CN107570895B - Laser processing apparatus - Google Patents
Laser processing apparatus Download PDFInfo
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- CN107570895B CN107570895B CN201610964082.0A CN201610964082A CN107570895B CN 107570895 B CN107570895 B CN 107570895B CN 201610964082 A CN201610964082 A CN 201610964082A CN 107570895 B CN107570895 B CN 107570895B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a laser processing device, which can adjust the opening width of a processing hole of a processing plate, and comprises: a processing plate supporting the processing member and having at least one mounting groove and a processing hole; the adjusting component is positioned in the mounting groove and is used for adjusting the opening width of the processing hole; a fastening member for fixing the adjusting member to the processing plate; and a laser beam irradiation portion that irradiates a laser beam toward a workpiece disposed on the processing plate. The laser processing apparatus according to the present invention includes an adjustment member, so that the opening width of the processing hole of the processing plate can be adjusted. A workpiece having various processing patterns can be laser-processed using the laser processing apparatus according to the present invention.
Description
Technical Field
The present invention relates to a laser processing apparatus, and more particularly to a laser processing apparatus capable of adjusting the opening width of a processing hole of a processing plate.
Background
Laser machining can be applied to marking or cutting according to a pattern of a workpiece with a high-density heat source, welding or heat treatment of a workpiece, or the like. The laser processing has the advantages of simple processing of the processed piece, small thermal deformation, low abrasion caused by non-contact, capability of carrying out complicated fine processing and the like.
When laser machining is performed, a workpiece is placed on a machining plate and fixed at a predetermined position. In this case, the processing plate may have a processing hole at a position corresponding to a processing position of the workpiece. Through the processing hole, fine foreign matters like smoke (fuse) generated when the workpiece is processed are sucked into a dust collecting device at the lower part of the processing plate and then removed. And, by machining the hole, the laser beam via the workpiece passes without damaging the machined plate.
Therefore, in order to perform laser processing on workpieces having different cutting specifications, it is necessary to separately manufacture a processing plate having a processing hole conforming to the cutting specification of the workpiece. That is, depending on the laser-cut shape and position of the workpiece, it is necessary to manufacture a machined plate having a machined hole corresponding thereto, which leads to problems of increased manufacturing equipment, increased operating time, and increased manufacturing cost.
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described problems, and an object thereof is to provide a laser processing apparatus capable of adjusting the opening width of a processing hole of a processing plate.
Means for solving the problems
In order to achieve the above object, a laser processing apparatus according to the present invention includes: the processing plate is used for supporting a processing piece and is provided with at least one mounting groove and a processing hole; the adjusting component is positioned in the mounting groove and used for adjusting the opening width of the machining hole; a fastening member for fixing the adjustment member to the processing plate; and a laser beam irradiation unit that irradiates a laser beam toward a workpiece disposed on the processing plate.
The processing plate has a first fastening hole in the mounting groove for inserting the fastening member, and the adjusting member has a second fastening hole penetrating the fastening member, the second fastening hole having a cross-sectional area larger than that of the first fastening hole.
The outer diameter of the fastening part is substantially the same as the inner diameter of the first fastening hole.
The second fastening hole is oval.
The adjusting member includes a base portion having a second fastening hole and a side portion bent from the base portion.
The width of the base part is less than the sum of the widths of the mounting groove and the machining hole.
The adjustment member further includes an inclined portion between the base portion and the side surface portion.
The opening width of the machining hole is increased as the distance between the central portion of the machining plate and the adjusting member is increased.
The opening width of the machining hole is 0.05mm to 10 mm.
The processing plate is made of acrylic material.
The fastening member is a bolt.
The laser beam irradiation part includes CO2One of a laser light generating device, a YAG laser light generating device and a Glass laser light generating device.
The laser processing device also comprises a dust collecting device for removing foreign matters generated during laser processing of the workpiece.
Effects of the invention
The laser processing apparatus according to the present invention includes an adjustment member, so that the opening width of the processing hole of the processing plate can be adjusted.
A workpiece having various processing patterns can be laser-processed using the laser processing apparatus according to the present invention.
Drawings
Fig. 1 is a partial perspective view illustrating a portion of a display panel cut by a laser processing apparatus according to an embodiment of the present invention.
Fig. 2 is a perspective view for explaining a laser processing apparatus according to an embodiment of the present invention.
Fig. 3 is a perspective view illustrating a processing plate and an adjustment member according to an embodiment of the present invention.
Fig. 4 is a plan view illustrating a processing plate, an adjusting member, and a fastening member according to an embodiment of the present invention.
Fig. 5 is a sectional view taken along line I-I' of fig. 4.
Fig. 6a and 6b are views for explaining the adjustment of the opening width of the machining hole according to the position of the adjustment member.
Fig. 7 is a sectional view showing a processing plate, an adjusting member, and a fastening member according to another embodiment of the present invention.
Detailed Description
The advantages and features of the present invention and methods of accomplishing the same may become more apparent from the following detailed description of embodiments thereof taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various ways, and the embodiments are only for perfecting the disclosure of the present invention and for informing those skilled in the art of the scope of the present invention completely, and the present invention should be defined based on the scope of the claims. Therefore, in some embodiments, detailed descriptions of well-known process steps, well-known element structures, and well-known technologies are omitted so as not to obscure the present invention. Throughout the specification, the same reference numerals denote the same constituent elements.
Unless specifically defined otherwise, all terms (including technical and scientific terms) used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries should not be interpreted as being idealized or overly formal without being expressly defined herein.
The configuration and operation of the present invention will be described in detail below with reference to the embodiments of the present invention shown in the drawings.
Fig. 1 is a partial perspective view illustrating a portion of a display panel cut by a laser processing apparatus according to an embodiment of the present invention, and fig. 2 is a perspective view for explaining the laser processing apparatus according to an embodiment of the present invention.
As shown in fig. 1, a laser processing apparatus according to an embodiment of the present invention may be used to cut corners 330 of a display panel 300.
As shown in fig. 2, the laser processing apparatus for cutting a portion of the display panel 300 as described above includes a processing plate 100, an adjustment member 200, and a laser beam irradiation portion 400.
The processing board 100 supports the display panel 300 as a workpiece. The display panel 300 may be adsorbed on the processing board 100 by other means or vacuum supplied from the outside. The display panel 300 may be directly placed on the processing board 100 or fixed to the processing board 100 through a medium such as a double-sided tape.
The processing plate 100 has a mounting groove 101 and a processing hole 102, which will be described later. The mounting groove 101 and the machining hole 102 can be machined by a laser beam L. Therefore, the processing plate 100 may be made of a material that can be processed by the laser beam L, and for example, the processing plate 100 may be made of an acrylic material. In this case, the laser beam L for processing the processing plate 100 may be the same as or different from the laser beam L for processing the display panel 300.
An adjustment member 200, which will be described later, is disposed in the mounting groove 101, and the depth of the mounting groove 101 is substantially the same as the height of the adjustment member 200. This point will be described in detail later.
The processing hole 102 is formed at a position corresponding to a cutting processing position of the display panel 300 so that the laser beam L passing through the display panel 300 passes in a state of not damaging the processing plate 100.
When the display panel 300 is laser-cut, the adjustment member 200 is positioned in the mounting groove 101 of the processing plate 100 and fixed to the processing plate 100. At this time, the adjusting member 200 can adjust the opening width of the machining hole 102. That is, the operator adjusts the opening width of the machining hole 102 for workpieces having different laser cutting shapes and positions by adjusting the position of the adjustment member 200 disposed in the mounting groove 101 of the machining plate 100. This point will be described in detail later.
The laser beam irradiation unit 400 irradiates the laser beam L toward the display panel 300 disposed on the processing plate 100. The laser beam irradiation part 400 is positioned at the upper end of the display panel 300 to be cut and processed, and irradiates the laser beam L perpendicularly to the display panel 300. The vertically irradiated laser beam L processes the upper and lower surfaces of the display panel 300 into the same shape.
The type of the laser beam L used for cutting the processing plate 100 and the display panel 300 is not limited, and may be, for example, CO2A laser beam L generated by one of a laser generating device, a YAG laser generating device and a Glass laser generating device.
The transmission speed of the laser beam irradiation part 400 is changed according to the cutting position, shape, physical properties, or the like of the display panel 300, and the laser processing apparatus according to an embodiment of the present invention may further include a control part (not shown) that adjusts the output of the laser beam L according to the transmission speed of the laser beam irradiation part 400.
The output pattern of the laser beam L may be changed in various ways according to the type of the laser beam L by a control part (not shown), and according to an embodiment of the present invention, the output pattern of the laser beam L may be changed by adjusting the frequency and duty ratio (duty ratio) of the laser beam L. That is, according to an embodiment of the present invention, the output adjustment of the pulse-type laser beam L is performed by adjusting the frequency and the duty ratio, instead of applying the continuous-type laser beam L, which is applied to the pulse-type laser beam L. Here, the frequency corresponds to an operation period of an electronic shutter (shutter) that generates the laser beam L from the laser beam irradiation section 400 in the case of the pulse-type laser beam L, and the duty ratio corresponds to a laser beam L generation time that lasts for one period of the electronic shutter.
More specifically, although the normal method of adjusting the output of the laser beam L is generally performed by adjusting the pumping energy supplied to the laser beam irradiation unit 400 in order to generate the laser beam L, according to an embodiment of the present invention, the method of adjusting the output of the laser beam L is performed by adjusting the frequency and duty ratio of the pulse-type laser beam. In contrast to the prior art in which the output adjustment is performed by adjusting the energy, and thus it is difficult to control the correct output amount, and thus precise control cannot be achieved in a fine aspect, the output adjustment according to an embodiment of the present invention is performed by adjusting the frequency and duty ratio of the laser beam L in a very fine unit, so that the output amount of the laser beam L can be adjusted more finely and correctly.
The output mode of the laser beam L according to such frequency adjustment and duty ratio adjustment can be performed as follows: the frequency and the duty ratio are adjusted in a predetermined interval based on the material of the display panel 300 and the transmission speed of the laser beam irradiation unit 400, and experimental data for testing the cutting depth, whether to cut, and the like are prepared and tabulated and applied to the actual output adjustment of the laser beam L. For example, the laser beam irradiation portion 400 may be set to move at an acceleration or deceleration rate in the cutting direction in the corner section of the cut display panel 300, and the laser beam irradiation portion 400 may be set to move at a constant speed in the middle section of the cut display panel 300. In more detail, the frequency and duty ratio of the laser beam L may be set to be higher in an acceleration or deceleration section of the laser beam irradiation portion 400 so that the output of the laser beam L is larger than in a constant velocity section, and conversely, the frequency and duty ratio of the laser beam L may be set to be lower in the constant velocity section of the laser beam irradiation portion 400 so that the output of the laser beam L is smaller than in the acceleration or deceleration section. Accordingly, the output amount of the laser beam L per unit length irradiated to the display panel 300 is maintained uniform throughout the processing of the display panel 300, and thus the display panel 300 having a good laser processing state can be formed.
As described above, when the display panel 300 is cut by the laser beam L irradiated by the laser beam irradiation unit 400, various foreign substances such as smoke and dust may be generated from the display panel 300 due to the heat of the laser beam L. According to an embodiment of the present invention, the laser processing apparatus may further include a dust collecting device (not shown) to remove foreign substances generated during laser processing. The dust collecting device (not shown) may be located at the upper end or the lower end of the processing plate 100 to timely suck foreign materials generated when processing the workpiece, thereby preventing the foreign materials from being accumulated on the processing plate 100 or the adjustment member 200. Thus, a more precise cutting process can be achieved, and the quality of the cut display panel 300 can be improved.
Further, a protective cover (not shown) for accommodating these components in the internal space may be provided. The operation space can be separated from the outside by a protective cover (not shown), and the operation process can be smoothly completed.
Fig. 3 is a perspective view illustrating a processing plate and an adjusting member according to an embodiment of the present invention, fig. 4 is a plan view illustrating the processing plate, the adjusting member, and a fastening member according to an embodiment of the present invention, and fig. 5 is a sectional view taken along line I-I' of fig. 4.
Referring to fig. 3 to 5, the processing plate 100 has a mounting groove 101 and a processing hole 102.
When the display panel 300 is laser-cut, the adjustment member 200 is disposed in the mounting groove 101. At this time, the depth D of the mounting groove 101 is substantially the same as the height H of the adjustment member 200. Thus, when the adjustment member 200 is positioned in the mounting groove 101 of the processing plate 100, the heights from the bottom of the processing plate 100 to the upper surface of the adjustment member 200 and the upper surface of the processing plate 100 are the same, so that the workpiece can be stably supported.
The processing hole 102 is formed at a position corresponding to a cutting position of the display panel 300 so that the laser beam L passing through the display panel 300 passes through without damaging the processing plate 100. That is, when the workpiece is cut, the laser beam L passes through the processing hole 102, and thus occurrence of a spark, a Burr (Burr), or the like on the processing plate 100 due to the laser beam L can be prevented. Further, it is possible to prevent the occurrence of sparks, burrs, or the like on the processing plate 100 from affecting the workpiece and causing the workpiece to become a defective product.
As shown in fig. 4, according to an embodiment of the present invention, although the machining hole 102 has a straight cross section, the machining hole 102 may have a shape by variously changing the size and shape of the regulating member 200 without being limited thereto "
Word (Chinese character) "
A cross section of a character shape.
Also, as shown in fig. 3 to 5, the processing plate 100 has a first fastening hole 105 located at a lower portion of the mounting groove 101, and a fastening member 500 is inserted into the first fastening hole in order to fix the adjustment member 200 to the processing plate 100. The inner diameter of the first fastening hole 105 is formed to be substantially the same as the outer diameter of the fastening member 500. Thus, the adjustment member 200 is firmly fixed to the processing plate 100 when the workpiece is laser-cut.
The adjustment member 200 has a second fastening hole 205 into which the fastening member 500 can be inserted. The cross-sectional area of the second fastening hole 205 is larger than that of the first fastening hole 105, and according to an embodiment of the present invention, the cross-section of the second fastening hole 205 is elliptical. That is, the minor axis length of the elliptical second fastening hole 205 is substantially the same as the diameter of the first fastening hole 105 and the diameter of the fastening member 500, and the major axis length of the second fastening hole 205 is formed to be greater than the diameter of the first fastening hole 105 and the diameter of the fastening member 500.
That is, the adjustment member 200 is positioned in the mounting groove 101 of the processing plate 100, and the position of the adjustment member 200 can be adjusted along the major axis direction of the elliptical second fastening hole 205. In more detail, the position of the adjustment member 200 can be varied by an amount corresponding to the subtraction of the diameter of the fastening member 500 from the length of the long axis of the second fastening hole 205. By adjusting the position of the adjustment member 200, the opening width of the machining hole 102 of the machining plate 100 is adjusted.
Preferably, the opening width of the processing hole 102 of the processing plate 100 is formed to be larger than the interval of the cutting part when the display panel 300 is completely cut. According to the laser processing apparatus of an embodiment of the present invention, the opening width of the processing hole 102 is adjusted for each of the workpieces having different laser cutting shapes and positions, and laser cutting of various workpieces can be completed using the processing plate 100 and the adjusting member 200 according to an embodiment of the present invention without manufacturing another processing plate.
The adjustment member 200 includes a base portion 201 having a second fastening hole 205 and a side portion 202 bent from the base portion 201. At this time, the width W3 of the base portion 201 is smaller than the sum of the width W1 of the mounting groove 101 and the width W2 of the machining hole 102. Thus, the position of the adjustment member 200 can be changed in the width W3 direction of the base portion 201, that is, in the longitudinal direction of the second fastening hole 205.
The fastening member 500 according to an embodiment of the present invention may be a bolt. The present invention is not limited to this, and the fastening member 500 may be variously modified.
Fig. 6a and 6b are views for explaining the adjustment of the opening width of the machining hole according to the position of the adjustment member. Fig. 6a shows a state in which the adjustment member 200 is disposed at a position relatively distant from the center portion C of the processing plate 100, and fig. 6b shows a state in which the adjustment member 200 is disposed at a position relatively close to the center portion C of the processing plate 100.
Referring to fig. 6a and 6b, the adjustment member 200 is positioned in the mounting groove 101 to adjust the opening width of the processing hole 102. At this time, the opening width of the machining hole 102 is equal to or less than the width W2 of the machining hole 102, and the opening width of the machining hole 102 may be about 0.05mm to 10 mm.
In more detail, the opening width W4 of the machining hole 102 when the adjustment member 200 is disposed at a position relatively distant from the center portion C of the machining plate 100 is larger than the opening width W5 of the machining hole 102 when disposed relatively close to the center portion C.
Preferably, the opening width of the processing hole 102 of the processing plate 100 is formed to be larger than the cutting portion interval of the display panel 300 when the display panel 300 is completely cut, but if the opening width of the processing hole 102 is formed to be too large, the area of the processing plate 100 supporting the display panel 300 becomes small, and there is a possibility that the display panel 300 sags when the laser cutting processing is performed. According to the laser processing apparatus of the embodiment of the present invention, since the opening width of the processing hole 102 can be adjusted for workpieces having different laser cutting shapes and positions, it is possible to prevent a problem due to the opening width of the processing hole 102.
That is, when the cut portion interval of the display panel 300 is large and it is necessary to form a large opening width of the processing hole 102, the adjustment member 200 is disposed at a position distant from the center portion C of the processing plate 100 as shown in fig. 6 a. When the cutting interval of the display panel 300 is small and it is necessary to form a small opening width of the machining hole 102, the adjustment member 200 is disposed at a position close to the center portion C of the machining plate 100 as shown in fig. 6 b.
Therefore, by using the processing plate 100 and the regulating member 200 according to an embodiment of the present invention, laser cutting processing of various workpieces can be completed without separately manufacturing the respective processing plates.
Fig. 7 is a sectional view showing a processing plate, an adjusting member, and a fastening member according to another embodiment of the present invention.
Referring to fig. 7, when a surface of the processing board 100 opposite to the laser beam irradiation part 400 is defined as an upper surface 108 and a surface located opposite to the upper surface 108 is defined as a lower surface 109, the processing hole 102 according to another embodiment of the present invention has different widths at the upper surface 108 and the lower surface 109, respectively.
In this case, the machining hole 102 of the machining plate 100 can be machined by the laser beam L, and the machining plate 100 may be made of a material that can be machined by the laser beam L, for example, an acrylic material.
The adjustment member 200 includes a base portion 201 having a second fastening hole 205, an inclined portion 203 bent from the base portion 201, and a side surface portion 202 bent from the inclined portion. As in an embodiment of the present invention, the adjusting member 200 is positioned in the mounting groove 101 of the processing plate 100, thereby adjusting the opening width of the processing hole 102.
The laser processing apparatus according to another embodiment of the present invention has the above-described structure, so that the width W6 of the upper opening formed by the upper surface 108 of the processing plate 100 and the regulating member 200 is formed smaller than the width W7 of the lower opening formed in the lower surface 109 of the processing plate 100.
As shown in fig. 7, the laser beam L is diffused when passing through the processing plate 100 after being irradiated for cutting the display panel 300. Therefore, according to the laser processing apparatus of the other embodiment of the present invention, the width of the opening portion gradually increases as it goes from the upper surface 108 to the lower surface 109 of the processing plate 100, and thus the processing plate 100 and the regulating member 200 can be prevented from being damaged by the laser beam L having the diffusibility.
At this time, the cross-section of the opening part according to another embodiment of the present invention is shown to be tapered, but is not limited thereto, and may be deformed into various shapes such as quadrangle, step, etc. so as to meet process conditions.
Although the embodiments of the present invention have been described with reference to the drawings, those skilled in the art will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, the above-described embodiments are merely examples in any respect, and should not be construed as limiting the embodiments of the present invention.
Reference numerals
100 processing plate 101 mounting groove
102, a processing hole 105, a first fastening hole
200 adjusting part 205 second fastening hole
300 display panel 400 laser beam irradiation part
500 fastening means L laser beam.
Claims (12)
1. A laser processing apparatus comprising:
the processing plate is used for supporting a processing piece and is provided with at least one mounting groove and a processing hole;
the adjusting component is positioned in the mounting groove and used for adjusting the opening width of the machining hole;
a fastening member for fixing the adjustment member to the processing plate; and
a laser beam irradiation unit that irradiates a laser beam toward the workpiece disposed on the processing plate,
the adjustment member includes a base portion, a side surface portion bent from the base portion, and an inclined portion between the base portion and the side surface portion.
2. The laser processing apparatus according to claim 1,
the processing plate is provided with a first fastening hole which is positioned in the mounting groove and used for inserting the fastening part, the adjusting part is provided with a second fastening hole which penetrates through the fastening part, and the cross-sectional area of the second fastening hole is larger than that of the first fastening hole.
3. The laser processing apparatus according to claim 2,
the fastening member has an outer diameter identical to an inner diameter of the first fastening hole.
4. The laser processing apparatus according to claim 2,
the second fastening hole is oval.
5. The laser processing apparatus according to claim 2,
the base portion has the second fastening hole.
6. The laser processing apparatus according to claim 5,
the width of the base part is smaller than the sum of the widths of the mounting groove and the machining hole.
7. The laser processing apparatus according to claim 1,
the opening width of the machining hole is increased as the distance between the central portion of the machining plate and the adjustment member is increased.
8. The laser processing apparatus according to claim 1,
the opening width of the processing hole is 0.05mm to 10 mm.
9. The laser processing apparatus according to claim 1,
the processing plate is made of acrylic materials.
10. The laser processing apparatus according to claim 1,
the fastening member is a bolt.
11. The laser processing apparatus according to claim 1,
the laser beam irradiation part includes CO2One of a laser light generating device, a YAG laser light generating device and a Glass laser light generating device.
12. The laser processing apparatus according to claim 1, further comprising:
and the dust collecting device is used for removing foreign matters generated during laser processing of the workpiece.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160084260A KR102570318B1 (en) | 2016-07-04 | 2016-07-04 | Laser Processing Apparatus |
| KR10-2016-0084260 | 2016-07-04 |
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| Publication Number | Publication Date |
|---|---|
| CN107570895A CN107570895A (en) | 2018-01-12 |
| CN107570895B true CN107570895B (en) | 2021-07-23 |
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| CN109014728B (en) * | 2018-09-04 | 2023-07-07 | 桂林航天工业学院 | Passenger car body framework welding fixture with deflection function |
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| US6963047B2 (en) * | 2001-07-24 | 2005-11-08 | Reinhard Diem | Device for accommodating flat materials during separation by a separating device, and a separating method |
| CN101909806A (en) * | 2007-12-27 | 2010-12-08 | 三星钻石工业股份有限公司 | Laser processing apparatus |
| CN102858489A (en) * | 2010-04-12 | 2013-01-02 | 三菱电机株式会社 | Laser-cutting method and laser-cutting device |
| CN202841789U (en) * | 2012-08-16 | 2013-03-27 | 上海昊德电气有限公司 | Sliding type plugging device of electrical cabinet cable inlet |
| CN204799846U (en) * | 2015-07-13 | 2015-11-25 | 江苏省苏中建设集团股份有限公司 | Reinforcing bar processing operation platform |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102570318B1 (en) | 2023-08-24 |
| KR20180004867A (en) | 2018-01-15 |
| CN107570895A (en) | 2018-01-12 |
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