CN107603496B - Ultraviolet light curing adhesive and manufacturing method thereof - Google Patents

Abstract

The invention discloses an ultraviolet light curing adhesive and a preparation method thereof, wherein the ultraviolet light curing adhesive is arranged between an organic layer and a metal oxide layer, the peeling force between the ultraviolet light curing adhesive and the organic layer or/and the metal oxide layer is larger than or equal to 2000 g, and the ultraviolet light curing adhesive can simultaneously connect a low-polarity organic layer and the metal oxide layer without damaging the surface of the metal oxide layer.

Description

Ultraviolet light curing adhesive and manufacturing method thereof

Technical Field

The invention relates to glue, in particular to ultraviolet light curing glue and a manufacturing method thereof.

Background

The ultraviolet light curing glue is prepared by adding a photoinitiator into resin, and generating active free radicals after absorbing high-intensity ultraviolet rays in ultraviolet light curing equipment, so that polymerization, crosslinking and grafting reactions are initiated, and the resin is converted from a liquid state to a solid state within seconds. The volume shrinkage rate is small after curing, the elongation is large, and the bonding strength is high.

At present, the ultraviolet curing technology and the electronic industry provide a new process, the process utilizes the ultraviolet curing glue coated on a base material to react under the initiation of ultraviolet light to cure and form, and the process is carried out at normal temperature and normal pressure.

With the development of times, the requirements of the industry standards such as electronics and the like are continuously improved, particularly, ultraviolet curing is widely used on some special materials for various processing, higher requirements on the hardness, the cohesiveness and the acid value of the ultraviolet curing adhesive are provided, and a product which is better in environment and can play a role in environmental protection is required.

Disclosure of Invention

The invention aims to provide a photocuring glue for the adhesion between a low-polarity organic layer and a metal oxide layer;

on the other hand, the preparation method of the photocuring glue for the adhesion between the low-polarity organic layer and the metal oxide layer is provided.

In order to achieve the purpose, the invention adopts the following technical scheme:

the ultraviolet light curing glue is arranged between an organic layer and a metal oxide layer, and the peeling force between the ultraviolet light curing glue and the organic layer or/and the metal oxide layer is larger than or equal to 2000 g.

Further, the ultraviolet light curing adhesive comprises the following components in percentage by weight:

the oligomer is a urethane acrylate resin with the functionality of 2-4;

the coupling agent is one or two of amino, aminoalkyl compound and ureide.

Further, the reactive diluent is selected from one or more of pentaerythritol triacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, isobornyl acrylate, dipentaerythritol hexaacrylate and propoxylated glycerol triacrylate.

Further, the adhesion promoter is one or two of beta-carboxyethyl acrylate and mercaptan.

Further, the photopolymerization initiator is selected from one or more of 1-hydroxy-cyclohexyl-phenyl ketone, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-acetone and benzoin dimethyl ether.

Further, the solvent is selected from one or more of toluene, propylene glycol methyl ether, ethyl acetate, butyl acetate and butanone.

Further, the auxiliary agent is one or more of a flatting agent, a dispersing agent and a surface wetting agent.

The manufacturing method of the ultraviolet light curing adhesive comprises the following steps:

s1, adding the oligomer, the reactive diluent, the photopolymerization initiator, the adhesion promoter, the solvent and the auxiliary agent according to a certain proportion, mixing and stirring for 30 minutes;

s2, adding the coupling agent at the temperature of 20-30 ℃ and the humidity of 70-90%, and sealing and stirring for 20 minutes.

The purple light curing glue for the interlayer adhesion between the low-polarity organic layer and the metal oxide layer provided by the invention can simultaneously connect the low-polarity organic layer and the metal oxide layer without damaging the surface of the metal oxide layer.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Solvents, reagents, coating methods, technical parameters, coating equipment and the like used in the present invention are all conventional solvents, reagents, methods, parameters, equipment and the like in the technical field unless otherwise specified.

The polyurethane acrylate with the functionality of 2-4 in the invention refers to polyurethane acrylate resin with the functionality of 2-4, preferably polyurethane acrylate resin with the functionality of 3, and the invention is selected from 583-1 of double bond company.

The active diluent disclosed by the invention has the main functions of participating in a film forming reaction and increasing the softness of a film, the film can be coated with low-polarity light-cured glue after film forming, the peel force of the film coated with the low-polarity light-cured glue after curing is larger than or equal to 2000 g, and the active diluent can be used as a dissolving dispersant.

The coupling agent is mainly used for connecting metal oxides and is selected from one or more of amino 1122 and 1124, aminoalkyl 1146 and ureide 2201 and 2202 of Digao company.

The dispersant of the invention has the function of smoothing and even brightening the surface, and is selected from one or more of BYK358N, BYK361N, BYK3550, BYK2200 and BYK2050 of BYK company.

The invention may also include a wetting agent which acts to eliminate cratering and to smooth the surface.

The leveling agent is selected from one or more of WET270, WET280 and WET KL245 of Digao company.

The preparation method comprises the following steps:

the ultraviolet curing adhesive of the invention, S1, is prepared by adding oligomer, reactive diluent, photopolymerization initiator, adhesion promoter, solvent and auxiliary agent according to a certain proportion, mixing and stirring for 30 minutes; s2, adding the coupling agent at the temperature of 20-30 ℃ and the humidity of 70-90%, and sealing and stirring for 20 minutes.

Example 1:

example 2:

example 3:

example 4:

example 5:

comparative example 1:

comparative example 2:

test items

The glue performance detection provided by the invention comprises hardness, B, transmittance, haze, adhesive force, stripping force and appearance.

(1) Hardness: the dry film thickness is 3-4 μm, and the pencil hardness test is carried out under a load of 750 g.

(2) And (3) testing the peeling force: after the ultraviolet curing glue is coated on the metal oxide layer, the metal oxide layer is subjected to a hundred-grid test 5B, and then the two surfaces of the organic layer are attached to form a sandwich structure of the metal oxide layer of the organic layer of the metal oxide layer, wherein the organic layer is a quantum dot layer, one metal oxide layer is fixed, the stripping force of the film is tested by adopting a TH-8203S type multifunctional electronic tensile machine, and the test standard refers to ASTM D3330.

(3) B: the dry film thickness was 3-4 μm, the film was cut to 5cm x 6cm size and tested using a color difference meter SE-6000, which was averaged three times.

(4) Transmittance, haze: the dry film thickness was 3-4 μm, the film was cut to 5cm x 6cm size and tested using a haze meter HM-150, with three measurements averaged.

(5) And (3) apparent testing: the dry film thickness is 3-4 μm, and the film is observed by naked eyes after being cured. The film was cut to 10 x 12cm size, baked at 100 ℃, and visually observed after baking.

(6) Adhesive force 1: and coating the ultraviolet curing glue on the metal oxide layer, and performing a hundred-grid test after the dry film thickness is 3-4 mu m after curing.

And (3) adhesive force 2: and (3) coating the ultraviolet curing glue on the organic layer, and carrying out a hundred-grid test after the thickness of the cured dry film is 3-4 mu m.

And (3) adhesive force: coating the ultraviolet curing glue on the metal oxide layer, and boiling the cured film with 3-4 mu m of dry film thickness under 1 atmospheric pressure and 100 ℃ for 8 hours to carry out a hundred-grid test.

And (4) adhesion force: and coating the ultraviolet curing glue on the organic layer, and after curing, boiling the cured film with 1 pieces of dry film with the thickness of 3-4 mu m and water at 100 ℃ for 8 hours to perform a hundred-grid test.

It should be noted that the above-mentioned embodiments illustrate rather than limit the invention in any form, and that all modifications and variations of the present invention are intended to be included within the scope of the invention.

Claims (7)

1. The ultraviolet light curing glue is characterized in that the ultraviolet light curing glue is arranged between an organic layer and a metal oxide layer, and the stripping force between the ultraviolet light curing glue and the organic layer or/and the metal oxide layer is larger than or equal to 2000 g;

and the ultraviolet light curing adhesive comprises the following components in percentage by weight:

the oligomer is a urethane acrylate resin with the functionality of 2-4;

the coupling agent is selected from one or more of digao corporation designations 1122, 1124, 1146, 2201, 2202.

2. The UV-curable adhesive according to claim 1, wherein the reactive diluent is selected from one or more of pentaerythritol triacrylate, tripropylene glycol diacrylate, 1, 6-hexanediol diacrylate, isobornyl acrylate, dipentaerythritol hexaacrylate, and glycerol propoxylate triacrylate.

3. The UV-curable adhesive according to claim 1, wherein the adhesion promoter is one or both of beta-carboxyethyl acrylate and thiol.

4. The UV-curable adhesive according to claim 1, wherein the photopolymerization initiator is selected from one or more of 1-hydroxy-cyclohexyl-phenyl ketone, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, and benzoin bis-methyl ether.

5. The UV-curable adhesive according to claim 1, wherein the solvent is one or more selected from toluene, propylene glycol methyl ether, ethyl acetate, butyl acetate, and methyl ethyl ketone.

6. The UV-curable adhesive according to claim 1, wherein the auxiliary agent is one or more of a leveling agent, a dispersing agent and a surface wetting agent.

7. A method for manufacturing the UV-curable adhesive according to any one of claims 1 to 6, comprising the steps of:

s1, adding the oligomer, the reactive diluent, the photopolymerization initiator, the adhesion promoter, the solvent and the auxiliary agent according to a certain proportion, mixing and stirring for 30 minutes;

s2, adding the coupling agent at the temperature of 20-30 ℃ and the humidity of 70-90%, and sealing and stirring for 20 minutes.