CN107703662A - Display base plate and preparation method thereof - Google Patents
Display base plate and preparation method thereof Download PDFInfo
- Publication number
- CN107703662A CN107703662A CN201710884907.2A CN201710884907A CN107703662A CN 107703662 A CN107703662 A CN 107703662A CN 201710884907 A CN201710884907 A CN 201710884907A CN 107703662 A CN107703662 A CN 107703662A
- Authority
- CN
- China
- Prior art keywords
- metal level
- alignment mark
- base plate
- display area
- transparency electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A kind of display base plate of the application and preparation method thereof.The display base plate, including：Underlay substrate, including multiple effective display area and wiring region, the wiring region are arranged at around the effective display area, and multiple active switches are arranged at the effective display area；And conductive pad, the wiring region is arranged at around the effective display area, wherein, formed with alignment mark in the conductive pad.Alignment mark is integrated into the conductive pad on display base plate by the application, therefore without the wiring region otherwise designed alignment mark in effective coverage periphery, avoid the wiring space for tying up periphery.
Description
Technical field
The application is related to display technology field, more particularly to a kind of display base plate and preparation method thereof.
Background technology
In the manufacturing process of display panel, all need to carry out display base plate detection.Measured in order to facilitate display base plate, be right
The operation such as position and inspection, the mark of some identifications can be placed around display base plate in design, opened a way to enter walking line/
When short-circuit (Open/Short) is checked, so that detection device captures.Contraposition of the detection device meeting launching electronics beam to display base plate
Marked region, metallic region in alignment mark region can absorption detecting equipment send electronically form electric current, but mark
Electrons stay, and detection device determines whether correctly to align by sensory current.
However, alignment mark is generally designed in chip (Chip) periphery of display panel, and it is to be uniformly distributed setting,
Need to occupy certain space, so being unfavorable for the wiring of periphery.
The content of the invention
In order to solve the above-mentioned technical problem, the purpose of the application is, there is provided a kind of display base plate and preparation method thereof, can
Not change the premise of existing production procedure significantly, conductive pad alignment mark being integrated on display base plate.
The purpose of the application and solves its technical problem using following technical scheme to realize.Itd is proposed according to the application
A kind of display base plate, the display base plate includes：Underlay substrate, including multiple effective display area and wiring region, the wiring
Area is arranged at around the effective display area, and multiple active switches are arranged at the effective display area；And conductive pad, positioned at institute
State around effective display area and be arranged at the wiring region, wherein, formed with alignment mark in the conductive pad.
The application, which solves its technical problem, can also be applied to the following technical measures to achieve further.
In the embodiment of the application, the alignment mark includes L marks, F marks, cross mark or rice word mark.
In the embodiment of the application, the shape width of the cross section of the alignment mark is 50um.
In the embodiment of the application, the alignment mark is formed in a manner of hollow out among the conductive pad.
In the embodiment of the application, described conductive pad includes：Metal level, it is arranged at the wiring of the underlay substrate
Area and around the effective display area, the metal level is formed with through hole；Insulating barrier, layer are located on the layer on surface of metal
Circumferential edges；Transparency electrode, it is arranged on the metal level and the insulating barrier, and in the through hole, the transparency electrode connects
Lead to the metal level；Alignment mark, pattern the metal level and formed with the transparency electrode.
In the embodiment of the application, described conductive pad is square or circular.
Time purpose of the application is a kind of display base plate, and it includes：Underlay substrate, including effective display area and wiring
Area, the wiring region are arranged at around the effective display area, and multiple active switches are arranged at the effective display area；It is multiple to lead
Electrical pad, the wiring region is arranged at around the effective display area, each conductive pad includes：Metal level, it is arranged at institute
State the wiring region of underlay substrate and around the effective display area, the metal level is formed with through hole；Insulating barrier, layer ring are set
In the layer on surface of metal circumferential edges；Transparency electrode, it is arranged on the metal level and the insulating barrier, and the through hole
In, the transparency electrode connects the metal level；Alignment mark, pattern the metal level and formed with the transparency electrode；
Wherein, the alignment mark of the multiple conductive pad is pattern identical, that phase XOR Local Phase is same；The multiple conductive pad is
Being configured at around the effective display area away from, Unequal distance or Local Isometric；The distance between two adjacent conductive pads are less than
120 millimeters.
The further object of the application is a kind of preparation method of display base plate, including：Underlay substrate is provided；Formed and actively opened
On the underlay substrate；Metal level is formed in the wiring region of underlay substrate and around effective display area；Form insulating barrier
In the metal level, the insulating barrier is located on the layer on surface of metal circumferential edges；Through hole is formed in the metal level；Formed
Transparency electrode is on the metal level and the insulating barrier and in the through hole, and the transparency electrode connects the metal level；
Wherein, the metal level and the transparency electrode are to be patterned to form alignment mark.
The application, which solves its technical problem, can also be applied to the following technical measures to achieve further.
Include in the embodiment of the application, the step of the preparation method：After forming metal level, described in patterning
Metal level is to form the alignment mark；And after forming the transparency electrode, the transparency electrode is patterned with described in exposure
Alignment mark.
Include in the embodiment of the application, the step of the preparation method：After formed transparency electrode, the gold
Category layer and the transparency electrode are to form alignment mark in same patterning stages.
The application can not significantly change the premise of existing production procedure, and alignment mark is integrated into leading on display base plate
Electrical pad, therefore without the wiring region otherwise designed alignment mark in effective coverage periphery, avoid the wiring space for tying up periphery；
Conductive pad is generally evenly distributed in effective display area periphery, can meet conductive pad and mark from need to be more than 0mm with a distance from viewing area
Required distance, and detection device can be altered to alignment mark with alternate selection conductive pad, to meet the distance of adjacent marker
120 millimeters of requirement need to be more than.
Brief description of the drawings
Fig. 1 a are the schematic diagram that exemplary alignment mark is laid in display base plate.
Fig. 1 b are schematic diagram of the exemplary display base plate in the region formed with alignment mark structure.
Fig. 1 c are cross-sectional view of the exemplary display base plate in the region formed with alignment mark structure.
Fig. 2 is display foundation the present processes, and the schematic diagram of display base plate is arranged on applied to alignment mark.
Fig. 3 a are the structural representation of exemplary conductive pad.
Fig. 3 b are the cross-sectional view of conductive pad shown in Fig. 3 a.
Fig. 4 a is display foundation the present processes, the structural representation applied to conductive pad.
Fig. 4 b is display foundation the present processes, the cross-sectional view applied to conductive pad.
Fig. 5 a to Fig. 5 d is display foundation the present processes, the formation schematic diagram applied to conductive pad.
Fig. 6 is applied to the signal that F alignment marks are arranged on display base plate for display according to the present processes, an embodiment
Figure.
Embodiment
The explanation of following embodiment is with reference to additional schema, to illustrate the particular implementation that the application can be used to implementation
Example.The direction term that the application is previously mentioned, such as " on ", " under ", "front", "rear", "left", "right", " interior ", " outer ", " side "
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used is to illustrate and understand the application, and is not used to
Limit the application.
Accompanying drawing and explanation are considered as inherently illustrative rather than restricted.In figure, the similar list of structure
Member is represented with identical label.In addition, being described to understand and be easy to, the size and thickness of each component shown in accompanying drawing are
Arbitrarily show, but the application not limited to this.
In the accompanying drawings, for clarity, the thickness in layer, film, panel, region etc. is exaggerated.In the accompanying drawings, in order to manage
Solve and be easy to describe, exaggerate the thickness of some layers and region.It will be appreciated that ought such as layer, film, region or substrate group
Part be referred to as " " another component " on " when, the component can be directly on another component, or there may also be in
Between component.
In addition, in the description, unless explicitly described as opposite, otherwise word " comprising " will be understood as meaning to wrap
The component is included, but is not excluded for any other component.In addition, in the description, " above " means to be located at target group
Part either above or below, and be not intended to must be positioned on the top based on gravity direction.
Further to illustrate that the application is to reach the technological means and effect that predetermined goal of the invention taken, below in conjunction with
Accompanying drawing and preferred embodiment, a kind of display base plate proposed to foundation the application and preparation method thereof, its embodiment,
Structure, feature and its effect, describe in detail as after.
Fig. 1 a are that exemplary alignment mark is laid in the schematic diagram of display base plate, Fig. 1 b are that exemplary display base plate exists
Schematic diagram, Fig. 1 c in the region formed with alignment mark structure are exemplary display base plate formed with alignment mark structure
The cross-sectional view in region.
As shown in Figure 1a, in the manufacturing process of display panel, all need to carry out display base plate detection.These testing processes
Need to carry out contraposition setting.The operation such as measure, align and check in order to facilitate display base plate 100, can be in display base in design
The surrounding of plate 100 places the alignment mark 110 of some identifications.
In certain embodiments, the display base plate 100 is provided with multiple effective display area 210 and wiring region 220, institute
State wiring region 220 to be arranged at around each effective display area 210, and a number of conduction is set in wiring region 220
Pad.However, display base plate 100 includes but is not limited to be active switch array mother-substrate.The active switch array mother-substrate bag
Multiple array base paltes are included, the exposed development in the effective display area 210 per array basal plate and other assemblies are set.To mother substrate
After demand component on effective display area that upper setting matches with the active switch array mother-substrate, wiring region, two are carried out
The vacuum of mother substrate is to box.Afterwards by cutting, you can obtain multiple display panels.
Please refer to shown in Fig. 1 b and Fig. 1 c, alignment mark 110 is typically designed as 1400um*1400um's
Square, this square are made up of glass substrate 111, metal level 112, insulating barrier 113 and transparency electrode (ITO) 114, metal level
112 are connected to shared cabling (com line) 120, i.e., for display base plate, metal level 112 is connected to the shared substrate of array and walked
Line (Acom).Indicia patterns 115 are then that graphical or etching sheet metal is formed.Such as：Square center can hollow out one
" L " monogram.
The main function of alignment mark 110 is after display base plate 100 completes, and is entering walking line open/short
(Open/Short) when checking, there is provided used when capturing coordinate to high-speed motion picture camera (Charge-Coupled Device, CCD).
Contraposition process is specifically, detection device applies common electric voltage letter on display base plate 100 on associate conductive pad (pad)
Number, and alignment mark 110 field emission electron beam of the electron gun to display base plate 100 is utilized, for the region of alignment mark 110
The part of middle indicia patterns 115, due in the absence of metal, electronics can not be absorbed, so electronics will in indicia patterns 115
It is left.However, metallic region in the region of alignment mark 110 can absorption detecting equipment send electronically form electric current, and by
Guide to shared cabling 120.And then assisted by photo-translating system, the parts of indicia patterns 115 will show shinny
Or obfuscation, the position of indicia patterns 115 can be grabbed so as to read coordinate by high-speed motion picture camera.In this way, examine
Measurement equipment i.e. can determine display base plate 100 whether accurate contraposition.
Fig. 2 is applied to the signal that alignment mark is arranged on display base plate for display according to the present processes, an embodiment
Figure.Prior art construction and component, Fig. 1 a to Fig. 1 c are referred in favor of understanding.Fig. 2 is refer to, in the embodiment of the application one
In, a kind of display base plate, including：Underlay substrate 200, including multiple effective display area 210 and wiring region 220, the cloth
Line area 220 is arranged at around the effective display area 210, and multiple active switches are arranged at the effective display area 210；And lead
Electrical pad (pad) 230, the wiring region 220 is arranged at around the effective display area 210, in the conductive pad 230
Formed with alignment mark 235 (such as Fig. 4 a).
In certain embodiments, display base plate is, for example, array base palte, and conductive pad 230 is provided in the array base palte
Four corners of between chip on film (Chip On Flex or Chip On Film, COF) the 250 and periphery of chip (Chip) 260,
These positions are usually on the shared cabling (com line) of display base plate.Conductive pad 23 is arranged oppositely to turn on two-phase
Display base plate.It is by the design integration of alignment mark 235 to the conductive pad 230 that there is originally in embodiments herein
In structure.Wherein, chip on film refers to integrated circuit (IC), chip (Chip) being fixed on crystal grain mantle on FPC
Structure fills technology, is the technology for engaging chip with flexible base plate circuit with soft additional circuit boards work encapsulation chip carrier,
In this embodiment, though chip on film and chip have assignment component and numbering, use is still needed to depending on actual demand, not with this
It is limited shown in figure.
In certain embodiments, Fig. 1 a are refer to, display base plate 100 can also be active switch array mother-substrate, herein
Do not limit, the active switch array mother-substrate includes multiple array base paltes, the substrate of the active switch array mother-substrate
After the exposed development of each effective display area domain and other assemblies are set on substrate, to setting and the master on mother substrate
Demand component on effective display area that dynamic switch arrays mother substrate matches, wiring region, with the progress to mother substrate
After vacuum is to box, by cutting, multiple display panels are can obtain.
It is the transversal of conductive pad shown in Fig. 3 a please refer to structural representation that Fig. 3 a are exemplary conductive pad, Fig. 3 b
Face schematic diagram, Fig. 4 a are display foundation the present processes, and structural representation and Fig. 4 b applied to conductive pad are display foundation
The present processes, the cross-sectional view applied to conductive pad.
As shown in Fig. 3 a and Fig. 3 b, the square design architectural difference of exemplary conductive pad and exemplary alignment mark is not
Greatly, it is made up of more glass substrate 131, metal level 132, insulating barrier 133 and transparency electrode 134, metal level 132 is connected to shared
Cabling (com line), array as the aforementioned share substrate cabling (Acom).
As shown in Fig. 4 a and Fig. 4 b, the conductive pad shown in one embodiment of the invention, its structure and exemplary conductive pad
It is essentially consistent, difference is on conductive pad 230 formed with alignment mark 235.
In the embodiment of the application, described conductive pad includes：Metal level 132, it is arranged at the underlay substrate 131
Wiring region and around the effective display area, the metal level 132 is formed with through hole 136；Insulating barrier 133, layer ring are set
In the surface perimeter edge of metal level 132；Transparency electrode 134, it is arranged on the metal level 132 and the insulating barrier 133,
And in the through hole 136, the transparency electrode 134 connects the metal level 132；Alignment mark 235, pattern the gold
Belong to layer 132 and the transparency electrode 134 and formed.
In the embodiment of the application, described conductive pad is square or circular.
In the embodiment of the application, the alignment mark 235 includes L marks, cross mark, rice word mark, or
Similar indicia patterns, and these indicia patterns with single use or can be used in mixed way.Furthermore, it is possible to according to different stream
Journey and use different indicia patterns, so as to reduce the situation of misrecognition.
In the embodiment of the application, the alignment mark 235 be formed in a manner of hollow out the conductive pad 230 it
In, the purpose is to facilitate ultraviolet light (UV) by facilitate the curing operation of gold size.Dutycycle is generally 10um/10um, right
For position mark 235 after hollow out, the shape width of its cross section is 50um, more than 10um, therefore does not influence gold size solidification.
In the embodiment of the application one, a kind of display panel of the application, including, it includes the first substrate being arranged oppositely
With second substrate；Wherein, conductive pad 230 combines the design of alignment mark 235 on display base plate, including in foregoing embodiments
It is any, and the display base plate is the first substrate or the second substrate.
In the embodiment of the application, the distance between adjacent two conductive pads 230 are less than 120 millimeters, are also
Refer to, in 120 millimeters of distance, at least exist with two or more alignment marks 235.Related detection device
Using the specified different conductive pad of selectivity as alignment mark, to meet that the distance of adjacent marker need to be wanted more than 120 millimeters
Ask.
Fig. 5 a to Fig. 5 b is display foundation the present processes, the formation schematic diagram applied to conductive pad 230.Formation side
Method includes：Underlay substrate 131 is provided；Active switch is formed in the underlay substrate 131；Metal level 132 is formed in underlay substrate
131 wiring region and around the effective display area；Insulating barrier 133 is formed in the metal level 132, wherein, it is described exhausted
Edge layer 133 is located on the surface perimeter edge of metal level 132；Through hole 136 is formed in the metal level 132；Form transparency electrode
134 on the metal level 132 and the insulating barrier 133 and in the through hole 136, and the transparency electrode 134 connect it is described
Metal level 132；Wherein, the metal level 132 and the transparency electrode 134 are to be patterned to form alignment mark.
In certain embodiments, after metal level 132 is formed, the metal level 132 is patterned to form the register guide
Note 235；And after forming transparency electrode 134, the transparency electrode 134 is patterned with the exposure alignment mark 235.
In certain embodiments, after transparency electrode 134 is formed, the metal level 132 is with the transparency electrode 134
In same patterning stages to form alignment mark 245.
In certain embodiments, the metal level 132 is formed by depositional mode.
In certain embodiments, it is to be patterned by photoetching or wet etching and shape after the metal level 132 is formed
Into the pattern of the alignment mark.
In certain embodiments, the insulating barrier 133 is formed on the metal level, then will by photoetching or wet etching
Alignment mark position is etched, to remove the position of the corresponding alignment mark of the insulating barrier 133.
In certain embodiments, it is that pattern is carried out and shape by photoetching or wet etching after the transparency electrode 134 is formed
Into alignment mark.
Fig. 6 is applied to the signal that F alignment marks are arranged on display base plate for display according to the present processes, an embodiment
Figure.Fig. 6 is refer to, in the embodiment of the application one, formed with alignment mark 235, this alignment mark in the conductive pad 230
Figure for F mark (being to fall " F " shape region etch).F mark figure be different from foregoing L marks, cross mark,
Rice word mark, there is the key element of direction discernment, be advantageous to improve the accuracy of position identification.
In the embodiment of the application, a kind of display base plate, it includes：Underlay substrate 200, including it is multiple effectively aobvious
Show area 210 and wiring region 220, the wiring region 220 is arranged at around each effective display area 210, multiple active switches
It is arranged at the effective display area 210；Multiple conductive pads 230, it is arranged at around the effective display area 210 described
Wiring region 220, each conductive pad 230 include：Metal level 132, it is arranged at the wiring region 220 of the underlay substrate 200 and is located at
Around the effective display area 210, the metal level 132 is formed with through hole 136；Insulating barrier 133, layer are located on the metal
132 surface perimeter edge of layer；Transparency electrode 134, it is arranged on the metal level 132 and the insulating barrier 133, and it is described logical
In hole 136, the transparency electrode 134 connects the metal level 132；Alignment mark 235, pattern the metal level 132 and institute
State transparency electrode 134 and formed；Wherein, the alignment mark 235 of the multiple conductive pad 230 is identical, phase XOR Local Phase is same
Pattern；The multiple conductive pad 230 is that equidistant, Unequal distance or Local Isometric are configured at the effective display area 210 weeks
Enclose；The distance between two adjacent conductive pads 230 are less than 120 millimeters.
In certain embodiments, herein described display base plate, its applicable display panel may be, for example, LCD
Plate, right not limited to this, it also can be OLED display panel, W-OLED display panels, QLED display panels, and plasma is shown
Panel, curved face type display panel or other types display panel.
The application can not significantly change the premise of existing production procedure, and alignment mark is integrated into leading on display base plate
Electrical pad, therefore without the wiring region otherwise designed alignment mark in effective coverage periphery, avoid the wiring space for tying up periphery；
Conductive pad is generally evenly distributed in effective display area periphery, can meet conductive pad and mark from need to be more than 0mm with a distance from viewing area
Required distance, and detection device can be altered to alignment mark with alternate selection conductive pad, to meet the distance of adjacent marker
120mm requirement need to be more than；Suitable for combining three color panels, four color panels, COT (Color filter on TFT side)
Processing procedure completes display panel.
" in certain embodiments " and " in various embodiments " term is used repeatedly etc..This term is not usually
Refer to identical embodiment；But it may also mean that identical embodiment.The word such as "comprising", " having " and " comprising " is synonymous
Word, unless its context meaning shows other meanings.
It is described above, only it is the specific embodiment of the application, not makees any formal limitation to the application, though
Right the application is disclosed above with specific embodiment, but is not limited to the application, any to be familiar with this professional technology people
Member, is not departing from the range of technical scheme, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, as long as being the content without departing from technical scheme, the technical spirit according to the application
Any simple modification, equivalent change and modification made to above example, still fall within the scope of technical scheme
It is interior.
Claims (10)
- A kind of 1. display base plate, it is characterised in that including：Underlay substrate, including multiple effective display area and wiring region, the wiring region is arranged at around the effective display area, more Individual active switch is arranged at the effective display area；Conductive pad, the wiring region is arranged at around the effective display area；Wherein, formed with alignment mark in the conductive pad.
- 2. display base plate as claimed in claim 1, it is characterised in that the alignment mark includes L marks, F marks, cross Note or rice word mark.
- 3. display base plate as claimed in claim 1, it is characterised in that the shape width of the cross section of the alignment mark is 50um。
- 4. display base plate as claimed in claim 1, it is characterised in that the alignment mark be formed in a manner of hollow out it is described Among conductive pad.
- 5. display base plate as claimed in claim 1, it is characterised in that described conductive pad includes：Metal level, it is arranged at the wiring region of the underlay substrate and around the effective display area, the metal level is formed There is through hole；Insulating barrier, layer are located on the layer on surface of metal circumferential edges；Transparency electrode, it is arranged on the metal level and the insulating barrier, and in the through hole, the transparency electrode connects institute State metal level；Alignment mark, pattern the metal level and formed with the transparency electrode.
- 6. display base plate as claimed in claim 1, it is characterised in that described conductive pad is square or circular.
- A kind of 7. display base plate, it is characterised in that including：Underlay substrate, including multiple effective display area and wiring region, the wiring region is arranged at around the effective display area, more Individual active switch is arranged at the effective display area；Multiple conductive pads, the wiring region is arranged at around the effective display area, each conductive pad includes：Metal level, it is arranged at the wiring region of the underlay substrate and around effective display area, the metal level is formed with logical Hole；Insulating barrier, layer are located on the layer on surface of metal circumferential edges；Transparency electrode, it is arranged on the metal level and the insulating barrier, and in the through hole, the transparency electrode connects institute State metal level；Alignment mark, pattern the metal level and formed with the transparency electrode；Wherein, the alignment mark of the multiple conductive pad is pattern identical, that phase XOR Local Phase is same；The multiple conductive pad is that equidistant, Unequal distance or Local Isometric are configured at around the effective display area；The distance between two adjacent conductive pads are less than 120 millimeters.
- A kind of 8. preparation method of display base plate, it is characterised in that including：Underlay substrate is provided；Active switch is formed in the underlay substrate；Metal level is formed in the wiring region of underlay substrate and around effective display area；Insulating barrier is formed in the metal level, wherein the insulating barrier layer is located on the layer on surface of metal circumferential edges；Through hole is formed in the metal level；Transparency electrode is formed in the through hole and on the metal level and the insulating barrier, and described in transparency electrode connection Metal level；Wherein, the metal level and the transparency electrode are to be patterned to form alignment mark.
- 9. the preparation method of display base plate as claimed in claim 8, it is characterised in that after forming metal level, described in patterning Metal level is to form the alignment mark；And after forming the transparency electrode, the transparency electrode is patterned with described in exposure Alignment mark.
- 10. the preparation method of display base plate as claimed in claim 8, it is characterised in that after forming transparency electrode, the metal Layer is to form alignment mark in same patterning stages with the transparency electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710884907.2A CN107703662A (en) | 2017-09-26 | 2017-09-26 | Display base plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710884907.2A CN107703662A (en) | 2017-09-26 | 2017-09-26 | Display base plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107703662A true CN107703662A (en) | 2018-02-16 |
Family
ID=61174797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710884907.2A Pending CN107703662A (en) | 2017-09-26 | 2017-09-26 | Display base plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107703662A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109633956A (en) * | 2018-11-26 | 2019-04-16 | 深圳市华星光电半导体显示技术有限公司 | Tft array substrate and its alignment method |
| CN110262108A (en) * | 2019-06-28 | 2019-09-20 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110333615A (en) * | 2019-04-28 | 2019-10-15 | 云谷（固安）科技有限公司 | A kind of array substrate and display panel |
| CN111857446A (en) * | 2020-07-13 | 2020-10-30 | Tcl华星光电技术有限公司 | Mask plate, display panel and preparation method of display panel |
| CN113960823A (en) * | 2021-09-28 | 2022-01-21 | 惠科股份有限公司 | Display substrate and correction method of optical detection frame |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129339A (en) * | 1994-10-20 | 1996-08-21 | 国际商业机器公司 | Electrically conductive paste materials and applications |
| CN1435715A (en) * | 2002-02-01 | 2003-08-13 | Lg.菲利浦Lcd株式会社 | Method for mfg. liquid crystal display device |
| KR20050060669A (en) * | 2003-12-17 | 2005-06-22 | 삼성전자주식회사 | Manufacturing method of thin film transistor array panel |
| CN101047157A (en) * | 2006-03-28 | 2007-10-03 | 统宝光电股份有限公司 | Conducting pad system and its making method |
| CN201122220Y (en) * | 2007-11-02 | 2008-09-24 | 群康科技(深圳)有限公司 | LCD panel |
| CN101534607A (en) * | 2008-03-12 | 2009-09-16 | 南亚电路板股份有限公司 | Routing substrate and production method thereof |
| CN103278970A (en) * | 2013-04-13 | 2013-09-04 | 福建华映显示科技有限公司 | Display panel and manufacturing method of display panel |
| CN103676245A (en) * | 2013-12-26 | 2014-03-26 | 南京中电熊猫液晶显示科技有限公司 | Array substrate alignment mark structure and alignment method of array substrate |
| CN106502016A (en) * | 2016-12-09 | 2017-03-15 | 惠科股份有限公司 | A kind of display floater and display device |
| CN107067969A (en) * | 2017-04-20 | 2017-08-18 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method, display device |
-
2017
- 2017-09-26 CN CN201710884907.2A patent/CN107703662A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1129339A (en) * | 1994-10-20 | 1996-08-21 | 国际商业机器公司 | Electrically conductive paste materials and applications |
| CN1435715A (en) * | 2002-02-01 | 2003-08-13 | Lg.菲利浦Lcd株式会社 | Method for mfg. liquid crystal display device |
| KR20050060669A (en) * | 2003-12-17 | 2005-06-22 | 삼성전자주식회사 | Manufacturing method of thin film transistor array panel |
| CN101047157A (en) * | 2006-03-28 | 2007-10-03 | 统宝光电股份有限公司 | Conducting pad system and its making method |
| CN201122220Y (en) * | 2007-11-02 | 2008-09-24 | 群康科技(深圳)有限公司 | LCD panel |
| CN101534607A (en) * | 2008-03-12 | 2009-09-16 | 南亚电路板股份有限公司 | Routing substrate and production method thereof |
| CN103278970A (en) * | 2013-04-13 | 2013-09-04 | 福建华映显示科技有限公司 | Display panel and manufacturing method of display panel |
| CN103676245A (en) * | 2013-12-26 | 2014-03-26 | 南京中电熊猫液晶显示科技有限公司 | Array substrate alignment mark structure and alignment method of array substrate |
| CN106502016A (en) * | 2016-12-09 | 2017-03-15 | 惠科股份有限公司 | A kind of display floater and display device |
| CN107067969A (en) * | 2017-04-20 | 2017-08-18 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method, display device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109633956A (en) * | 2018-11-26 | 2019-04-16 | 深圳市华星光电半导体显示技术有限公司 | Tft array substrate and its alignment method |
| CN110333615A (en) * | 2019-04-28 | 2019-10-15 | 云谷（固安）科技有限公司 | A kind of array substrate and display panel |
| CN110333615B (en) * | 2019-04-28 | 2022-03-22 | 广州国显科技有限公司 | Array substrate and display panel |
| CN110262108A (en) * | 2019-06-28 | 2019-09-20 | 厦门天马微电子有限公司 | Display panel and display device |
| CN110262108B (en) * | 2019-06-28 | 2022-07-01 | 厦门天马微电子有限公司 | Display panel and display device |
| CN111857446A (en) * | 2020-07-13 | 2020-10-30 | Tcl华星光电技术有限公司 | Mask plate, display panel and preparation method of display panel |
| US11520441B2 (en) | 2020-07-13 | 2022-12-06 | Tcl China Star Optoelectronics Technology Co., Ltd. | Mask, display panel, and method for manufacturing thereof |
| US11995274B2 (en) | 2020-07-13 | 2024-05-28 | Tcl China Star Optoelectronics Technology Co., Ltd. | Mask, display panel, and method for manufacturing thereof |
| CN113960823A (en) * | 2021-09-28 | 2022-01-21 | 惠科股份有限公司 | Display substrate and correction method of optical detection frame |
| CN113960823B (en) * | 2021-09-28 | 2024-02-27 | 惠科股份有限公司 | Display substrate and correction method of optical detection frame |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107703662A (en) | Display base plate and preparation method thereof | |
| US10867155B2 (en) | Fingerprint identification display panel and fabricating method thereof, fingerprint identification display device | |
| US10541368B2 (en) | Substrate for use in manufacturing display device and method for forming element on substrate | |
| TWI549287B (en) | Organic light emitting display | |
| KR101341030B1 (en) | Organic emitting display device and method for manufacturing the same | |
| US10020328B2 (en) | Test element unit, array substrate, display panel, display apparatus, and method of manufacturing array substrate | |
| KR101857620B1 (en) | Touch panel and method of manufacturing the same | |
| CN106775039B (en) | Embedded touch screen, manufacturing method thereof and display device | |
| WO2016160693A1 (en) | Organic light-emitting diode displays with crack detection and crack propagation prevention circuitry | |
| EP2256554A3 (en) | Multicolored mask process for making display circuitry | |
| CN107742623B (en) | Display substrate, organic light-emitting device, film evaporation detection method and display device | |
| WO2020052029A1 (en) | Display panel | |
| US5646452A (en) | Registration accuracy measurement mark for semiconductor devices | |
| KR20110025375A (en) | Flat panel display integrated touch screen panel | |
| US20190368028A1 (en) | Vapor deposition mask and method for manufacturing vapor deposition mask | |
| US20130087934A1 (en) | Substrate for display device and method for manufacturing the same | |
| US20220066268A1 (en) | Panel structure, display device, and alignment detection method of panel structure | |
| CN104576673A (en) | Flat-plate image sensor and manufacturing method thereof | |
| KR102467880B1 (en) | Organic Light Emitting Diode Display Device and Method for Manufactruing the Same | |
| WO2020124885A1 (en) | Display panel and display device | |
| CN106992205A (en) | A kind of organic EL display panel and display of organic electroluminescence | |
| CN110767831B (en) | Transparent OLED substrate, display panel, array substrate, display screen and display device | |
| KR20150145305A (en) | Organic Light Emitting Display Device and Method for manufacturing the same | |
| KR101425732B1 (en) | Substrate of lcd | |
| US20070024182A1 (en) | Flat panel display apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180216 |