CN107703700A - Terminal device, circuit board assemblies, flash lamp component and its manufacture method - Google Patents
Terminal device, circuit board assemblies, flash lamp component and its manufacture method Download PDFInfo
- Publication number
- CN107703700A CN107703700A CN201710826266.5A CN201710826266A CN107703700A CN 107703700 A CN107703700 A CN 107703700A CN 201710826266 A CN201710826266 A CN 201710826266A CN 107703700 A CN107703700 A CN 107703700A
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- Prior art keywords
- heat sink
- flash
- fpc plates
- lamp components
- light lamp
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- 238000000034 method Methods 0.000 title claims abstract description 28
- 230000000712 assembly Effects 0.000 title claims abstract description 15
- 238000000429 assembly Methods 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 239000000463 material Substances 0.000 claims description 51
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- 125000004122 cyclic group Chemical group 0.000 claims description 5
- 238000010422 painting Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 4
- 239000004519 grease Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000036244 malformation Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
This application provides a kind of terminal device, circuit board assemblies, flash lamp component and its manufacture method, the flash lamp component includes：FPC plates, flash of light lamp components, the first heat sink and the second heat sink；Flash of light lamp components are attached at a side surface of FPC plates, and are electrically connected with FPC plates；First heat sink is attached at the same side surface of FPC plates with flash of light lamp components, and neighbouring flash of light lamp components are set；Second heat sink is located at another side surface of FPC plates, and is set with different both sides face of the flash of light lamp components in FPC plates；First heat sink and second heat sink are used to radiate to flash of light lamp components.The flash lamp component, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve structure design flexibility of the flash of light lamp components in terminal device；On the other hand using the stiffening plate of FPC plates both sides be used as heat sink, can greatly improve flash of light lamp components radiating efficiency, extension glisten lamp components service life.
Description
Technical field
The present invention relates to the technical field of terminal device flexible circuit board assembly structure, is specifically related to a kind of terminal and sets
Standby, circuit board assemblies, flash lamp component and its manufacture method.
Background technology
Necessary functions structure of the flash lamp as terminal devices such as mobile phones, in the prior art, flash of light lamp components are general all
It is integrally fixed above main PCB plate, because main PCB plate is hardboard, this results in flash of light lamp components and the Z-direction of cell phone rear cover is (aobvious
The vertical direction of display screen) gap ratio is relatively fixed, and design engineer cannot flexibly set when being designed to flash of light lamp components
Its position, and also it is unfavorable for reducing the design of terminal device integral thickness；Further, since flash of light lamp components are fixed on main PCB plate,
Cause its heat dispersion poor, and then influence the service life of flash of light lamp components.
The content of the invention
On the one hand the embodiment of the present application provides a kind of flash lamp component for terminal device, the flash lamp component bag
Include：
FPC plates；
Glisten lamp components, is attached at a side surface of the FPC plates, and be electrically connected with the FPC plates；
First heat sink, the same side surface of the FPC plates, and the neighbouring flash of light are attached at the flash of light lamp components
Lamp components are set；
Second heat sink, located at another side surface of the FPC plates, and with the flash of light lamp components in the FPC plates
Different both sides face is set；
First heat sink and second heat sink are used to radiate to the flash of light lamp components.
On the other hand the embodiment of the present application also provides a kind of manufacture method of the flash lamp component for terminal device, described
Method includes：
One FPC plates are provided；
Be sticked flash of light lamp components on the surface of the FPC plates side, and makes the flash of light lamp components and the FPC plates electrical
Connection；
It is sticked the first heat sink in the FPC plate surfaces for the flash of light lamp components that are sticked, and makes first heat sink neighbouring
The flash of light lamp components are set；
Be sticked the second heat sink in another side surface of the FPC plates, and makes second heat sink and the flash lamp
Device is set in the different both sides face of the FPC plates；
Wherein, first heat sink and second heat sink are used to radiate to the flash of light lamp components.
The embodiment of the present application also provides a kind of circuit board assemblies for terminal device, and the circuit board assemblies include master control
Flash lamp component any one of circuit board and above-described embodiment, the main control board and the flash lamp component
FPC plates connect, to realize the control to the lamp components that glistened in the flash lamp component.
Further, the embodiment of the present application provides a kind of terminal device again, and the terminal device is included in above-described embodiment
Described circuit board assemblies.
The flash lamp component that the embodiment of the present application provides, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve flash of light
Structure design flexibility of the lamp components in terminal device；On the other hand heat sink, Ke Yi great are used as by the use of the stiffening plate of FPC plates
Width improves the radiating efficiency of flash of light lamp components, extends the service life of flash of light lamp components；In addition, by being set in FPC plates both sides
Heat sink, it can further improve the heat-sinking capability to the lamp components that glisten.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the overall structure diagram for the embodiment of flash lamp component one that the application is used for terminal device；
Fig. 2 is the side view of flash lamp component in Fig. 1 embodiments；
Fig. 3 is the structure schematic side view for another embodiment of flash lamp component that the application is used for terminal device；
Fig. 4 is the structure schematic elevation view of flash lamp component in Fig. 3 embodiments；
Fig. 5 is the structure schematic side view for the another embodiment of flash lamp component that the application is used for terminal device；
Fig. 6 is the structure schematic elevation view of flash lamp component in Fig. 5 embodiments；
Fig. 7 is the structure schematic elevation view for the flash lamp component another embodiment that the application is used for terminal device；
Fig. 8 is the overall structure diagram for the flash lamp component a further embodiment that the application is used for terminal device；
Fig. 9 is the structure schematic side view of flash lamp component in Fig. 8 embodiments；
Figure 10 is the structure schematic elevation view of flash lamp component in Fig. 8 embodiments；
Figure 11 is that the application is used for the flash lamp component of terminal device and the structure schematic elevation view of another embodiment；
Figure 12 is that the application is used for the flash lamp component of terminal device and the overall structure diagram of a further embodiment；
Figure 13 is the structure schematic side view of flash lamp component in Figure 12 embodiments；
Figure 14 is the structure schematic side view for the flash lamp component also another embodiment that the application is used for terminal device；
Figure 15 is the structure schematic side view that heat sink material part covers the second heat sink；
Figure 16 is the structure schematic side view for the also another embodiment of flash lamp component that the application is used for terminal device；
Figure 17 is the structure schematic side view for the flash lamp component yet another embodiment that the application is used for terminal device；
Figure 18 is the structural representation that heat sink material connects from FPC plates both sides in Figure 17；
Figure 19 is the structure schematic side view for the flash lamp component a further embodiment that the application is used for terminal device；
Figure 20 is the structural representation that the first heat sink is also provided with heat sink material in Figure 19 embodiments；
Figure 21 is the schematic flow sheet of the embodiment of manufacture method one for the flash lamp component that the application is used for terminal device；
Figure 22 is the schematic flow sheet of another embodiment of manufacture method for the flash lamp component that the application is used for terminal device；
Figure 23 is the structural representation of the embodiment of the application circuit board assemblies one；
Figure 24 is the structural representation of the embodiment of the application terminal device one.
Embodiment
With reference to the accompanying drawings and examples, the present invention is described in further detail.It is emphasized that following implement
Example is merely to illustrate the present invention, but the scope of the present invention is not defined.Likewise, following examples are only the portion of the present invention
Point embodiment and not all embodiments, the institute that those of ordinary skill in the art are obtained under the premise of creative work is not made
There are other embodiments, belong to the scope of protection of the invention.
Term " first " in the present invention, " second ", " the 3rd " are only used for describing purpose, and it is not intended that instruction or dark
Show relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first ", " second ", " are defined
At least one this feature can be expressed or be implicitly included to three " feature.In description of the invention, " multiple " be meant that to
It is few two, such as two, three etc., unless otherwise specifically defined.The directional instruction of institute is (all in the embodiment of the present invention
Such as up, down, left, right, before and after ...) it is only used for explaining the phase under a certain particular pose (as shown in drawings) between each part
To position relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as comprising
The step of process of series of steps or unit, method, system, product or equipment are not limited to list or unit, and
It is alternatively also to include the step of not listing or unit, or alternatively also includes for these processes, method, product or equipment
Intrinsic other steps or unit.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments
In at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
Embodiment 1
Also referring to Fig. 1 and Fig. 2, Fig. 1 is the entirety for the embodiment of flash lamp component one that the application is used for terminal device
Structural representation, Fig. 2 are the side views of flash lamp component in Fig. 1 embodiments.It should be noted that terminal signified in the present invention
Equipment includes mobile phone, tablet personal computer, notebook computer and wearable device etc..In this embodiment, flash lamp component includes
FPC plates 110, flash of light lamp components 120 and heat sink 130.FPC：Flexible PCB, Flexible Printed Circuit's
Abbreviation FPC；Usually there is height reliability, excellent pliability to be a kind of made of base material using polyimides or polyester film
Printed circuit board (PCB), there is the characteristics of high Distribution density, in light weight, thickness of thin, good bending property.
Specifically, flash of light lamp components 120 are attached at a side surface of FPC plates 110, and are electrically connected with FPC plates；Radiating
Plate 130 is attached at another side surface of FPC plates 110, and is set with flash of light lamp components 120 in the different both sides face of FPC plates 110
Put, heat sink 130 is used to radiate to flash of light lamp components 120.
Alternatively, the material of the heat sink 130 can be steel, and heat sink 130 is the stiffening plate of FPC plates 110, that is, is radiated
Plate 130 can be the steel stiffening plate of FPC plates 110, and technical scheme can be the heat sink that is individually sticked on FPC plates 110
Or by the use of the steel stiffening plate of FPC plates 110 as heat sink, and the latter is then not required to the heat sink that is individually sticked again, it is possible to reduce system
Journey, reduce production cost.
Still optionally further, in the present embodiment heat sink 130 and FPC plates 110 fitting area (namely heat sink 130
Area) it is less than the area of FPC plates 110, and more than the fitting area of flash of light lamp components 120 and FPC plates 110.Such structure (radiating
The area of plate 130 is more than the fitting area of flash of light lamp components 120 and FPC plates 110) it can further improve flash of light lamp components 120
Radiating efficiency.
In addition, it is necessary to explanation, does not limit only include in diagram in other embodiments, in each flash lamp component
Flash of light lamp components 120 and one block of heat sink 130, can also be that multiple flash of light lamp components 120 are set on same FPC plates
And the structure of multiple heat sinks 130, and same heat sink 130 can correspond to multiple flash of light lamp components 120 and set, above-mentioned knot
Structure variant embodiment is in the range of the understanding of those skilled in the art, and here is omitted.
The flash lamp component that the present embodiment provides, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve flash of light modulator
Structure design flexibility of the part in terminal device；On the other hand by the use of the stiffening plate of FPC plates as heat sink, can significantly carry
The radiating efficiency of high flash lamp components, extend the service life of flash of light lamp components.
Embodiment 2
Referring to Fig. 3, the structure side that Fig. 3 is another embodiment of flash lamp component that the application is used for terminal device regards signal
Figure, unlike a upper embodiment, heat sink material 140 is coated with the heat sink 130 of the flash lamp component in the present embodiment,
For improving radiating efficiency.Wherein, the heat sink material 140 can be heat dissipating silicone grease.
Referring to Fig. 4, Fig. 4 is the structure schematic elevation view of flash lamp component in Fig. 3 embodiments；In this embodiment, dissipate
Hot material 140 is completely covered heat sink 130 and set.This kind of setting structure, radiating efficiency on the one hand can be further improved, it is another
The setting of heat sink 130, which is completely covered, in aspect heat sink material 140 can prevent heat sink 130 from getting rusty (general heat sink is steel plate).
The flash lamp component that the present embodiment provides, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve flash of light modulator
Structure design flexibility of the part in terminal device；On the other hand by the use of the stiffening plate of FPC plates as heat sink, can significantly carry
The radiating efficiency of high flash lamp components, extend the service life of flash of light lamp components；Further, also by being coated with heat sink
Heat sink material, further strengthen the radiating efficiency of heat sink.
Embodiment 3
Also referring to Fig. 5 and Fig. 6, Fig. 5 is the knot for the another embodiment of flash lamp component that the application is used for terminal device
Structure schematic side view, Fig. 6 are the structure schematic elevation view of flash lamp component in Fig. 5 embodiments, the embodiment and a upper embodiment
Unlike, heat sink material 140 is covered on a part of position of heat sink 130, i.e., heat sink material 140 from heat sink 130 one
The setting structure that side covers to it.
Embodiment 4
Referring to Fig. 7, the structure that Fig. 7 is the flash lamp component another embodiment that the application is used for terminal device faces signal
Scheme, in the embodiment, heat sink material 140 is arranged to the structure type of two, is located at from diverse location lid on heat sink 130.When
So, in other embodiments heat sink material 140 can also be other structures and the mulching method of heat sink 130, it is no longer detailed herein
State.
Wherein, the flash lamp component in embodiment 3,4, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve flash of light
Structure design flexibility of the lamp components in terminal device；On the other hand heat sink, Ke Yi great are used as by the use of the stiffening plate of FPC plates
Width improves the radiating efficiency of flash of light lamp components, extends the service life of flash of light lamp components；Further, also by heat sink
The heat sink material of the area coverage of different structure one is coated with, while heat sink radiating efficiency is ensured, has taken into account heat sink material
Cost Problems.
Embodiment 5
Also referring to Fig. 8-Figure 10, Fig. 8 is the whole of the flash lamp component a further embodiment that the application is used for terminal device
Body structural representation, Fig. 9 are the structure schematic side views of flash lamp component in Fig. 8 embodiments, and Figure 10 is glistened in Fig. 8 embodiments
The structure schematic elevation view of lamp component.Flash lamp component in the embodiment includes：FPC plates 110, flash of light lamp components 120, first
The heat sink 132 of heat sink 131 and second.
Specifically, flash of light lamp components 120 are attached at a side surface of FPC plates 110, and are electrically connected with FPC plates 110；
First heat sink 131 is attached at the same side surface of FPC plates 110 with flash of light lamp components 120, and neighbouring flash of light lamp components 120 are set
Put；And the second heat sink 132 is then located at another side surface of FPC plates, and with flash of light lamp components 120 in the different both sides of FPC plates
Face is set；First, second heat sink (131,132) is used to radiate to flash of light lamp components 120.
Optionally as well, the material of first, second heat sink (131,132) can be steel, and first, second heat sink
(131,132) can be the stiffening plate of FPC plates 110, i.e. first, second heat sink (131,132) is the steel reinforcement of FPC plates 110
Plate, technical scheme can be individually be sticked on FPC plates 110 first, second heat sink or utilization FPC plates 110
Steel stiffening plate is as first, second heat sink, and the latter is then not required to the heat sink that is individually sticked again, it is possible to reduce processing procedure, reduces life
Produce cost.
Alternatively, it is also possible to one of wherein be the steel stiffening plate of FPC plates 110 for first, second heat sink, and other one
It is the independent cooling plate structure on the FPC plates 110 being sticked.Please continue to refer to Figure 10, the first heat sink 131 in the embodiment is
One list structure, and neighbouring flash of light lamp components 120 are set.
Explanation is needed also exist for, does not limit only include in diagram in other embodiments, in each flash lamp component
Flash of light lamp components 120 and one piece of first, second heat sink (131,132), can also be set on same FPC plates it is more
The structure of individual flash of light lamp components 120 and multiple first, second heat sinks (131,132), and same heat sink can be correspondingly more
Individual flash of light lamp components 120 are set, and above-mentioned malformation embodiment is in the range of the understanding of those skilled in the art, herein also not
Repeat again.
The flash lamp component that the present embodiment provides, by setting heat sink in FPC plates both sides, can further it improve to dodging
The heat-sinking capability of optical modulator part, extend the service life of flash of light lamp components.
Embodiment 6
Figure 11 is referred to, Figure 11 is that the application is used for the flash lamp component of terminal device and the structure of another embodiment is faced
Schematic diagram, as different from Example 5, the first heat sink 131 in the present embodiment are U-shape structure, and flash of light lamp components 120 are located at
The middle part of first heat sink 131 of U-shape structure, that is, the lamp components 120 that glisten are by the face ring of the first heat sink 131 3 around the embodiment
In flash lamp component, by setting the first cooling plate structure of U-shape structure, can improve the first heat sink to glisten lamp components
120 heat dissipation.
Embodiment 7
Also referring to Figure 12 and 13, Figure 12 is the flash lamp component and a further embodiment that the application is used for terminal device
Overall structure diagram, Figure 13 are the structure schematic side views of flash lamp component in Figure 12 embodiments；First in the present embodiment
Heat sink 131 is cyclic structure, and flash of light lamp components 120 are located at the middle part of the first heat sink 131 of cyclic structure, i.e. cyclic structure
The first heat sink around it is described flash of light lamp components 120 set.
The flash lamp component of offer in the embodiment, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve flash of light
Structure design flexibility of the lamp components in terminal device；On the other hand heat sink, Ke Yi great are used as by the use of the stiffening plate of FPC plates
Width improves the radiating efficiency of flash of light lamp components, extends the service life of flash of light lamp components；Further, also by setting ring-type knot
First cooling plate structure of structure, heat dissipation of first heat sink to the lamp components that glisten can be improved.
Embodiment 8
Figure 14 is referred to, Figure 14 is that the structure side for the flash lamp component also another embodiment that the application is used for terminal device regards
Schematic diagram, in this embodiment, heat sink material 140 is coated with the second heat sink 132 of flash lamp component, is radiated for improving
Efficiency.Wherein, the heat sink material 140 can be heat dissipating silicone grease.Alternatively, the heat sink material 140, which can be covered all, (specifically please
Refering to Fig. 4) or the second heat sink 132 of part covering, Figure 15 is referred to, Figure 15 is that heat sink material part covers the second heat sink
Structure schematic side view.Showing for the structure setting relation of the heat sink material and heat sink in Fig. 6, Fig. 7 can also be referred to together
It is intended to.
Embodiment 9
Figure 16 is referred to, Figure 16 is that the structure side for the also another embodiment of flash lamp component that the application is used for terminal device regards
Schematic diagram, the embodiment as different from Example 8, radiating material have been coated with the first heat sink 131 and the second heat sink 132
Material 140, and the heat sink material 140 being coated with the first heat sink 131 and the second heat sink 132 is at least mutual from the side of FPC plates
Connection, it is overall to form a heat sink material 140.This kind of setting structure is on the one hand by the first heat sink 131 and the second radiating
The heat sink material 140 being coated with plate 132 improves radiating efficiency, on the other hand by the first heat sink 131 and the second heat sink
The heat sink material 140 being coated with 132 is interconnected, and can make the heat between the first heat sink 131 and the second heat sink 132
It is quick to transmit, and then further improve radiating efficiency.
Embodiment 10
Figure 17 is referred to, Figure 17 is that the structure side for the flash lamp component yet another embodiment that the application is used for terminal device regards
Schematic diagram, in this embodiment, the second heat sink 132 and the first heat sink 131 extend from phase the same side edge of FPC plates 110
The surface for going out FPC plates 110 is set, so as to form gap 303, heat sink material between the first heat sink 131 and the second heat sink 132
140 in gap 303 between the first heat sink 131 and the second heat sink 132, alternatively, located at the first heat sink 131 with
Heat sink material is located on the second heat sink 132 and the first heat sink 131 with applying in gap 303 between second heat sink 132
Heat sink material is interconnected.
Wherein, in Figure 17 embodiments, it is interconnected between the heat sink material 140 of the side of FPC plates 110, refers to Figure 18, is schemed
18 be the structural representation that heat sink material connects from FPC plates both sides in Figure 17, in Figure 18 embodiments, first, second heat sink
The heat sink material 140 being coated with (131,132) is connected together from FPC plates both sides.
Embodiment 11
Figure 19 is referred to, Figure 19 is the structure side for the flash lamp component a further embodiment that the application is used for terminal device depending on showing
It is intended to, in this embodiment, the second heat sink 132 and the first heat sink 131 extend FPC plates from the both sides edge of FPC plates 110
110 surface is set, so that between being formed respectively in the both sides of FPC plates 110 between the first heat sink 131 and the second heat sink 132
Gap 303, heat sink material 140 are located at the in gap 303 between the first heat sink 131 and the second heat sink 132, and with painting
Heat sink material on two heat sinks 132 is interconnected.
Further, Figure 20 is referred to, Figure 20 is the structure that the first heat sink is also provided with heat sink material in Figure 19 embodiments
Schematic diagram, in this embodiment, on the first heat sink 131, the second heat sink 132 and the first heat sink 131 and second radiates
Heat sink material 140 is coated with gap 303 between plate 132.Alternatively, the second heat sink is completely covered in heat sink material 140
132 and part cover the first heat sink 131, painting is located at the first heat sink 131, on the second heat sink 132 and the first heat sink
131 and the second gap 303 between heat sink 132 in heat sink material be interconnected.
The flash lamp component provided in the embodiment, by setting the heat sink structure bigger than FPC plate, so that heat sink
Gap is formed between (the first heat sink and the second heat sink that are located at different surfaces), and heat sink material is filled in gap, can
The thermal resistance between front heat sink (the first heat sink) and reverse side heat sink (the second heat sink) is greatly reduced, it is fast so as to be advantageous to
Speed radiating, further extend the service life of flash of light lamp components.
Embodiment of the method 1
Figure 21 is referred to, Figure 21 is the stream of the embodiment of manufacture method one for the flash lamp component that the application is used for terminal device
Journey schematic diagram, this method include but is not limited to following steps.
Step S110, there is provided a FPC plates.
Step S120, be sticked flash of light lamp components on the surface of FPC plates side, and makes flash of light lamp components and FPC plates electricity
Property connection.
Step S130, be sticked heat sink on the surface of FPC plate opposite sides, and makes heat sink with flash of light lamp components in FPC plates
Different both sides face set.
The material of the heat sink can be steel, and heat sink can be the stiffening plate of FPC plates, i.e. heat sink can be FPC
The steel stiffening plate of plate, technical scheme can be that the heat sink that is individually sticked on FPC plates can also be steel using FPC plates
Stiffening plate is as heat sink.Wherein, heat sink is used to radiate to flash of light lamp components.
Alternatively, be sticked on the surface of FPC plates heat sink the step of after also include heat sink material is coated with heat sink
The step of.It please join on technical characteristics such as the structure type of each part in flash lamp component in this method and link position relations
The associated description of above-described embodiment is read, here is omitted.
The flash lamp component preparation method that the present embodiment provides, on the one hand will glisten lamp components and the hardened conjunctions of FPC, improve
Structure design flexibility of the flash of light lamp components in terminal device；On the other hand, can by the use of the stiffening plate of FPC plates as heat sink
To greatly improve the radiating efficiency of flash of light lamp components, extend the service life of flash of light lamp components；Further, also by radiating
Heat sink material is coated with plate, further strengthens the radiating efficiency of heat sink.
Embodiment of the method 2
Figure 22 is referred to, Figure 22 is another embodiment of manufacture method for the flash lamp component that the application is used for terminal device
Schematic flow sheet, this method include but is not limited to following steps.
Step S210, there is provided a FPC plates.
Step S220, be sticked flash of light lamp components on the surface of FPC plates side, and flash of light lamp components is electrically connected with FPC plates
Connect.
Step S230, it is sticked the first heat sink in the FPC plate surfaces for the flash of light lamp components that are sticked, and makes the first heat sink neighbouring
The lamp components that glisten are set.
Step S240, be sticked the second heat sink in another side surface of FPC plates, and makes the second heat sink and flash of light lamp components
Set in the different both sides face of FPC plates.
Optionally as well, the material of first, second heat sink can be steel, and first, second heat sink can be FPC
The stiffening plate of plate, i.e. first, second heat sink are the steel stiffening plate of FPC plates, and technical scheme can be single on FPC plates
Solely be sticked first, second heat sink or by the use of FPC plates steel stiffening plate as first, second heat sink, and the latter is then not required to
Individually be sticked heat sink again, it is possible to reduce processing procedure, reduces production cost.Alternatively, it is also possible to for first, second heat sink it is therein
One is the steel stiffening plate of FPC plates, and one is the independent cooling plate structure on the FPC plates being sticked in addition.Wherein, first,
Two heat sinks are used to radiate to flash of light lamp components.
In addition, method is additionally may included in the upper coating radiating of one of first heat sink and the second heat sink or both
The step of material.Likewise, on the structure type of each part in flash lamp component in this method and link position relation etc.
Technical characteristic refers to the associated description of above-described embodiment, is also not repeated herein.
The flash lamp component preparation method that the present embodiment provides, can be further by setting heat sink in FPC plates both sides
The heat-sinking capability to the lamp components that glisten is improved, extends the service life of flash of light lamp components.
Further, the embodiment of the present application also provides a kind of circuit board assemblies for terminal device, refers to Figure 23, figure
23 be the structural representation of the embodiment of the application circuit board assemblies one, the circuit board assemblies 10 include main control board 200 and
Flash lamp component 100 any one of above-described embodiment, the FPC plates of main control board 200 and flash lamp component 100 connect
Connect, to realize the control to the lamp components that glistened in flash lamp component 100., please on the specific structural features of flash lamp component 100
Refering to the associated description of above-mentioned flash lamp component embodiment, no longer it is described in detail herein.
In addition, the embodiment of the present application also provides a kind of terminal device, Figure 24 is referred to, Figure 24 is the application terminal device one
The structural representation of embodiment, the terminal device can be mobile phone, tablet personal computer, notebook computer and wearable device etc.,
The present embodiment is illustrated by taking mobile phone as an example.The terminal device can include screen 241, Cao Zuoanjian 242, housing 243 and above-mentioned
Circuit board assemblies (be located at enclosure interior, therefore do not indicated in figure) in embodiment.
On the one hand the terminal device that the present embodiment provides, its flash lamp component by flash of light lamp components and the hardened conjunctions of FPC, improve
Structure design flexibilities of the flash of light lamp components in terminal device；On the other hand by the use of the stiffening plate of FPC plates as heat sink,
The radiating efficiency of flash of light lamp components can be greatly improved, extends the service life of flash of light lamp components.
The section Example of the present invention is the foregoing is only, is not thereby limited the scope of the invention, every utilization
The equivalent device or equivalent flow conversion that description of the invention and accompanying drawing content are made, or directly or indirectly it is used in other correlations
Technical field, be included within the scope of the present invention.
Claims (10)
1. a kind of flash lamp component for terminal device, it is characterised in that the flash lamp component includes：
FPC plates；
Glisten lamp components, is attached at a side surface of the FPC plates, and be electrically connected with the FPC plates；
First heat sink, the same side surface of the FPC plates, and the neighbouring flash of light modulator are attached at the flash of light lamp components
Part is set；
Second heat sink, located at another side surface of the FPC plates, and with the flash of light lamp components in the different of the FPC plates
Both sides face is set；
First heat sink and second heat sink are used to radiate to the flash of light lamp components.
2. flash lamp component according to claim 1, it is characterised in that first heat sink is cyclic structure, described
First heat sink of cyclic structure is set around the flash of light lamp components.
3. flash lamp component according to claim 1, it is characterised in that second heat sink and/or it is described first dissipate
Hot plate is the steel stiffening plate of the FPC plates.
4. flash lamp component according to claim 1, it is characterised in that second heat sink and/or it is described first dissipate
Heat sink material is coated with hot plate, for improving radiating efficiency.
5. flash lamp component according to claim 4, it is characterised in that second heat sink and first heat sink
The surface for extending the FPC plates from least phase the same side edge of the FPC plates is set, so that first heat sink and institute
State and gap formed between the second heat sink, on first heat sink, second heat sink and first heat sink with
Heat sink material is coated with gap between second heat sink.
6. flash lamp component according to claim 5, it is characterised in that the heat sink material is completely covered described second and dissipated
Hot plate simultaneously partly covers first heat sink, and painting is located at first heat sink, on second heat sink and described the
The heat sink material in gap between one heat sink and second heat sink is interconnected.
7. the manufacture method of a kind of flash lamp component for terminal device, it is characterised in that methods described includes：
One FPC plates are provided；
Be sticked flash of light lamp components on the surface of the FPC plates side, and the flash of light lamp components is electrically connected with the FPC plates
Connect；
It is sticked the first heat sink in the FPC plate surfaces for the flash of light lamp components that are sticked, and makes first heat sink neighbouring described
The lamp components that glisten are set；
Be sticked the second heat sink in another side surface of the FPC plates, and makes second heat sink and the flash of light lamp components
Set in the different both sides face of the FPC plates；
Wherein, first heat sink and second heat sink are used to radiate to the flash of light lamp components.
8. according to the method for claim 7, it is characterised in that methods described be additionally included in first heat sink and/or
The step of heat sink material is coated with second heat sink.
A kind of 9. circuit board assemblies for terminal device, it is characterised in that the circuit board assemblies include main control board with
And the flash lamp component described in claim any one of 1-6, the FPC plates of the main control board and the flash lamp component connect
Connect, to realize the control to the lamp components that glistened in the flash lamp component.
10. a kind of terminal device, it is characterised in that the terminal device includes the circuit board assemblies described in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710826266.5A CN107703700A (en) | 2017-09-13 | 2017-09-13 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710826266.5A CN107703700A (en) | 2017-09-13 | 2017-09-13 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107703700A true CN107703700A (en) | 2018-02-16 |
Family
ID=61172396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710826266.5A Pending CN107703700A (en) | 2017-09-13 | 2017-09-13 | Terminal device, circuit board assemblies, flash lamp component and its manufacture method |
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| Country | Link |
|---|---|
| CN (1) | CN107703700A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030202328A1 (en) * | 2002-04-25 | 2003-10-30 | Deeney Jeffrey L. | Wrap- around cooling arrangement for printed circuit board |
| CN201601938U (en) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | Radiating device and circuit board thereof |
| CN102123561A (en) * | 2010-04-19 | 2011-07-13 | 苹果公司 | Electronic sub-component used for electronic device |
| CN202720432U (en) * | 2012-09-07 | 2013-02-06 | 广东欧珀移动通信有限公司 | Flash lamp mounting structure |
| CN203748098U (en) * | 2013-11-06 | 2014-07-30 | 福建联迪商用设备有限公司 | Flexible circuit board structure improving heat dissipation performance of flashlight of camera |
| CN204089960U (en) * | 2014-06-30 | 2015-01-07 | 惠州市泰宇光电有限公司 | Mobile phone camera module |
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN105388681A (en) * | 2015-12-28 | 2016-03-09 | 魅族科技（中国）有限公司 | Flashlight module and terminal |
| CN106842775A (en) * | 2017-02-20 | 2017-06-13 | 维沃移动通信有限公司 | A kind of electronic equipment |
-
2017
- 2017-09-13 CN CN201710826266.5A patent/CN107703700A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030202328A1 (en) * | 2002-04-25 | 2003-10-30 | Deeney Jeffrey L. | Wrap- around cooling arrangement for printed circuit board |
| CN201601938U (en) * | 2009-12-30 | 2010-10-06 | 上海研祥智能科技有限公司 | Radiating device and circuit board thereof |
| CN102123561A (en) * | 2010-04-19 | 2011-07-13 | 苹果公司 | Electronic sub-component used for electronic device |
| CN202720432U (en) * | 2012-09-07 | 2013-02-06 | 广东欧珀移动通信有限公司 | Flash lamp mounting structure |
| CN203748098U (en) * | 2013-11-06 | 2014-07-30 | 福建联迪商用设备有限公司 | Flexible circuit board structure improving heat dissipation performance of flashlight of camera |
| CN204089960U (en) * | 2014-06-30 | 2015-01-07 | 惠州市泰宇光电有限公司 | Mobile phone camera module |
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN105388681A (en) * | 2015-12-28 | 2016-03-09 | 魅族科技（中国）有限公司 | Flashlight module and terminal |
| CN106842775A (en) * | 2017-02-20 | 2017-06-13 | 维沃移动通信有限公司 | A kind of electronic equipment |
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Application publication date: 20180216 |