CN107706121B - Precision consistency correction method and system for batch test of multiple test devices - Google Patents
Precision consistency correction method and system for batch test of multiple test devices Download PDFInfo
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- CN107706121B CN107706121B CN201710775817.XA CN201710775817A CN107706121B CN 107706121 B CN107706121 B CN 107706121B CN 201710775817 A CN201710775817 A CN 201710775817A CN 107706121 B CN107706121 B CN 107706121B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
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Abstract
The invention relates to a method and a system for correcting the precision consistency of batch test of a plurality of test devices, wherein the method comprises the following steps: the calibration elements are tested by the plurality of test devices, the relative correction coefficient of each test device is obtained according to the measured value, each test device is provided with the calibration element, and the precision of the calibration element is higher than the test precision of the plurality of test devices; using the plurality of test equipment to test the elements to be tested in batch, and taking the value directly read from the test equipment as the measured value of each element to be tested; and correcting the measured value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested. According to the precision consistency correction method and system for batch testing of multiple test devices, precision machining of the element to be tested is guaranteed through the relative correction coefficient of each test device, machining precision of the element to be tested can be guaranteed without adjusting the test devices to the precision standard of a standard machine one by one, time and labor are saved, and machining efficiency is obviously improved.
Description
Technical Field
The invention relates to the field of high-precision testing and processing, in particular to a precision consistency correction method and system for batch testing of multiple test devices.
Background
In the process of testing and mass production of integrated circuit wafers, the number of a batch of wafers is from several to hundreds of wafers or even thousands of wafers, and the wafers need to be processed on a plurality of test devices to meet the requirement of capacity. There may be slight differences in accuracy between different test devices that are within the nominal accuracy range of the device. For wafers with low precision requirements, usually, the difference does not affect the mass production of the wafers. However, in some cases where the precision requirement is high, the precision difference between the test equipments will seriously affect the normal batch production of the wafers. The current method is that the same wafer sample with the accuracy meeting the requirement is used for testing in each testing device, and the accuracy of each testing device is manually adjusted until the accuracy of the testing device meets the requirement; the wafer sample has obvious performance drift along with the increase of time and multiple electric shocks, is sensitive to temperature, has poor stability and needs to be replaced regularly. The method for adjusting the precision of the test equipment manually to ensure the precision of the wafer is time-consuming and labor-consuming, and the production efficiency is seriously influenced.
Disclosure of Invention
In view of the above, it is desirable to provide a method and a system for correcting accuracy consistency in batch tests of a plurality of test apparatuses capable of performing high-efficiency processing while ensuring accuracy.
A precision consistency correction method for batch test of a plurality of test devices is provided, each test device is provided with a calibration element, and the method comprises the following steps:
testing the calibration element by using the plurality of test devices, and obtaining a relative correction coefficient of each test device according to a measured value, wherein the precision of the calibration element is higher than that of each test device;
using the plurality of test equipment to test the elements to be tested in batch, and taking the value directly read from the test equipment as the measured value of each element to be tested;
and correcting the measured value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
In one embodiment, the step of using the plurality of test devices to test the calibration element and obtaining the relative correction coefficient of each test device according to the measured values includes:
and testing the standard element by using the plurality of test devices to obtain the relative correction coefficient of each test device.
In one embodiment, the step of using the plurality of test devices to test the standard element and obtaining the relative correction coefficient of each test device specifically includes:
testing the standard elements by using the plurality of test devices to obtain measured values of the standard elements on each test device;
and obtaining the relative correction coefficient by using the measured value of the standard element and the standard value of the standard element.
In one embodiment, the device under test comprises a wafer, and the test equipment comprises a tester.
In one embodiment, the standard element is a precision resistor.
On the other hand, the invention also provides a system for correcting the accuracy consistency of batch testing of a plurality of test devices, which comprises the following steps:
the relative correction coefficient acquisition module is used for testing the calibration elements by using the plurality of test equipment and obtaining the relative correction coefficient of each test equipment according to the measured value, and each test equipment is provided with the calibration element, and the precision of the calibration element is higher than the test precision of each test equipment;
the device comprises a module for acquiring the measured value of the element to be tested, a module for testing the element to be tested in batch by using the plurality of test equipment, and a module for reading the value directly from the test equipment as the measured value of each element to be tested;
and the actual value acquisition module of the element to be tested is used for correcting the actual measurement value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
In one embodiment, the relative correction coefficient obtaining module includes:
and the standard element acquisition relative correction coefficient module is used for testing the standard element by using the plurality of test devices and acquiring the relative correction coefficient of each test device.
In one embodiment, the standard element obtaining relative correction factor module includes:
the standard element actual measurement value acquisition module is used for testing the standard elements by using the plurality of test equipment and acquiring the actual measurement values of the standard elements measured on each test equipment;
and the relative correction coefficient acquisition module is used for acquiring the relative correction coefficient by using the measured value of the standard element and the standard value of the standard element.
In one embodiment, the device under test comprises a wafer, and the test equipment comprises a tester.
In one embodiment, the standard element is a precision resistor.
According to the precision consistency correction method and system for batch testing of multiple test devices, precision machining of the element to be tested is guaranteed through the relative correction coefficient of each test device, machining precision of the element to be tested can be guaranteed without adjusting the test devices to the precision standard of a standard machine one by one, time and labor are saved, and machining efficiency is obviously improved.
Drawings
FIG. 1 is a flow diagram of a method for accuracy consistency correction for batch testing of multiple test devices in an embodiment;
FIG. 2 is a flowchart illustrating a method for correcting accuracy consistency in a batch test of a plurality of test apparatuses in another embodiment;
FIG. 3 is a system block diagram of a system for accuracy consistency correction for batch testing of multiple test devices under an embodiment;
FIG. 4 is a system block diagram of a system for correcting accuracy consistency in batch testing of multiple test apparatuses in another embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a flowchart of a method for correcting accuracy consistency in batch testing of multiple test apparatuses in an embodiment.
In this embodiment, the method for correcting the accuracy consistency in batch testing of multiple test devices includes:
s100, testing the calibration elements by using a plurality of test devices, obtaining the relative correction coefficient of each test device according to the measured value, wherein each test device is provided with the calibration element, and the precision of the calibration element is higher than the test precision of each test device.
The calibration elements are respectively tested by a plurality of test devices, the test values obtained by testing the calibration elements by each test device are obtained according to the measured values, the relative correction coefficients of each test device are obtained according to the test values obtained by different test devices, the calibration elements are arranged on each test device, and the precision of the calibration elements is higher than that of each test device. The self-testing precision of the calibration element on each piece of testing equipment is within the allowable range of the measurement error, and in one embodiment, a qualified instrument with higher precision is used for periodically calibrating the testing precision of the calibration element, so that the self-testing precision of the calibration element on each piece of testing equipment is ensured to be within the allowable range of the measurement error. In one embodiment, the calibration element refers to a standard element, such as a standard resistor, which is higher than the stability and accuracy of the testing equipment, and in one embodiment, the testing accuracy of each testing equipment is 1-2 orders of magnitude lower than that of the calibration element, such as 0.1% of the testing accuracy of each testing equipment and 0.01% of the calibration element accuracy. In other embodiments, it may be any non-standard element that is more stable and accurate than the test equipment.
S200, using a plurality of test devices to test the elements to be tested in batch, and taking the value directly read from the test devices as the actual measurement value of each element to be tested.
The elements to be tested are tested in batch by using a plurality of test devices, and the value directly read from the test devices is used as the measured value of each element to be tested.
S300, correcting the actual measurement value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
After the actual measurement value of each device under test is measured in step S200, the actual measurement value is corrected by the relative correction coefficient of the testing equipment used by the device under test, so as to obtain the actual value of the device under test, thereby ensuring the processing accuracy.
According to the precision consistency correction method for batch testing of multiple test devices, the actual value of the element to be tested is ensured through the relative correction coefficient of each test device, so that precision machining is ensured, the actual machining precision of the element to be tested can be ensured without adjusting the precision standard from the test devices to the standard machine one by one, time and labor are saved, and the machining efficiency is obviously improved.
Referring to fig. 2, fig. 2 is a flowchart of a method for correcting accuracy consistency in batch testing of multiple test apparatuses in another embodiment.
In this embodiment, the method for correcting the accuracy consistency in batch testing of multiple test devices includes:
s101, testing the standard element by using a plurality of testing devices, and acquiring measured values of the standard element measured on each testing device.
Each test device is provided with a standard element, the precision of the standard element is higher than the test precision of the plurality of test devices, the plurality of test devices are used for respectively testing the standard element, and the measured value of the standard element on each test device is obtained.
And S102, obtaining the relative correction coefficient of each testing device by using the measured value of the standard element and the standard value of the standard element.
The relative correction coefficient of each testing device can be obtained by using the measured value of the standard element on each testing device and the standard value of the standard element. In one embodiment, the relative correction factor is a ratio of the standard value of the standard component to the actual measured value of the standard component, based on the standard value of the standard component. In one embodiment, the standard element is a precision resistor.
S103, the device under test is batch-tested using a plurality of test apparatuses, and the value directly read from the test apparatuses is used as the actual measurement value of each device under test.
The elements to be tested are tested in batch by using a plurality of test devices, and the value directly read from the test devices is used as the measured value of each element to be tested. In one embodiment, the device under test comprises a wafer and the test equipment comprises a tester.
S104, correcting the actual measurement value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
And correcting the measured value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested. In one embodiment, the product of the measured value of the dut and the relative correction factor of the testing equipment used by the dut is the actual value of the dut.
Referring to fig. 3, fig. 3 is a system block diagram of a system for correcting accuracy consistency in batch testing of multiple test apparatuses in an embodiment.
In this embodiment, the system for correcting the accuracy consistency in batch testing of a plurality of test devices includes:
the relative correction coefficient obtaining module 10 is configured to use the multiple test devices to test the calibration element, and obtain the relative correction coefficient of each test device according to the measured value, where a calibration element is provided on each test device, and the precision of the calibration element is higher than the test precision of each test device.
The module 20 for acquiring the actual measurement value of the device under test is configured to test the device under test in batch by using the plurality of test apparatuses, and use the value directly read from the test apparatus as the actual measurement value of each device under test.
The actual value obtaining module 30 of the device under test is configured to correct the actual value through the relative correction coefficient of the testing apparatus used by the device under test, so as to obtain the actual value of the device under test.
In one embodiment, the relative correction coefficient obtaining module 10 includes:
and the standard element acquisition relative correction coefficient module is used for testing the standard element by using the plurality of test devices and acquiring the relative correction coefficient of each test device.
Referring to fig. 4, fig. 4 is a system block diagram of a system for correcting accuracy consistency in batch testing of multiple test apparatuses in another embodiment.
In this embodiment, the system for correcting the accuracy consistency in batch testing of a plurality of test devices includes:
and a relative correction coefficient obtaining module 10, configured to use the multiple test devices to test the calibration element, and obtain a relative correction coefficient of each test device according to the measured value, where the precision of the calibration element is higher than the test precision of the multiple test devices.
The module 20 for acquiring the actual measurement value of the device under test is configured to test the device under test in batch by using the plurality of test apparatuses, and use the value directly read from the test apparatus as the actual measurement value of each device under test.
The actual value obtaining module 30 of the device under test is configured to correct the actual value through the relative correction coefficient of the testing apparatus used by the device under test, so as to obtain the actual value of the device under test. In one embodiment, the device under test comprises a wafer and the test equipment comprises a tester.
The relative correction coefficient acquisition module 10 includes:
and a module 11 for acquiring measured values of the standard elements, configured to test the standard elements by using the plurality of test apparatuses, and acquire measured values of the standard elements measured by each of the test apparatuses. In one embodiment, the standard element is a precision resistor.
The module 12 for obtaining relative correction coefficients of the measured values and the standard values of the standard elements is used for obtaining the relative correction coefficients of the testing apparatuses by using the measured values of the standard elements and the standard values of the standard elements.
According to the precision consistency correction system for batch testing of multiple test devices, the actual value of the element to be tested is guaranteed through the relative correction coefficient of each test device, so that precision machining is guaranteed, the actual machining precision of the element to be tested can be guaranteed without adjusting the test devices to the precision standard of a standard machine one by one, time and labor are saved, and the machining efficiency is obviously improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A precision consistency correction method for batch test of a plurality of test devices is characterized in that each test device is provided with a calibration element, and the method comprises the following steps:
the calibration elements are tested by the plurality of test devices, the relative correction coefficient of each test device is obtained according to the measured value, the precision of each calibration element is higher than that of each test device, the test precision of each calibration element on each test device is within the allowable range of the measurement error, and the calibration elements are periodically calibrated by using a qualified instrument with higher precision;
using the plurality of test equipment to test the elements to be tested in batch, and taking the value directly read from the test equipment as the measured value of each element to be tested;
and correcting the measured value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
2. The method of claim 1, wherein the step of testing the calibration element using the plurality of test devices and obtaining the relative correction factor of each test device from the measured values comprises:
and testing the standard element by using the plurality of test devices to obtain the relative correction coefficient of each test device.
3. The method for correcting the accuracy consistency in the batch test of the plurality of test devices according to claim 2, wherein the step of using the plurality of test devices to test the standard element and obtaining the relative correction coefficient of each test device specifically comprises:
testing the standard elements by using the plurality of test devices to obtain measured values of the standard elements on each test device;
and obtaining the relative correction coefficient of each test device by using the measured value of the standard element and the standard value of the standard element.
4. The method of claim 1, wherein the device under test comprises a wafer and the test equipment comprises a tester.
5. The method of claim 2, wherein the standard element is a precision resistor.
6. The utility model provides a precision uniformity correction system of many test equipment batch test which characterized in that includes:
the relative correction coefficient acquisition module is used for testing the calibration elements by using the plurality of test equipment, obtaining the relative correction coefficient of each test equipment according to the measured value, arranging the calibration element on each test equipment, wherein the precision of the calibration element is higher than that of each test equipment, the test precision of the calibration element on each test equipment is within the allowable range of the measurement error, and periodically calibrating the test precision of the calibration element by using a high-precision qualified instrument;
the device comprises a module for acquiring the measured value of the element to be tested, a module for testing the element to be tested in batch by using the plurality of test equipment, and a module for reading the value directly from the test equipment as the measured value of each element to be tested;
and the actual value acquisition module of the element to be tested is used for correcting the actual measurement value through the relative correction coefficient of the test equipment used by the element to be tested to obtain the actual value of the element to be tested.
7. The system of claim 6, wherein the relative correction factor obtaining module comprises:
and the standard element acquisition relative correction coefficient module is used for testing the standard element by using the plurality of test devices and acquiring the relative correction coefficient of each test device.
8. The system of claim 7, wherein the standard element obtaining relative correction factor module comprises:
the standard element actual measurement value acquisition module is used for testing the standard elements by using the plurality of test equipment and acquiring the actual measurement values of the standard elements measured on each test equipment;
and the relative correction coefficient acquisition module is used for acquiring the relative correction coefficient of each testing device by using the measured value of the standard element and the standard value of the standard element.
9. The system of claim 6, wherein the device under test comprises a wafer and the test equipment comprises a tester.
10. The system of claim 7, wherein the standard component is a precision resistor.
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| CN109186940B (en) * | 2018-08-01 | 2020-08-04 | 昆山丘钛微电子科技有限公司 | Monitoring method and monitoring device for testing precision |
| CN112289698A (en) * | 2020-10-28 | 2021-01-29 | 天合光能股份有限公司 | Calibration method of sliced battery standard slice |
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| CN1490629A (en) * | 2001-12-10 | 2004-04-21 | ������������ʽ���� | Correcting method, quality checking method for electronic component and characteristic measuring system |
| CN105589051A (en) * | 2014-11-18 | 2016-05-18 | 德信东源电力技术服务（北京）有限公司 | Method and device for calibrating current and method for detecting current |
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| JPH0661749A (en) * | 1992-08-10 | 1994-03-04 | Yokogawa Electric Corp | Correction coefficient deciding method |
| JP5458817B2 (en) * | 2009-11-12 | 2014-04-02 | 株式会社村田製作所 | Method of correcting electrical characteristic measurement error of electronic component and electronic component characteristic measuring apparatus |
| CN102768529B (en) * | 2012-08-06 | 2014-08-13 | 北京雪迪龙科技股份有限公司 | Volume flow correction method for mass flow controller |
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| CN1490629A (en) * | 2001-12-10 | 2004-04-21 | ������������ʽ���� | Correcting method, quality checking method for electronic component and characteristic measuring system |
| CN105589051A (en) * | 2014-11-18 | 2016-05-18 | 德信东源电力技术服务（北京）有限公司 | Method and device for calibrating current and method for detecting current |
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