CN107644943A - A kind of steam oxygen blocking barrier film and preparation method thereof - Google Patents
A kind of steam oxygen blocking barrier film and preparation method thereof Download PDFInfo
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Abstract
The present invention relates to a kind of film for optical use, more particularly to a kind of steam oxygen blocking barrier film and preparation method thereof.The steam oxygen blocking barrier film includes substrate layer, first organic barrier layer, the first inorganic barrier layer, second organic barrier layer, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd inorganic barrier layer；First organic barrier layer, the first inorganic barrier layer, second organic barrier layer, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd inorganic barrier layer are sequentially overlapped in the upper surface of substrate layer.Steam oxygen blocking barrier film provided by the invention has higher barrier, heat resistance, film defect is less, thickness is uniform, and the adhesive force of barrier layer and substrate layer is preferable, excellent combination property, improves the yield of production；It applied to OLED display devices, can preferably play a protective role, improve service life of equipment.
Description
Technical field
The present invention relates to a kind of film for optical use, more particularly to a kind of steam oxygen blocking barrier film and preparation method thereof.
Background technology
In Display Technique of today, light source that liquid crystal display uses all be using one group of light emitting diode of equipment back side as
Light source, or use blue-ray LED and fluorescent RE powder to be engaged to reach the effect of display different color.The white light finally sent
Colour purity is not high, color saturation is low, can only realize 70~75%NTSC colour gamut.
With the development of technology, quantum dot membrane technology and OLED technology, larger raising colour gamut are introduced so that display is set
Standby colour gamut can reach 100% full gamut even more high, have more preferable color representation power.OLED and quantum dot are in environment
Steam and oxygen it is very sensitive, the use of Obstruct membrane is particularly important.OLED can be used for Flexible Displays, be that following one becomes greatly
Gesture, and OLED is harsher to the steam oxygen-barrier property and thermal stability requirement of Obstruct membrane.The property relationship of Obstruct membrane is shown
The performance of equipment and life-span.
At present, Obstruct membrane is mainly prepared using vacuum deposition method individual layer, and continuity defects are also easy to produce in preparation process, is made
The uniformity of standby water oxygen Obstruct membrane and poor in the adhesive force of base material is general to the barrier of steam oxygen.
The content of the invention
In order to improve the steam oxygen-barrier property of steam oxygen blocking barrier film and heat resistance, the present invention provides a kind of steam oxygen
Obstruct membrane and preparation method thereof.The steam oxygen blocking barrier film includes substrate layer, first organic barrier layer, the first inorganic resistance successively
Interlayer, second organic barrier layer, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd inorganic barrier layer.The present invention provides
Steam oxygen blocking barrier film (abbreviation water oxygen Obstruct membrane) there is higher steam oxygen-barrier property and heat resistance, available for heat it is steady
In the higher OLED display devices of qualitative requirement, it is possible to increase the service life of OLED display devices.
In order to solve the above-mentioned technical problem, the present invention provides following technical proposals：
The present invention provides a kind of steam oxygen blocking barrier film, and the steam oxygen blocking barrier film includes substrate layer successively, and first has
Machine barrier layer, the first inorganic barrier layer, second organic barrier layer, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd nothing
Machine barrier layer.
Further, described first organic barrier layer is in the upper surface of substrate layer, and first inorganic barrier layer is first
The upper surface of organic barrier layer, second organic barrier layer is in the upper surface of the first inorganic barrier layer, the second inorganic resistance
For interlayer in the upper surface of second organic barrier layer, the 3rd organic barrier layer is described in the upper surface of the second inorganic barrier layer
3rd inorganic barrier layer is in the upper surface of the 3rd organic barrier layer.
In described steam oxygen blocking barrier film, organic barrier layer is printed on substrate layer or inorganic barrier layer upper table
Face.
Further, organic barrier layer is prepared using the method for ink jet printing coating fluid, and temperature control is in 80-120
℃。
Further, in described steam oxygen blocking barrier film, the thickness of first, second, and third organic barrier layer
Respectively 1-5 μm.
Further, the thickness of described first organic barrier layer is preferably 2-4 μm.
Further, the thickness of described second organic barrier layer is preferably 2-4 μm.
Further, the thickness of the 3rd organic barrier layer is preferably 2-4 μm.
Further, the thickness of described first organic barrier layer is most preferably 2-3 μm.
Further, the thickness of described second organic barrier layer is most preferably 2-3 μm.
Further, the thickness of the 3rd organic barrier layer is most preferably 2-3 μm.
Further, in described steam oxygen blocking barrier film, the thickness of first, second, and third inorganic barrier layer
Respectively 10-200nm.
Further, the thickness of first inorganic barrier layer is preferably 100-200nm.
Further, the thickness of second inorganic barrier layer is preferably 100-200nm.
Further, the thickness of the 3rd inorganic barrier layer is preferably 100-200nm.
Further, the thickness of first inorganic barrier layer is most preferably 150-170nm.
Further, the thickness of second inorganic barrier layer is most preferably 150-170nm.
Further, the thickness of the 3rd inorganic barrier layer is most preferably 150-170nm.
Further, in described steam oxygen blocking barrier film, the substrate layer is transparent polymer film, the base material
The thickness of layer is 50-200 μm.
Further, the thickness of the substrate layer is preferably 50-150 μm.
Further, the thickness of the substrate layer is preferably 120-150 μm.
Further, the substrate layer is selected from polyethylene terephthalate (PET), PEN
Or one kind in Vingon (PVDF) (PEN).
Further, the substrate layer material is preferably PEN or PVDF.
Further, the substrate layer material is preferably PEN.
Further, in described steam oxygen blocking barrier film, the thickness of first, second, and third organic barrier layer
It is identical or different.
Further, the material of described first, second, and third organic barrier layer be selected from polyvinylidene chloride (PVDC) or
One kind in Vingon (PVDF).
Further, organic barrier layer is first configured to coating fluid (abbreviation solution), and the coating fluid includes 20%
Polyvinylidene resin, 0.5~1% levelling agent, 79-79.5% solvent.
Further, the one kind of the Polyvinylidene resin in PVDC or PVDF.
Further, the solvent is selected from toluene.
Further, the material of described first, second, and third organic barrier layer is identical or different.
Further, the material of described first organic barrier layer is preferably PVDF.
Further, the material of described second organic barrier layer is preferably PVDF.
Further, the material of the 3rd organic barrier layer is preferably PVDF.
Further, in described steam oxygen blocking barrier film, the thickness of first, second, and third inorganic barrier layer
It is identical or different.
Further, the material of first, second, and third inorganic barrier layer is selected from Si oxide (SiOx) or alumina
One kind in compound (AlOx).
Further, the material of first, second, and third inorganic barrier layer is identical or different.
Further, the material of first inorganic barrier layer is preferably SiOx.
Further, the material of second inorganic barrier layer is preferably SiOx.
Further, the material of the 3rd inorganic barrier layer is preferably SiOx.
Further, substrate layer selects PEN or PVDF, and thickness is 50-150 μm；First organic barrier layer be PVDF or
PVDC, thickness are 2-4 μm, and second organic barrier layer is PVDF or PVDC, and thickness is 2-4 μm, and the 3rd organic barrier layer is PVDF
Or PVDC, thickness are 2-4 μm；First inorganic barrier layer is SiOx or AlOx, thickness 100-200nm, the second inorganic barrier
Layer is SiOx or AlOx, and thickness 100-200nm, the 3rd inorganic barrier layer are SiOx or AlOx, thickness 100-
200nm；Above-mentioned technical proposal includes embodiment 2-4, embodiment 6-8.
Further, substrate layer selects PEN, and thickness is 100-150 μm；First, second, and third organic barrier layer is
PVDF, thickness are 2-3 μm；First, second, and third inorganic barrier layer is SiOx, and thickness is 150-170nm；Above-mentioned skill
Art scheme includes embodiment 3, embodiment 7-8.
Further, in described steam oxygen blocking barrier film, organic barrier layer is printed by the way of ink jet printing
Brush is printed on the upper surface of substrate layer in substrate layer or inorganic barrier layer upper surface, first organic barrier layer, and second is organic
Barrier layer is printed on the upper surface of the first inorganic barrier layer, and the 3rd organic barrier layer is printed on the upper table of the second inorganic barrier layer
Face.
Further, in described steam oxygen blocking barrier film, the surface roughness of the steam oxygen blocking barrier film is
0.75μm—0.92μm。
Further, in described steam oxygen blocking barrier film, the moisture-vapor transmission 3.1 of the steam oxygen blocking barrier film
×10-6g/m2·day—4.5×10-6g/m2·day。
Further, the OTR oxygen transmission rate 5.2 × 10 of the steam oxygen blocking barrier film-5g/m2·day—6.2×10-5g/
m2·day。
Further, in described steam oxygen blocking barrier film, the inorganic barrier layer is using PVD's (physical vapour deposition (PVD))
Mode sputtering sedimentation is in the upper surface of organic barrier layer；First inorganic barrier layer sputters at the upper table of first organic barrier layer
Face, the second inorganic barrier layer sputter at the upper surface of second organic barrier layer, and the 3rd inorganic barrier layer sputters at the 3rd organic resistance
The upper surface of interlayer.
Further, described PVD modes are sputter coating, and the sputter coating is magnetron sputtering.
Further, the inorganic barrier layer by the way of PVD sputtering sedimentation in the surface of organic barrier layer, the system
Preparation Method comprises the steps：
(1) using first, second, and third organic barrier layer as substrate；
(2) using double target magnetic control sputterings, silicon target and aluminium target is installed on two magnetic control targets, connect intermediate frequency power supply or direct current
Source；
(3) using Ar gas as protective gas, oxygen (O is passed through in sputter procedure2) it is used as oxygen source；
(4) target as sputter power is adjusted, by identical or different target as sputter to first, second, and third organic barrier layer table
Face, obtain first, second, and third inorganic barrier layer.
Further, during inorganic barrier layer is deposited, power 150W-400W, O2Flow be 10-
32sccm, depositing temperature are 80-300 DEG C.
Further, during inorganic barrier layer is deposited, base vacuum<1×10-4Pa。
Further, the present invention provides a kind of method for preparing described steam oxygen blocking barrier film, under methods described includes
State step：
(1) substrate layer is prepared；
(2) first organic barrier layer is printed in the upper surface of substrate layer；
(3) the first inorganic barrier layer is sputtered in the upper surface of first organic barrier layer；
(4) second organic barrier layer is printed in the upper surface of the first inorganic barrier layer；
(5) the second inorganic barrier layer is sputtered in the upper surface of second organic barrier layer；
(6) the 3rd organic barrier layer is printed in the upper surface of the second inorganic barrier layer；
(7) the 3rd inorganic barrier layer is sputtered in the upper surface of the 3rd organic barrier layer.
Further, in step (2), (4) and (6)：Organic barrier layer is first configured to coating fluid, and coating fluid uses
Dispersion machine is disperseed, then by coating fluid spray printing in the upper surface of substrate layer.
Further, the jitter time of dispersion machine is 20~30min, and rotating speed is 100~200rmb/min；
Further, temperature of the coating fluid spray printing in the upper surface of substrate layer is 80-120 DEG C.
Compared with existing steam oxygen blocking barrier film, steam oxygen blocking barrier film provided by the invention have higher barrier and
It heat resistance, available for OLED display devices, can preferably play a protective role, improve service life of equipment.The present invention provides
Water oxygen Obstruct membrane be using it is organic be superimposed with inorganic barrier layer by the way of the multilayer steam oxygen blocking barrier film for preparing, have more preferable
Barrier and heat endurance；Organic barrier layer is prepared using ink jet printing, avoids the continuity being also easy to produce in preparation process
Defect, obtained film defects are less, and thickness is more uniform, and more preferable with the adhesive force of substrate layer, performance is more excellent, improves
The yield of production.The preparation method technique of steam oxygen blocking barrier film provided by the invention is simple, easily operated.
Brief description of the drawings
Fig. 1 is the structural representation of steam oxygen blocking barrier film provided by the invention.
Embodiment
For the functional character and advantage that are more readily understood the structure of the present invention and can reach, hereafter by the preferable of the present invention
Embodiment, and coordinate schema to be described below in detail：
As shown in figure 1, steam oxygen blocking barrier film provided by the invention includes substrate layer 101, first organic barrier layer
102, the first inorganic barrier layer 103, second organic barrier layer 104, the second inorganic barrier layer 105, the 3rd organic He of barrier layer 106
3rd inorganic barrier layer 107.
The preparation method of water oxygen Obstruct membrane provided by the invention comprises the following steps：
(1) substrate layer is prepared；
(2) first organic barrier layer is printed in the upper surface of substrate layer；
(3) the first inorganic barrier layer is sputtered in the upper surface of first organic barrier layer；
(4) second organic barrier layer is printed in the upper surface of the first inorganic barrier layer；
(5) the second inorganic barrier layer is sputtered in the upper surface of second organic barrier layer；
(6) the 3rd organic barrier layer is printed in the upper surface of the second inorganic barrier layer；
(7) the 3rd inorganic barrier layer is sputtered in the upper surface of the 3rd organic barrier layer.
In step (2), (4) and (6), organic barrier layer is first configured to coating fluid, and coating fluid is entered using dispersion machine
Row is scattered, by coating fluid spray printing in the upper surface of substrate layer；The jitter time of dispersion machine is 20~30min, rotating speed is 100~
200rmb/min；The temperature control in coating fluid is printed at 80-120 DEG C.
In step (3), (5) and (7), inorganic barrier layer by the way of PVD sputtering sedimentation in the upper of organic barrier layer
Surface, the preparation method comprise the steps：
(1) using first, second, and third organic barrier layer as substrate；
(2) using double target magnetic control sputterings, silicon target and aluminium target is installed on two magnetic control targets, connect intermediate frequency power supply or direct current
Source；
(3) power is 150W-400W, and using Ar gas as protective gas, O is passed through in sputter procedure2As oxygen source,
Oxygen source flow is 10-32sccm, and depositing temperature is 80-300 DEG C.
(4) by adjusting target as sputter power, by identical or different target as sputter to first, second, and third organic barrier
The upper surface of layer, obtains first, second, and third inorganic barrier layer.
Further, during inorganic barrier layer is deposited, base vacuum<1*10-4Pa。
The method of testing of the main performance of steam oxygen blocking barrier film provided by the invention is summarized as follows：
(1) barrier of steam oxygen blocking barrier film：Evaluated by moisture-vapor transmission and OTR oxygen transmission rate.Using
The water oxygen vapor permeability tester of MOCON companies, moisture-vapor transmission is tested at 23 DEG C, under conditions of 90%RH and is passed through with oxygen
Rate.The numerical value of moisture-vapor transmission and OTR oxygen transmission rate is lower, represents that the water oxygen rejection rate of steam oxygen blocking barrier film is higher, water oxygen
Barrier is better.
(2) hot and humid test：Obstruct membrane is placed on 110 DEG C, under conditions of 85%RH after 1000 hours, test barrier
The moisture-vapor transmission and OTR oxygen transmission rate of film.
(3) uniformity and planarization of barrier layer：It is thick that surface is carried out to the upper surface of barrier layer using AFM
The measurement of rugosity, surface roughness is smaller, then barrier layer more uniform ground.
(4) adhesive force of barrier layer and base material interlayer：Ply adhesion is tested using hundred lattice, by cross-cut tester, according to
ASTM D3359 standard testings.
Embodiment 1
Steam oxygen blocking barrier film provided by the invention includes substrate layer, first organic barrier layer, the first inorganic barrier layer,
Two organic barrier layers, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd inorganic barrier layer；First organic barrier layer
In the upper surface of substrate layer, first inorganic barrier layer is in the upper surface of first organic barrier layer, second organic barrier
Layer is in the upper surface of the first inorganic barrier layer, and second inorganic barrier layer is in the upper surface of second organic barrier layer, and described the
Three organic barrier layers are in the upper surface of the second inorganic barrier layer, upper table of the 3rd inorganic barrier layer in the 3rd organic barrier layer
Face.
Wherein, substrate layer selects PET, and thickness is 100 μm；First, second, and third organic barrier layer is PVDC, thickness
It is 1 μm；First, second, and third inorganic barrier layer is SiOx, and thickness is 10nm.The phase of gained steam oxygen blocking barrier film
Close performance and test result is shown in Table 1.
Embodiment 2
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PEN, and thickness is 150 μm；Firstth,
Two and the 3rd organic barrier layer is PVDF, and thickness is 2 μm；First, second, and third inorganic barrier layer is SiOx, thickness
It is 100nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Embodiment 3
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PEN, and thickness is 100 μm；Firstth,
Two and the 3rd organic barrier layer is PVDF, and thickness is 3 μm；First, second, and third inorganic barrier layer is SiOx, thickness
It is 150nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Embodiment 4
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PVDF, and thickness is 50 μm；Firstth,
Two and the 3rd organic barrier layer is PVDC, and thickness is 4 μm；First, second, and third inorganic barrier layer is AlOx, thickness
It is 200nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Embodiment 5
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PVDF, and thickness is 200 μm；Firstth,
Two and the 3rd organic barrier layer is PVDC, and thickness is 5 μm；First, second, and third inorganic barrier layer is AlOx, thickness
It is 200nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Embodiment 6
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PVDF, and thickness is 150 μm；First has
Machine barrier layer is PVDC, and thickness is 2 μm；First inorganic barrier layer is AlOx, thickness 100nm；Second organic barrier layer is
PVDF, thickness are 5 μm；Second inorganic barrier layer is SiOx, thickness 100nm；3rd organic barrier layer is PVDC, and thickness is 2 μ
m；3rd inorganic barrier layer is SiOx, thickness 100nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table
1。
Embodiment 7
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PEN, and thickness is 125 μm；Firstth,
Two and the 3rd organic barrier layer is PVDF, and thickness is 3 μm；First, second, and third inorganic barrier layer is SiOx, thickness
It is 150-170nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Embodiment 8
The steam oxygen blocking barrier film provided such as embodiment 1.Wherein, substrate layer selects PEN, and thickness is 150 μm；Firstth,
Two and the 3rd organic barrier layer is PVDF, and thickness is 2 μm；First, second, and third inorganic barrier layer is SiOx, thickness
It is 160-170nm.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Comparative example 1
The steam oxygen blocking barrier film provided such as embodiment 2.Wherein, Obstruct membrane only includes substrate layer, first organic barrier layer
With the first inorganic barrier layer.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Comparative example 2
The steam oxygen blocking barrier film provided such as embodiment 3.Wherein, Obstruct membrane only includes substrate layer, first organic barrier layer
With the first inorganic barrier layer.The correlated performance and test result of gained steam oxygen blocking barrier film are shown in Table 1.
Comparative example 3
The steam oxygen blocking barrier film provided such as embodiment 2.Wherein, organic barrier layer is prepared in base using vacuum deposition method
The upper surface of material layer or inorganic barrier layer.
Vapor passes through before and after the hot and humid test for the water oxygen Obstruct membrane that the embodiment 1-8 of table 1 and comparative example 1-3 is provided
Rate, OTR oxygen transmission rate testing result
It can be drawn from the testing result shown in table 1, the barrier of the steam oxygen blocking barrier film in the present invention is preferable, and water steams
Vapor permeability reaches 10-6, OTR oxygen transmission rate reaches 10-5, after hot and humid test, still keep higher barrier.Its
In, the combination property for the steam oxygen blocking barrier film that embodiment 2-4, embodiment 6-7 are provided is preferable：Roughness is at most 0.88 μm；
Water vapor transmittance before hot and humid test is at most 3.6 × 10-6g/m2Day, OTR oxygen transmission rate are at most 5.8 × 10-5g/
m2·day；Water vapor transmittance after hot and humid test is at most 5.8 × 10-6g/m2Day, OTR oxygen transmission rate are at most 6.2
×10-5g/m2·day。
Particularly, the combination property for the steam oxygen blocking barrier film that embodiment 3, embodiment 7-8 are provided is best：Roughness is at most
For 0.76 μm；Water vapor transmittance before hot and humid test is at most 3.2 × 10-6g/m2Day, OTR oxygen transmission rate are at most
5.2×10-5g/m2·day；Water vapor transmittance after hot and humid test is at most 5.2 × 10-6g/m2Day, oxygen pass through
Rate is at most 5.8 × 10-5g/m2·day.Compared to common steam oxygen blocking barrier film, the steam oxygen of sandwich construction in the present invention
The barrier of Obstruct membrane is more preferable, and heat resistance is stronger, so as to add the service life of display.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.It is every
The equivalent changes and modifications done according to present invention, it is encompassed by the scope of the claims of the present invention.
Claims (10)
1. a kind of steam oxygen blocking barrier film, it is characterised in that the steam oxygen blocking barrier film includes substrate layer successively, and first is organic
Barrier layer, the first inorganic barrier layer, second organic barrier layer, the second inorganic barrier layer, the 3rd organic barrier layer and the 3rd are inorganic
Barrier layer.
2. steam oxygen blocking barrier film according to claim 1, it is characterised in that organic barrier layer is printed on substrate layer
Or inorganic barrier layer upper surface.
3. steam oxygen blocking barrier film according to claim 1, it is characterised in that first, second, and third organic resistance
The thickness of interlayer is respectively 1-5 μm.
4. steam oxygen blocking barrier film according to claim 1, it is characterised in that the first, second, and third inorganic resistance
The thickness of interlayer is respectively 10-200nm.
5. steam oxygen blocking barrier film according to claim 1, it is characterised in that the substrate layer is that transparent polymer is thin
Film, the thickness of the substrate layer is 50-200 μm.
6. steam oxygen blocking barrier film according to claim 3, it is characterised in that first, second, and third organic resistance
The thickness of interlayer is identical or different.
7. steam oxygen blocking barrier film according to claim 4, it is characterised in that characterized in that, first, second He
The thickness of 3rd inorganic barrier layer is identical or different.
8. steam oxygen blocking barrier film according to claim 2, it is characterised in that organic barrier layer uses ink jet printing
Mode be printed on substrate layer or inorganic barrier layer upper surface, first organic barrier layer is printed on the upper surface of substrate layer,
Second organic barrier layer is printed on the upper surface of the first inorganic barrier layer, and the 3rd organic barrier layer is printed on the second inorganic barrier layer
Upper surface.
9. steam oxygen blocking barrier film according to claim 1, it is characterised in that the surface of the steam oxygen blocking barrier film is thick
Rugosity is 0.75 μm -0.92 μm.
10. a kind of method for preparing described steam oxygen blocking barrier film, methods described comprise the steps：
(1) substrate layer is prepared；
(2) first organic barrier layer is printed in the upper surface of substrate layer；
(3) the first inorganic barrier layer is sputtered in the upper surface of first organic barrier layer；
(4) second organic barrier layer is printed in the upper surface of the first inorganic barrier layer；
(5) the second inorganic barrier layer is sputtered in the upper surface of second organic barrier layer；
(6) the 3rd organic barrier layer is printed in the upper surface of the second inorganic barrier layer；
(7) the 3rd inorganic barrier layer is sputtered in the upper surface of the 3rd organic barrier layer.
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| CN112895660A (en) * | 2021-03-25 | 2021-06-04 | 江苏日久光电股份有限公司 | High-barrier film and preparation method thereof |
| CN114340265A (en) * | 2021-12-30 | 2022-04-12 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
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| CN112895660A (en) * | 2021-03-25 | 2021-06-04 | 江苏日久光电股份有限公司 | High-barrier film and preparation method thereof |
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Application publication date: 20180130 |