CN107556703A - A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application - Google Patents

A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application Download PDF

Info

Publication number
CN107556703A
CN107556703A CN201710933884.XA CN201710933884A CN107556703A CN 107556703 A CN107556703 A CN 107556703A CN 201710933884 A CN201710933884 A CN 201710933884A CN 107556703 A CN107556703 A CN 107556703A
Authority
CN
China
Prior art keywords
resin
lead metal
alpha ray
resin combination
ray shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710933884.XA
Other languages
Chinese (zh)
Inventor
徐坤
赵之明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Hongan Rui Electronic Technology Co Ltd
Original Assignee
Hefei Hongan Rui Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Hongan Rui Electronic Technology Co Ltd filed Critical Hefei Hongan Rui Electronic Technology Co Ltd
Priority to CN202210823846.XA priority Critical patent/CN115058097A/en
Priority to CN201710933884.XA priority patent/CN107556703A/en
Publication of CN107556703A publication Critical patent/CN107556703A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2234Oxides; Hydroxides of metals of lead
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/003Additives being defined by their diameter
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/014Additives containing two or more different additives of the same subgroup in C08K
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

The invention discloses a kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application, containing particle diameter distribution in 16 μm of > in the composition epoxy resin, 10 16 μm, 10 μm of < lead metal oxide powder and particle diameter distribution is at 0.5 1.0 μm, 5 μm 15 μm, lead metal powder between 1.0 5u μ ms, each powder can form equally distributed structure in resin, avoid due to agglomeration caused by skewness and particle diameter inequality, finally reduce resin internal porosity, obtain more highdensity resin material, composite is in dielectric strength, alpha ray shield effect etc. is obviously improved, in x-ray source, the field such as alpha ray shield and high-voltage isulation device has broad application prospects.

Description

A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application
Technical field
The present invention relates to alpha ray shield and high-voltage isulation resin material technical field, specially a kind of alpha ray shield and high pressure Insualtion resin composition and preparation method and application.
Background technology
X-ray is widely used in safety check, industrial detection, medical treatment etc. perspective field, and x-ray is mainly accelerated using high pressure Electronic impact metallic target afterwards produces, and the device that x-ray occurs is x-ray source, and x-ray source includes:X-ray generator, high pressure Power supply unit, insulation fuel tank, control unit etc..X-ray generator includes radome and ray tube, and radome is by x-ray tube bag Wrap up in, ray exit window and electrode extraction channel are reserved on radome, x-ray generator and high voltage supply unit etc., which are installed on, to be filled Inside the fuel tank shell completely to insulate, radome can realize that x-ray is emitted from window at exit window, is carried out at non-exit window Ray separates, and needs high pressure resistant breakdown between each pole of radome loading high pressure.
Technically realize radome function using pure lead, metal, leaded resin etc. at present:
(1) pure lead is used, pure lead and metal, can guarantee that excellent ray cut-off, but due to the characteristic of metallic conduction, make Spacing increase between pole must be realized, in design by increasing the spatial volume of radome to carry with when pure lead and metal High high-voltage isulation, so by cause x penetrate source it is heavy and difficult in maintenance etc. the problems such as;
(2) in order to avoid pure lead the problem of, domestic and international relevant unit and producer, in design using containing lead-filled epoxy resin etc. Shielding can be solved while improve high-voltage isulation characteristic by carrying out radome design so that design to penetrate volume source small, it is in light weight, And safety requirements can be met.
The problem of technically leaded resin is present at present:
(1) temperature characterisitic is poor, and due to formula, process variations, during product use, during special temperature rise, resin holds Easily softening, cause the intensity decreases of product during use, the cracked failure of product etc.;
(2) insulating properties is bad, due to formula, process variations, easily goes out filler sedimentation and reunites, cause product using Cheng Yi is in reunion point discharge breakdown;
(3) shielding properties is bad, and due to formula, process variations, product difficulty reaches high fill level, causes effective lead equivalent Deficiency, so as to shielding properties deficiency;
(4) life-span, due to formula variation, process variations, immersion, irradiation between product is long-term in insulating oil, occur peeling, Falling particle causes product failure.
The content of the invention
In order to solve the problems, such as that existing leaded resin material is present, the technical solution adopted by the present invention is as follows:
A kind of alpha ray shield and high-voltage isulation resin combination, it is characterised in that the resin combination is by following components group Into:
At least two epoxy resin compositions;
At least one active epoxy diluent;
At least three kinds of polynary amine curing agent mixtures;
At least two auxiliary agents;
At least one lead metal oxide powder;
Lead metal powder;
The percentage by weight of described lead metal oxide powder is 80-90wt%, by the μ of 50-56wt%D50 particle diameters < 10 M lead metal oxide, 16 μm of the lead metal oxide and 5-6wt%D50 particle diameters > that 25-28wt%D50 particle diameters are 10-16 μm Lead metal oxide composition;
The percentage by weight of described lead metal powder is 0.1-2wt%, is 0.5-1.0 μ by 0.05-1wt%D50 particle diameters M lead metal, the lead metal that 0.03-0.6wt%D50 particle diameters are 1.0-5u μm and 0.02-0.4wt%D50 particle diameters are in 5 μm of -15 μ M lead metal composition.
The percentage by weight of described epoxy resin composition is 10-20wt%, by bisphenol A epoxide resin, Bisphenol F epoxy Two or more composition in resin, novolac epoxy resin or aliphatic epoxy resin, preferably bisphenol A epoxide resin and double The mixture of phenol F epoxy resin composition.
Described composition epoxy resin is preferably by 3-16wt% bisphenol A epoxide resins and 2-10wt% Bisphenol F epoxy trees The mixture of fat composition.
Described active epoxy diluent is AGE, butyl glycidyl ether, one kind or one kind in benzyl glycidyl ether More than, its percentage by weight is 2.5-7wt%.
Described polynary amine curing agent mixture is diethylenetriamine, polyethylene polyamine, N- aminoethyl piperazines, epoxy change Property IPD in three kinds or more composition, its percentage by weight is 2.1-3.0wt%.
Described polynary amine curing agent mixture is preferably by 48-65wt% diethylenetriamines, 4-12wt%N- aminoethyls The mixture of the proportioning composition of piperazine, 3-9wt% polyethylene polyamines and the epoxide modified IPDs of 14-45wt%.
Described auxiliary agent is two kinds in polyamine acid amides dipersant, acidic polyester dipersant, organic silicon defoamer Or two or more compositions, the wherein dosage of dispersant is the 0.1-1.5% of lead metal oxide and lead powder gross weight, defoamer Dosage is the 0.1-2% of epoxy resin composition gross weight.
Described lead metal oxide is the one or more in PbO, Pb3O4, PbO2.
A kind of described alpha ray shield and the preparation method of high-voltage isulation resin combination, it is characterised in that step is as follows:
Step 1, epoxy resin is weighed in proportion, be mixed evenly;
Step 2, weigh in proportion in the component that active epoxy diluent is added obtained by step 1, add to stirring while stirring Uniformly;
Step 3, weigh in the blending ingredients that dispersant is added obtained by step 2, be uniformly mixed in proportion;
Step 4, weigh in the component that lead metal oxide component is added obtained by step 3, add when scattered, extremely in proportion It is uniformly dispersed at a high speed;
Step 5, weigh in the component that lead metal powder is added obtained by step 4, disperse when adding in proportion, it is scattered to high speed Uniformly;
Step 6, weigh in the component that organic silicon defoamer is added obtained by step 5, be uniformly mixed in proportion;
Step 7, polynary amine curing agent component is weighed in proportion, be well mixed;
Step 8, the component obtained by the curing agent component and step 6 that are mixed in step 7 is mixed evenly in proportion;
Step 9, the component vacuumizing and defoaming that completion will be well mixed in step 8, it is processed good to be poured into after completion deaeration Cavity or mould in, stand 2-24h after insert in baking oven, under the conditions of 50~70 DEG C solidify 120~150min, solidified It is stripped, produces after complete.
The present invention also protects application of the described resin combination in x-ray source, alpha ray shield and high-voltage isulation device.
Compared with prior art, the lead oxides containing the distribution of three class different grain sizes in composition epoxy resin of the invention Powder and the lead metal powder of three class different grain sizes distribution, wherein lead metal oxide powder particle size are distributed in 16 μm of >, 10-16 μm, between 10 μm of <, lead metal powder size overcomes simple between 5 μm -15 μm, 0.5-1.0 μm, 1.0-5u μ ms The defects of leaded resin high-pressure poor insulativity, the alpha ray shield performance of lead oxides modified resin is improved, simultaneously because lead is golden Each powder of category powder and lead metal oxide powder can form equally distributed structure in resin, avoid due to skewness With agglomeration caused by particle diameter inequality, finally reduce resin internal porosity, obtain more highdensity resin material, it is compound Material is obviously improved in dielectric strength, alpha ray shield effect etc., exhausted in x-ray source, alpha ray shield and high pressure The fields such as edge device have broad application prospects.
Embodiment
Technical solution of the present invention is described further below by embodiment.
The raw material and equipment used in embodiment:
Raw material:Electron level pellet powder PbO, Pb3O4、PbO2, micro/nano level Pb powder, commercially available bisphenol A epoxide resin, commercially available Bisphenol F Epoxy resin, commercially available novolac epoxy resin, AGE, diethylenetriamine, polyethylene polyamine, N- aminoethyl piperazines, epoxide modified different Buddhist That ketone diamines, acidic polyester solution, organic silicon defoamer;
Equipment:Dispersion machine, particle size analyzer, viscosimeter, hardometer, omnipotent push-and-pull machine, high-tension resistive tester, conductometer.
Embodiment 1-27
Embodiment 1-27 resin combination is prepared according to following steps according to each component of the formula ratio of table 2:
Step 1, resin premixed material prepared according to table 1;
Step 2, weigh in the resin premixed material that dispersant is added obtained by step 1, be uniformly mixed in proportion;
Step 3, the particle diameter for determining with particle size analyzer lead metal oxide, weigh according to the ratio of table 1 and match, obtain lead oxides Premix, then adds this premix in the component obtained by step 3, adds when scattered, to being uniformly dispersed at a high speed;
Step 4, lead metal powder footpath is determined with particle size analyzer, and weigh proportioning in proportion, gained lead metal powder adds step 3 In the component of gained, disperse when adding, to being uniformly dispersed at a high speed;
Step 5, weigh in the component that organic silicon defoamer is added obtained by step 4, be uniformly mixed in proportion;
Step 6, polynary amine curing agent component weighed according to the ratio of table 1, be well mixed, obtain curing agent premix;
Component obtained by step 7, the curing agent premix by step 6 and step 6 is mixed evenly in proportion;
Step 8, the component vacuumizing and defoaming that completion will be well mixed in step 7, it is processed good to be poured into after completion deaeration Cavity or mould in, stand 2-24h after insert in baking oven, under the conditions of 50~70 DEG C solidify 120~150min, solidified It is stripped after complete, obtains alpha ray shield and high-voltage isulation Resin Composition Example 1-27.The premix that embodiment 1-27 is used is matched somebody with somebody Measure and its see Tables 1 and 2 with the formula ratio of other components in side;The performance of resin combination obtained by embodiment 1-27 is shown in Table 3.
The embodiment 1-27 premix formulations of table 1
The formula of each resin combinations of embodiment 1-27 of table 2
The embodiment 1-27 resin combination physical performances of table 3

Claims (10)

1. a kind of alpha ray shield and high-voltage isulation resin combination, it is characterised in that the resin combination is composed of the following components:
At least two epoxy resin compositions;
At least one active epoxy diluent;
At least three kinds of polynary amine curing agent mixtures;
At least two auxiliary agents;
At least one lead metal oxide powder;
Lead metal powder;
The percentage by weight of described lead metal oxide powder is 80-90 wt%, by 10 μm of 50-56 wt%D50 particle diameters <'s 16 μm of the lead metal oxide and 5-6 wt%D50 particle diameters > that lead metal oxide, 25-28 wt%D50 particle diameters are 10-16 μm Lead metal oxide forms;
The percentage by weight of described lead metal powder is 0.1-2 wt%, is 0.5-1.0 μm by 0.05-1 wt%D50 particle diameters Lead metal, the lead metal that 0.03-0.6 wt%D50 particle diameters are 1.0-5u μm and 0.02-0.4 wt%D50 particle diameters are at 5 μm -15 μm Lead metal forms.
2. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described epoxy The percentage by weight of resin compound is 10-20 wt%, by bisphenol A epoxide resin, bisphenol F epoxy resin, novolac epoxy resin Or two or more composition in aliphatic epoxy resin, preferably bisphenol A epoxide resin and bisphenol F epoxy resin form Mixture.
3. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described epoxy The mixture that resin combination is preferably made up of 3-16wt% bisphenol A epoxide resins and 2-10wt% bisphenol F epoxy resins.
4. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described activity Epoxide diluent is AGE, the one or more in butyl glycidyl ether, benzyl glycidyl ether, its percentage by weight For 2.5-7 wt%.
5. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described is polynary Amine-type cure agent composition is in diethylenetriamine, polyethylene polyamine, N- aminoethyl piperazines, epoxide modified IPD Three kinds or more forms, and its percentage by weight is 2.1-3.0 wt%.
6. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described is polynary Preferably by 48-65 wt% diethylenetriamines, 4-12 wt%N- aminopiperazines, 3-9 wt%, more ethene is more for amine-type cure agent composition The mixture of the proportioning composition of amine and the epoxide modified IPDs of 14-45 wt%.
7. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described auxiliary agent For in polyamine acid amides dipersant, acidic polyester dipersant, organic silicon defoamer two or more composition, wherein The dosage of dispersant is lead metal oxide and the 0.1-1.5% of lead powder gross weight, and the dosage of defoamer is epoxy resin composition The 0.1-2% of gross weight.
8. a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that described lead gold It is PbO, Pb to belong to oxide3O4、PbO2In one or more.
9. the preparation method of a kind of alpha ray shield as claimed in claim 1 and high-voltage isulation resin combination, it is characterised in that Step is as follows:
Step 1, epoxy resin is weighed in proportion, be mixed evenly;
Step 2, weigh in proportion in the component that active epoxy diluent is added obtained by step 1, add to stir while stirring;
Step 3, weigh in the blending ingredients that dispersant is added obtained by step 2, be uniformly mixed in proportion;
Step 4, weigh in the component that lead metal oxide component is added obtained by step 3, add when scattered, to high speed in proportion It is uniformly dispersed;
Step 5, weigh in the component that lead metal powder is added obtained by step 4, disperse when adding in proportion, it is scattered equal to high speed It is even;
Step 6, weigh in the component that organic silicon defoamer is added obtained by step 5, be uniformly mixed in proportion;
Step 7, polynary amine curing agent component is weighed in proportion, be well mixed;
Step 8, the component obtained by the curing agent component and step 6 that are mixed in step 7 is mixed evenly in proportion;
Step 9, the component vacuumizing and defoaming that completion will be well mixed in step 8, processed good chamber is poured into after completing deaeration In body or mould, inserted after standing 2-24h in baking oven, solidify 120 ~ 150min under the conditions of 50 ~ 70 DEG C, taken off after completion of cure Mould, produce.
10. the resin combination as described in claim 1-8 is any is in x-ray source, alpha ray shield and high-voltage isulation device Using.
CN201710933884.XA 2017-10-10 2017-10-10 A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application Pending CN107556703A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202210823846.XA CN115058097A (en) 2017-10-10 2017-10-10 Ray shielding and high-voltage insulating resin composition and preparation method and application thereof
CN201710933884.XA CN107556703A (en) 2017-10-10 2017-10-10 A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710933884.XA CN107556703A (en) 2017-10-10 2017-10-10 A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202210823846.XA Division CN115058097A (en) 2017-10-10 2017-10-10 Ray shielding and high-voltage insulating resin composition and preparation method and application thereof

Publications (1)

Publication Number Publication Date
CN107556703A true CN107556703A (en) 2018-01-09

Family

ID=60984355

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210823846.XA Pending CN115058097A (en) 2017-10-10 2017-10-10 Ray shielding and high-voltage insulating resin composition and preparation method and application thereof
CN201710933884.XA Pending CN107556703A (en) 2017-10-10 2017-10-10 A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202210823846.XA Pending CN115058097A (en) 2017-10-10 2017-10-10 Ray shielding and high-voltage insulating resin composition and preparation method and application thereof

Country Status (1)

Country Link
CN (2) CN115058097A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108276646A (en) * 2018-02-06 2018-07-13 中国船舶重工集团公司第七〇九研究所 A kind of proportioning type composite shielding material and preparation method thereof with neutron and the comprehensive shielded effects of γ
CN109401206A (en) * 2018-12-24 2019-03-01 张冬生 A kind of Epocryl base shielding material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595754A (en) * 2012-01-06 2012-07-18 同方威视技术股份有限公司 Radiation device installing box and oil cooling cyclic system as well as X-ray generator
CN106867201A (en) * 2017-03-06 2017-06-20 苏州镭瑞机电科技有限公司 A kind of part lead semi-annular jade pendant and manufacture method for High-Voltage Insulation and alpha ray shield

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2231008A1 (en) * 1997-03-05 1998-09-05 Thin Film Technology, Inc. Polymeric composition for radiation shielding
KR101297099B1 (en) * 2011-05-13 2013-08-20 한국원자력연구원 Epoxy resin compositions for neutron shielding materials and mehtod for preparing the same
CN104710727B (en) * 2015-03-27 2017-11-17 中国科学院长春应用化学研究所 Epoxy resin-matrix neutron and gamma ray shielding composite and preparation method and application

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595754A (en) * 2012-01-06 2012-07-18 同方威视技术股份有限公司 Radiation device installing box and oil cooling cyclic system as well as X-ray generator
CN106867201A (en) * 2017-03-06 2017-06-20 苏州镭瑞机电科技有限公司 A kind of part lead semi-annular jade pendant and manufacture method for High-Voltage Insulation and alpha ray shield

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
马延洪: "《X线物理与防护》", 30 April 1990, 人民卫生出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108276646A (en) * 2018-02-06 2018-07-13 中国船舶重工集团公司第七〇九研究所 A kind of proportioning type composite shielding material and preparation method thereof with neutron and the comprehensive shielded effects of γ
CN109401206A (en) * 2018-12-24 2019-03-01 张冬生 A kind of Epocryl base shielding material

Also Published As

Publication number Publication date
CN115058097A (en) 2022-09-16

Similar Documents

Publication Publication Date Title
US9994729B2 (en) Liquid sealing material, and electronic component using same
KR101819264B1 (en) Epoxy resin composition and semiconductor sealing material using same
CN106753026B (en) The modified method in surface, modified silver powder are carried out to silver powder and include its conductive silver glue
CN107556703A (en) A kind of alpha ray shield and high-voltage isulation resin combination and preparation method and application
DE112010005303T5 (en) Thermosetting resin composition, B-stage thermal conductivity layer and power module
JP2016108498A (en) Electric conductive adhesive composition and semiconductor device
JP2003026766A (en) Epoxy-based reactive diluent and liquid epoxy resin composition containing the same
CN108148351B (en) Radiation protection material
EP3438200B1 (en) Curable composition, cured object obtained therefrom, and rotary device
JP5647769B2 (en) COF sealing resin composition
JP2004051824A (en) Epoxy resin composition for casting
JP2010275334A (en) Process for producing surface treated silica particle, surface treated silica particle, epoxy resin composition and semiconductor device
TWI523910B (en) High-voltage machine with composite insulating resin materials, and the use of its high-voltage machines
TW201936876A (en) Resin composition for sealing
CN104194703A (en) Halogen-free flame retardant epoxy resin used for electronic packaging material and preparation method of halogen-free flame retardant epoxy resin
JP2011201948A (en) Epoxy resin composition for casting and coil component using the same
JP2012036240A (en) Encapsulating resin composition
US20220028574A1 (en) Electrical insulation material and manufacturing process
CN106158069B (en) Electrode size and preparation method thereof
Park et al. Mechanical and electrical properties of cycloaliphatic epoxy/silica systems for electrical insulators for outdoor applications
CN106365507A (en) Organic ceramic substrate composition, organic ceramic substrate, and copper-clad plate
WO2015090935A1 (en) Breakdown-resistant and anti-arcing cast resin composition
Park et al. Effect of Silicone-modified Microsilica Content on Electrical and Mechanical Properties of Cycloaliphatic Epoxy/Microsilica System
JP6332488B2 (en) Selection method and manufacturing method of liquid epoxy resin composition, electronic component device and manufacturing method thereof
CN104245837A (en) Curable compositions

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180109