CN107565008B - LED point-like light-emitting structure - Google Patents

LED point-like light-emitting structure Download PDF

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Publication number
CN107565008B
CN107565008B CN201710701770.2A CN201710701770A CN107565008B CN 107565008 B CN107565008 B CN 107565008B CN 201710701770 A CN201710701770 A CN 201710701770A CN 107565008 B CN107565008 B CN 107565008B
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packaging
thickness
led lamp
substrate
led
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CN107565008A (en
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黎思奇
任陈铭
王智勇
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Interface Optoelectronics Shenzhen Co Ltd
Interface Technology Chengdu Co Ltd
General Interface Solution Ltd
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Abstract

The invention relates to an LED point-like light-emitting structure. The LED point-like light-emitting structure comprises a substrate, LED lamp beads and a packaging colloid; the LED lamp beads are arranged on the substrate; the LED lamp comprises a substrate, a plurality of LED lamp beads, a plurality of packaging glue layers and a plurality of packaging glue layers, wherein the packaging glue layers are arranged on the substrate and wrap the LED lamp beads, the plurality of packaging glue layers are different in refractive index, and the refractive indexes of the plurality of packaging glue layers are gradually reduced along the direction away from the LED lamp beads.

Description

LED point-like light-emitting structure
Technical Field
The invention relates to an LED point-like light-emitting structure.
Background
The existing LED light-emitting structure generally comprises a substrate, LED lamp beads and a packaging colloid. The LED lamp beads are arranged on the substrate, and the packaging colloid is coated on the LED lamp beads and is attached to the substrate. However, since the refractive index of the encapsulant is fixed, the light emitting angle of the LED light emitting structure is small due to the limitation of the refractive index.
Disclosure of Invention
Therefore, it is necessary to provide a point-like light emitting structure of LED with a large light emitting angle.
An LED point-like light-emitting structure comprises a substrate, LED lamp beads and a packaging colloid; the LED lamp beads are arranged on the substrate; the LED lamp comprises a substrate, a plurality of LED lamp beads, a plurality of packaging glue layers and a plurality of packaging glue layers, wherein the packaging glue layers are arranged on the substrate and wrap the LED lamp beads, the plurality of packaging glue layers are different in refractive index, and the refractive indexes of the plurality of packaging glue layers are gradually reduced along the direction away from the LED lamp beads.
In one embodiment, the optical thickness of each of the encapsulant layers is less than or equal to 1.2.
In one embodiment, the refractive index of each of the encapsulant layers is greater than 1 and less than 1.5.
In one embodiment, the encapsulant has a penetration greater than 98%.
In one embodiment, the light emitting angle of the LED point light emitting structure is greater than 120 degrees.
In one embodiment, the plurality of packaging adhesive layers comprise a first packaging adhesive layer, a second packaging adhesive layer, a third packaging adhesive layer, a fourth packaging adhesive layer and a wrapping layer which are sequentially stacked, and the wrapping layer wraps the LED lamp beads and is attached to the substrate.
In one embodiment, the thickness of the first adhesive layer, the thickness of the second adhesive layer, the thickness of the third adhesive layer and the thickness of the fourth adhesive layer are all smaller than the thickness of the wrapping layer.
In one embodiment, the thickness of the first adhesive layer, the thickness of the second adhesive layer, the thickness of the third adhesive layer and the thickness of the fourth adhesive layer increase in sequence.
In one embodiment, the substrate is further provided with a clamping frame in a protruding manner, and the clamping frame is clamped on the periphery of the encapsulant.
In one embodiment, the substrate is a rectangular plate, and the fastening frame is a rectangular frame.
Because last encapsulation colloid of LED lamp pearl includes a plurality of encapsulation glue films, just the refracting index of a plurality of encapsulation glue films is along keeping away from LED lamp pearl's direction reduces gradually, consequently, makes every encapsulation glue film can be right the light that LED lamp pearl sent plays the refraction effect to guide light to produce bigger deflection one by one, thereby make the luminous angle of light great.
Drawings
Fig. 1 is a schematic plan view of an LED dot light emitting structure according to an embodiment.
Fig. 2 is a schematic plan view of an LED dot light emitting structure according to another embodiment.
FIG. 3 is a graph of wavelength versus transmittance for an embodiment.
FIG. 4 is a graph of wave-penetration rate for another embodiment.
FIG. 5 is a graph of wavelength versus transmittance for yet another embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention relates to an LED point-like light-emitting structure. For example, the LED dot-shaped light emitting structure includes a substrate, LED beads, and a molding compound; the LED lamp beads are arranged on the substrate. For example, the encapsulant is disposed on the substrate and covers the LED beads. For example, the encapsulant is formed with a plurality of encapsulant layers, the refractive index of a plurality of encapsulant layers sets up differently, the refractive index of a plurality of encapsulant layers along keep away from LED lamp pearl the direction reduces gradually. For another example, an LED dot light emitting structure includes a substrate, LED beads, and a molding compound. For example, the LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. For example, the encapsulant is formed with a plurality of encapsulant layers, and the refractive indexes of the encapsulant layers are different. For example, the refractive indexes of the plurality of packaging adhesive layers are gradually reduced along the direction far away from the LED lamp beads.
Referring to fig. 1, an LED dot light emitting structure 100 includes a substrate 10, LED beads 20, and a molding compound 30. For example, the LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. For example, the encapsulant is formed with a plurality of encapsulant layers 31, and the refractive indexes of the encapsulant layers are different. For example, the refractive indexes of the plurality of packaging adhesive layers are gradually reduced along the direction far away from the LED lamp beads.
Because last encapsulation colloid of LED lamp pearl includes a plurality of encapsulation glue films, just the refracting index of a plurality of encapsulation glue films is along keeping away from LED lamp pearl's direction reduces gradually, consequently, makes every encapsulation glue film can be right light 40 that LED lamp pearl sent plays the refraction effect to guide light to produce bigger deflection one by one, thereby make the luminous angle of light great.
For example, in order to improve the penetration rate of the encapsulant, the optical thickness of each encapsulant layer is less than or equal to 1.2. The refractive index of each packaging adhesive layer is larger than 1 and smaller than 1.5. The penetration rate of the packaging colloid is more than 98%. The light emitting angle of the LED point-like light emitting structure is larger than 120 degrees. For example, an LED dot light emitting structure includes a substrate, an LED bead, and an encapsulant. The LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. The packaging colloid is formed with a plurality of packaging glue layers, and the refractive index of a plurality of packaging glue layers is arranged differently. The refractive indexes of the plurality of packaging adhesive layers are gradually reduced along the direction far away from the LED lamp beads, wherein the optical thickness of each packaging adhesive layer is smaller than or equal to 1.2, and the refractive index of each packaging adhesive layer is larger than 1 and smaller than 1.5. The penetration rate of the packaging colloid is more than 98%. The light emitting angle of the LED point-like light emitting structure is larger than 120 degrees. For another example, an LED dot light emitting structure includes a substrate, LED beads, and a molding compound. The LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. The packaging colloid is formed with a plurality of packaging glue layers, and the refractive index of a plurality of packaging glue layers is arranged differently. The refracting index of a plurality of encapsulation glue films is along keeping away from LED lamp pearl's direction reduces gradually, a plurality of encapsulation glue films are including first encapsulation glue film 311, second encapsulation glue film 312, third encapsulation glue film 313, fourth encapsulation glue film 314 and the parcel layer 315 that stacks gradually the setting, the parcel layer cladding LED lamp pearl is located with pasting on the base plate. Through the arrangement of the thickness and the refractive index of the packaging adhesive layer, the penetration rate of the packaging adhesive can be ensured to be greater than 98%.
For example, in order to facilitate the clamping of the LED lamp beads, the thickness of the first encapsulant layer, the thickness of the second encapsulant layer, the thickness of the third encapsulant layer, and the thickness of the fourth encapsulant layer are all smaller than the thickness of the wrapping layer. The thickness of first encapsulation glue film, the thickness of second encapsulation glue film, the thickness of third encapsulation glue film and the thickness of fourth encapsulation glue film increases in proper order. The substrate is also convexly provided with a clamping frame 11 which is clamped at the periphery of the packaging colloid. The base plate is a rectangular plate, and the clamping frame is a rectangular frame. For another example, an LED dot light emitting structure includes a substrate, LED beads, and a molding compound. The LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. The packaging colloid is formed with a plurality of packaging glue layers, and the refractive index of a plurality of packaging glue layers is arranged differently. The refracting index of a plurality of encapsulation glue films is along keeping away from LED lamp pearl's direction reduces gradually, the thickness of first encapsulation glue film the thickness of second encapsulation glue film the thickness of third encapsulation glue film and the thickness of fourth encapsulation glue film all is less than the thickness of parcel layer. The thickness of first encapsulation glue film, the thickness of second encapsulation glue film, the thickness of third encapsulation glue film and the thickness of fourth encapsulation glue film increases in proper order. The substrate is also convexly provided with a clamping frame 11 which is clamped at the periphery of the packaging colloid. The base plate is a rectangular plate, and the clamping frame is a rectangular frame. Through setting up the rectangle frame to conveniently the card establishes LED lamp pearl, and then make LED punctiform light emitting structure is more stable.
Referring to fig. 2, an LED dot light emitting structure includes a substrate 10, LED beads 20, and a molding compound 50. For example, the LED lamp beads are arranged on the substrate; the packaging colloid is arranged on the substrate and coats the LED lamp beads. For example, the encapsulant is formed with a plurality of encapsulant layers, and the refractive indexes of the encapsulant layers are different. For example, the refractive indexes of the plurality of packaging adhesive layers are gradually reduced along the direction far away from the LED lamp beads. The plurality of packaging adhesive layers comprise a first packaging adhesive layer 51, a second packaging adhesive layer 52, a third packaging adhesive layer 53, a fourth packaging adhesive layer 54, a fifth packaging adhesive layer 55 and a wrapping layer 56 which are sequentially stacked. Because last encapsulation colloid of LED lamp pearl includes five encapsulation glue films, just the refracting index of five encapsulation glue films is along keeping away from LED lamp pearl's direction reduces gradually, consequently, makes every encapsulation glue film can be right light 40 that LED lamp pearl sent plays the refraction effect to guide light to produce bigger deflection one by one, thereby make the luminous angle of light great, for example, be greater than 120 degrees.
Referring to fig. 3, for example, the plurality of encapsulation adhesive layers include a first encapsulation adhesive layer 311, a second encapsulation adhesive layer 312, a third encapsulation adhesive layer 313, a fourth encapsulation adhesive layer 314, and a wrapping layer 315, which are sequentially stacked. The optical thickness of the first packaging adhesive layer to the fourth packaging adhesive layer is 1, the refractive indexes of the first packaging adhesive layer to the fourth packaging adhesive layer are 1.1, 1.2, 1.3 and 1.4 in sequence, the thickness (actual thickness) of the first packaging adhesive layer to the fourth packaging adhesive layer is 98.21 nanometers, 105.77 nanometers, 114.58 nanometers and 125 nanometers in sequence, and at the moment, as can be seen from fig. 3, the penetration rate of the packaging adhesive is greater than 99%.
Referring to fig. 4, for example, the optical thicknesses of the first encapsulant layer to the fourth encapsulant layer are all equal to each other and are 1.2, the refractive indexes of the first encapsulant layer to the fourth encapsulant layer are 1.1, 1.2, 1.3 and 1.4 in sequence, and the thicknesses (actual thicknesses) of the first encapsulant layer to the fourth encapsulant layer are 117.86 nm, 126.92 nm, 137.5 nm and 150 nm in sequence, at this time, as can be seen from fig. 4, the transmittance of the encapsulant is greater than 98%.
Referring to fig. 5, for example, the optical thicknesses of the first to fourth encapsulant layers are all 1.3, the refractive indexes of the first to fourth encapsulant layers are 1.1, 1.2, 1.3 and 1.4, and the thicknesses (actual thicknesses) of the first to fourth encapsulant layers are 127.68 nm, 137.5 nm, 148.96 nm and 162.5 nm, which shows that the transmittance of the encapsulant is as low as 97% in fig. 5.
Therefore, in order to realize a wider light emitting angle under the condition of having a higher transmittance, it is necessary to ensure that the optical thickness of each encapsulating adhesive layer is less than or equal to 1.2, the refractive index of each encapsulating adhesive layer is greater than 1 and less than 1.5, and thus the transmittance can be ensured to be greater than 98%.
For example, the conventional encapsulant is a single layer design, which is formed by filling a single material, so as to form a single light-emitting angle, which is smaller than 120 degrees. The packaging colloid is designed in a multi-layer mode; the packaging colloid is made of materials with different refractive indexes, so that the luminous angle is wide and increased. Since the transmittance is reduced due to the excessive thickness of the multi-layer colloid material, the optimal transmittance can be achieved by simulating different optical film thicknesses through fig. 3-5. (2) In order to increase the light emission angle θ 1 (light exit angle), n2 (refractive index of the light entrance layer) > n1 (refractive index of the light exit layer) needs to be between the glass refractive index of 1.5 and the air refractive index of 1. On the LED sealing structure, adopting (1) multilayer colloid sealing; (2) the optical film thickness (QWOT, quarter wavelength optical thickness) of each layer of material is less than or equal to 1.2; (3)1< refractive index of each layer <1.5, and the refractive index decreases from the lower layer to the upper layer, so that the LED has wider light-emitting angle and higher transmittance.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (4)

1. An LED point-like light-emitting structure is characterized by comprising a substrate, LED lamp beads and a packaging colloid;
the LED lamp beads are arranged on the substrate;
the packaging colloid is arranged on the substrate and wraps the LED lamp beads, a plurality of packaging adhesive layers are formed on the packaging colloid, the refractive indexes of the packaging adhesive layers are different, and the refractive indexes of the packaging adhesive layers are gradually reduced along the direction far away from the LED lamp beads;
the optical thickness of each packaging adhesive layer is less than or equal to 1.2, the refractive index of each packaging adhesive layer is greater than 1 and less than 1.5, and the penetration rate of the packaging adhesive is greater than 98%; the plurality of packaging glue layers comprise a first packaging glue layer, a second packaging glue layer, a third packaging glue layer, a fourth packaging glue layer and a wrapping layer which are sequentially stacked, the wrapping layer wraps the LED lamp beads and is attached to the substrate, the thickness of the first packaging glue layer, the thickness of the second packaging glue layer, the thickness of the third packaging glue layer and the thickness of the fourth packaging glue layer are all smaller than the thickness of the wrapping layer, and the thickness of the first packaging glue layer, the thickness of the second packaging glue layer, the thickness of the third packaging glue layer and the thickness of the fourth packaging glue layer are sequentially increased; the substrate is also convexly provided with a clamping frame which is clamped at the periphery of the packaging colloid.
2. The LED point-like light emitting structure according to claim 1, wherein the light emitting angle of the LED point-like light emitting structure is greater than 120 degrees.
3. The point-like LED light emitting structure according to claim 1, wherein the optical thicknesses of the first to fourth encapsulant layers are all 1, and the refractive indexes of the first to fourth encapsulant layers are 1.1, 1.2, 1.3 and 1.4 in sequence.
4. The LED point-like light emitting structure according to claim 1, wherein the substrate is a rectangular plate, and the fastening frame is a rectangular frame.
CN201710701770.2A 2017-08-16 2017-08-16 LED point-like light-emitting structure Active CN107565008B (en)

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CN110085724B (en) * 2019-03-28 2022-02-22 永曜电机(深圳)有限公司 Eye-protecting LED light source
CN111505865A (en) * 2020-04-20 2020-08-07 深圳市隆利科技股份有限公司 Direct type backlight module
CN115877612B (en) * 2022-12-26 2023-11-21 惠科股份有限公司 Backlight module and display device

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CN104979456A (en) * 2014-04-02 2015-10-14 四川新力光源股份有限公司 LED light source device, packaging method, backlight module and display device thereof

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KR20130072753A (en) * 2011-12-22 2013-07-02 엘지이노텍 주식회사 Light emitting device, method for fabricating the same, and light emitting device package
CN103280516A (en) * 2013-05-15 2013-09-04 陕西煤业化工技术研究院有限责任公司 Light-emitting diode packaging material and packaging forming method
CN104979456A (en) * 2014-04-02 2015-10-14 四川新力光源股份有限公司 LED light source device, packaging method, backlight module and display device thereof
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