, the absorbent module packet are provided
Include it is several be set in the range of the support frame frame plate is enclosed, and be set to the first nail bed bottom plate and the second nail bed
Sub- absorbent module in the clearance space of bottom plate, the sub- absorbent module include abutting positioned at bottom and the first nail bed bottom plate
Pedestal, set on the base top and supported by the pedestal telescopic rod, set on the damping bullet of the telescopic rod top end
Piece and silicon steel sheet set on damping elastic slice top；
The second nail bed bottom plate being set up at the top of the support frame frame plate is provided, the second nail bed bottom plate is transparent toughened glass
Plate, the second nail bed bottom plate with a thickness of 0.5 ~ 1.5 centimetre, the second nail bed backplate surface stamp have black and it is parallel between
Every the horizontal wire and munnion line of setting, the horizontal wire of two of arbitrary neighborhood and the horizontal wire, the munnion line and described
The spacing of munnion line is 1 centimetre, and the PIN nail includes PIN nail ontology and the iron set on PIN nail body bottom portion end face
Piece, the iron plate and the PIN nail ontology fixed by PP glue sticking, the iron plate with a thickness of 1.0 ~ 1.5mm；
The circuit system being electrically connected with the absorbent module is provided, the circuit system includes solenoid driver circuit, described
Solenoid driver circuit includes current-limiting resistance, IRL3803 pipe, first diode, the second diode and the external electricity being electrically connected
Source.
9. the production method of the anti-welding nail bed of printed circuit board according to claim 8, which is characterized in that including walking as follows
It is rapid:
Liquid crystal screen display is provided,
Multiple weighing sensors, each weighing sensor and a signal processing are uniformly installed on the second nail bed bottom plate
Device is connected, and the output end of each signal processor is connected on liquid crystal screen display；
Wherein, the signal processor includes single-chip microcontroller, amplifier circuit, memory, local display and keyboard, amplifier electricity
The input terminal on road is connected with weighing sensor, and the output end of amplifier circuit is connected with single-chip microcontroller and liquid crystal screen display
It connects, which is connected by I/O interface with memory, local display and keyboard, and the quantity of the weighing sensor is
Ten, the quantity of corresponding signal processor is ten, and the liquid crystal screen display is made of the independent display channel of multichannel,
Each display channel is made of 15 groups of LED backlight plates, driving circuit, driving powers, the stress condition of printed circuit board finally with
15 grades of step LED backlight board groups at column figure show that the memory is power down nonvolatile storage for depositing
Store up setup parameter and sensing data.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710908066.4A CN107708324B (en) | 2017-09-29 | 2017-09-29 | Anti-welding nail bed of printed circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710908066.4A CN107708324B (en) | 2017-09-29 | 2017-09-29 | Anti-welding nail bed of printed circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN107708324A CN107708324A (en) | 2018-02-16 |
| CN107708324B true CN107708324B (en) | 2019-10-15 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108882529A (en) * | 2018-06-27 | 2018-11-23 | 东莞市鹏利节能设备有限公司 | A kind of pcb board automatic printing machine worktable and paving nail method |
| CN112437541B (en) * | 2020-11-04 | 2022-08-23 | 江西旭昇电子有限公司 | Manufacturing method of nail bed plate of printed circuit board anti-welding single-table-board full-automatic production line |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10151725A (en) * | 1996-11-25 | 1998-06-09 | Matsushita Electric Ind Co Ltd | Sheet and method for step replacement of screen printing machine |
| CN203134209U (en) * | 2012-12-04 | 2013-08-14 | 天津市盛丹电子技术发展有限公司 | Electronic nail bed display apparatus |
| CN203352956U (en) * | 2013-07-18 | 2013-12-18 | 苏州矽微电子科技有限公司 | PCB adsorption device for cooperating with film-sticking machine |
| CN105307408A (en) * | 2015-09-07 | 2016-02-03 | 苏州恩欧西精密机械制造有限公司 | Vacuum adsorption printing tool |
| CN105704939A (en) * | 2016-04-11 | 2016-06-22 | 苏州市惠利华电子有限公司 | All-purposed bed of nails |
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Effective date of registration: 20201218 Address after: No. 435, building B, Zhaoqing New Area Investment Development Co., Ltd., No. 526000, building B, Guicheng new town, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: Guangdong Xizhen Circuit Technology Co.,Ltd. Address before: 413000 Longtang Village, Changchun Industrial Park, Ziyang District, Yiyang City, Hunan Province Patentee before: AOSHIKANG TECHNOLOGY Co.,Ltd. |