CN107606679A - A kind of graphene heat conducting floor and preparation method thereof - Google Patents
A kind of graphene heat conducting floor and preparation method thereof Download PDFInfo
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- CN107606679A CN107606679A CN201710918632.XA CN201710918632A CN107606679A CN 107606679 A CN107606679 A CN 107606679A CN 201710918632 A CN201710918632 A CN 201710918632A CN 107606679 A CN107606679 A CN 107606679A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The present invention provides a kind of graphene heat conducting floor and its manufacture method, including upper floor, groove, through hole, projection, auxiliary heat dissipation chamber, heating board, upper substrate, jack, plug, infrabasal plate, the warm core apparatus of graphene thermal, euthermic chip, graphene warm core thin plate, overtemperature protection system, housing, temperature sensor, temperature controller, lower shoe, plate body, expansion link, annulus, outer toroid, annulus slide rail, interior annular, turbine flabellum, spring, far infrared reflectance coating, external screw thread and internal thread；Quality of the present invention is small, and heat conduction is uniform, and graphene carbon atom particle can produce Brownian movement, so that graphene heating floor heating effect is good, quick heating, realizes locellus divided time heating again, can arbitrarily adjust temperature, save operating cost.Meanwhile graphene heating floor has far-infrared thermal radiation function, 6 16 microns of far infrareds can occur, promote blood circulation of human body, produce health-care efficacy.
Description
Technical field
The invention belongs to floor heating field, more particularly to a kind of graphene heat conducting floor and preparation method thereof.
Background technology
In the prior art, ground warm device is had been obtained for being widely applied, and the research on heating floor has also been compared
Maturation, usually electric heating material is arranged in floor, reaches heating by being powered to the electric heating material in floor
Purpose so that floor heating is to warm oneself.Floor of the prior art is generally made up of multilayer plate body, adjacent plate body it
Between be provided with metal heat-conducting layer so that heat energy Transmit evenly caused by heater in floor.But use metal material
Manufactured heat-conducting layer largely increases the weight on floor, therefore, is badly in need of that a kind of quality is small, heat conductivility in ground warm device field
Good heating floor.
The content of the invention
Concrete technical scheme of the present invention is as follows：
A kind of graphene heat conducting floor, is spliced by multiple bodies, and the body includes upper floor；Under the upper floor
Surface is provided with the heating board of flush fitting；The heating board lower surface is provided with the lower floor of flush fitting；On described
The orthogonal both sides in floor are respectively equipped with the groove parallel with the upper floor；The orthogonal other both sides in upper floor
It is respectively equipped with the projection parallel with the upper floor, the projection and the groove match；Insertion is provided with the middle part of the groove
To the through hole of the projection；The through hole is in the crisscross network for forming circulation of the Shangdi intralamellar part；The network intersection point
Place is provided with the auxiliary heat dissipation chamber connected with the through hole.
Optimization, the heating board includes upper substrate；Jack is provided with the middle part of the side wall of upper substrate one, another side wall is provided with
The plug to match with the jack；The graphene thermal that the upper substrate lower surface is provided with flush fitting warms up core apparatus；Institute
State graphene thermal and warm up core apparatus lower surface provided with the infrabasal plate being bonded with it.
Optimization, the graphene, which warms up core apparatus, includes the warm core thin plate of graphene；The graphene warms up to be set inside core thin plate
There are some euthermic chips with the jack and plug electric connection, the euthermic chip is evenly distributed in length and breadth；The graphene
Warm core thin plate one end is provided with the overtemperature protection system being electrically connected with the jack.
Optimization, the overtemperature protection system includes housing, the housing be bonded with the warm core thin plate of the graphene one
Side is provided with temperature sensor；The inside that the housing warms up core thin plate side away from the graphene is provided with and the temperature control sensor
The temperature controller of electric connection.
Optimization, the lower shoe includes internal for empty plate body；It is provided with the middle part of the plate body vertical with its upper and lower surface
Expansion link, the expansion link outer wall is provided with external screw thread；The annulus being socketed with it is provided with the top of the expansion link, in the annulus
Wall is provided with the internal thread matched with the external screw thread；The annulus bottom is provided with the spring for being secured to connection, the spring housing
On expansion link outer wall and the other end is fixedly connected with plate body lower surface inwall, and the lower shoe upper surface is provided with and it
The far infrared reflectance coating being concordantly bonded.
Optimization, the annulus includes outer toroid, and the outer toroid bottom is provided with opening；The outer toroid inwall be provided with
Its parallel annulus slide rail；The outer toroid outer wall is provided with turbine flabellum in parallel；The outer toroid inwall, which is provided with, to be passed through
The interior annular that annulus slide rail is slidably socketed with it.
Optimization, the vertical and horizontal section of auxiliary heat dissipation chamber is arcuate structure.
Optimization, the graphene, which warms up core thin plate, to be prepared by the material of following parts by weight：
Optimization, the preparation method comprises the following steps：
A. plank cutting is prepared by machinery for upper floor, and step specific as follows is as follows：
A-1 plank) is cut into required size by machine and wood cutting；
A-2) by A-1) in plank be put into the cutting that internal network and auxiliary heat dissipation chamber are carried out in lathe；
B. it is as follows to warm up core thin plate preparation process for graphene：
B-1 a location-plate) is provided, the location-plate upper surface is provided with and area identical with ground plate shape and is less than floor
Locating slot；
B-2) powdered grapheme material is mixed with heat conduction glue, graphene glue solution is made；
B-3) the graphene glue solution prepared in step B-2 is poured into locating slot, positioning is then more than by area
The stripper plate of groove is squeezed into plate to the graphene glue solution in locating slot；
B-4 manufactured plate in B-3 steps) is moved on into dry ventilation, air-dried processing is carried out and graphene board is made；
B-5) graphene board in B-4 is placed in machining tool to being cut beyond the graphene board of positioning slot part
Remove, smooth treatment is then carried out to its surface by milling machine, then by graphene board numerically controlled lathe, added on graphene board surface
Work goes out to place some chip slots uniformly arranged of euthermic chip；
B-6) euthermic chip is placed in the chip slot in B-5, by the graphite in B-2 after then chip is electrically connected with
Alkene glue solution pours into chip slot, is closed, and is then placed in dry ventilation and processing is dried, then pass through milling machine pair again
Surface carries out smooth treatment and the warm core thin plate of graphene is made；
C. lower shoe is prepared to cut plank by machinery and prepared, and step specific as follows is as follows：
C-1 plank) is cut into required size by machine and wood cutting；
C-2) by C-1) in plank be put into lathe carry out inner passage cutting；
C-3) expansion link is connected in passage made of C-2；
D. graphene is warmed up into core thin plate taking-up locating slot and heating board is made by glue bonding with upper substrate and infrabasal plate；
E. heating board and upper floor and lower shoe are bonded into plate body by glue.
Optimization, the upper floor uses solid wood with lower shoe.
Beneficial effects of the present invention are as follows：
The present invention provides a kind of graphene heat conducting floor and preparation method thereof, and quality is small, and heat conduction is uniform, and graphene carbon is former
Sub- particle can produce Brownian movement, so that graphene heating floor heating effect is good, quick heating, realize locellus timesharing confession again
It is warm, temperature can be arbitrarily adjusted, has saved operating cost.Meanwhile graphene heating floor has far-infrared thermal radiation function, can send out
Raw 6-16 micron far infrareds, promote blood circulation of human body, produce health-care efficacy.
Brief description of the drawings
Fig. 1 is integral disassembly, assembly schematic diagram of the present invention；
Fig. 2 is overall structure diagram of the present invention；
Fig. 3 is that graphene of the present invention warms up core thin plate dismounting schematic diagram；
Fig. 4 is upper substrate side view of the present invention；
Fig. 5 is that graphene thermal of the present invention warms up core apparatus dismounting schematic diagram；
Fig. 6 is lower shoe elevation cross-sectional view of the present invention；
Fig. 7 is enlarged drawing at Fig. 6 B of the present invention；
Fig. 8 is annulus elevation cross-sectional view of the present invention；
Fig. 9 is annulus top plan view of the present invention.
Wherein：1st, upper floor, 11, groove, 12, through hole, 13, projection, 14, auxiliary heat dissipation chamber, 2, heating board, 21, upper base
Plate, 211, jack, 212, plug, 22, infrabasal plate, 23, graphene thermal warm up core apparatus, 231, euthermic chip, 232, graphene warms up
Core thin plate, 233, overtemperature protection system, 2331, housing, 2332, temperature sensor, 2333, temperature controller, 3, lower shoe, 31, plate
Body, 32, expansion link, 33, annulus, 331, outer toroid, 332, annulus slide rail, 333, interior annular, 334, turbine flabellum, 34, spring,
35th, far infrared reflectance coating, 36, external screw thread, 37, internal thread.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
A kind of graphene heat conducting floor of embodiment 1
Refer to shown in Fig. 1-9, a kind of graphene heat conducting floor, be spliced by multiple bodies 4, the body includes
Upper floor 1；The lower surface of upper floor 1 is provided with the heating board 2 of flush fitting；The lower surface of heating board 2 is provided with and it
The lower floor 3 being concordantly bonded；The 1 orthogonal both sides of upper floor are respectively equipped with the groove 11 parallel with the upper floor 1；
The orthogonal both sides in addition in the upper floor 1 are respectively equipped with the projection 13 parallel with the upper floor 1, the projection 13 and institute
Groove 11 is stated to match；The middle part of groove 11 is provided with the through hole 12 for penetrating into the projection 13；The through hole 12 is on described
The crisscross network for forming circulation in the inside of floor 1；The network point of intersection is provided with the auxiliary heat dissipation chamber connected with the through hole
14；Network through hole can aid in hot gas to carry out Homogeneouslly-radiating while reduce the formation of floor inner moisture, reach Homogeneouslly-radiating, protect
Hold internally dry purpose.
As a kind of technical optimization scheme of the present invention, the heating board 2 includes upper substrate 21；The side of upper substrate 21
Jack 211 is provided with the middle part of wall, another side wall is provided with the plug 212 to match with the jack 211；The lower surface of upper substrate 21
Graphene thermal provided with flush fitting warms up core apparatus 23；The warm lower surface of core apparatus 23 of the graphene thermal is provided with to be bonded with it
Infrabasal plate 22；Realize the Electricity Federation between plate and plate.
As a kind of technical optimization scheme of the present invention, the graphene, which warms up core apparatus 23, includes the warm core thin plate of graphene
232；The graphene warms up the inside of core thin plate 232 and is provided with some euthermic chips being electrically connected with the jack 211 and plug 212
231, the euthermic chip 231 is evenly distributed in length and breadth；The graphene warms up the one end of core thin plate 232 and is provided with and the electricity of jack 211
Property connection overtemperature protection system 233；The euthermic chip of addition reaches heating purpose, and graphene board, which reaches, uniformly dissipates heat flow
The purpose of hair.
As a kind of technical optimization scheme of the present invention, the overtemperature protection system 233 includes housing 2331, the housing
2331 sides being bonded with the warm core thin plate 232 of the graphene are provided with temperature sensor 2332；The housing 2331 is away from described
The inside that graphene warms up the side of core thin plate 232 is provided with the temperature controller 2333 being electrically connected with the temperature control sensor 2332；Reach
The purpose of safe handling.
As a kind of technical optimization scheme of the present invention, the lower shoe 3 includes internal for empty plate body 31；The plate body
31 middle parts are provided with the expansion link 32 vertical with its upper and lower surface, and the outer wall of expansion link 32 is provided with external screw thread 36；The expansion link
32 tops are provided with the annulus 33 being socketed with it, and the inwall of annulus 33 is provided with the internal thread 37 matched with the external screw thread 36；Institute
State the bottom of annulus 33 be provided be secured to connection spring 34, the spring 34 be enclosed on the outer wall of expansion link 32 and the other end with
The lower surface inwall of plate body 31 is fixedly connected, and the far infrared that the upper surface of lower shoe 3 is provided with flush fitting reflects
Film 35；The effect of spring reaches damping purpose；Infrared emitting film realizes infrared emanation function, reaches and promotes blood of human body to follow
Ring, produce health-care efficacy.
As a kind of technical optimization scheme of the present invention, the annulus 33 includes outer toroid 331, the bottom of outer toroid 331
Portion is provided with opening；The inwall of outer toroid 331 is provided with annulus slide rail 332 in parallel；The outer wall of outer toroid 331 be provided with
Its parallel turbine flabellum 334；The inwall of outer toroid 331 is provided with the interior annular being slidably socketed by annulus slide rail 332 with it
333；When being under pressure on floor, realize the rotation of annulus, so as to when turbine flabellum rotate, reach the purpose of ventilation and heat.
As a kind of technical optimization scheme of the present invention, the 14 vertical and horizontal section of auxiliary heat dissipation chamber is arcuate structure；Increase
The Free up Memory of big heating, realize the purpose of auxiliary heat dissipation.
A kind of graphene heat conducting floor of embodiment 2
The graphene heat conducting floor that the embodiment provides is distinguished as with embodiment 1：
Graphene, which warms up core thin plate, to be prepared by the material of following parts by weight：
Graphene provided by the invention, which warms up core thin plate, can effectively improve the heat-conductive characteristic on floor, by adding in graphene
Enter acrylic resin, polyoxyethylene alkyl ether and selenium chloride and be remarkably improved the heat-conductive characteristic of graphene in itself, heat conductivity
45% can be improved, when by acrylic resin, polyoxyethylene alkyl ether and selenium chloride any one deletion, heat-conductive characteristic with
Graphene is compared, and 12.8% is reduced, when changing acrylic resin into epoxy resin, selenium chloride is changed into iron chloride, heat conductivity
8.5% can be improved compared with graphene, it follows that, acrylic resin, polyoxyethylene alkyl ether are added only in graphene
The heat-conductive characteristic of the warm core thin plate of graphene can be significantly improved with selenium chloride.
A kind of graphene heat conducting floor of embodiment 3
As a kind of technical optimization scheme of the present invention, the preparation method comprises the following steps：
A. plank cutting is prepared by machinery for upper floor, and step specific as follows is as follows：
A-1 plank) is cut into required size by machine and wood cutting；
A-2) by A-1) in plank be put into the cutting that internal network and auxiliary heat dissipation chamber are carried out in lathe；
B. it is as follows to warm up core thin plate preparation process for graphene：
B-1 a location-plate) is provided, the location-plate upper surface is provided with and area identical with ground plate shape and is less than floor
Locating slot；
B-2) powdered grapheme material is mixed with heat conduction glue, graphene glue solution is made；
B-3) the graphene glue solution prepared in step B-2 is poured into locating slot, positioning is then more than by area
The stripper plate of groove is squeezed into plate to the graphene glue solution in locating slot；
B-4 manufactured plate in B-3 steps) is moved on into dry ventilation, air-dried processing is carried out and graphene board is made；
B-5) graphene board in B-4 is placed in machining tool to being cut beyond the graphene board of positioning slot part
Remove, smooth treatment is then carried out to its surface by milling machine, then by graphene board numerically controlled lathe, added on graphene board surface
Work goes out to place some chip slots uniformly arranged of euthermic chip；
B-6) euthermic chip is placed in the chip slot in B-5, by the graphite in B-2 after then chip is electrically connected with
Alkene glue solution pours into chip slot, is closed, and is then placed in dry ventilation and processing is dried, then pass through milling machine pair again
Surface carries out smooth treatment and the warm core thin plate of graphene is made；
C. lower shoe is prepared to cut plank by machinery and prepared, and step specific as follows is as follows：
C-1 plank) is cut into required size by machine and wood cutting；
C-2) by C-1) in plank be put into lathe carry out inner passage cutting；
C-3) expansion link is connected in passage made of C-2；
D. graphene is warmed up into core thin plate taking-up locating slot and heating board is made by glue bonding with upper substrate and infrabasal plate；
E. heating board and upper floor and lower shoe are bonded into plate body by glue.
As a kind of technical optimization scheme of the present invention, the upper floor uses solid wood with lower shoe.
Claims (10)
1. a kind of graphene heat conducting floor, it is spliced by multiple bodies (4), it is characterised in that：The body (4) includes Shangdi
Plate (1)；Upper floor (1) lower surface is provided with the heating board (2) of flush fitting；Heating board (2) lower surface is provided with
The lower floor (3) of flush fitting；The orthogonal both sides of the upper floor (1) are respectively equipped with flat with the upper floor (1)
Capable groove (11)；The orthogonal both sides in addition of the upper floor (1) are respectively equipped with the projection parallel with the upper floor (1)
(13), the projection (13) matches with the groove (11)；It is provided with the middle part of the groove (11) and penetrates into the projection (13)
Through hole (12)；The internal crisscross network for forming circulation of the through hole (12) on described floor (1)；The network intersection point
Place is provided with the auxiliary heat dissipation chamber (14) connected with the through hole.
A kind of 2. graphene heat conducting floor according to claim 1, it is characterised in that：The heating board (2) includes upper base
Plate (21)；Jack (211) is provided with the middle part of the side wall of upper substrate (21) one, another side wall is provided with and the jack (211) phase
The plug (212) matched somebody with somebody；The graphene thermal that upper substrate (21) lower surface is provided with flush fitting warms up core apparatus (23)；It is described
Graphene thermal warms up core apparatus (23) lower surface and is provided with the infrabasal plate (22) being bonded with it.
A kind of 3. graphene heat conducting floor according to claim 2, it is characterised in that：The graphene warms up core apparatus (23)
Core thin plate (232) is warmed up including graphene；The graphene is warmed up and is provided with and the jack (211) and plug inside core thin plate (232)
(212) some euthermic chips (231) being electrically connected with, the euthermic chip (231) are evenly distributed in length and breadth；The graphene warms up core
Thin plate (232) one end is provided with the overtemperature protection system (233) being electrically connected with the jack (211).
A kind of 4. graphene heat conducting floor according to claim 3, it is characterised in that：The overtemperature protection system (233)
Including housing (2331), the side that the housing (2331) is bonded with the warm core thin plate (232) of the graphene is provided with TEMP
Device (2332)；The inside that the housing (2331) warms up core thin plate (232) side away from the graphene is provided with and temperature control biography
The temperature controller (2333) that sensor (2332) is electrically connected with.
A kind of 5. graphene heat conducting floor according to claim 1, it is characterised in that：The lower shoe (3) includes inside
For the plate body (31) of sky；The expansion link (32) vertical with its upper and lower surface, the expansion link are provided with the middle part of the plate body (31)
(32) outer wall is provided with external screw thread (36)；The annulus (33) being socketed with it, the annulus (33) are provided with the top of the expansion link (32)
Inwall is provided with the internal thread (37) matched with the external screw thread (36)；Annulus (33) bottom is provided with the bullet for being secured to connection
Spring (34), the spring (34) is enclosed on expansion link (32) outer wall and the other end is fixed with the plate body (31) lower surface inwall
Connection, lower shoe (3) upper surface are provided with the far infrared reflectance coating (35) of flush fitting.
A kind of 6. graphene heat conducting floor according to claim 5, it is characterised in that：The annulus (33) includes outer toroid
(331), outer toroid (331) bottom is provided with opening；Outer toroid (331) inwall is provided with annulus slide rail in parallel
(332)；Outer toroid (331) outer wall is provided with turbine flabellum (334) in parallel；Outer toroid (331) inwall is provided with
The interior annular (333) being slidably socketed by annulus slide rail (332) with it.
A kind of 7. graphene heat conducting floor according to claim 2, it is characterised in that：The auxiliary heat dissipation chamber (14) is vertical and horizontal
Section is arcuate structure.
8. core apparatus is warmed up according to graphene thermal as claimed in claim 2, it is characterised in that：The graphene warms up core thin plate
(232) it is to be prepared by the material of following parts by weight：
A kind of 9. preparation method of the graphene heat conducting floor described in claim 1, it is characterised in that；The preparation method includes
Following steps：
A. plank cutting is prepared by machinery for upper floor, and step specific as follows is as follows：
A-1 plank) is cut into required size by machine and wood cutting；
2) by A-1) in plank be put into the cutting that internal network and auxiliary heat dissipation chamber are carried out in lathe；
B. it is as follows to warm up core thin plate preparation process for graphene：
B-1 a location-plate) is provided, the location-plate upper surface is provided with the positioning that and area identical with ground plate shape is less than floor
Groove；
B-2) powdered grapheme material is mixed with heat conduction glue, graphene glue solution is made；
B-3) the graphene glue solution prepared in step B-2 is poured into locating slot, locating slot is then more than by area
Stripper plate is squeezed into plate to the graphene glue solution in locating slot；
B-4 manufactured plate in B-3 steps) is moved on into dry ventilation, air-dried processing is carried out and graphene board is made；
B-5) graphene board in B-4 is placed to being cut off beyond the graphene board of positioning slot part in machining tool, so
Smooth treatment is carried out to its surface by milling machine afterwards, then by graphene board numerically controlled lathe, gone out in graphene board Surface Machining
Some chip slots uniformly arranged of euthermic chip can be placed；
B-6) euthermic chip is placed in the chip slot in B-5, by the graphene glue in B-2 after then chip is electrically connected with
The aqueous solution pours into chip slot, is closed, and is then placed in dry ventilation and processing is dried, then again by milling machine to surface
Carry out smooth treatment and the warm core thin plate of graphene is made；
C. lower shoe is prepared to cut plank by machinery and prepared, and step specific as follows is as follows：
C-1 plank) is cut into required size by machine and wood cutting；
C-2) by C-1) in plank be put into lathe carry out inner passage cutting；
C-3) expansion link is connected in passage made of C-2；
D. graphene is warmed up into core thin plate taking-up locating slot and heating board is made by glue bonding with upper substrate and infrabasal plate；
E. heating board and upper floor and lower shoe are bonded into plate body by glue.
A kind of 10. preparation method of graphene heat conducting floor according to 9, it is characterised in that：The upper floor and lower shoe
Use solid wood.
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Cited By (2)
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| CN109605536A (en) * | 2018-12-07 | 2019-04-12 | 广西大学 | High-efficiency heat conduction high density fiberboard and its manufacturing method |
| CN112663782A (en) * | 2020-12-20 | 2021-04-16 | 杭州美奇餐饮服务有限公司 | Main structure of green environment-friendly assembly type building |
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| CN205025047U (en) * | 2015-10-09 | 2016-02-10 | 江苏怡天木业有限公司 | Heat conduction floor slab |
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| CN105352008A (en) * | 2015-12-04 | 2016-02-24 | 江苏洛基木业有限公司 | Graphene self-heating floor and low-voltage self-heating floor system |
| CN106255239A (en) * | 2016-08-29 | 2016-12-21 | 江苏科暖热能科技有限公司 | A kind of floor heating Graphene electric hot plate and production method thereof |
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| CN106401132A (en) * | 2016-11-15 | 2017-02-15 | 苏州亨达尔工业材料有限公司 | Floor heating floor |
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| CN109605536A (en) * | 2018-12-07 | 2019-04-12 | 广西大学 | High-efficiency heat conduction high density fiberboard and its manufacturing method |
| CN109605536B (en) * | 2018-12-07 | 2021-06-29 | 广西大学 | High-efficiency heat-conducting high-density fiberboard and manufacturing method thereof |
| CN112663782A (en) * | 2020-12-20 | 2021-04-16 | 杭州美奇餐饮服务有限公司 | Main structure of green environment-friendly assembly type building |
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