CN107696350B8 - Bga模塑模具 - Google Patents

Bga模塑模具 Download PDF

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Publication number
CN107696350B8
CN107696350B8 CN201711133121.3A CN201711133121A CN107696350B8 CN 107696350 B8 CN107696350 B8 CN 107696350B8 CN 201711133121 A CN201711133121 A CN 201711133121A CN 107696350 B8 CN107696350 B8 CN 107696350B8
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CN
China
Prior art keywords
adjusting unit
cavity
die
unit
adjusting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201711133121.3A
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English (en)
Other versions
CN107696350B (zh
CN107696350A (zh
Inventor
吴晓英
庄建玲
其他发明人请求不公开姓名
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Chongqing Jinweida Packaging Products Co ltd
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201711133121.3A priority Critical patent/CN107696350B8/zh
Publication of CN107696350A publication Critical patent/CN107696350A/zh
Publication of CN107696350B publication Critical patent/CN107696350B/zh
Application granted granted Critical
Publication of CN107696350B8 publication Critical patent/CN107696350B8/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

本发明公开了一种BGA模塑模具，包括模座，模座的中部纵向均匀排布有多个料筒，料筒的左右两侧设置有模盒，所述模盒包括多个型腔，型腔与型腔之间通过型腔成型条模块隔离；所述型腔成型条模块由两个相邻的成型条组成；型腔外边框条中安装有纵向位置调节装置和横向位置调节装置；所述纵向位置调节装置包括调节左单元和调节右单元；调节左单元和调节右单元对称分布；调节左单元和调节右单元均包括移动件和固定件；所述移动件与成型条的端部固定连接；本发明的纵向位置调节装置包括调节左单元和调节右单元，可对两个成型条的位置单独进行调整，以满足每个模盒型腔内的基板的尺寸的细微变化。
CN201711133121.3A 2016-03-08 2016-03-08 Bga模塑模具 Expired - Fee Related CN107696350B8 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711133121.3A CN107696350B8 (zh) 2016-03-08 2016-03-08 Bga模塑模具

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610129891.XA CN105666745B (zh) 2016-03-08 2016-03-08 一种bga模塑模具
CN201711133121.3A CN107696350B8 (zh) 2016-03-08 2016-03-08 Bga模塑模具

Related Parent Applications (1)

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CN201610129891.XA Division CN105666745B (zh) 2016-03-08 2016-03-08 一种bga模塑模具

Publications (3)

Publication Number Publication Date
CN107696350A CN107696350A (zh) 2018-02-16
CN107696350B CN107696350B (zh) 2019-12-20
CN107696350B8 true CN107696350B8 (zh) 2020-02-04

Family

ID=56307183

Family Applications (7)

Application Number Title Priority Date Filing Date
CN201710842619.0A Expired - Fee Related CN107553789B (zh) 2016-03-08 2016-03-08 一种bga模塑模具
CN201711133121.3A Expired - Fee Related CN107696350B8 (zh) 2016-03-08 2016-03-08 Bga模塑模具
CN201711198733.0A Active CN107993944B (zh) 2016-03-08 2016-03-08 一种用于半导体封装的bga模塑模具及其工作方法
CN201711133122.8A Active CN107901293B (zh) 2016-03-08 2016-03-08 Bga模塑模具的工作方法
CN201710842618.6A Expired - Fee Related CN107571429B (zh) 2016-03-08 2016-03-08 一种bga模塑模具的工作方法
CN201711198730.7A Active CN107962713B (zh) 2016-03-08 2016-03-08 用于半导体封装的bga模塑模具及其工作方法
CN201610129891.XA Expired - Fee Related CN105666745B (zh) 2016-03-08 2016-03-08 一种bga模塑模具

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201710842619.0A Expired - Fee Related CN107553789B (zh) 2016-03-08 2016-03-08 一种bga模塑模具

Family Applications After (5)

Application Number Title Priority Date Filing Date
CN201711198733.0A Active CN107993944B (zh) 2016-03-08 2016-03-08 一种用于半导体封装的bga模塑模具及其工作方法
CN201711133122.8A Active CN107901293B (zh) 2016-03-08 2016-03-08 Bga模塑模具的工作方法
CN201710842618.6A Expired - Fee Related CN107571429B (zh) 2016-03-08 2016-03-08 一种bga模塑模具的工作方法
CN201711198730.7A Active CN107962713B (zh) 2016-03-08 2016-03-08 用于半导体封装的bga模塑模具及其工作方法
CN201610129891.XA Expired - Fee Related CN105666745B (zh) 2016-03-08 2016-03-08 一种bga模塑模具

Country Status (1)

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CN (7) CN107553789B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107039293B (zh) * 2017-05-31 2023-03-14 安徽大华半导体科技有限公司 半导体封装模具

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4946633A (en) * 1987-04-27 1990-08-07 Hitachi, Ltd. Method of producing semiconductor devices
SG65615A1 (en) * 1996-07-25 1999-06-22 Advanced Systems Automation Pt Bga moulding assembly for encapsulating bga substrates of varying thickness
JP2003007741A (ja) * 2001-06-19 2003-01-10 Rohm Co Ltd 半導体装置の製造方法
CN201405485Y (zh) * 2009-04-30 2010-02-17 成都尚明工业有限公司 高效节能半导体塑封模具
JP4933596B2 (ja) * 2009-07-09 2012-05-16 日本航空電子工業株式会社 樹脂成型品
CN201645752U (zh) * 2010-02-09 2010-11-24 东莞朗诚模具有限公司 高电压器件封装的模具装置
CN104552672B (zh) * 2014-12-08 2017-02-01 南通富士通微电子股份有限公司 Bga模塑模具
CN105328829B (zh) * 2015-11-14 2017-08-04 苏州光韵达光电科技有限公司 一种bga模塑模具
CN205522126U (zh) * 2016-03-08 2016-08-31 浙江乔兴建设集团湖州智能科技有限公司 一种bga模塑模具

Also Published As

Publication number Publication date
CN107993944B (zh) 2019-12-10
CN107993944A (zh) 2018-05-04
CN107901293B (zh) 2019-12-17
CN107571429B (zh) 2019-12-20
CN107696350B (zh) 2019-12-20
CN107571429A (zh) 2018-01-12
CN107901293A (zh) 2018-04-13
CN105666745A (zh) 2016-06-15
CN107696350A (zh) 2018-02-16
CN107962713A (zh) 2018-04-27
CN107553789B (zh) 2019-11-08
CN105666745B (zh) 2017-12-22
CN107553789A (zh) 2018-01-09
CN107962713B (zh) 2021-01-15

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Inventor after: Wu Xiaoying

Inventor after: Zhuang Jianling

Inventor after: Other inventor requests not to publish the name

Inventor before: Request for anonymity

CB03 Change of inventor or designer information
CI03 Correction of invention patent

Correction item: Inventor

Correct: Wu Xiaoying|Zhuang Jianling|Other inventors ask not to disclose names

False: Do not announce the inventor

Number: 51-02

Page: The title page

Volume: 35

Correction item: Inventor

Correct: Wu Xiaoying|Zhuang Jianling|Other inventors ask not to disclose names

False: Do not announce the inventor

Number: 51-02

Volume: 35

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TR01 Transfer of patent right

Effective date of registration: 20211026

Address after: 402760 No.92 Donglin Avenue, Biquan street, Bishan District, Chongqing

Patentee after: Chongqing high tech Industry Research Institute Co.,Ltd.

Address before: 213000 Liaohe Road Changgong Institute, New North District, Changzhou City, Jiangsu Province

Patentee before: Zhu Baosheng

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TR01 Transfer of patent right

Effective date of registration: 20211215

Address after: 402760 plant 1, No. 1011, Baiyun Avenue, Qinggang street, Bishan District, Chongqing

Patentee after: Chongqing jinweida packaging products Co.,Ltd.

Address before: 402760 No.92 Donglin Avenue, Biquan street, Bishan District, Chongqing

Patentee before: Chongqing high tech Industry Research Institute Co.,Ltd.

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Granted publication date: 20191220

CF01 Termination of patent right due to non-payment of annual fee