CN107564856B - Stripping method of flexible substrate - Google Patents
Stripping method of flexible substrate Download PDFInfo
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- CN107564856B CN107564856B CN201610508151.7A CN201610508151A CN107564856B CN 107564856 B CN107564856 B CN 107564856B CN 201610508151 A CN201610508151 A CN 201610508151A CN 107564856 B CN107564856 B CN 107564856B
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- 239000000758 substrate Substances 0.000 title claims abstract description 113
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- 238000002360 preparation method Methods 0.000 abstract description 2
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- 239000000806 elastomer Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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- 239000005262 ferroelectric liquid crystals (FLCs) Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
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Abstract
The invention relates to the field of preparation of flexible display devices, in particular to a stripping method of a flexible substrate. The stripping method has low cost, can be implemented in a large area, does not damage electronic or optical devices on the flexible substrate during stripping, and improves the yield and the capacity of products.
Description
Technical Field
The invention relates to the field of preparation of flexible display devices, in particular to a stripping method of a flexible substrate.
Background
In general, a flexible display is formed by coating a flexible substrate material such as PI (polyimide) on a rigid substrate, baking the coated substrate to form a flexible substrate, forming an electronic or optical device on the flexible substrate, and then performing lift-off by laser irradiation after the flexible substrate is formed, that is, applying high-intensity laser to an interface between a polymer substrate (flexible substrate) and the rigid substrate (e.g., glass) to ablate a polymer thin layer on the interface, thereby performing lift-off.
However, the stripping mode is limited by the laser scanning size, and large-area stripping cannot be realized; but also can damage the device in the laser irradiation process and reduce the yield of products; in addition, the laser stripping equipment has high cost and difficult maintenance, and reduces the productivity.
Disclosure of Invention
In view of the above technical problems, the present invention is directed to a method for peeling off a flexible substrate, which is low in cost and capable of peeling off a large area, and does not damage devices during peeling off, thereby improving yield and productivity of products.
The main technical scheme for solving the technical problems is as follows:
a method for peeling a flexible substrate, the method comprising:
preparing a flexible composite film layer on a rigid substrate;
arranging a flexible substrate on the telescopic composite film layer;
preparing a display device on the flexible substrate, and
and peeling the flexible substrate by deforming the flexible composite film layer.
Preferably, in the peeling method, the stretchable composite film layer is an electrostrictive composite film layer.
Preferably, in the peeling method, the step of preparing the electrostrictive composite film layer on the rigid substrate includes:
forming a first electrode on the rigid substrate;
forming an electrostrictive layer over the first electrode;
forming a second electrode on the electrostrictive layer;
wherein the flexible substrate is formed over the second electrode, and the electrostrictive layer is deformed by applying a voltage to the first electrode and the second electrode to peel the flexible substrate from the rigid substrate.
In the above peeling method, preferably, a voltage applied to the first electrode and the second electrode is greater than a phase transition threshold voltage of the electrostrictive layer.
Preferably, in the peeling method, the first electrode, the electrostrictive layer, and the second electrode are formed as flat film layers, and sequentially cover the rigid substrate.
Preferably, in the above-mentioned peeling method, before the first electrode is formed,
forming a plurality of grooves on the rigid substrate, wherein the first electrodes cover the bottoms and the side walls of the grooves and the exposed upper surface of the rigid substrate;
the electrostrictive layer is filled in the grooves and is flush with the first electrode covering the exposed upper surface of the rigid substrate;
the second electrode comprises a plurality of blocks which are sequentially formed on the electrostrictive layer filled in the grooves and are not in contact with the first electrode.
Preferably, in the above-mentioned peeling method, before forming the second electrode,
forming a first dielectric layer over the first electrode overlying the exposed upper surface of the rigid substrate;
continuously forming a second electrode on the electrostrictive layer and the upper surface and the side wall of the first dielectric layer;
wherein the first dielectric layer isolates the first electrode from the second electrode.
Preferably, in the peeling method, the step of preparing the electrostrictive composite film layer on the rigid substrate includes:
forming a third electrode on the rigid substrate;
forming a first electrostrictive layer over the third electrode;
forming a fourth electrode on the first electrostrictive layer;
forming a second electrostrictive layer over the fourth electrode;
forming a fifth electrode on the second electrostrictive layer;
wherein the flexible substrate is formed over the fifth electrode, and the first electrostrictive layer and the second electrostrictive layer are deformed by applying a voltage to the third electrode, the fourth electrode, and the fifth electrode, so that the flexible substrate is peeled off from the rigid substrate.
In the above peeling method, preferably, a voltage applied to the third electrode, the fourth electrode, and the fifth electrode is greater than a phase transition threshold voltage of the first electrostrictive layer and a phase transition threshold voltage of the second electrostrictive layer.
Preferably, in the peeling method, the third electrode, the first electrostrictive layer, the fourth electrode, the second electrostrictive layer, and the fifth electrode are formed as flat film layers, and are sequentially covered on the rigid substrate.
Preferably, in the peeling method, the fourth electrode is divided into a plurality of blocks which are sequentially formed in the first electrostrictive layer and the second electrostrictive layer, and the fourth electrodes in the first electrostrictive layer and the second electrostrictive layer correspond to each other up and down, so that the first electrostrictive layer and the second electrostrictive layer deform at the corresponding positions simultaneously after voltage is applied;
and a second dielectric layer is formed between the first electrostrictive layer and the second electrostrictive layer to isolate the first electrostrictive layer from the second electrostrictive layer and isolate the fourth electrodes which vertically correspond to each other.
Preferably, in the peeling method, the third electrode and the fifth electrode are connected to the fourth electrode through pins, respectively.
Preferably, in the peeling method, after the external force is applied to deform the stretchable composite film layer to peel the flexible substrate, a remaining portion of the stretchable composite film layer on the flexible substrate is removed.
The technical scheme has the following advantages or beneficial effects:
the invention realizes the separation of the flexible substrate and the rigid substrate by manufacturing the electrostrictive layer and the electrode between the flexible substrate and the rigid substrate and controlling the electrostrictive layer to deform through voltage after manufacturing an electronic or optical device. The stripping method has low cost, can be implemented in a large area, does not damage devices on the flexible substrate during stripping, and improves the yield and the capacity of products.
Drawings
Embodiments of the present invention will now be described more fully hereinafter with reference to the accompanying drawings. The drawings are, however, to be regarded as illustrative and explanatory only and are not restrictive of the scope of the invention.
FIG. 1 is a diagram illustrating the core steps of the peeling method of the flexible substrate according to the present invention;
FIGS. 2 to 7 are structural views of respective steps in the embodiment.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. Of course, the invention is capable of other embodiments in addition to those detailed.
The method for peeling off the flexible substrate is applied to peeling off a flexible substrate which is prepared with a display device (such as a Thin Film Transistor (TFT), an electronic or optical element (OLED) and the like) and is packaged from a rigid substrate, an electrostrictive layer and an electrode are manufactured between the flexible substrate and the rigid substrate, and the electrostrictive layer is controlled to deform through voltage, so that the flexible substrate is separated from the rigid substrate, and the core steps can be referred to fig. 1. The electrostrictive material can be ceramic or organic matter, and the electrode material can be metal.
The flexible substrate and the peeling method thereof according to the present invention will be described in detail with reference to the following specific embodiments and the accompanying drawings.
The first embodiment is as follows:
as shown in the structure diagram of the flexible substrate shown in fig. 2, a metal thin film is formed on a rigid substrate 1 by a sputtering (sputter) film forming method to serve as a first electrode 2; the first electrode 2 may be formed by other suitable methods, and in this embodiment, the first electrode 2 is formed by sputtering, but this is not a limitation of the present invention.
After the first electrode 2 is manufactured, an electrostrictive film 3 is manufactured by adopting a sputtering or sol-gel method to cover the first electrode 2; and a plurality of second electrodes 4 are formed in the electrostrictive film 3 by using a film patterning process (such as a photolithography process) and distributed in the electrostrictive film 3, and preferably, the plurality of second electrodes 4 are uniformly distributed in the electrostrictive film 3 and flush with the upper surface of the electrostrictive film 3.
Then, forming a dielectric layer 5 to cover the electrostrictive film 3 and the plurality of second electrodes 4; and the electrostrictive film 30 is manufactured on the dielectric layer 5 by adopting the method consistent with the method for manufacturing the electrostrictive film 3 and covers the dielectric layer 5; meanwhile, a plurality of second electrodes 40 are uniformly distributed in the electrostrictive film 30, and the plurality of second electrodes 40 distributed in the electrostrictive film 30 vertically correspond to the plurality of second electrodes 4 distributed in the electrostrictive film 3, so that the electrostrictive film 30 on the upper layer and the electrostrictive film 3 on the lower layer deform at corresponding positions simultaneously when a voltage is applied subsequently. The dielectric layer 5 serves to separate the two electrostrictive films 3 and 30 and to separate the two second electrodes 4 and 40.
Further, a layer of the third electrode 6 is formed on the electrostrictive film 30, and the same sputtering method as that for the first electrode 2 can be adopted; then the first electrode 2 is connected with a plurality of second electrodes 4 through pins, and the third electrode 6 is connected with a plurality of second electrodes 40 through pins; and the flexible substrate 7 of the present embodiment is formed over the third electrode 6, resulting in the structure shown in fig. 2.
The strain generated by the dielectric medium under the action of the external electric field and proportional to the square of the field strength is called electrostriction, and the electrostriction effect is possessed by all dielectric media, namely non-piezoelectric crystals or piezoelectric crystals. For example, some polyurethane-based high molecular polymers and perovskite-based ceramic materials have electrostrictive properties, and these materials can be greatly deformed by applying an electric field.
As a preferred embodiment, here the electrostrictive films 3 and 30 may be nematic gels of reverse piezoelectric properties or ferroelectric liquid crystal elastomer films.
After devices (not shown) such as TFTs, electronic or optical elements, etc. are formed on the flexible substrate 7 and the package is completed, the flexible substrate 7 needs to be peeled off from the rigid substrate 1. By applying a voltage to the first electrode 2, the second electrodes 4 and 40 and the third electrode 6 (since the deformation generated by the electrostrictive material is independent of the direction of the external electric field, it is only necessary to ensure that the voltage with opposite polarity is applied to the first electrode 2 and the second electrode 4, and the voltage with opposite polarity is applied to the second electrode 40 and the third electrode 6 at the same time), when the voltage value exceeds the phase transition threshold voltage of the electrostrictive films 3 and 30, the electrostrictive films 3 and 30 undergo convex deformation as shown in fig. 3, and the electrostrictive films 30 and 3 on the upper and lower layers interact with each other, so that the upper and lower layers are separated, i.e., the flexible substrate 7 is separated from the rigid substrate 1.
The third electrode 6 remaining on the flexible substrate 7 after separation, and the electrostrictive film 30 and the second electrode 40 can be easily removed by etching, for example, dry etching or wet etching.
It should be noted that the second electrode is divided into a plurality of blocks to be arranged as an upper layer and a lower layer (the second electrode 40 and the second electrode 4), and the upper layer and the lower layer are correspondingly arranged to ensure that the electrostrictive films 30 and 3 are deformed at the corresponding positions at the same time. In other variant embodiments, the second electrode may be provided as a single block or may be incorporated into a single block, with reference to the block diagrams shown in fig. 4 and 5, where the same reference numerals as in the above figures denote the same membrane layers.
Specifically, in the configuration diagram shown in fig. 4, the rigid substrate 1 is covered with the first electrode 2, the electrostrictive film 31, the second electrode 41 (formed on the electrostrictive film 31 as a whole), the dielectric layer 5, the second electrode 401 (formed on the dielectric layer 5 as a whole), the electrostrictive film 301, the third electrode 6, and the flexible substrate 7 in this order. Further, after a display device (not shown) is formed on the flexible substrate 7 and the encapsulation is completed, voltages are applied to the first electrode 2, the second electrodes 41 and 401, and the third electrode 6, so that the electrostrictive films 31 and 301 are subjected to convex deformation to complete the separation of the flexible substrate 7 from the rigid substrate 1. The manufacturing method and electrostriction principle of each film layer are similar to those described above, and thus are not described in detail.
Alternatively, without using the dielectric layer 5, the first electrode 2, the electrostrictive film 31, the second electrode 41 (formed on the entire surface of the electrostrictive film 31), the electrostrictive film 301, the third electrode 6, and the flexible substrate 7 may be formed in this order on the rigid substrate 1, with reference to the configuration diagram shown in fig. 5. After the first electrode 2, the second electrode 41 and the third electrode 6 are energized, the electrostrictive films 31 and 301 may also be deformed to separate the flexible substrate 7 from the rigid substrate 1.
Example two:
this embodiment is different from the first embodiment and the modified embodiments thereof in that only one electrostrictive layer is formed, and the same reference numerals as those in the above-described drawings denote the same film layers with reference to the structural view shown in fig. 6.
Forming a plurality of grooves on the rigid substrate 1, wherein the first electrode 20 covers the bottoms and the side walls of the grooves and the exposed upper surface of the rigid substrate 1; the electrostrictive material 300 is filled in a plurality of grooves (the inner walls of which have been covered by the first electrode 20) and is preferably flush with the first electrode 20 covering the exposed upper surface of the rigid substrate 1; then, forming a dielectric layer 50 on the first electrode 20 covering the exposed upper surface of the rigid substrate 1 (the dielectric layer 50 is divided into a plurality of blocks and respectively covers the first electrode 20 covering the exposed upper surface of the rigid substrate 1); then, a second electrode 400 is formed on the electrostrictive material 300 and on the upper surface and the sidewall of the dielectric layer 50; the dielectric layer 50 is used to separate the first electrode 20 from the second electrode 400. By applying a voltage to the first electrode 20 and the second electrode 400, the electrostrictive material 300 is deformed, and the flexible substrate 7 and the rigid substrate 1 can be separated from each other.
Alternatively, as shown in the structure diagram of fig. 7, the dielectric layer 50 may not be used, and after the electrostrictive material 300 is filled in the groove whose inner wall is covered with the first electrode 20, the second electrode 4001 may be directly divided into several pieces to be formed on the electrostrictive material 300, as long as it is ensured that the second electrode 4001 does not contact with the first electrode 20.
Of course, a flexible composite film layer (which may include an upper electrode layer, a lower electrode layer, and an intermediate electrostrictive film layer) may be directly formed on the rigid substrate by a full-surface film formation method, and then a flexible substrate may be formed on the flexible composite film layer, and a voltage may be applied to the two electrodes to deform the electrostrictive film layer during peeling.
In addition to the above embodiments, the electrostrictive material and the electrodes fabricated between the flexible substrate and the rigid substrate according to the present invention may be disposed in other ways to form different flexible substrate structures and corresponding peeling methods, which can satisfy the purpose of controlling the electrostrictive material to deform by voltage, thereby achieving the separation of the flexible substrate and the rigid substrate.
It should be noted that the first electrode, the second electrode, the third electrode, and the first to fifth electrodes mentioned in the above-mentioned summary of the invention are only used for distinguishing the electrodes at different positions, and they do not conflict with each other, and the electrodes at different positions are distinguished by using the reference numerals in different embodiments, which does not limit the present invention.
In summary, according to the peeling method for the flexible substrate provided by the invention, the electrostrictive material and the electrode are manufactured between the flexible substrate and the rigid substrate, and after the electronic or optical device is manufactured on the flexible substrate, the electrostrictive material is controlled to deform by voltage, so that the flexible substrate is separated from the rigid substrate. The stripping method has low cost, can be implemented in a large area, does not damage electronic or optical devices on the flexible substrate during stripping, and improves the yield and the capacity of products.
Various alterations and modifications will no doubt become apparent to those skilled in the art after having read the above description. Therefore, the appended claims should be construed to cover all such variations and modifications as fall within the true spirit and scope of the invention. Any and all equivalent ranges and contents within the scope of the claims should be considered to be within the intent and scope of the present invention.
Claims (11)
1. A method for peeling a flexible substrate, the method comprising:
preparing a flexible composite film layer on a rigid substrate;
arranging a flexible substrate on the telescopic composite film layer;
preparing a display device on the flexible substrate; and
peeling the flexible substrate by deforming the stretch composite film layer;
the telescopic composite film layer is an electrostrictive composite film layer;
the step of preparing the electrostrictive composite film layer on the rigid substrate includes:
forming a first electrode on the rigid substrate;
forming an electrostrictive layer over the first electrode; and
forming a second electrode on the electrostrictive layer;
the step of forming the first electrode further comprises, before the step of forming the first electrode:
forming a plurality of grooves on the rigid substrate, wherein the first electrodes cover the bottoms and the side walls of the grooves and the exposed upper surface of the rigid substrate;
the electrostrictive layer is filled in the grooves and is flush with the first electrode covering the exposed upper surface of the rigid substrate;
the second electrode comprises a plurality of blocks which are sequentially formed on the electrostrictive layer filled in the grooves and are not in contact with the first electrode.
2. The peeling method according to claim 1,
the flexible substrate is formed over the second electrode, and the step of peeling off the flexible substrate includes:
deforming the electrostrictive layer by applying a voltage to the first electrode and the second electrode to peel the flexible substrate from the rigid substrate.
3. The lift-off method of claim 2, wherein the voltage applied across the first electrode and the second electrode is greater than a phase transition threshold voltage of the electrostrictive layer.
4. The lift-off method of claim 1, wherein the first electrode, the electrostrictive layer, and the second electrode are formed as flat film layers, which are sequentially coated on the rigid substrate.
5. The lift-off method of claim 1, wherein the step of forming the second electrode further comprises, prior to:
forming a first dielectric layer over the first electrode overlying the exposed upper surface of the rigid substrate; and
continuously forming a second electrode on the electrostrictive layer and the upper surface and the side wall of the first dielectric layer;
wherein the first dielectric layer isolates the first electrode from the second electrode.
6. The peeling method of claim 1, wherein the step of preparing the electrostrictive composite film layer on the rigid substrate includes:
forming a third electrode on the rigid substrate;
forming a first electrostrictive layer over the third electrode;
forming a fourth electrode on the first electrostrictive layer;
forming a second electrostrictive layer over the fourth electrode; and
forming a fifth electrode on the second electrostrictive layer;
wherein the flexible substrate is formed over the fifth electrode, and the first electrostrictive layer and the second electrostrictive layer are deformed by applying a voltage to the third electrode, the fourth electrode, and the fifth electrode, so that the flexible substrate is peeled off from the rigid substrate.
7. The peeling method as claimed in claim 6, wherein a voltage applied to the third electrode, the fourth electrode and the fifth electrode is greater than a phase transition threshold voltage of the first electrostrictive layer and the second electrostrictive layer.
8. The lift-off method of claim 6, wherein the third electrode, the first electrostrictive layer, the fourth electrode, the second electrostrictive layer, and the fifth electrode are formed as flat film layers, which are sequentially coated on the rigid substrate.
9. The peeling method as claimed in claim 6, wherein the fourth electrode is divided into a plurality of blocks which are sequentially formed in the first electrostrictive layer and the second electrostrictive layer, and the fourth electrode in the first electrostrictive layer and the second electrostrictive layer correspond up and down to ensure that the first electrostrictive layer and the second electrostrictive layer are simultaneously deformed at corresponding positions after the voltage is applied;
and a second dielectric layer is formed between the first electrostrictive layer and the second electrostrictive layer to isolate the first electrostrictive layer from the second electrostrictive layer and isolate the fourth electrodes which vertically correspond to each other.
10. The peeling method as claimed in claim 6, wherein the third electrode and the fifth electrode are connected to the fourth electrode through pins, respectively.
11. The peeling method as claimed in claim 1, further comprising:
and removing the residual telescopic composite film layer on the flexible substrate.
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| CN201610508151.7A CN107564856B (en) | 2016-07-01 | 2016-07-01 | Stripping method of flexible substrate |
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| CN201610508151.7A CN107564856B (en) | 2016-07-01 | 2016-07-01 | Stripping method of flexible substrate |
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| CN107564856B true CN107564856B (en) | 2020-02-21 |
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| CN106711078B (en) * | 2016-12-29 | 2019-08-13 | 昆山工研院新型平板显示技术中心有限公司 | A kind of production method of flexible device |
| CN108732825A (en) * | 2018-04-03 | 2018-11-02 | 肇庆市华师大光电产业研究院 | It is a kind of can automatically controlled surface topography device and its preparation method and application |
| CN109037152B (en) * | 2018-08-09 | 2021-01-12 | 京东方科技集团股份有限公司 | Manufacturing method of flexible display panel, flexible display panel and display device |
| CN110556330B (en) * | 2019-09-12 | 2022-03-22 | 云谷（固安）科技有限公司 | Supporting substrate, stripping device, flexible display panel and preparation method thereof |
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| EP1081745A2 (en) * | 1999-09-06 | 2001-03-07 | LINTEC Corporation | Method of detaching article and apparatus |
| WO2014100186A2 (en) * | 2012-12-21 | 2014-06-26 | Invensas Corporation | Method and structure for carrier-less thin wafer handling |
| CN104465475A (en) * | 2013-09-22 | 2015-03-25 | 昆山工研院新型平板显示技术中心有限公司 | Method for manufacturing flexible display device and flexible display device |
| CN104698631A (en) * | 2015-03-30 | 2015-06-10 | 京东方科技集团股份有限公司 | Display device and ultra-thin glass joint structure and stripping method thereof |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1081745A2 (en) * | 1999-09-06 | 2001-03-07 | LINTEC Corporation | Method of detaching article and apparatus |
| WO2014100186A2 (en) * | 2012-12-21 | 2014-06-26 | Invensas Corporation | Method and structure for carrier-less thin wafer handling |
| CN104465475A (en) * | 2013-09-22 | 2015-03-25 | 昆山工研院新型平板显示技术中心有限公司 | Method for manufacturing flexible display device and flexible display device |
| CN104698631A (en) * | 2015-03-30 | 2015-06-10 | 京东方科技集团股份有限公司 | Display device and ultra-thin glass joint structure and stripping method thereof |
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Address after: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee after: Shanghai Hehui optoelectronic Co.,Ltd. Address before: 201506, No. nine, No. 1568, Jinshan Industrial Zone, Shanghai, Jinshan District Patentee before: EverDisplay Optronics (Shanghai) Ltd. |
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