CN107624028A - A kind of high power module fin radiator suitable for multiple-variable flow device group - Google Patents
A kind of high power module fin radiator suitable for multiple-variable flow device group Download PDFInfo
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- CN107624028A CN107624028A CN201710991259.0A CN201710991259A CN107624028A CN 107624028 A CN107624028 A CN 107624028A CN 201710991259 A CN201710991259 A CN 201710991259A CN 107624028 A CN107624028 A CN 107624028A
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Abstract
A kind of high power module fin radiator suitable for multiple-variable flow device group, it is made up of radiating bottom plate and some radiating fins, multigroup high power module is in close contact by the contact surface at the top of heat-radiating substrate and radiating bottom plate, the underface of power model is source center, the fin centered on the radiating fin of source center, the radiating fin of central fins both sides centered on the central fins, thickness outwards gradually it is thinning, spacing is gradually thinning, twice of fin thickness centered on the thickness of radiating bottom plate.The present invention in source center by setting central fins, and the radiating fin of central fins both sides is arranged to centered on it, thickness outwards gradually it is thinning, spacing is gradually thinning, and radiating bottom plate thickness is set to the structure of twice of central fins thickness, solve the problems, such as that central temperature is too high, two sides temperature is relatively low, the level and vertical heat conduction ability of radiator are improved, center maximum temperature is effectively reduced, accelerates integrally-built radiating rate and efficiency.
Description
Technical field
The present invention relates to the radiator of power model, is especially a kind of high power module wing suitable for multiple-variable flow device group
Sheet heat radiator.
Background technology
To improve the reliability and capacity of high-power brushless doubly-fed adjustable speed system, high-power brushless doubly-fed adjustable speed system is mostly
Worked by the way of multiple-variable flow device group redundancy or the series-parallel structure of high-power switch device is used in current transformer, this causes
High power device number used in high-power brushless doubly-fed adjustable speed system increases considerably.However, high-power brushless is double at present
Governing system is presented still to use using equidistant, the traditional fin radiator of equal thickness, this traditional fin radiator
During the problem of central temperature is high, two sides temperature is relatively low be present, power model radiating efficiency is very low.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of high power module fin suitable for multiple-variable flow device group and radiated
Device, solve the technical problem that traditional heat sinks radiator structure central temperature is too high, two sides temperature is relatively low, while entirety can be accelerated
The radiating rate and radiating efficiency of structure.
The present invention technical solution be to provide it is a kind of with following structure be applied to multiple-variable flow device group it is high-power
Module fin radiator, mainly it is made up of radiating bottom plate and some radiating fins being arranged on radiating bottom plate, the radiating bottom
The top surface of plate is contact surface, and multigroup high power module is in close contact by heat-radiating substrate and the contact surface, and high power module is just
Lower section is source center, wherein, the fin centered on the radiating fin of source center, the radiating fins of central fins both sides with
Centered on the central fins, thickness outwards gradually it is thinning, spacing is gradually thinning, fin is thick centered on the thickness of the radiating bottom plate
Twice of degree.
A kind of high power module fin radiator suitable for multiple-variable flow device group of the present invention, wherein, each center wing
The thickness of piece is equal, and thickness is no more than 10mm.
A kind of high power module fin radiator suitable for multiple-variable flow device group of the present invention, wherein, central fins
The radiating fin of both sides using central fins as the symmetrical distribution of symmetry axis, and the thickness ratio of each adjacent heat radiation fin be 0.7~
0.9, the thickness of most thin radiating fin is not less than 2mm.
A kind of high power module fin radiator suitable for multiple-variable flow device group of the present invention, wherein, adjacent heat radiation
The gap ratio of fin is 1.1~1.5, and the spacing of adjacent heat radiation fin is maximum to be no more than 20mm.
A kind of high power module fin radiator suitable for multiple-variable flow device group of the present invention, wherein, all radiatings
The height of fin is equal, 6~8 times of fin thickness centered on height.
After above structure, compared with prior art, a kind of high power module suitable for multiple-variable flow device group of the invention
Fin radiator has advantages below：With the thickness of radiating fin in prior art radiator and the equal difference of spacing, this hair
It is bright by setting central fins in source center, and the radiating fin of central fins both sides is arranged to using the central fins in
The heart, thickness outwards gradually it is thinning, spacing is gradually thinning, and the thickness of radiating bottom plate is set to the knot of twice of central fins thickness
Structure, the technical problem that existing heat-radiation structure for heat radiator central temperature is too high, two sides temperature is relatively low is efficiently solved, improves radiating
Level and the vertical heat conduction ability of device so that the central temperature of radiator effectively drops close to the lip temperature of radiator
The low maximum temperature at radiator center, while accelerate integrally-built radiating rate and radiating efficiency.
Brief description of the drawings
Fig. 1 is a kind of structural representation of high power module fin radiator suitable for multiple-variable flow device group of the invention；
Fig. 2 is the finite element thermal analysis flow chart of radiator of the present invention.
Embodiment
With reference to the accompanying drawings and detailed description to a kind of high power module wing suitable for multiple-variable flow device group of the invention
Sheet heat radiator is described in further detail：
As shown in figure 1, in this embodiment, a kind of high power module wing suitable for multiple-variable flow device group of the invention
Sheet heat radiator, mainly it is made up of radiating bottom plate 11 and some radiating fins 12 being arranged on radiating bottom plate 11, radiating bottom plate 11
Top surface be contact surface, multigroup high power module 10 is in close contact by heat-radiating substrate and the contact surface, high power module 10
Underface is source center, the fin 13 centered on the radiating fin 12 of source center, the radiating fin of the both sides of central fins 13
Piece 12 centered on the central fins 13, thickness outwards gradually it is thinning, spacing is gradually thinning.
The thickness of each central fins 13 is equal, and thickness is no more than 10mm, wing centered on the thickness of radiating bottom plate 11
Twice of the thickness of piece 13；The radiating fin 12 of the both sides of central fins 13 with central fins 13 for the symmetrical distribution of symmetry axis, and
The thickness ratio of each adjacent heat radiation fin 12 is 0.7~0.9, and the thickness of most thin radiating fin 12 is not less than 2mm；Adjacent heat radiation fin
12 gap ratio is 1.1~1.5, and the spacing of adjacent heat radiation fin 12 is maximum to be no more than 20mm.This structure causes radiating efficiency
It is more preferable with the effect of radiating rate.
The height of all radiating fins 12 is equal, 6~8 times of the thickness of fin 13 centered on height.
In this embodiment, by the present invention in that with three central fins 13, and remaining radiating fin is rationally designed
The thickness of density degree, central fins 13 and the thickness of radiating bottom plate 11 between piece 12, solve existing radiator heat-dissipation knot
The technical problem that structure central temperature is too high, two sides temperature is relatively low, improve the level and vertical heat conduction ability of radiator so that
The central temperature of radiator significantly reduces the maximum temperature at radiator center, simultaneously close to the lip temperature of radiator
Accelerate integrally-built radiating rate and radiating efficiency.The radiator of this new structure of the present invention helps to promote multigroup big
Power model is in mesohigh AC speed regulating field, the particularly application in brushless dual-feed motor governing system field.
Because the structure of this radiator of the present invention is more complicated, can be difficult to realize using Analytic Method.For this
Complicated boundary condition in real system be present and its analytic value can not be obtained, because the load that it is received is quite a lot of, theory point
Analysis is difficult often to carry out, it is desirable to it is analyzed, it is necessary to first simplify structure, then solved using finite element analysis.
It is soft with ANSYS finite element analyses below to make the purpose of the present invention, technical scheme and effect clearer, clear and definite
Exemplified by part (software is commercial software), and the present invention is described in further detail with reference to Fig. 2.
The step of specific implementation, is as follows：
Step 1：The simplification of heat analysis problem.Heat conduction is required in view of contact interface between high power module and radiator
The material such as glue or heat conduction silver paste is bonded so that contact gap is smaller so as to ignore, it can thus be assumed that high-power
Thermal resistance between module and radiator between contact interface is 0.Because the major way of heat dissipation in radiator is thermal convection current, heat
Relative thermal convection action very little is radiated, therefore, model heat is dissipated to during ambient systems by heat transfer ignores heat radiation
Effect, it is general only to consider thermal convection current and conduction of heat；
Step 2：The unit of all parameters in ANSYS softwares during setup algorithm is world standard unit；
Step 3：Using SOLID70 heat analysis cell formation high power modules and radiator, and bag is set in the unit
Include the parameters such as thermal conductivity, specific heat capacity, convection transfer rate, heat density；
Step 4：After the unit is set, solid threedimensional model is first established using top-to-bottom method, i.e., is first established real
The general model of body, then " chiseling and carving " is carried out to details and obtains the threedimensional model close to entity；
Step 5：LED threedimensional models are divided using free mesh, but should be noted to set three-dimensional mould
The element number of type can not be too big；
Step 6：Establish the Heat Conduction Differential Equations related to radiator heat analysis：
Wherein：
V in formulax, Vy, VzFor medium conduction velocity, p, c are respectively the density and specific heat capacity of road lamp cooling body；T is radiator
Temperature；X, y, z are 3 d space coordinate system；For the generation heat of unit volume endogenous pyrogen in the unit time；
Step 7：Set in a model the thermally equilibrated differential equation as：
Step 8：The boundary condition for setting the heat convection between radiator outer surface and surrounding air is：
qn=h (tw-tf)
In formula, qnHot-fluid perpendicular to surface, tw、tfThe respectively temperature of boundary and environment, the heat convection of radiator
Coefficient h is constant.
Step 9：Set in a model the heat transfer governing equation of radiator transient equilibrium as：
In formula, [C] is specific heat matrix；[K] is conductance matrix, includes thermal conductivity factor and convection coefficient；{ T } is node temperature
Vector；Derivative for temperature to the time；[Q] is node hot-fluid vector；Solution above equation can obtain the temperature in radiator
It is distributed and changes with time.
Step 10：After designing finite element thermal model, the structure according to Fig. 1, radiator heat-dissipation performance will be influenceed
Factor of three different parameters as orthogonal test, three factors are respectively thickness, the radiating bottom plate of the central fins of radiator
Thickness and four kinds of different density degree fin radiator, each factor takes four levels, the wherein central fins of radiator
Four levels of thickness be respectively：5mm、5.5mm、6mm、6.5mm、7mm、7.5mm、8mm、8.5mm、9mm、9.5mm；Radiating bottom
Twice of fin centered on plate thickness, the thickness ratio of adjacent heat radiation fin is 0.7,0.8,0.9；The gap ratio of adjacent heat radiation fin
For 1.1,1.2,1.3,1.4,1.5；6,7,8 times of fin thickness centered on all radiating fin height.And with the highest of model
Temperature is index, is analyzed using orthogonal arrage；
Step 11：After quadrature analysis terminates, range analysis of the thickness of radiator central fins to test index is formed
The extreme difference of range analysis table to test index of table, the thickness of radiating bottom plate and different density degree structured heat sink to test index
Analytical table, optimized parameter is obtained by above three analytical table.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, technical side of the those of ordinary skill in the art to the present invention
The various modifications and improvement that case is made, all should fall within the scope of protection of the present invention.
Claims (5)
1. a kind of high power module fin radiator suitable for multiple-variable flow device group, mainly by radiating bottom plate (11) and it is arranged on scattered
Some radiating fins (12) composition on hot bottom plate (11), the top surface of the radiating bottom plate (11) is contact surface, multigroup high-power
Module (10) is in close contact by heat-radiating substrate and the contact surface, and the underface of high power module (10) is source center, and it is special
Sign is：The fin (13) centered on the radiating fin (12) of source center, the radiating fin of central fins (13) both sides
Piece (12) centered on the central fins (13), thickness outwards gradually it is thinning, spacing is gradually thinning, the radiating bottom plate (11)
Twice of fin (13) thickness centered on thickness.
2. a kind of high power module fin radiator suitable for multiple-variable flow device group according to claim 1, its feature exist
In：The thickness of each central fins (13) is equal, and thickness is no more than 10mm.
3. a kind of high power module fin radiator suitable for multiple-variable flow device group according to claim 2, its feature exist
In：The radiating fin (12) of central fins (13) both sides with central fins (13) for the symmetrical distribution of symmetry axis, it is and each adjacent
The thickness ratio of radiating fin (12) is 0.7~0.9, and the thickness of most thin radiating fin (12) is not less than 2mm.
4. a kind of high power module fin radiator suitable for multiple-variable flow device group according to claim 3, its feature exist
In：The gap ratio of adjacent heat radiation fin (12) is 1.1~1.5, and the spacing of adjacent heat radiation fin (12) is maximum to be no more than 20mm.
5. a kind of high power module fin radiator suitable for multiple-variable flow device group according to claim 4, its feature exist
In：The height of all radiating fins (12) is equal, 6~8 times of fin (13) thickness centered on height.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710991259.0A CN107624028A (en) | 2017-10-23 | 2017-10-23 | A kind of high power module fin radiator suitable for multiple-variable flow device group |
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| CN201710991259.0A CN107624028A (en) | 2017-10-23 | 2017-10-23 | A kind of high power module fin radiator suitable for multiple-variable flow device group |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229461A (en) * | 2012-04-26 | 2013-11-07 | Fanuc Ltd | Servo amplifier including heat sink with fins having wall thickness and pitch dependent on distance from heat source |
| CN205430861U (en) * | 2015-12-22 | 2016-08-03 | 派克汉尼汾动力传动产品（无锡）有限公司 | Novel radiator structure |
| CN208079607U (en) * | 2017-10-23 | 2018-11-09 | 河北上水能源科技有限公司 | A kind of high power module fin radiator suitable for multiple-variable flow device group |
-
2017
- 2017-10-23 CN CN201710991259.0A patent/CN107624028A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013229461A (en) * | 2012-04-26 | 2013-11-07 | Fanuc Ltd | Servo amplifier including heat sink with fins having wall thickness and pitch dependent on distance from heat source |
| CN205430861U (en) * | 2015-12-22 | 2016-08-03 | 派克汉尼汾动力传动产品（无锡）有限公司 | Novel radiator structure |
| CN208079607U (en) * | 2017-10-23 | 2018-11-09 | 河北上水能源科技有限公司 | A kind of high power module fin radiator suitable for multiple-variable flow device group |
Non-Patent Citations (1)
| Title |
|---|
| 华楚霞: "大功率LED路灯散热器的研究与优化", 《中国优秀硕士学位论文全文数据库 工程科技Ⅱ辑》 * |
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Application publication date: 20180123 |