CN107685521B - A equipment tool for notebook heat dissipation bubble is cotton - Google Patents
A equipment tool for notebook heat dissipation bubble is cotton Download PDFInfo
- Publication number
- CN107685521B CN107685521B CN201610634905.3A CN201610634905A CN107685521B CN 107685521 B CN107685521 B CN 107685521B CN 201610634905 A CN201610634905 A CN 201610634905A CN 107685521 B CN107685521 B CN 107685521B
- Authority
- CN
- China
- Prior art keywords
- foam
- jig
- assembly
- ceramic
- release film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 230000017525 heat dissipation Effects 0.000 title claims description 13
- 229920000742 Cotton Polymers 0.000 title description 16
- 239000006260 foam Substances 0.000 claims abstract description 78
- 239000000919 ceramic Substances 0.000 claims abstract description 57
- 238000003825 pressing Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Connection Of Plates (AREA)
- Jigs For Machine Tools (AREA)
Abstract
The invention relates to an assembly jig for radiating foam of a notebook computer, which comprises a jig lower plate, a jig cover plate arranged on the jig lower plate and a foam assembly arranged on the jig cover plate, wherein a ceramic clamping groove matched with ceramic is formed in the jig cover plate, the ceramic clamping groove corresponds to the foam position in the foam assembly, and the ceramic is placed in the ceramic clamping groove, so that the ceramic and the foam in the foam assembly are adhered together, and the assembly is completed. Compared with the prior art, the invention adopts the model tool to accurately position the foam and the ceramic, effectively ensures that the foam is positioned in the middle of the ceramic after assembly and keeps a distance of 0.1mm from the edge of the ceramic, greatly improves the accuracy of assembly, reduces the reject ratio of products by about eighty percent compared with a manual assembly mode, reduces the production cost, has simple operation and high positioning speed, can be rapidly assembled in batches, and greatly improves the efficiency of assembly.
Description
Technical Field
The invention belongs to the technical field of notebook heat dissipation, and relates to an assembly jig for notebook heat dissipation foam.
Background
When the notebook heat dissipation foam is assembled, one surface of the foam with the double-sided adhesive needs to be adhered to the ceramic surface, so that the two foam bodies are combined into a whole. Wherein, the foam is positioned in the middle of the ceramic and keeps a distance of 0.1mm from the edge of the ceramic.
In the prior art, the assembly is carried out in a manual mode, and when the assembly is carried out manually, the 0.1mm distance between the foam and the edge of the ceramic is difficult to control, so that the reject ratio of the product is very high, and the foam is very fragile, cannot be reworked if the assembly is successful at one time, can only be scrapped directly, and the production cost is greatly increased.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the assembly jig for the notebook heat dissipation foam with high assembly accuracy.
The aim of the invention can be achieved by the following technical scheme:
the utility model provides an equipment tool for notebook heat dissipation bubble is cotton, this tool includes the tool hypoplastron, sets up the tool apron on the tool hypoplastron and sets up the cotton assembly of bubble on the tool apron, the tool apron on seted up the ceramic draw-in groove with ceramic looks adaptation, this ceramic draw-in groove corresponds with the position of bubble cotton in the cotton assembly of bubble, place the pottery in the ceramic draw-in groove, make the pottery stick together with the bubble cotton in the cotton assembly of bubble, accomplish the equipment promptly.
The shape and the size of the ceramic clamping groove are consistent with those of the ceramic, so that the ceramic is tightly clamped, and the assembly precision is improved. The foam in the foam assembly corresponds to the middle of the ceramic clamping groove and keeps a distance of 0.1mm from the edge of the ceramic clamping groove.
The jig lower plate is provided with a guide post, and the jig cover plate is provided with a jig cover plate positioning hole matched with the guide post.
The thickness of the jig lower plate is 12-18mm, the length of the guide post is 4-6mm, and the thickness of the jig cover plate is 0.4-0.6mm. The guide post is formed by milling and grinding by a numerical control machine tool, and the precision is high.
The foam assembly comprises an upper release film arranged on the jig cover plate and foam arranged on the lower surface of the upper release film.
And an upper release film positioning hole matched with the guide post is formed in the upper release film.
The lower surface of the upper release film is also provided with a foam positioning block. The foam positioning block is preset on the lower surface of the upper release film and used for accurately positioning foam.
The foam positioning block is an L-shaped foam positioning block. The L-shaped foam positioning block is used for positioning two adjacent edges of foam, so that the positioning accuracy of the foam is improved.
And a lower release film is arranged between the lower jig plate and the cover plate, and a lower release film positioning hole matched with the guide post is formed in the lower release film. The lower release film separates the ceramic from the lower plate of the jig, so that the ceramic can be stuck, the assembly precision is prevented from being influenced by shaking of the ceramic, and the ceramic is convenient to peel off.
When the foam adhesive is actually applied, firstly, foam with adhesive on the two sides is aligned with a foam positioning block on the surface of the upper release film, and the foam is accurately adhered on the surface of the upper release film to form a foam assembly; then sequentially placing the lower release film and the jig cover plate on the lower jig plate, and positioning through the guide posts, wherein the release surface of the lower release film faces the jig cover plate; accurately placing the ceramic in a ceramic clamping groove of a jig cover plate, and applying pressure to bond the ceramic and the lower release film together; the surface of the foam assembly, which is provided with foam, faces the jig cover plate and is placed on the jig cover plate, and positioning is carried out through the guide post; pressing the foam assembly to tightly adhere the foam and the ceramic together, thereby completing the assembly.
Compared with the prior art, the invention has the following characteristics:
1) The foam and the ceramic are accurately positioned by adopting the model tool, so that the foam is positioned in the middle of the ceramic after assembly, and keeps a distance of 0.1mm from the edge of the ceramic, the assembly accuracy is greatly improved, the reject ratio of products is about eighty percent lower than that of a manual assembly mode, and the production cost is reduced;
2) The operation is simple, the positioning speed is high, the batch rapid assembly can be carried out, and the assembly efficiency is greatly improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram of a lower plate of the jig according to the present invention;
FIG. 3 is a schematic view of the structure of the lower release film according to the present invention;
FIG. 4 is a schematic diagram of a cover plate of the jig of the present invention;
FIG. 5 is a schematic view of a foam assembly according to the present invention;
the figure indicates:
1-tool lower plate, 2-tool apron, 3-ceramic draw-in groove, 4-bubble cotton, 5-guide pillar, 6-tool apron locating hole, 7-last release film, 8-last release film locating hole, 9-bubble cotton locating piece, 10-down release film, 11-down release film locating hole, 12-bubble cotton assembly.
Detailed Description
The invention will now be described in detail with reference to the drawings and specific examples. The present embodiment is implemented on the premise of the technical scheme of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present invention is not limited to the following examples.
Example 1:
the utility model provides an equipment tool for notebook heat dissipation bubble is cotton, this tool includes tool hypoplastron 1, set up tool apron 2 on tool hypoplastron 1 and set up the cotton assembly 12 of bubble on tool apron 2, set up on the tool apron 2 with ceramic assorted ceramic draw-in groove 3, ceramic draw-in groove 3 shape and size are unanimous with ceramic, the position correspondence of bubble cotton 4 in ceramic draw-in groove 3 and the cotton assembly 12 of bubble, bubble cotton 4 corresponds in the middle of ceramic draw-in groove 3, and keep 0.1 mm's distance with ceramic draw-in groove 3 edge. And placing the ceramic in the ceramic clamping groove 3 to adhere the ceramic and the foam 4 in the foam assembly 12 together, thus completing the assembly.
As shown in fig. 2, a guide post 5 is arranged on the lower jig plate 1, and as shown in fig. 4, a jig cover plate positioning hole 6 matched with the guide post 5 is formed in the jig cover plate 2. The thickness of the jig lower plate 1 is 15mm, the length of the guide post 5 is 5mm, and the thickness of the jig cover plate 2 is 0.5mm. As shown in fig. 5, the foam assembly 12 includes an upper release film 7 disposed on the jig cover plate 2 and foam 4 disposed on the lower surface of the upper release film 7. An upper release film positioning hole 8 matched with the guide post 5 is formed in the upper release film 7. The lower surface of the upper release film 7 is also provided with a foam positioning block 9. The foam positioning block 9 is an L-shaped foam positioning block. A lower release film 10 is arranged between the lower jig plate 1 and the cover jig plate 2, and as shown in fig. 3, a lower release film positioning hole 11 matched with the guide post 5 is formed in the lower release film 10.
When the jig is in practical application, firstly, the foam 4 with the adhesive on the two sides is aligned with the foam positioning block 9 on the surface of the upper release film 7, and the foam 4 is accurately adhered on the surface of the release film 7 to form a foam assembly 12; then sequentially placing the lower release film 10 and the jig cover plate 2 on the lower jig plate 1, and positioning through the guide posts 5, wherein the release surface of the lower release film 10 faces the jig cover plate 2; accurately placing the ceramic in a ceramic clamping groove 3 of a jig cover plate 2, and applying pressure to bond the ceramic and a lower release film 10 together; the surface of the foam assembly 12 with the foam 4 faces the jig cover plate 2 and is placed on the jig cover plate 2, and the foam assembly is positioned through the guide post 5; pressing the foam assembly 12 tightly adheres the foam 4 to the ceramic, thereby completing the assembly.
Example 2:
in this embodiment, the thickness of the lower jig plate 1 is 12mm, the length of the guide post 5 is 4mm, the thickness of the cover plate 2 of the jig is 0.4mm, and the rest is the same as that of embodiment 1.
Example 3:
in this embodiment, the thickness of the lower jig plate 1 is 18mm, the length of the guide post 5 is 6mm, the thickness of the cover plate 2 of the jig is 0.6mm, and the rest is the same as that of embodiment 1.
The previous description of the embodiments is provided to facilitate a person of ordinary skill in the art in order to make and use the present invention. It will be apparent to those skilled in the art that various modifications can be readily made to these embodiments and the generic principles described herein may be applied to other embodiments without the use of the inventive faculty. Therefore, the present invention is not limited to the above-described embodiments, and those skilled in the art, based on the present disclosure, should make improvements and modifications without departing from the scope of the present invention.
Claims (5)
1. The jig for assembling the notebook heat dissipation foam is characterized by comprising a jig lower plate (1), a jig cover plate (2) arranged on the jig lower plate (1) and a foam assembly (12) arranged on the jig cover plate (2), wherein a ceramic clamping groove (3) matched with ceramic is formed in the jig cover plate (2), and the ceramic clamping groove (3) corresponds to the foam (4) in the foam assembly (12);
the jig lower plate (1) is provided with a guide post (5), and the jig cover plate (2) is provided with a jig cover plate positioning hole (6) matched with the guide post (5);
the foam assembly (12) comprises an upper release film (7) arranged on the jig cover plate (2) and foam (4) arranged on the lower surface of the upper release film (7);
a lower release film (10) is arranged between the lower jig plate (1) and the cover plate (2), and a lower release film positioning hole (11) matched with the guide post (5) is formed in the lower release film (10);
the lower surface of the upper release film (7) is also provided with a foam positioning block (9);
the foam (4) corresponds to the middle of the ceramic clamping groove (3) and keeps a distance of 0.1mm from the edge of the ceramic clamping groove (3).
2. The assembly jig for the notebook heat dissipation foam is characterized in that the thickness of the lower jig plate (1) is 12-18mm, the length of the guide post (5) is 4-6mm, and the thickness of the cover plate (2) of the jig is 0.4-0.6mm.
3. The assembly jig for the notebook heat dissipation foam is characterized in that an upper release film positioning hole (8) matched with the guide post (5) is formed in the upper release film (7).
4. The assembly jig for the notebook heat dissipation foam according to claim 1, wherein the foam positioning block (9) is an L-shaped foam positioning block.
5. The method for using the assembly jig for the notebook heat dissipation foam as set forth in claim 1, wherein the method comprises the following specific steps:
firstly, aligning foam (4) with glue on two sides with a foam positioning block (9) on the surface of an upper release film (7), and accurately adhering the foam (4) on the surface of the release film (7) to form a foam assembly (12); then sequentially placing the lower release film (10) and the jig cover plate (2) on the lower jig plate (1) and positioning the lower release film through the guide posts (5), wherein the release surface of the lower release film (10) faces the jig cover plate (2); accurately placing the ceramic in a ceramic clamping groove (3) of a jig cover plate (2), applying pressure, and adhering the ceramic and a lower release film (10) together; the surface of the foam assembly (12) with the foam (4) faces the jig cover plate (2), and is placed on the jig cover plate (2) to be positioned through the guide post (5); pressing the foam assembly (12) to tightly adhere the foam (4) and the ceramic together, thereby completing the assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634905.3A CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634905.3A CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107685521A CN107685521A (en) | 2018-02-13 |
| CN107685521B true CN107685521B (en) | 2023-09-29 |
Family
ID=61151654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610634905.3A Active CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107685521B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10008939A1 (en) * | 1999-09-04 | 2001-03-29 | Gmp Co | Heating arrangement has ceramic heating arrangement on side region of upper and lower aluminum elements, temperature sensor that detects temperature of rubber coating for display |
| CN202292857U (en) * | 2011-10-10 | 2012-07-04 | 英华达（上海）科技有限公司 | Shell disassembling jig of electronic device |
| CN102729280A (en) * | 2012-07-11 | 2012-10-17 | 隆扬电子（昆山）有限公司 | Die-cutting and waste-removing jig for foam |
| CN104669601A (en) * | 2013-12-03 | 2015-06-03 | 上海景奕电子科技有限公司 | Device for assembling foam |
| CN204773957U (en) * | 2015-06-19 | 2015-11-18 | 重庆市鸿富诚电子新材料有限公司 | Be suitable for electrically conductive cloth and cotton adhesive tool of electrically conductive bubble |
| CN205364784U (en) * | 2016-03-04 | 2016-07-06 | 允昌科技(苏州)有限公司 | Apron locating pasting closes tool |
| CN205970287U (en) * | 2016-08-04 | 2017-02-22 | 南卜电子科技（上海）有限公司 | A equipment tool that is used for notebook heat dissipation bubble cotton |
-
2016
- 2016-08-04 CN CN201610634905.3A patent/CN107685521B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10008939A1 (en) * | 1999-09-04 | 2001-03-29 | Gmp Co | Heating arrangement has ceramic heating arrangement on side region of upper and lower aluminum elements, temperature sensor that detects temperature of rubber coating for display |
| CN202292857U (en) * | 2011-10-10 | 2012-07-04 | 英华达（上海）科技有限公司 | Shell disassembling jig of electronic device |
| CN102729280A (en) * | 2012-07-11 | 2012-10-17 | 隆扬电子（昆山）有限公司 | Die-cutting and waste-removing jig for foam |
| CN104669601A (en) * | 2013-12-03 | 2015-06-03 | 上海景奕电子科技有限公司 | Device for assembling foam |
| CN204773957U (en) * | 2015-06-19 | 2015-11-18 | 重庆市鸿富诚电子新材料有限公司 | Be suitable for electrically conductive cloth and cotton adhesive tool of electrically conductive bubble |
| CN205364784U (en) * | 2016-03-04 | 2016-07-06 | 允昌科技(苏州)有限公司 | Apron locating pasting closes tool |
| CN205970287U (en) * | 2016-08-04 | 2017-02-22 | 南卜电子科技（上海）有限公司 | A equipment tool that is used for notebook heat dissipation bubble cotton |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107685521A (en) | 2018-02-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190808 Address after: Room F101, 1st Floor, Building 2, 2059 Metropolitan Road, Minhang District, Shanghai 201108 Applicant after: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. Address before: 201400 South Side of Second Floor Office Area of No. 3 Standard Factory Building, No. 19 Zhenglang Road, Fengxian District, Shanghai Applicant before: NANBO ELECTRONIC TECHNOLOGY (SHANGHAI) CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |