CN107706121A - The precision consistent correction method and system of more test equipment batch testings - Google Patents
The precision consistent correction method and system of more test equipment batch testings Download PDFInfo
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- CN107706121A CN107706121A CN201710775817.XA CN201710775817A CN107706121A CN 107706121 A CN107706121 A CN 107706121A CN 201710775817 A CN201710775817 A CN 201710775817A CN 107706121 A CN107706121 A CN 107706121A
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- test equipment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The present invention relates to a kind of precision consistent correction method and system of more test equipment batch testings, including：Demarcation element is tested using the more test equipments, according to the relative correction factor for being worth to each test equipment measured, every test equipment is provided with demarcation element, and the precision for demarcating element is higher than the measuring accuracy of the more test equipments；Using the more test equipments batch testing element under test, using the measured value from the value that test equipment is directly read as each element under test；The relative correction factor of the test equipment used by element under test is modified to measured value, obtains the actual value of the element under test.The precision consistent correction method and system of above-mentioned more test equipment batch testings, ensure that the precision of element under test is processed by the relative correction factor of each test equipment, test equipment need not be adjusted one by one to the accuracy standard of Standard Machine it is ensured that the machining accuracy of element under test, time saving and energy saving, processing efficiency significantly improves.
Description
Technical field
The present invention relates to high precision measurement manufacture field, more particularly to a kind of precision of more test equipment batch testings
Consistent correction method and system.
Background technology
Tested in IC wafers in batch production process, the quantity of a collection of wafer is even thousands of from several to hundreds of
Piece is not waited, it is necessary to processed in more test equipments, could meet capacity requirements.Can exist between different test equipments in precision
Fine difference, these differences are in the range of the accuracy rating of equipment.For the not high wafer of required precision, it is generally the case that
This difference does not interfere with the batch machining production of wafer.But in the case of some required precisions are high, between test equipment
The batch that precision difference can seriously affect wafer normally produces.Current way is to utilize the satisfactory same crystalline substance of precision
Circle sample is tested in every test equipment respectively, by manually adjusting the precision of every test equipment, until test
Untill the precision of equipment meets the requirements；And wafer sample growth over time and multiple surge, performance can produce obvious drift
Move, and it is more sensitive to temperature, and stability is poor, it is necessary to regularly replace.It is such a to adjust test equipment essence by manually
Degree has a strong impact on production efficiency so as to ensure that the method for wafer precision wastes time and energy.
The content of the invention
Based on this, it is necessary to which providing one kind can be in the case where ensureing precision, and more tests for carrying out high efficiency processing are set
The precision consistent correction method and system of standby batch testing.
A kind of precision consistent correction method of more test equipment batch testings, every test equipment are provided with demarcation member
Part, methods described include：
The demarcation element is tested using the more test equipments, each test equipment is worth to according to what is measured
Relative correction factor, it is described demarcation element precision be higher than every test equipment measuring accuracy；
Using the more test equipments batch testing element under test, using from the value that test equipment is directly read as respectively treating
Survey the measured value of element；
The relative correction factor of the test equipment used by element under test is modified to measured value, is obtained described to be measured
The actual value of element.
In one of the embodiments, it is described that the demarcation element is tested using the more test equipments, root
Include according to the step of relative correction factor for being worth to each test equipment measured：
Standard component is tested using the more test equipments, obtains the relative correction factor of each test equipment.
In one of the embodiments, it is described that standard component is tested using the more test equipments, obtain each
The step of relative correction factor of test equipment is specially：
Standard component is tested using the more test equipments, the standard component is obtained and is set in each test
The standby measured value above measured；
The relative correction factor is worth to using the measured value of the standard component and the standard of the standard component.
In one of the embodiments, the element under test includes wafer, and the test equipment includes tester.
In one of the embodiments, the standard component is precision resistance.
On the other hand, the present invention also proposes a kind of precision consistent correction system of more test equipment batch testings, wraps
Include：
With respect to correction factor acquisition module, for being tested using the more test equipments demarcation element, according to
That measures is worth to the relative correction factor of each test equipment, and every test equipment is provided with demarcation element, the demarcation element
Precision be higher than every test equipment measuring accuracy；
The measured value acquisition module of element under test, will for using the more test equipments batch testing element under test
Measured value from the value that test equipment is directly read as each element under test；
The actual value acquisition module of element under test, for the relative correction factor of the test equipment used by element under test
Measured value is modified, obtains the actual value of the element under test.
In one of the embodiments, the relative correction factor acquisition module includes：
Standard component obtains relative correction factor module, for being surveyed using the more test equipments to standard component
Examination, obtain the relative correction factor of each test equipment.
In one of the embodiments, the standard component obtains relative correction factor module and included：
The measured value acquisition module of standard component, for being tested using the more test equipments standard component,
Obtain the measured value that the standard component measures in each test equipment；
The measured value and standard value of standard component obtain relative correction factor module, for the reality using the standard component
The standard of measured value and the standard component is worth to the relative correction factor.
In one of the embodiments, the element under test includes wafer, and the test equipment includes tester.
In one of the embodiments, the standard component is precision resistance.
The precision consistent correction method and system of above-mentioned more test equipment batch testings, passes through the phase of each test equipment
To correction factor come ensure the precision of element under test process, it is not necessary to one by one adjust test equipment to Standard Machine accuracy standard just
The machining accuracy of element under test is can guarantee that, time saving and energy saving, processing efficiency significantly improves.
Brief description of the drawings
Fig. 1 is the flow chart of the precision consistent correction method of more test equipment batch testings in an embodiment；
Fig. 2 is the flow chart of the precision consistent correction method of more test equipment batch testings in another embodiment；
Fig. 3 is the system block diagram of the precision consistent correction system of more test equipment batch testings in an embodiment；
Fig. 4 is the systematic square frame of the precision consistent correction system of more test equipment batch testings in another embodiment
Figure.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes
The embodiment of description.On the contrary, the purpose for providing these embodiments is made to the disclosure more thorough and comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases
The arbitrary and all combination of the Listed Items of pass.
Referring to Fig. 1, Fig. 1 is the flow of the precision consistent correction method of more test equipment batch testings in an embodiment
Figure.
In the present embodiment, the precision consistent correction method of the more test equipment batch testings includes：
S100, demarcation element is tested using more test equipments, according to each test equipment that is worth to measured
With respect to correction factor, every test equipment is provided with demarcation element, and the precision of the demarcation element is set higher than described every test
Standby measuring accuracy.
Demarcation element is tested respectively using more test equipments, tested according to each test equipment that is worth to measured
The test value that the demarcation element obtains, the test value obtained according to different test equipments, obtain the relative amendment of each test equipment
Coefficient, every test equipment are provided with demarcation element, demarcate measuring accuracy of the precision higher than every test equipment of element.Every
The measuring accuracy of demarcation element in itself in test equipment in one embodiment, makes all in the range of measurement error permission
Measuring accuracy calibration periodically is carried out to demarcation element with the qualified instrument of higher precision, so as to ensure the mark in every test equipment
The measuring accuracy of element in itself is determined all in the range of measurement error permission.In one embodiment, demarcation element refers to be higher than
The standard component of test equipment stability and accuracy, such as measuring resistance, in one of the embodiments, each test equipment
Measuring accuracy than the low 1-2 order of magnitude of demarcation element, such as each test equipment measuring accuracy 0.1%, and demarcate element
Precision is 0.01%.It is in other embodiments or any higher than test equipment stability and the non-standard member of accuracy
Part.
S200, using more test equipment batch testing element under tests, using from the value that test equipment is directly read as each
The measured value of element under test.
Using more test equipment batch testing element under tests, using from the value that test equipment is directly read as each member to be measured
The measured value of part.
S300, the relative correction factor of the test equipment used by element under test are modified to measured value, treated
Survey the actual value of element.
After step S200 measures the measured value of each element under test, the test equipment that is used by the element under test it is relative
Correction factor is modified to measured value, it is possible to the actual value of element under test is obtained, so as to ensure machining accuracy.
The precision consistent correction method of above-mentioned more test equipment batch testings, passes through the relative amendment of each test equipment
Coefficient ensures the actual value of element under test, so as to ensure that precision is processed, it is not necessary to adjust test equipment one by one and arrive Standard Machine
Accuracy standard is it is ensured that the actual processing precision of element under test, and time saving and energy saving, processing efficiency significantly improves.
Referring to Fig. 2, Fig. 2 is the stream of the precision consistent correction method of more test equipment batch testings in another embodiment
Cheng Tu.
In the present embodiment, the precision consistent correction method of the more test equipment batch testings includes：
S101, standard component is tested using more test equipments, obtain standard component and surveyed in each test equipment
The measured value obtained.
Standard component is designed with every test equipment, the precision of standard component is smart higher than the test of more test equipments
Degree, is tested standard component respectively using more test equipments, obtains the reality that standard component measures in each test equipment
Measured value.
S102, the relative amendment system of each test equipment is worth to using the measured value of standard component and the standard of standard component
Number.
Each survey is can be obtained by using the standard value of measured value of the standard component in each test equipment He the standard component
Try the relative correction factor of equipment.In one embodiment, on the basis of the standard value of the standard component, it is with respect to correction factor
The ratio of the standard value of standard component and the measured value of standard component.In one of the embodiments, standard component is accurate electricity
Resistance.
S103, using more test equipment batch testing element under tests, using from the value that test equipment is directly read as each
The measured value of element under test.
Using more test equipment batch testing element under tests, using from the value that test equipment is directly read as each member to be measured
The measured value of part.In one embodiment, element under test includes wafer, and test equipment includes tester.
S104, the relative correction factor of the test equipment used by element under test are modified to measured value, treated
Survey the actual value of element.
The relative correction factor of the test equipment used by element under test is modified to measured value, it is possible to is treated
Survey the actual value of element.In one embodiment, the test equipment that the measured value of element under test uses with element under test it is relative
The product of correction factor is exactly the actual value of element under test.
Referring to Fig. 3, Fig. 3 is the system of the precision consistent correction system of more test equipment batch testings in an embodiment
Block diagram.
In the present embodiment, the precision consistent correction system of the more test equipment batch testings includes：
With respect to correction factor acquisition module 10, for being tested using the more test equipments demarcation element, root
According to the relative correction factor for being worth to each test equipment measured, every test equipment is provided with demarcation element, the demarcation member
The precision of part is higher than the measuring accuracy of every test equipment.
The measured value acquisition module 20 of element under test, for using the more test equipments batch testing element under test,
Using the measured value from the value that test equipment is directly read as each element under test.
The actual value acquisition module 30 of element under test, for the relative amendment system of the test equipment used by element under test
It is several that measured value is modified, obtain the actual value of the element under test.
In one embodiment, include with respect to correction factor acquisition module 10：
Standard component obtains relative correction factor module, for being surveyed using the more test equipments to standard component
Examination, obtain the relative correction factor of each test equipment.
Referring to Fig. 4, Fig. 4 is that the precision consistent correction system of more test equipment batch testings in another embodiment is
System block diagram.
In the present embodiment, the precision consistent correction system of the more test equipment batch testings includes：
With respect to correction factor acquisition module 10, for being tested using the more test equipments demarcation element, root
According to the relative correction factor for being worth to each test equipment measured, the precision of the demarcation element is higher than the more test equipments
Measuring accuracy.
The measured value acquisition module 20 of element under test, for using the more test equipments batch testing element under test,
Using the measured value from the value that test equipment is directly read as each element under test.
The actual value acquisition module 30 of element under test, for the relative amendment system of the test equipment used by element under test
It is several that measured value is modified, obtain the actual value of the element under test.In one embodiment, element under test includes wafer,
Test equipment includes tester.
Include with respect to correction factor acquisition module 10：
The measured value acquisition module 11 of standard component, for being surveyed using the more test equipments to standard component
Examination, obtains the measured value that the standard component measures in each test equipment.In one embodiment, standard component is essence
Cipher telegram hinders.
The measured value and standard value of standard component obtain relative correction factor module 12, for utilizing the standard component
The standard of measured value and the standard component is worth to the relative correction factor of each test equipment.
The precision consistent correction system of above-mentioned more test equipment batch testings, passes through the relative amendment of each test equipment
Coefficient ensures the actual value of element under test, so as to ensure that precision is processed, it is not necessary to adjust test equipment one by one and arrive Standard Machine
Accuracy standard is it is ensured that the actual processing precision of element under test, and time saving and energy saving, processing efficiency significantly improves.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. precision consistent correction method of more test equipment batch testings, it is characterised in that in every test equipment Provided with demarcation element, methods described includes：The demarcation element is tested using the more test equipments, according to the phase for being worth to each test equipment measured To correction factor, the precision of the demarcation element is higher than the measuring accuracy of every test equipment；Using the more test equipments batch testing element under test, using from the value that test equipment is directly read as each member to be measured The measured value of part；The relative correction factor of the test equipment used by element under test is modified to the measured value, is obtained described to be measured The actual value of element.
- 2. the precision consistent correction method of more test equipment batch testings according to claim 1, it is characterised in that It is described that the demarcation element is tested using the more test equipments, according to the phase for being worth to each test equipment measured The step of correction factor, is included：Standard component is tested using the more test equipments, obtains the relative correction factor of each test equipment.
- 3. the precision consistent correction method of more test equipment batch testings according to claim 2, it is characterised in that It is described standard component to be tested using the more test equipments, the step of obtaining the relative correction factor of each test equipment Specially：Standard component is tested using the more test equipments, obtains the standard component in each test equipment The measured value measured；The relative of each test equipment is worth to using the measured value of the standard component and the standard of the standard component to repair Positive coefficient.
- 4. the precision consistent correction method of more test equipment batch testings according to claim 1, it is characterised in that The element under test includes wafer, and the test equipment includes tester.
- 5. the precision consistent correction method of more test equipment batch testings according to claim 2, it is characterised in that The standard component is precision resistance.
- A kind of 6. precision consistent correction system of more test equipment batch testings, it is characterised in that including：With respect to correction factor acquisition module, for being tested using the more test equipments demarcation element, according to measuring The relative correction factor for being worth to each test equipment, every test equipment is provided with demarcation element, the essence of the demarcation element Measuring accuracy of the degree higher than every test equipment；The measured value acquisition module of element under test, will be from survey for using the more test equipments batch testing element under test Measured value of the value that examination equipment is directly read as each element under test；The actual value acquisition module of element under test, for the relative correction factor of test equipment that is used by element under test to reality Measured value is modified, and obtains the actual value of the element under test.
- 7. the precision consistent correction system of more test equipment batch testings according to claim 6, it is characterised in that The relative correction factor acquisition module includes：Standard component obtains relative correction factor module, for being tested using the more test equipments standard component, Obtain the relative correction factor of each test equipment.
- 8. the precision consistent correction system of more test equipment batch testings according to claim 7, it is characterised in that The standard component, which obtains relative correction factor module, to be included：The measured value acquisition module of standard component, for being tested using the more test equipments standard component, obtain The measured value that the standard component measures in each test equipment；The measured value and standard value of standard component obtain relative correction factor module, for the measured value using the standard component The relative correction factor of each test equipment is worth to the standard of the standard component.
- 9. the precision consistent correction system of more test equipment batch testings according to claim 6, it is characterised in that The element under test includes wafer, and the test equipment includes tester.
- 10. the precision consistent correction system of more test equipment batch testings according to claim 7, its feature exist In the standard component is precision resistance.
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| CN201710775817.XA CN107706121B (en) | 2017-08-31 | 2017-08-31 | Precision consistency correction method and system for batch test of multiple test devices |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109186940A (en) * | 2018-08-01 | 2019-01-11 | 昆山丘钛微电子科技有限公司 | The monitoring method of measuring accuracy and the monitoring device of measuring accuracy |
| CN112289698A (en) * | 2020-10-28 | 2021-01-29 | 天合光能股份有限公司 | Calibration method of sliced battery standard slice |
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| JP5458817B2 (en) * | 2009-11-12 | 2014-04-02 | 株式会社村田製作所 | Method of correcting electrical characteristic measurement error of electronic component and electronic component characteristic measuring apparatus |
| CN105589051A (en) * | 2014-11-18 | 2016-05-18 | 德信东源电力技术服务（北京）有限公司 | Method and device for calibrating current and method for detecting current |
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| JPH0661749A (en) * | 1992-08-10 | 1994-03-04 | Yokogawa Electric Corp | Correction coefficient deciding method |
| CN1490629A (en) * | 2001-12-10 | 2004-04-21 | ������������ʽ���� | Correcting method, quality checking method for electronic component and characteristic measuring system |
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| CN112289698A (en) * | 2020-10-28 | 2021-01-29 | 天合光能股份有限公司 | Calibration method of sliced battery standard slice |
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|---|---|
| CN107706121B (en) | 2020-05-26 |
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