CN107685521A - A kind of assembled fixture for laptop heat-dissipation foam - Google Patents
A kind of assembled fixture for laptop heat-dissipation foam Download PDFInfo
- Publication number
- CN107685521A CN107685521A CN201610634905.3A CN201610634905A CN107685521A CN 107685521 A CN107685521 A CN 107685521A CN 201610634905 A CN201610634905 A CN 201610634905A CN 107685521 A CN107685521 A CN 107685521A
- Authority
- CN
- China
- Prior art keywords
- foam
- tool
- cover plate
- mould release
- release membrance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000006260 foam Substances 0.000 title claims abstract description 84
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 51
- 229920000742 Cotton Polymers 0.000 claims 3
- 230000006978 adaptation Effects 0.000 claims 1
- 230000002950 deficient Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229910052573 porcelain Inorganic materials 0.000 description 5
- 239000003292 glue Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The present invention relates to a kind of assembled fixture for laptop heat-dissipation foam, the tool includes tool lower plate, the tool cover plate being arranged in tool lower plate and the foam assembly being arranged on tool cover plate, the ceramic neck being adapted with ceramics is offered on tool cover plate, the ceramic neck is corresponding with the position of foam in foam assembly, ceramics are placed in ceramic neck, ceramics is sticked together with the foam in foam assembly, that is, complete assembling.Compared with prior art, the present invention is accurately positioned using modeling tool to foam and ceramics, and after being effectively guaranteed assembling, foam is located at ceramic middle, and 0.1mm distance is kept with ceramic edge, substantially increase the accuracy of assembling, product fraction defective lower than manual assembling mode 80 or so percent, reduce production cost, it is and simple to operate, locating speed is fast, can carry out the quick assembling of batch, substantially increases the efficiency of assembling.
Description
Technical field
The invention belongs to laptop heat-dissipation technical field, is related to a kind of assembled fixture for laptop heat-dissipation foam.
Background technology
When laptop heat-dissipation foam assembles, it is necessary to which the foam of double-sides belt glue is wherein simultaneously pasted onto into ceramic surface,
Both are made to be combined into an entirety.Wherein, foam should be located at ceramic middle, and 0.1mm distance is kept with ceramic edge.
Prior art is assembled using manual mode more, when assembling by hand, the 0.1mm spacing of foam and ceramic edge
Be difficult to control, thus the fraction defective of product is very high, and because foam is very fragile, if once not assembling successfully, just without
Method is done over again, and can only directly be scrapped, and substantially increases the cost of production.
The content of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide one kind assembling accuracy is high
The assembled fixture for laptop heat-dissipation foam.
The purpose of the present invention can be achieved through the following technical solutions：
A kind of assembled fixture for laptop heat-dissipation foam, the tool include tool lower plate, are arranged in tool lower plate
Tool cover plate and the foam assembly that is arranged on tool cover plate, offer on described tool cover plate and be adapted with ceramics
Ceramic neck, the ceramic neck is corresponding with the position of foam in foam assembly, and ceramics are placed in ceramic neck, make pottery
Porcelain sticks together with the foam in foam assembly, that is, completes assembling.
The shape and size of described ceramic neck are consistent with ceramics, and ceramics are tightly blocked, improve the precision of assembling.
Foam in described foam assembly corresponds to the middle of ceramic neck, and with ceramic pocket edges keep 0.1mm away from
From.
Described tool lower plate is provided with guide pillar, and the tool cover plate being adapted with guide pillar is offered on described tool cover plate
Positioning hole.
The thickness of described tool lower plate is 12-18mm, and the length of described guide pillar is 4-6mm, described tool cover plate
Thickness be 0.4-0.6mm.Described guide pillar is molded by Digit Control Machine Tool milling, and precision is high.
Described foam assembly includes the upper mould release membrance being arranged on tool cover plate and is arranged on mould release membrance following table
The foam in face.
The upper mould release membrance positioning hole being adapted with guide pillar is offered on described upper mould release membrance.
The lower surface of described upper mould release membrance is additionally provided with foam locating piece.The foam locating piece is preset under mould release membrance
Surface, for being accurately positioned to foam.
Described foam locating piece is L-type foam locating piece.The L-type foam locating piece two sides adjacent to foam are carried out
Positioning, to improve the positioning precision of foam.
Lower mould release membrance is provided between described tool lower plate and tool cover plate, offers on the lower mould release membrance and is mutually fitted with guide pillar
The lower mould release membrance positioning hole matched somebody with somebody.Described lower mould release membrance keeps apart ceramics with tool lower plate, can cling ceramics, prevents because of pottery
Porcelain rocks and influences the precision of assembling, while is easy to peel off on ceramics again.
The present invention incites somebody to action in practical application, first by the foam locating piece on mould release membrance surface in the foam alignment of double-sides belt glue
Foam is accurately bonded at mould release membrance surface, forms foam assembly；Then lower mould release membrance, tool cover plate are placed on tool successively
In lower plate, and positioned by guide pillar, wherein, the layer upper surface of lower mould release membrance is towards tool cover plate；Ceramic accurate be placed on is controlled
In the ceramic neck for having cover plate, and apply pressure, sticked together ceramic with lower mould release membrance；Foam assembly is had the one of foam
Facing to tool cover plate, and it is placed on tool cover plate, is positioned by guide pillar；Foam assembly is pressed, by foam and pottery
Porcelain tightly sticks together, that is, completes assembling.
Compared with prior art, the invention has the characteristics that：
1) foam and ceramics are accurately positioned using modeling tool, after being effectively guaranteed assembling, foam is positioned at pottery
Porcelain middle, and 0.1mm distance is kept with ceramic edge, the accuracy of assembling is substantially increased, product fraction defective is than by hand
Assembling mode low percent 80 or so, reduces production cost；
2) simple to operate, locating speed is fast, can carry out the quick assembling of batch, substantially increases the efficiency of assembling.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the present invention；
Fig. 2 is the structural representation of tool lower plate in the present invention；
Fig. 3 is the structural representation of lower mould release membrance in the present invention；
Fig. 4 is the structural representation of tool cover plate in the present invention；
Fig. 5 is the structural representation of foam assembly in the present invention；
Description of symbols in figure：
1-tool lower plate, 2-tool cover plate, 3-ceramic neck, 4-foam, 5-guide pillar, the positioning of 6-tool cover plate
Hole, the upper mould release membrance positioning hole of 7-upper mould release membrance, 8-, 9-foam locating piece, 10-lower mould release membrance, 11-lower mould release membrance positioning
Hole, 12-foam assembly.
Embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.The present embodiment is with technical solution of the present invention
Premised on implemented, give detailed embodiment and specific operating process, but protection scope of the present invention is not limited to
Following embodiments.
Embodiment 1：
A kind of assembled fixture for laptop heat-dissipation foam as shown in Figure 1, the tool include tool lower plate 1, set
Tool cover plate 2 in tool lower plate 1 and the foam assembly 12 being arranged on tool cover plate 2, offer on tool cover plate 2
The ceramic neck 3 being adapted with ceramics, the shape and size of ceramic neck 3 are consistent with ceramics, ceramic neck 3 and foam assembly
The position of foam 4 is corresponding in 12, and foam 4 corresponds to the middle of ceramic neck 3, and keeps 0.1mm with the ceramic edge of neck 3
Distance.Ceramics are placed in ceramic neck 3, ceramics is sticked together with the foam 4 in foam assembly 12, i.e. completion group
Dress.
As shown in Fig. 2 tool lower plate 1 is provided with guide pillar 5, fitted as shown in figure 4, being offered on tool cover plate 2 with the phase of guide pillar 5
The tool cover plate positioning hole 6 matched somebody with somebody.The thickness of tool lower plate 1 is 15mm, and the length of guide pillar 5 is 5mm, and the thickness of tool cover plate 2 is
0.5mm.As shown in figure 5, foam assembly 12 includes the upper mould release membrance 7 being arranged on tool cover plate 2 and is arranged on release
The foam 4 of the lower surface of film 7.The upper mould release membrance positioning hole 8 being adapted with guide pillar 5 is offered on upper mould release membrance 7.Upper mould release membrance 7
Lower surface is additionally provided with foam locating piece 9.Foam locating piece 9 is L-type foam locating piece.Set between tool lower plate 1 and tool cover plate 2
There is lower mould release membrance 10, as shown in figure 3, offering the lower mould release membrance positioning hole 11 being adapted with guide pillar 5 on lower mould release membrance 10.
Tool, will in practical application, the foam 4 of double-sides belt glue to be first aligned to the foam locating piece 9 on the upper surface of mould release membrance 7
Foam 4 is accurately bonded at the surface of mould release membrance 7, composition foam assembly 12；Then lower mould release membrance 10, tool cover plate 2 are put successively
Put in tool lower plate 1, and positioned by guide pillar 5, wherein, the layer upper surface of lower mould release membrance 10 is towards tool cover plate 2；Will pottery
Porcelain is accurately placed in the ceramic neck 3 of tool cover plate 2, and applies pressure, is sticked together ceramic with lower mould release membrance 10；By foam
Assembly 12 has the one of foam 4 facing to tool cover plate 2, and is placed on tool cover plate 2, is positioned by guide pillar 5；Pressing
Foam assembly 12, foam 4 and ceramics are tightly sticked together, that is, complete assembling.
Embodiment 2：
In the present embodiment, the thickness of tool lower plate 1 is 12mm, and the length of guide pillar 5 is 4mm, and the thickness of tool cover plate 2 is
0.4mm, remaining is the same as embodiment 1.
Embodiment 3：
In the present embodiment, the thickness of tool lower plate 1 is 18mm, and the length of guide pillar 5 is 6mm, and the thickness of tool cover plate 2 is
0.6mm, remaining is the same as embodiment 1.
The above-mentioned description to embodiment is understood that for ease of those skilled in the art and using invention.
Person skilled in the art obviously can easily make various modifications to these embodiments, and described herein general
Principle is applied in other embodiment without by performing creative labour.Therefore, the invention is not restricted to above-described embodiment, ability
Field technique personnel do not depart from improvement that scope made and modification all should be the present invention's according to the announcement of the present invention
Within protection domain.
Claims (8)
1. a kind of assembled fixture for laptop heat-dissipation foam, it is characterised in that the tool includes tool lower plate (1), set
Tool cover plate (2) in tool lower plate (1) and the foam assembly (12) being arranged on tool cover plate (2), described controls
The ceramic neck (3) being adapted with ceramics is offered on tool cover plate (2), the ceramic neck (3) in foam assembly (12) with steeping
The position of cotton (4) is corresponding, and ceramics are placed in ceramic neck (3), makes ceramics and the foam (4) in foam assembly (12) viscous
Together, that is, assembling is completed.
2. a kind of assembled fixture for laptop heat-dissipation foam according to claim 1, it is characterised in that described controls
Tool lower plate (1) is provided with guide pillar (5), and the tool cover plate positioning being adapted with guide pillar (5) is offered on described tool cover plate (2)
Hole (6).
3. a kind of assembled fixture for laptop heat-dissipation foam according to claim 2, it is characterised in that described controls
The thickness for having lower plate (1) is 12-18mm, and the length of described guide pillar (5) is 4-6mm, and the thickness of described tool cover plate (2) is
0.4-0.6mm。
A kind of 4. assembled fixture for laptop heat-dissipation foam according to claim 2, it is characterised in that described bubble
Cotton assembly (12) includes the upper mould release membrance (7) being arranged on tool cover plate (2) and is arranged on mould release membrance (7) lower surface
Foam (4).
5. a kind of assembled fixture for laptop heat-dissipation foam according to claim 4, it is characterised in that described is upper
The upper mould release membrance positioning hole (8) being adapted with guide pillar (5) is offered on mould release membrance (7).
6. a kind of assembled fixture for laptop heat-dissipation foam according to claim 4, it is characterised in that described is upper
The lower surface of mould release membrance (7) is additionally provided with foam locating piece (9).
A kind of 7. assembled fixture for laptop heat-dissipation foam according to claim 6, it is characterised in that described bubble
Cotton locating piece (9) is L-type foam locating piece.
8. a kind of assembled fixture for laptop heat-dissipation foam according to claim 2, it is characterised in that described controls
Lower mould release membrance (10) is provided between tool lower plate (1) and tool cover plate (2), is offered on the lower mould release membrance (10) and guide pillar (5) phase
The lower mould release membrance positioning hole (11) of adaptation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634905.3A CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610634905.3A CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107685521A true CN107685521A (en) | 2018-02-13 |
| CN107685521B CN107685521B (en) | 2023-09-29 |
Family
ID=61151654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610634905.3A Active CN107685521B (en) | 2016-08-04 | 2016-08-04 | A equipment tool for notebook heat dissipation bubble is cotton |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107685521B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10008939A1 (en) * | 1999-09-04 | 2001-03-29 | Gmp Co | Heating arrangement has ceramic heating arrangement on side region of upper and lower aluminum elements, temperature sensor that detects temperature of rubber coating for display |
| CN202292857U (en) * | 2011-10-10 | 2012-07-04 | 英华达（上海）科技有限公司 | Shell disassembling jig of electronic device |
| CN102729280A (en) * | 2012-07-11 | 2012-10-17 | 隆扬电子（昆山）有限公司 | Die-cutting and waste-removing jig for foam |
| CN104669601A (en) * | 2013-12-03 | 2015-06-03 | 上海景奕电子科技有限公司 | Device for assembling foam |
| CN204773957U (en) * | 2015-06-19 | 2015-11-18 | 重庆市鸿富诚电子新材料有限公司 | Be suitable for electrically conductive cloth and cotton adhesive tool of electrically conductive bubble |
| CN205364784U (en) * | 2016-03-04 | 2016-07-06 | 允昌科技(苏州)有限公司 | Apron locating pasting closes tool |
| CN205970287U (en) * | 2016-08-04 | 2017-02-22 | 南卜电子科技（上海）有限公司 | A equipment tool that is used for notebook heat dissipation bubble cotton |
-
2016
- 2016-08-04 CN CN201610634905.3A patent/CN107685521B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10008939A1 (en) * | 1999-09-04 | 2001-03-29 | Gmp Co | Heating arrangement has ceramic heating arrangement on side region of upper and lower aluminum elements, temperature sensor that detects temperature of rubber coating for display |
| CN202292857U (en) * | 2011-10-10 | 2012-07-04 | 英华达（上海）科技有限公司 | Shell disassembling jig of electronic device |
| CN102729280A (en) * | 2012-07-11 | 2012-10-17 | 隆扬电子（昆山）有限公司 | Die-cutting and waste-removing jig for foam |
| CN104669601A (en) * | 2013-12-03 | 2015-06-03 | 上海景奕电子科技有限公司 | Device for assembling foam |
| CN204773957U (en) * | 2015-06-19 | 2015-11-18 | 重庆市鸿富诚电子新材料有限公司 | Be suitable for electrically conductive cloth and cotton adhesive tool of electrically conductive bubble |
| CN205364784U (en) * | 2016-03-04 | 2016-07-06 | 允昌科技(苏州)有限公司 | Apron locating pasting closes tool |
| CN205970287U (en) * | 2016-08-04 | 2017-02-22 | 南卜电子科技（上海）有限公司 | A equipment tool that is used for notebook heat dissipation bubble cotton |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107685521B (en) | 2023-09-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190808 Address after: Room F101, 1st Floor, Building 2, 2059 Metropolitan Road, Minhang District, Shanghai 201108 Applicant after: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. Address before: 201400 South Side of Second Floor Office Area of No. 3 Standard Factory Building, No. 19 Zhenglang Road, Fengxian District, Shanghai Applicant before: NANBO ELECTRONIC TECHNOLOGY (SHANGHAI) CO.,LTD. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee after: Shanghai Haobai Zhizao Precision Electronics Co.,Ltd. Address before: 201108 the 1 story 1F101 room 2, 2059 metropolitan Road, Minhang District, Shanghai. Patentee before: HOPINES ELECTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |