CN107665836A - Fluid process treatment device - Google Patents
Fluid process treatment device Download PDFInfo
- Publication number
- CN107665836A CN107665836A CN201710574742.9A CN201710574742A CN107665836A CN 107665836 A CN107665836 A CN 107665836A CN 201710574742 A CN201710574742 A CN 201710574742A CN 107665836 A CN107665836 A CN 107665836A
- Authority
- CN
- China
- Prior art keywords
- substrate
- height
- parameter
- difference
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims description 47
- 239000000758 substrate Substances 0.000 claims abstract description 99
- 239000007788 liquid Substances 0.000 claims abstract description 53
- 238000012545 processing Methods 0.000 claims abstract description 45
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 241001269238 Data Species 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 9
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 238000011084 recovery Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Abstract
A fluid processing apparatus. The fluid processing device comprises a device main body, a parameter obtaining module and a height adjusting module. The device main body comprises a substrate bearing unit and a liquid collecting unit, wherein the substrate bearing unit is used for bearing a substrate, and the liquid collecting unit is arranged around the substrate bearing unit. The parameter obtaining module is electrically connected with the device main body and obtains substrate parameters of the substrate. The height adjusting module is electrically connected with the parameter obtaining module so as to adjust the height difference between the substrate bearing unit and the liquid collecting unit according to the substrate parameters.
Description
Technical field
The present invention on a kind of fluids process processing unit, on one kind according to substrate parameter adjustment base plate carrying unit with
Difference in height improves the fluids process processing unit of the treatment fluid rate of recovery between liquid collecting unit.
Background technology
The processing unit of semiconductor substrate collects the treatment fluid of ring collection semiconductor chip, prior art using lifting mostly
For using the collector unit that ring is collected comprising multiple liquid, the plurality of liquid, which collects ring, to utilize elevating mechanism to drive with relative
Lifting start is carried out, ring is collected so that particular liquid when carrying out different liquids collection, can be lifted in advance, makes liquid runs down respectively liquid
The guiding that body collects ring is discharged by the respectively discharging tube below the collection ring.
However as the fast development of science and technology, to adapt to different process or package application, the kenel of semiconductor chip also by
Gradually polynary, the processing unit of the semiconductor substrate so used at present does not develop into the kenel for different semiconductor chips to adjust
Liquid collects the technology of the height of ring, only fixed each collection ring adjustable height in whole semiconductor processing device, causes to handle
Device can not accurate alignment processing for the semiconductor chip of different kenels so that the treatment fluid rate of recovery drop of semiconductor chip
It is low, therefore have improved necessity.
The content of the invention
The main object of the present invention is providing one kind according to substrate parameter adjustment base plate carrying unit and liquid collecting unit
Between difference in height improve the fluids process processing unit of the treatment fluid rate of recovery.
To reach above-mentioned purpose, fluids process processing unit of the invention includes apparatus main body, parameter obtain module with
And height adjusting module.Apparatus main body includes base plate carrying unit and liquid collecting unit, wherein base plate carrying unit to
Bearing substrate, liquid collecting unit are compassingly set at base plate carrying unit.Parameter obtains module electrical connection device main body, parameter
Obtain the substrate parameter that module obtains substrate.Height adjusting module is electrically connected with parameter and obtains module, so as to according to substrate parameter
Adjust difference in height between base plate carrying unit and liquid collecting unit.
Obtain height adjusting module that module is electrically connected with according to substrate parameter using with parameter, by base plate carrying unit with
Difference in height is adjusted to the optimum height of counterpart substrate parameter between liquid collecting unit, you can improves the fluids process processing of the present invention
The treatment fluid rate of recovery of device.
Brief description of the drawings
Fig. 1 is the hardware architecture diagram of the fluids process processing unit of the present invention.
Fig. 2 is the diagrammatic cross-section of the fluids process processing unit of the present invention.
Fig. 3 is put into the profile of the substrate of different kenels from Fig. 4 fluids process processing units.
Wherein reference is:
Fluids process processing unit 1,1a apparatus main bodies 10
The base plate carrying unit 12 of pedestal 11
The liquid collecting unit 14 of rotation motor 13
Collect the parameter of ring 141,142,143 and obtain module 20
The drive device 31 of height adjusting module 30
The drive device 312 of first driving means 311 second
The difference in height database 33 of control module 32
Substrate 100,100a, 100b difference in height D1, D2, D3
Embodiment
Your, for juror can be allowed to know more about the technology contents of the present invention, it is described as follows especially exemplified by preferred embodiment.
Below please also refer to hardware architecture diagrams of the Fig. 1 to Fig. 4 on the fluids process processing unit of the present invention, fluids process processing dress
The diagrammatic cross-section and fluids process processing unit put are put into the profile of the substrate of different kenels.
As shown in figure 1, the fluids process processing unit 1 of the present invention is applied to a handling process of substrate 100, wherein at this
The substrate 100 of embodiment is semiconductor chip, and handling process is in the surface confession in fluids process processing unit 1 to substrate 100
The processing routine such as it is etched, cleans to treatment fluid (such as chemicals or deionized water etc.), and handles and fill by fluids process
Put 1 collection, discharge opeing, the used treatment fluid of recovery.
In the present embodiment, fluids process processing unit 1 includes apparatus main body 10, parameter obtains module 20 and height is adjusted
Mould preparation block 30, wherein apparatus main body 10 include pedestal 11, base plate carrying unit 12, rotation motor 13 and liquid collecting unit
14.To bearing substrate 100, liquid collecting unit 14 is about cylindric and is compassingly set at substrate and holds base plate carrying unit 12
Carrier unit 12, in the present embodiment, liquid collecting unit 14 include 3 collection rings 141,142,143, but the present invention not as
Limit, the number for the collection ring that liquid collecting unit 14 includes can change design according to different demands.
As shown in figure 1, parameter obtains the electrical connection device main body 10 of module 20, parameter obtains module 20 to obtain substrate
100 substrate parameter.According to a particular embodiment of the invention, it can be optical measuring device, substrate ginseng that parameter, which obtains module 20,
Number input interface or parameter database.When it is optical measuring device that parameter, which obtains module 20, base is examined using optical sensor
The device of the kenel of plate 100, and optical measuring device can be complete module and be installed in fluids process processing unit 1, or in
Before substrate 100 is placed in base plate carrying unit 12, the substrate parameter that optical measuring device obtains substrate 100 is advanced with.Work as parameter
When acquirement module 20 is substrate parameter input interface, substrate parameter input interface can be that fluids process processing unit 1 is built-in
Parameter input interface, operator are manually entered substrate parameter.When parameter obtain module 20 be parameter database when, then must in advance by
The related substrate parameter of the substrate 100 of various different kenels, a parameter database is established for operation selection substrate parameter, and this joins
Number database can be stored directly in the built-in internal memory of fluids process processing unit 1, or is stored in and can be handled with fluids process
In the online external server of device 1.Wherein substrate parameter can be various different kenels, example:Type, the technique of pending substrate
Pattern, the flow speed characteristic of alignment processing liquid water, alignment processing liquid water splash characteristic, shape, size, thickness or angularity at least
One.
As shown in Fig. 2, Fig. 3 and Fig. 4, when the present invention fluids process processing unit 1 operate when, substrate 100,100a,
100b is with the synchronous axial system of rotation motor 13, the now substrate 100 of different kenels, 100a, 100b (example:Different-thickness or angularity
Substrate) by centrifugal force substrate surface process liquid can be caused to depart from substrate 100,100a, 100b height differ, therefore each
Substrate 100,100a, 100b have corresponding treatment fluid optimum recovery area between base plate carrying unit 12 and liquid collecting unit 14
Section, therefore parameter need to be utilized to obtain module 20 and obtain substrate 100,100a, 100b substrate parameter, and obtain module using with parameter
20 be electrically connected with height adjusting modules 30, according to substrate parameter by between base plate carrying unit 12 and liquid collecting unit 14 height
Difference adjust to should substrate parameter optimum height, you can improve the present invention fluids process processing unit 1 treatment fluid return
Yield.
According to the specific embodiment of the present invention, height adjusting module 30 includes drive device 31 and control module 32,
Wherein as shown in Figures 1 and 2, control module 32 is electrically connected with drive device 31.According to one embodiment of the invention, height adjusts
A difference in height database 33 is stored in module 30, the substrate that the difference in height database 33 stores corresponding to each substrate parameter is held
Height difference data between carrier unit 12 and liquid collecting unit 14, after 30 As-received board parameter of height adjusting module, control mould
Block 32 can find base plate carrying unit 12 corresponding with the specific substrate parameter and liquid collecting unit 14 according to substrate parameter
Between height difference data, then control drive device 31 by between base plate carrying unit 12 and liquid collecting unit 14 difference in height adjust
To the difference in height.
It is substrate parameter input interface or supplemental characteristic when parameter obtains module 20 according to the specific embodiment of the present invention
During storehouse, operator, which adopts, is manually entered substrate parameter or operation selection substrate parameter, when the As-received board parameter of height adjusting module 30
Afterwards, so as to according to the difference in height between substrate parameter adjustment base plate carrying unit 12 and the liquid collecting unit 14, wherein height is adjusted
Mould preparation block 30 can be that automatic execution or operator manually perform confirmation.
Herein it is noted that according to a particular embodiment of the invention, height adjusting module 30 can adjust substrate respectively and hold
The height of carrier unit 12 and liquid collecting unit 14 and form the difference in height of corresponding particular substrate parameter.Or height adjustment mould
Block 30 individually adjusts base plate carrying unit 12 or only individually adjusts the height of liquid collecting unit 14 and form corresponding specific base
The difference in height of board parameter.In addition, height adjusting module 30 can be held in the starting stage of handling process or interstage adjustment substrate
Difference in height between carrier unit 12 and liquid collecting unit 14.
According to one of present invention specific embodiment, height adjusting module 30 includes drive device 31 and control module 32,
Wherein as shown in Figures 1 and 2, drive device 31 includes first driving means 311, and control module 32 is electrically connected with the first driving dress
311 are put, first driving means 311 are arranged at pedestal 11, and are connected setting with base plate carrying unit 12, can adjust mould according to height
Block 30 adjusts the height of base plate carrying unit 12 and forms the difference in height of corresponding particular substrate parameter.In this embodiment, liquid is received
Collection unit 14 only lifts a specific collection ring (collect ring 141, collect ring 142 or collect ring 143) to a preset height fixed.
According to the another specific embodiment of the present invention, wherein as shown in Figure 3 and Figure 4, drive device 31 includes the second driving
Device 312, control module 32 are electrically connected with the second drive device 312, and the second drive device 312 is fixed on pedestal 11, and and liquid
The connection of body collector unit 14 is set, and the height of liquid collecting unit 14 can be adjusted according to height adjusting module 30, and is formed corresponding
The difference in height of particular substrate parameter, wherein a specific collection ring (collect ring 141, collect ring 142 or collect ring 143) must be lifted extremely
The difference in height of corresponding particular substrate parameter.Driving second device 312 wherein corresponding to liquid collecting unit 14 can be single drive
Dynamic device or corresponding each collection ring (example:Collect ring 141, collect ring 142 or collect ring 143) multiple independent driving devices.
This embodiment, base plate carrying unit 12 are fixed on a preset height.
According to the another specific embodiment of the present invention, wherein as shown in Figure 3 and Figure 4, drive device 31 includes the first driving
The drive device 312 of device 311 and second, control module 32 are electrically connected with the drive device 312 of first driving means 311 and second,
First driving means 311 are fixed on pedestal 11, and setting is connected with base plate carrying unit 12, and the second drive device 312 is fixed on
Pedestal 11, and setting is connected with liquid collecting unit 14, height adjusting module 30 adjusts base plate carrying unit 12 and liquid respectively
The height of collector unit 14 and the difference in height for forming corresponding particular substrate parameter.
Height adjusting module 30 adjusts the height of liquid collecting unit 14, and forms the height of corresponding particular substrate parameter
Difference, a specific collection ring (collect ring 141, collect ring 142 or collect ring 143) must be lifted to the height of corresponding particular substrate parameter
Difference.A specific collection ring is wherein lifted to the difference in height of corresponding particular substrate parameter, can be directly to lift to a corresponding specific base
The difference in height of board parameter adjusts lifting to corresponding after first lifting to a preset height fixed according to height adjusting module 30 again
The difference in height of particular substrate parameter.
As shown in Fig. 2, Fig. 3 and Fig. 4, to coordinate substrate 100,100a, 100b kenel, the control of height adjusting module 30
Module 32 receives base plate carrying unit 12 and liquid through drive device 31 according to the substrate parameter of substrate 100,100a, 100b
Difference in height between collection unit 14 is adjusted to D1, D2, D3, so as to corresponding from different substrates 100,100a, 100b, thereby improves not
Substrate 100 together, the organic efficiency of 100a, 100b treatment fluid.In the present embodiment, drive device 31 is stepper motor, control
Module 32 can be microprocessor, control chip or hardware unit, software program, firmware (firmware) in addition to aforementioned hardware
Or its combination is outer, can also be configured by circuit loop or other appropriate patterns.Substrate 100,100a, 100b thickness or angularity in
It is only to illustrate in figure, rather than is limited to embodiment.
As shown in Fig. 2, Fig. 3 and Fig. 4, the liquid collecting unit 14 of the present embodiment includes multiple collection rings 141,142,143,
According to substrate driving parameter, the drive device 31 adjusts multiple liters for collecting rings 141,142, one of 143 to control module 32
Drop, different types for the treatment of fluid is reclaimed to coordinate, how this adjusts the adjustable height for collecting ring 141,142,143, or is adjusted
Collection ring 141,142,143 number, can be directed to particular liquid collect when, lift specific collection ring difference in height or can be by controlling
Molding block 32 is adjusted according to the height difference data in storage difference in height database 33.
Herein it is noted that in the present embodiment, the difference in height that Fig. 2, Fig. 3 and Fig. 4 are illustrated is base plate carrying unit 12
With collecting the difference in height between ring 141.A spy is so being carried out according to the specific embodiment of the present invention, fluids process processing unit 1
When determining liquid collection, a specific collection ring (collect ring 141, collect ring 142 or collect ring 143), and control module must be lifted
32 according to the substrate driving parameter drive device 31 adjustment specific collection ring (such as:Ring 141 is collected, collect ring 142 or collects ring
143) or base plate carrying unit 12 lifting formed a difference in height.
It is noted that above are only embodiment, rather than it is limited to embodiment.For example this does not depart from basic framework of the present invention
Person, the interest field that this patent is advocated all is should be, and should be defined by right.
Claims (13)
1. a kind of fluids process processing unit, the handling process applied to a substrate, it is characterised in that fluids process processing
Device includes:
One apparatus main body, including a base plate carrying unit and a liquid collecting unit, wherein the base plate carrying unit are holding
The substrate is carried, the liquid collecting unit is compassingly set at the base plate carrying unit;
One parameter obtains module, is electrically connected with the apparatus main body, and the parameter obtains the substrate parameter that module obtains the substrate;With
And
One height adjusting module, it is electrically connected with the parameter and obtains module, so as to according to the substrate parameter adjustment base plate carrying list
Difference in height between member and the liquid collecting unit.
2. fluids process processing unit as claimed in claim 1, it is characterised in that the height adjusting module is in the handling process
A starting stage or an interstage adjust the difference in height.
3. the fluids process processing unit as described in claim the 1, it is characterised in that it is an optics that the parameter, which obtains module,
Measurement apparatus, a substrate parameter input interface or a parameter database.
4. fluids process processing unit as claimed in claim 1, it is characterised in that the height adjusting module includes a driving and filled
Put and a control module, the wherein control module are electrically connected with the drive device, the control module is driven according to the substrate parameter
The dynamic drive device adjusts the difference in height between the base plate carrying unit and the liquid collecting unit.
5. fluids process processing unit as claimed in claim 4, it is characterised in that the height adjusting module includes a difference in height
Database, difference in height database storage is respectively between base plate carrying unit and the liquid collecting unit corresponding to the substrate parameter
A height difference data, wherein after the height adjusting module receives the substrate parameter, the control module is found and the substrate is joined
After the corresponding height difference datas of number, then drive the drive device according to the difference in height data point reuse base plate carrying unit with
Difference in height between the liquid collecting unit.
6. fluids process processing unit as claimed in claim 4, it is characterised in that the drive device includes one first driving and filled
Put, the control module adjusts the lifting of the base plate carrying unit according to the substrate driving parameter first driving means, to be formed
The difference in height.
7. fluids process processing unit as claimed in claim 4, it is characterised in that the drive device includes one second driving and filled
Put, the liquid collecting unit includes multiple collection rings, and the control module according to the substrate driving parameter, adjust by second drive device
The whole the plurality of lifting for collecting ring, to form the difference in height.
8. fluids process processing unit as claimed in claim 7, it is characterised in that when carrying out particular liquid collection, rise
One specific collection ring drops, and according to the substrate driving parameter, second drive device adjusts the specific collection ring to the control module
Lifting, to form the difference in height.
9. fluids process processing unit as claimed in claim 8, it is characterised in that lift the specific collection ring to should base
Board parameter, for directly lifting to the difference in height.
10. fluids process processing unit as claimed in claim 8, it is characterised in that lift the specific collection ring to should
Substrate parameter, it is first to lift to a preset height fixed, then is lifted according to the substrate parameter adjustment to the difference in height.
11. fluids process processing unit as claimed in claim 4, it is characterised in that the drive device includes one first driving
Device and one second drive device, the control module drive the first driving means to adjust the substrate respectively according to the substrate parameter
The lifting of load bearing unit and second drive device is driven to adjust the lifting of the liquid collecting unit, to be formed to should substrate
The difference in height of parameter.
12. fluids process processing unit as claimed in claim 1, it is characterised in that the substrate parameter includes an at least substrate
Thickness or a substrate warp degree.
13. fluids process processing unit as claimed in claim 1, it is characterised in that the substrate parameter should including at least one pair of
The splash characteristic of the flow speed characteristic for the treatment of fluid water or a corresponding treatment fluid water.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105123712 | 2016-07-27 | ||
TW105123712 | 2016-07-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107665836A true CN107665836A (en) | 2018-02-06 |
CN107665836B CN107665836B (en) | 2019-10-11 |
Family
ID=61122219
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710574742.9A Active CN107665836B (en) | 2016-07-27 | 2017-07-14 | Fluid process treatment device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN107665836B (en) |
TW (1) | TWI646575B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111146122A (en) * | 2019-12-26 | 2020-05-12 | 厦门通富微电子有限公司 | Liquid collection device, developing/etching machine table and developing/etching method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090012054A (en) * | 2007-07-26 | 2009-02-02 | 도쿄엘렉트론가부시키가이샤 | Substrate transfer module and substrate process system |
TW201544895A (en) * | 2014-02-26 | 2015-12-01 | Tokyo Electron Ltd | Substrate processing method, program, computer-readable storage medium, and substrate processing system |
CN204991662U (en) * | 2015-01-22 | 2016-01-20 | 辛耘企业股份有限公司 | Fluid process treatment device |
-
2017
- 2017-06-29 TW TW106121840A patent/TWI646575B/en active
- 2017-07-14 CN CN201710574742.9A patent/CN107665836B/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090012054A (en) * | 2007-07-26 | 2009-02-02 | 도쿄엘렉트론가부시키가이샤 | Substrate transfer module and substrate process system |
TW201544895A (en) * | 2014-02-26 | 2015-12-01 | Tokyo Electron Ltd | Substrate processing method, program, computer-readable storage medium, and substrate processing system |
CN204991662U (en) * | 2015-01-22 | 2016-01-20 | 辛耘企业股份有限公司 | Fluid process treatment device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111146122A (en) * | 2019-12-26 | 2020-05-12 | 厦门通富微电子有限公司 | Liquid collection device, developing/etching machine table and developing/etching method |
CN111146122B (en) * | 2019-12-26 | 2022-10-28 | 厦门通富微电子有限公司 | Liquid collection device, developing/etching machine table and developing/etching method |
Also Published As
Publication number | Publication date |
---|---|
TWI646575B (en) | 2019-01-01 |
CN107665836B (en) | 2019-10-11 |
TW201812837A (en) | 2018-04-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101153053B1 (en) | Component mounting apparatus and component mounting method | |
CN1276467C (en) | Centring mechanism, centring device, semi-coductor manufacturing device and centring method | |
US20140102616A1 (en) | Method of die bonding and apparatus thereof | |
CN103515264A (en) | Detection apparatus and detection method for wafer position | |
CN107093569B (en) | A kind of wafer locating device and reaction chamber | |
US20190259172A1 (en) | Detecting method and detecting device | |
CN103247558A (en) | Substrate processing apparatus and substrate processing method | |
KR20100137363A (en) | Liquid processing apparatus, liquid processing method and storage medium | |
KR102034820B1 (en) | Apparatus for mounting semiconductor chips on a circuit board and method of mounting semiconductor chips on a circuit using the same | |
CN107665836A (en) | Fluid process treatment device | |
US10672640B2 (en) | Semiconductor processing apparatus and semiconductor processing method | |
KR20190055374A (en) | Apparatus and Method for Coating of Flux, Apparatus and Method for Attaching of Solder Ball Using the Same | |
CN108724961B (en) | Marking device | |
US20180254221A1 (en) | Apparatus and method for wafer thinning in advanced packaging applications | |
CN208225854U (en) | A kind of silicon wafer rejecting mechanism | |
KR20210119877A (en) | Die bonding apparatus and method of manufacturing semiconductor device | |
KR20140049305A (en) | Polarization film cutting device of display panel and method thereof | |
CN216487998U (en) | Bonding strength detection device and detection platform | |
KR20160072879A (en) | Unit for measuring flowrate, Apparatus for treating substrate with the unit, and method for measuring flowrate | |
TWM564251U (en) | Cleaning apparatus | |
CN104553364B (en) | A kind of noncontact full-automatic substrate slice grouping system and laser marking device | |
TWI667081B (en) | Cleaning apparatus and method | |
CN102610544A (en) | System and method for producing devices including a semiconductor part and a non-semiconductor part | |
CN203085495U (en) | A bonding machine platform device | |
CN106298573A (en) | The method of testing of rate of etch is improved by silicon chip spinning and oscillating mechanism |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |