CN107538337A - Substrate lapping device - Google Patents
Substrate lapping device Download PDFInfo
- Publication number
- CN107538337A CN107538337A CN201710473797.0A CN201710473797A CN107538337A CN 107538337 A CN107538337 A CN 107538337A CN 201710473797 A CN201710473797 A CN 201710473797A CN 107538337 A CN107538337 A CN 107538337A
- Authority
- CN
- China
- Prior art keywords
- grinding
- lapping device
- substrate
- grinding post
- post portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 73
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 102000000584 Calmodulin Human genes 0.000 claims description 8
- 108010041952 Calmodulin Proteins 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- CVEPFOUZABPRMK-UHFFFAOYSA-N 2-methylprop-2-enoic acid;styrene Chemical class CC(=C)C(O)=O.C=CC1=CC=CC=C1 CVEPFOUZABPRMK-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 239000012261 resinous substance Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Disclose substrate lapping device, body part is included according to the substrate lapping device of the present invention, connection member, grind post part and grinding ring component, wherein, the body part includes the protuberance that support and the middle section from the support protrude, the combined axis that the connection member includes the joint portion combined with the protuberance and the part from the joint portion protrudes, the grinding post part defines the engagement groove for combined axis insertion, at least a portion of wherein described grinding post part includes curve on the section parallel with the length direction of the combined axis, and the grinding ring component is combined with the fringe region of the support.
Description
Technical field
The present invention relates to lapping device, in more detail, is related to substrate lapping device.
Background technology
In a display device, panel display apparatus (Flat Panel Display) is as with flat and thin shape
Thin-type display device, it includes liquid crystal display device (Liquid Crystal Display), organic light-emitting display device
(Organic Light Emitting Diode Display) etc..Panel display apparatus includes the display panel of display image.
Generally, display panel is lower substrate and the upper substrate bonding in the device by that will be disposed with needed for display image and formation
Parent panel is cut into desired cell size and formed after parent panel.Now, the cutting technique of parent panel is cut by utilizing
Cut wheel (cutting wheel) and form the technique of cutting groove and the technique structure using the impact cutting groove such as disintegrating machine (breaker)
Into.Display panel can be divided into desired size by this cutting technique.
In addition, in recent years, in the display device with a variety of designs, it have developed the display dress of corner shape in curved surface
Put.As an example, make the substrate cutting technique of corner shape in curved surface that grinding stone can be used to carry out.
The content of the invention
It is an object of the invention to provide the substrate lapping device that the corner of substrate can be ground into curve form.
To achieve these goals, according to the substrate lapping device of embodiment of the present invention include body part, connection
Part, grinding post part and grinding ring component, wherein, the body part includes support and the central area from the support
The protuberance that domain protrudes, the connection member include the joint portion combined with the protuberance and the part from the joint portion
Prominent combined axis, the grinding post part define the engagement groove for combined axis insertion, and the grinding post part
At least a portion include curve on the section parallel with the length direction of the combined axis, and the grinding ring component with
The fringe region of the support combines.
According to embodiment of the present invention, the grinding post part is ground including being arranged in first at the top of the joint portion
Grinding column portion and what is be connected with the top in the described first grinding post portion second grind post portion, and the engagement groove is along described first
The central axis for grinding post portion and the second grinding post portion limits.
According to embodiment of the present invention, it is characterised in that the second grinding post portion includes being connected to first grinding
The basal surface in post portion, the upper surface relative with the basal surface, the connection basal surface and the upper surface outer surface and
Inner surface, and the out conductor in the second grinding post portion has curve shape on the section vertical with the basal surface.
According to embodiment of the present invention, it is characterised in that the basal surface has disk shape, and the upper surface has
Ring-shaped.
According to embodiment of the present invention, it is characterised in that the area of the basal surface is in the horizontal plane than the upper surface
Area it is big.
According to embodiment of the present invention, it is characterised in that on the section vertical with the basal surface, second grinding
The length of the upper side line in post portion is more than 6 millimeters (mm) with the length sum of the engagement groove.
According to embodiment of the present invention, it is characterised in that on the section vertical with the basal surface, the upper side line
Length is shorter than the length of the engagement groove.
According to embodiment of the present invention, it is characterised in that on the section vertical with the basal surface, second grinding
The length of the lower side line in post portion and the length sum of the engagement groove are more than 26 millimeters (mm).
According to embodiment of the present invention, it is characterised in that on the section vertical with the basal surface, first grinding
The out conductor in post portion has rectilinear form.
According to embodiment of the present invention, it is characterised in that grind post portion as one in the first grinding post portion and described second
Build.
According to embodiment of the present invention, it is characterised in that the first grinding post portion has cylinder form.
According to embodiment of the present invention, combination of the body part between the middle section and the fringe region
Limit at least one engagement groove in region, and the substrate lapping device also include with the engagement groove with reference to and described in rotating
The rotary part of body part.
According to embodiment of the present invention, the protuberance defines engagement groove, and the joint portion and the engagement groove
With reference to.
According to embodiment of the present invention, it is characterised in that the connection member is aluminium.
According to embodiment of the present invention, it is characterised in that the grinding post part and the grinding ring component are included each other
Different materials.
According to embodiment of the present invention, the grinding post part includes metal, and the grinding ring component includes resin.
According to embodiment of the present invention, it is characterised in that the combined axis has cylinder form.
According to embodiment of the present invention, lapping device may include to grind post portion, and grinding post portion defines combination at center
At least a portion of groove and outer surface has curve form.Particularly, the upper surface for grinding post portion can be provided as ring-shaped.
, can be in the case of no crackle or chip (chipping) phenomenon by the angle of substrate by this grinding post portion
It is curve form to fall partial mill.
Brief description of the drawings
Fig. 1 a are the stereograms according to the lapping device of embodiment of the present invention.
Fig. 1 b are the exploded perspective views of the lapping device according to Fig. 1 a of embodiment of the present invention.
Fig. 2 is the sectional view cut along I-I ' shown in Fig. 1 a according to embodiment of the present invention.
Fig. 3 is the sectional view that post part is ground shown in Fig. 2.
Fig. 4 and Fig. 5 is the stereogram for showing substrate.
Fig. 6 a to Fig. 6 c are the examples being ground using lapping device to the cutting zone of substrate.
Fig. 6 d are another examples being ground using lapping device to substrate.
Fig. 7 is the view for showing the substrate by being ground according to the lapping device of embodiment of the present invention.
Embodiment
The present invention can implement various modifications and can have various forms, and particular implementation will be shown and under in accompanying drawing
It is described in detail in text.Limit the invention to specifically disclose form however, this is not intended as, but be interpreted as containing
Lid is included in all modifications, equivalent and substitute in the thought and technical scope of the present invention.
When illustrating each accompanying drawing, similar reference is used to similar inscape.In the accompanying drawings, to make this hair
Ming and Qing Chu, the size of works are shown than actually zooming in or out.The wording such as first, second can be used for illustrating that various compositions will
Element, but above-mentioned inscape should not be limited by above-mentioned wording.Above-mentioned wording is merely for by an inscape and other structures
Used into the purpose that key element differentiates.For example, in the case of without departing substantially from the interest field of the present invention, the first inscape can
It is referred to as the second inscape, similarly, the second inscape is also referred to as the first inscape.Unless separately have in context
It is explicitly indicated, otherwise singular references include plural number statement.
It should be understood that feature, numeral, step described in the specification of the wording such as " comprising " or " having " instruction in this application
Suddenly, the presence of action, inscape, part or combinations thereof, rather than one or more of the other feature, number are excluded in advance
Word, step, action, inscape, presence or the additional possibility of accessory or combinations thereof.
Fig. 1 a are the stereograms according to the lapping device of embodiment of the present invention.Fig. 1 b are according to embodiment of the present invention
The exploded perspective view of lapping device shown in Fig. 1 a.
Lapping device GD shown in Fig. 1 a can be by directly contacting to be ground to object with object to be ground.Example
Such as, lapping device GD can be provided as mill (Grinder).According to embodiment of the present invention, lapping device GD can be to being included in
The structure of substrate or window in display device is ground.Herein, substrate and window can be made up of glass, sapphire, plastics etc..
Particularly, substrate may include upper substrate and lower substrate, and individual panel can with by upper substrate and under
The parent panel of portion's substrate bonding is cut and provided in units of unit.Lapping device GD can enter to the surface in cut region
Row grinding.In addition, the corner of substrate can be ground to curve form by lapping device GD.
Reference picture 1a and Fig. 1 b, lapping device GD may include body part BC, grinding ring component Gn1, grinding post part
Gn2, connection member MD and rotary part CC.In addition, the grinding dress for the rotary part CC for eliminating Fig. 1 a is disclosed in Figure 1b
Put GD.
Body part BC can Supported abrasive device GD, and can be with grinding ring component Gn1 and connection member MD on the whole
With reference to.According to embodiment, grinding ring component Gn1 can be combined with body part BC in body part BC edge, and even
Relay part MD can be combined with body part BC at body part BC center.
In addition, body part BC can include at least partly prominent protuberance at body part BC center.Particularly,
The engagement groove OPt combined with connection member MD can be defined at protuberance.Connection member MD can be limited to protrusion by being inserted into
Combined in engagement groove OPt at portion with body part BC.
Specifically, connection member MD may include the joint portion combined at body part BC center with body part BC
The MD1 and combined axis MD2 combined with grinding post part Gn2.Herein, combined axis MD2 can be a part of court from joint portion MD1
The cylinder form that grinding post part Gn2 direction protrudes.However, in addition to cylinder form, combined axis MD2 shape
Also the various shapes of quadrangular etc. can be provided as.In addition, joint portion MD1 may include towards the prominent of body part BC direction protrusion
The portion of rising.This jut can be plugged into the engagement groove OPt being limited at body part BC protuberance.
In addition, the technological thought of the present invention is not limited to this, and the combination between body part BC and connection member MD
Structure may be variously modified.As an example, fluted, and body can be limited in connection member MD joint portion MD1
Part BC protuberance can be plugged into this groove being limited in the MD1 of joint portion.
It is in addition, in light weight than grinding post part Gn2 according to embodiment, connection member MD weight.Show as one
Example, connection member MD can be made up of aluminum.That is, because connection member MD is made up of material in light weight, lapping device GD's
Overall weight can be reduced.
Grinding ring component Gn1 can have ring (ring) shape and be combined with body part BC.Although not shown, but body
Part B C and grinding ring component Gn1 can be bonded to each other by various modes.
As an example, body part BC may include at least one projection, and grind ring component Gn1 may include quantity with
The corresponding at least one groove of number of projection.Body part BC and grinding ring component Gn1 can utilize this projection and groove
It is bonded to each other.
As an example, body part BC may include at least one groove, and grind ring component Gn1 may include quantity with
The corresponding at least one projection of the quantity of included groove in body part BC.Body part BC and grinding ring component Gn1
It is bonded to each other using this projection and groove.
The engagement groove OPn for combined axis MD2 insertions can be defined in grinding post part Gn2.Engagement groove OPn can be with combined axis
MD2 length direction DLR is accordingly limited to grinding post part Gn2 inner side.That is, the inner side for grinding post part Gn2 can have
There is the hole shape of cylinder form.However, in addition to cylinder form, grind and may be alternatively formed to respectively on the inside of post part Gn2
Kind shape.That is, it is formed as on the inside of grinding post part Gn2 corresponding with combined axis MD2 shape.
As an example, combined axis MD2 be shaped as cylinder in the case of, engagement groove OPn is limited with cylinder form
It is scheduled in grinding post part Gn2.As an example, combined axis MD2 be shaped as quadrangular in the case of, engagement groove OPn with
Quadrangular shape is limited in grinding post part Gn2.
According to embodiment, grinding ring component Gn1 and grinding post part Gn2 may include mutually the same material.As one
Example, grinding ring component Gn1 and grinding post part Gn2 may include resin (resin).Herein, resin may include polyurethane
(polyurethane), polyimides (Polyimide), polyether sulfone (Polyethersulfone), makrolon
(polycarbonate), polymethyl methacrylate (polymethylmethacrylate), dimethyl silicone polymer
(polydimethylsiloxane), polystyrene (polystyrene) and styrene methacrylates (methacrylate
Styrene at least any one material in).
As another example, grinding ring component Gn1 and grinding post part Gn2 may include metal (metal).
According to embodiment, grinding ring component Gn1 and grinding post part Gn2 may include material different from each other.As one
Example, grinding ring component Gn1 may include resin, and grinding post part Gn2 may include metal (metal).In this case, wrap
The service life for including the grinding ring component Gn1 of resin may be shorter than the service life of the grinding post part Gn2 including metal.That is,
Because the entire area for grinding ring component Gn1 is bigger than the entire area for grinding post part Gn2, so in ring component Gn1 is ground
Include the short resinous substances of service life, and include the metallics of service life length in post part Gn2 is ground.By
This, the replacing opportunity ground ring component Gn1 and ground between post part Gn2 can become similar.
Rotary part CC can be combined with body part BC and be transmitted revolving force to body part BC.With rotary part CC with
High speed rotation is carried out on the basis of rotary shaft AX, grinding ring component Gn1 and grinding post part Gn2 are rotatable.As a result, grinding ring portion
Part Gn1 and grinding post part Gn2 can be based on revolving force and perform grinding operation.
Fig. 2 is the sectional view cut along I-I ' shown in Fig. 1 a according to embodiment of the present invention.
Reference picture 2, body part BC include support BCa and the protuberance BCb protruded from support BCa.Protuberance BCb
There can be the protuberance identical structure with describing in fig 1 a.
Support BCa can be configured to round-shaped, and is spaced including upper and lower surface, lower surface with upper surface
It is and relative.In addition, support BCa may include middle section CTA, fringe region TA and centrally located region CTA and fringe region
Calmodulin binding domain CaM CNA between TA.Calmodulin binding domain CaM CNA can surround middle section CTA, and fringe region TA can surround calmodulin binding domain CaM
CNA.In addition, though it is round-shaped by being described as having according to the support BCa of the present invention, but this is not limited to, support BCa
Polyhedral shapes can be had according to lapping device GD purposes.
It can be defined at support BCa lower surface at least one for being combined with the rotary part CC shown in Fig. 1 a
Engagement groove.According to the explanation of the present invention, the first engagement groove OP1 and the second engagement groove can be defined at support BCa lower surface
OP2.First engagement groove OP1 and the second engagement groove OP2 can be defined to and calmodulin binding domain CaM CNA weights at support BCa lower surface
It is folded.
Rotary part CC can be by being combined and being rotated come to grinding with the first engagement groove OP1 and the second engagement groove OP2
Ring component Gn1 and grinding post part Gn2 transmit revolving force.Grind ring component Gn1 and grinding post part Gn2 can be with rotary part CC
Rotation number proportionally the surface of substrate is ground.
In addition, though the first engagement groove OP1 and the second engagement groove OP2 are described as be at by support according to the explanation of the present invention
It is defined to overlapping with calmodulin binding domain CaM CNA at BCa lower surface, but is not limited to this.For example, can at support BCa lower surface
Define an engagement groove overlapping with calmodulin binding domain CaM CNA and middle section CTA.For example, it can be limited at support BCa lower surface
Surely there is an engagement groove overlapping with calmodulin binding domain CaM CNA.
Protuberance BCb can be protruded in middle section CTA from support BCa upper surface.It can be defined at protuberance BCb
For the engagement groove OPt combined with connection member MD.
Grinding ring component Gn1 can overlappingly be bound to support BCa with fringe region TA.Further, since grinding ring component
Gn1 is provided as ring-shaped, and connection member MD can be combined by the inside of ring-shaped with protuberance BCb, and grind post part
Gn2 can be combined with connection member MD.
Joint portion MD1 can be overlappingly inserted into engagement groove OPt with middle section CTA.By by from the one of joint portion MD1
The jut protruded partially towards the direction relative with support BCa is inserted into engagement groove OPt, protuberance BCb and joint portion
MD1 can be bonded to each other.
In addition, combined axis MD2 can dash forward from joint portion MD1 another part towards the direction relative with grinding post part Gn2
Go out.As described above, combined axis MD2 can have cylinder form, and it can be plugged into grinding post part Gn2 engagement groove OPn (ginsengs
According to Fig. 1 b) in.Particularly, combined axis MD2 can be inserted into a manner of filling grinding post part Gn2 engagement groove OPn is overall
In engagement groove OPn.
Grinding post part Gn2 can define engagement groove OPn, and be available for combined axis MD2 to be inserted by engagement groove OPn.
According to embodiment, grinding post part Gn2 basal surface can have disk (disk) shape.In this case, grind
The area of grinding column part Gn2 basal surface is big than engagement groove OPn area.In contrast, post part Gn2 upper surface is ground
There can be ring-shaped.In this case, the area of post part Gn2 upper surface is ground than engagement groove OPn in the horizontal plane
Area it is small.
In addition, grinding post part Gn2 basal surface and upper surface can be separated by out and relatively, and can be respectively in water
It is flat in plane.
According to embodiment, the area of grinding post part Gn2 basal surface can be in the horizontal plane than grinding post part Gn2's
The area of upper surface is big.This grinding post part Gn2 upper surface can be to extending to the point of plane from curved surface in the corner of substrate
It is ground.
According to embodiment, on the vertical section of the basal surface with grinding post part Gn2, at least a portion of outer surface
It may include curved surface.This grinding post part Gn2 will be described in more details by Fig. 3.
As described above, the surface of substrate can be ground according to the grinding ring component Gn1 of the present invention and grinding post part Gn2
Mill.For example, grinding ring component Gn1 the flat surfaces of cleaved substrate can be ground, and grind post part Gn2 can be right
The surface of the curve form of substrate is ground.However, the technological thought not limited to this of the present invention, and grind ring component Gn1
The various regions of substrate can be ground with grinding post part Gn2.
Fig. 3 is the sectional view that post part is ground shown in Fig. 2.
Reference picture 2 and Fig. 3, grinding post part Gn2 may include the grinding posts of the first grinding post portion Gn2a and second portion Gn2b.Root
According to the explanation of the present invention, grinding post part Gn2 can be described as respectively including the first grinding post portion Gn2a and the second grinding post
Portion Gn2b.However, the technological thought not limited to this of the present invention, and the first grinding post portion Gn2a and the second grinding post portion Gn2b can
Substantially it is provided as integral shape.
First grinding post portion Gn2a may be arranged at joint portion MD1 top.During first grinding post portion Gn2a can be provided as
Engagement groove OPn cylinder form is defined at the heart.
Second grinding post portion Gn2b is connectable to the first grinding post portion Gn2a top.It is identical with the first grinding post portion Gn2a
Ground, the second grinding post portion Gn2b define engagement groove OPn.In addition, the second grinding post portion Gn2b may include basal surface and basal surface
Be spaced and relative upper surface, connection basal surface and upper surface outer surface and inner surface.Herein, basal surface can be with
One grinding post portion Gn2a connections, and be spaced with upper surface and relatively.Outer surface and inner surface can connect basal surface
With upper surface.
In this case, on the section vertical with the second grinding post portion Gn2b basal surface, the second grinding post portion
Gn2b includes lower side line L1, upper side line L2, out conductor L3 and inside cord L4.
According to embodiment of the present invention, lower side line L1, upper side line L2 and inside cord L4 can be rectilinear form, and out conductor
L3 can have curve shape.That is, on the section vertical with the second grinding post portion Gn2b basal surface, the second grinding post portion Gn2b
It may include curved surface area RA corresponding with out conductor L3 and flat site FA corresponding with upper side line L2.
According to embodiment, upper side line L2 and engagement groove OPn length sum can be 6 millimeters (micro meter, hereafter
In be expressed as：Mm more than).Herein, upper side line L2 and engagement groove OPn length sum are described as the first length d1.
According to embodiment, lower side line L1 and engagement groove OPn length sum can be more than 26 millimeters (mm).Herein, under
Side line L1 and engagement groove OPn length sum is described as the second length d2.In this case, the second length d2 is than first
Length d1 grows.
Fig. 4 and Fig. 5 is the stereogram for showing substrate.
Reference picture 4 and Fig. 5, there is provided substrate S T.As described above, substrate S T can be the display device as display image
Structure display panel.As an example, display panel can be liquid crystal display panel, organic electroluminescence display panel, electrophoresis
Display panel or Electrowetting display panel etc., and its species is not defined.
Substrate S T may include upper surface US, the lower surface DS relative with upper surface US and connection upper surface US and lower surface DS
Side surface SD.In this case, substrate S T shown in Fig. 4 can be the substrate shape based on quadrangle form.
According to embodiment of the present invention, lapping device GD is executable to make substrate S T corner portion have grinding for curve form
Mill operation.I.e., as shown in Figure 5, lapping device GD can be by using grinding ring component Gn1 (reference picture 1) and grinding post part
Gn2 is ground to substrate S T cutting zone CA.
Fig. 6 a to Fig. 6 c are the examples being ground using lapping device to the cutting zone of substrate.Fig. 6 d are to utilize grinding
Another example that device is ground to substrate.
First, moved illustrate to be ground the cutting zone CA of substrate S T near corners by Fig. 6 a to Fig. 6 c
Make.Particularly, the action that the cutting zone CA in the corner as substrate S T is ground can be held by grinding post part Gn2
OK.
Specifically, reference picture 6a and Fig. 6 b, based on the revolving force of rotary part (CC, reference picture 1), the second grinding post portion
Gn2b can be ground while being moved on the basis of the SP1 of initiation region towards end region SP2 to substrate S T.In this feelings
Under condition, the second grinding post portion Gn2b can be ground using outer surface to cutting zone CA.
Reference picture 6c, substrate S T side surface may include curve regions RL and linearity region FL.In addition, in substrate S T song
In the grinding operation for the point that line region RL and linearity region FL meets, it can be occurred by grinding post part Gn2 outer surface SA
Chip phenomenon.That is, in the case where grinding post part Gn2 upper surface UA does not have even shape or is provided as a shape,
Grinding operation in this end region SP2 may become difficult.
Hereinafter, substrate S T curve regions RL and linearity region the FL point to meet are illustratively described as end zone
Domain SP2.In addition, the point that substrate S T curve regions RL and linearity region FL meet can be initiation region SP1.
According to embodiment of the present invention, the upper table for grinding post part Gn2 can be utilized for end region SP2 grinding operation
Face UA.As described above, grinding post part Gn2 upper surface UA can be provided as ring-shaped, and upper surface UA can be flat.
Second grinding post portion Gn2b inner side can be filled by the combined axis MD2 described in Fig. 2.
As shown in the figure 6c, for end region SP2 grinding operation, upper surface UA and substrate S T side surface can be each other
Relatively.In this case, upper surface UA can be parallel with substrate S T linearity region FL.As a result, with the flat of ring-shaped
The upper surface UA in face can be ground in the case of no chip phenomenon to end region SP2.
Fig. 6 d show the grinding operation according to grinding ring component Gn1.Reference picture 6d, substrate S T side surface SD (references
It can Fig. 4) be ground by grinding ring component Gn1.In this case, substrate S T can be fixed by external fixture, and
Grinding ring component Gn1 can be ground by being moved on substrate S T length direction to substrate S T side surface SD.
In addition, though illustrate that grind ring component Gn1 is ground to substrate S T side surface SD by Fig. 6 d, but this
The technological thought not limited to this of invention.That is, grinding ring component Gn1 can be ground to substrate S T various regions.
Fig. 7 is the view for showing the substrate by being ground according to the lapping device of embodiment of the present invention.
Reference picture 7, there is provided pass through the substrate S T ground according to the lapping device GD of embodiment of the present invention.In Fig. 7
Shown, substrate S T side surface may include curve regions RL and linearity region FL.
Ring component Gn1 and grinding post part Gn2 are ground to lining as described above, can be utilized according to the lapping device GD of the present invention
Bottom ST is ground.Especially, can be by grinding the second grinding post portion Gn2b included in post part Gn2 upper surface to substrate
ST curve regions RL and linearity region FL interface are ground.As a result, can prevent substrate S T linearity region FL or
Chip phenomenon in the FL of linearity region.
As described above, disclose embodiment in accompanying drawing and specification.Although particular term used herein,
It is that this is used merely for the sake of the description purpose of the present invention, rather than is remembered to limit in implication or limitation claims
The scope of the present invention of load and use.Therefore, it will be understood by those skilled in the art that can thus implement various modifications and equivalent
Other embodiment.Therefore, real technical protection scope of the invention should by the technological thought of appended claims Lai
Limit.
Description of reference numerals
BC：Body part
MD：Connection member
Gn1：Grind ring component
Gn2：Grind post part
ST：Substrate
Claims (10)
1. substrate lapping device, including：
Body part, including the protuberance that support and the middle section from the support protrude；
Connection member, including the joint portion that is combined with the protuberance and from the prominent combined axis of a part for the joint portion；
Post part is ground, defines the engagement groove for combined axis insertion, and at least a portion of the grinding post part
Include curve on the section parallel with the length direction of the combined axis；And
Ring component is ground, is combined with the fringe region of the support.
2. substrate lapping device as claimed in claim 1, wherein,
The grinding post part includes being arranged in the first grinding post portion at the top of the joint portion and ground with described first
Second grinding post portion of the top connection in post portion, and
Central axis of the engagement groove along the described first grinding post portion and the second grinding post portion limits.
3. substrate lapping device as claimed in claim 2, wherein,
The second grinding post portion includes being connected to the basal surface in the first grinding post portion, the upper table relative with the basal surface
Face and the connection basal surface and the outer surface and inner surface of the upper surface, and
The out conductor in the second grinding post portion has curve shape on the section vertical with the basal surface.
4. substrate lapping device as claimed in claim 3, wherein, the basal surface has disk shape, and the upper surface
With ring-shaped.
5. substrate lapping device as claimed in claim 3, wherein, the area of the basal surface is more than on described in the horizontal plane
The area on surface.
6. substrate lapping device as claimed in claim 3, wherein, on the section vertical with the basal surface, described second
It is more than 6 millimeters that the length of the upper side line in post portion, which is ground, with the length sum of the engagement groove.
7. substrate lapping device as claimed in claim 3, wherein, on the section vertical with the basal surface, described first
The out conductor in grinding post portion has rectilinear form.
8. substrate lapping device as claimed in claim 2, wherein, the first grinding post portion has cylinder form.
9. substrate lapping device as claimed in claim 1, wherein,
The body part limits at least one combination in the calmodulin binding domain CaM between the middle section and the fringe region
Groove, and
The substrate lapping device also includes rotary part, and the rotary part is combined with the engagement groove and makes the body
Part rotates.
10. substrate lapping device as claimed in claim 1, wherein, the grinding post part and the grinding ring component include
Material different from each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0079490 | 2016-06-24 | ||
| KR1020160079490A KR102547935B1 (en) | 2016-06-24 | 2016-06-24 | Grinding device for substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107538337A true CN107538337A (en) | 2018-01-05 |
| CN107538337B CN107538337B (en) | 2021-11-02 |
Family
ID=60970301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710473797.0A Active CN107538337B (en) | 2016-06-24 | 2017-06-21 | Substrate grinding device |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102547935B1 (en) |
| CN (1) | CN107538337B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102031500B1 (en) | 2018-08-10 | 2019-10-11 | 주식회사 포스코 | Grinding device |
| KR20200063379A (en) | 2018-11-27 | 2020-06-05 | 삼성디스플레이 주식회사 | Display device |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0705660A1 (en) * | 1994-10-03 | 1996-04-10 | National Optronics, Inc. | Combination lens edger, polisher, and safety beveler, tool therefor and use thereof |
| CN2717007Y (en) * | 2004-05-18 | 2005-08-10 | 付毅 | Abrasive disk special for picture tube glass tube screen |
| JP2005316448A (en) * | 2004-03-30 | 2005-11-10 | Hoya Corp | Glass substrate for mask blank, mask blank, method for producing glass substrate for mask blank, and polishing device |
| JP2006024840A (en) * | 2004-07-09 | 2006-01-26 | Sumitomo Metal Mining Co Ltd | Method for beveling gallium phosphide wafers |
| CN102189486A (en) * | 2010-03-11 | 2011-09-21 | 三星移动显示器株式会社 | Grinder, grinding method using the grinder, manufacturing method of display device using the grinding method, and display device manufactured by the manufacturing method |
| CN202225096U (en) * | 2011-09-14 | 2012-05-23 | 天津中屹铭科技有限公司 | Grinding wheel special for industrial casting grinder |
| CN202572065U (en) * | 2012-05-23 | 2012-12-05 | 蓝思旺科技(深圳)有限公司 | Processing grinding tool |
| CN202656073U (en) * | 2011-11-15 | 2013-01-09 | 山东电力研究院 | Specimen grinding-polishing disk with grinding-polishing integrated structure |
| CN103481181A (en) * | 2012-06-08 | 2014-01-01 | 株式会社新韩电子 | Surface-grinding apparatus for glass with cruved surface |
| CN203542272U (en) * | 2013-05-20 | 2014-04-16 | 安徽奥丰汽车配件有限公司 | Chamfering machine with variable chamfering dimension |
| CN203831258U (en) * | 2014-04-25 | 2014-09-17 | 福州鑫文达机械模具有限公司 | Milling cutter coarse and fine grinding wheel |
| CN203918740U (en) * | 2014-04-25 | 2014-11-05 | 苏州新一磁业有限公司 | Single-double dual-purpose grinder |
| CN204321832U (en) * | 2014-06-27 | 2015-05-13 | 冯宪轮 | electroplated grinding wheel |
| CN205148096U (en) * | 2015-10-08 | 2016-04-13 | 蓝思科技股份有限公司 | Multi -functional emery wheel stick |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6098440B2 (en) | 2013-08-29 | 2017-03-22 | 三菱マテリアル株式会社 | Ball end mill |
| JP6227159B2 (en) * | 2013-11-29 | 2017-11-08 | チョンチン シーシャン サイエンス アンド テクノロジー カンパニー， リミテッドＣｈｏｎｇｑｉｎｇ Ｘｉｓｈａｎ Ｓｃｉｅｎｃｅ ＆ Ｔｅｃｈｎｏｌｏｇｙ Ｃｏ．， Ｌｔｄ． | Side grinding drill with continuously variable angle |
| KR20150138601A (en) * | 2014-06-02 | 2015-12-10 | (주)성산툴스 | Assembly-type end-mill |
| KR20150145503A (en) * | 2014-06-20 | 2015-12-30 | 주식회사 케이엔제이 | Substrate polishing apparatus and method of the same |
-
2016
- 2016-06-24 KR KR1020160079490A patent/KR102547935B1/en active IP Right Grant
-
2017
- 2017-06-21 CN CN201710473797.0A patent/CN107538337B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0705660A1 (en) * | 1994-10-03 | 1996-04-10 | National Optronics, Inc. | Combination lens edger, polisher, and safety beveler, tool therefor and use thereof |
| JP2005316448A (en) * | 2004-03-30 | 2005-11-10 | Hoya Corp | Glass substrate for mask blank, mask blank, method for producing glass substrate for mask blank, and polishing device |
| CN2717007Y (en) * | 2004-05-18 | 2005-08-10 | 付毅 | Abrasive disk special for picture tube glass tube screen |
| JP2006024840A (en) * | 2004-07-09 | 2006-01-26 | Sumitomo Metal Mining Co Ltd | Method for beveling gallium phosphide wafers |
| CN102189486A (en) * | 2010-03-11 | 2011-09-21 | 三星移动显示器株式会社 | Grinder, grinding method using the grinder, manufacturing method of display device using the grinding method, and display device manufactured by the manufacturing method |
| CN202225096U (en) * | 2011-09-14 | 2012-05-23 | 天津中屹铭科技有限公司 | Grinding wheel special for industrial casting grinder |
| CN202656073U (en) * | 2011-11-15 | 2013-01-09 | 山东电力研究院 | Specimen grinding-polishing disk with grinding-polishing integrated structure |
| CN202572065U (en) * | 2012-05-23 | 2012-12-05 | 蓝思旺科技(深圳)有限公司 | Processing grinding tool |
| CN103481181A (en) * | 2012-06-08 | 2014-01-01 | 株式会社新韩电子 | Surface-grinding apparatus for glass with cruved surface |
| CN203542272U (en) * | 2013-05-20 | 2014-04-16 | 安徽奥丰汽车配件有限公司 | Chamfering machine with variable chamfering dimension |
| CN203831258U (en) * | 2014-04-25 | 2014-09-17 | 福州鑫文达机械模具有限公司 | Milling cutter coarse and fine grinding wheel |
| CN203918740U (en) * | 2014-04-25 | 2014-11-05 | 苏州新一磁业有限公司 | Single-double dual-purpose grinder |
| CN204321832U (en) * | 2014-06-27 | 2015-05-13 | 冯宪轮 | electroplated grinding wheel |
| CN205148096U (en) * | 2015-10-08 | 2016-04-13 | 蓝思科技股份有限公司 | Multi -functional emery wheel stick |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102547935B1 (en) | 2023-06-27 |
| KR20180001669A (en) | 2018-01-05 |
| CN107538337B (en) | 2021-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107538337A (en) | Substrate lapping device | |
| US8670246B2 (en) | Computers including an undiced semiconductor wafer with Faraday Cages and internal flexibility sipes | |
| CN104105997B (en) | The glasses manufacture method of polarization glass lens and glasses polarization glass lens | |
| CN105807546B (en) | Projection screen device, projection device, and projection method | |
| CN106090728A (en) | Backlight module and display device | |
| KR20070091352A (en) | Polishing wheel | |
| BR0012824A (en) | Method for producing microabrasive tools | |
| RU2009130784A (en) | HELICOPTER SCREW AND HELICOPTER CONTAINING THIS SCREW | |
| KR102578503B1 (en) | Lapping device | |
| KR101197543B1 (en) | Container for mixing and degassing equipment, and mixing and degassing equipment | |
| US10722995B2 (en) | Window for display apparatus, manufacturing method thereof, and manufacturing method of display apparatus | |
| CN106104338B (en) | Manufacturing method, optical connector and the optical fiber insertion apparatus of optical connector | |
| CN205254761U (en) | Optic fibre grinding -and -polishing machine | |
| US8017971B2 (en) | Light emitting diode light source | |
| KR100766207B1 (en) | Knife sharpener | |
| CN106956183A (en) | The processing method of glass cylinder mirror | |
| SE0500892L (en) | refiner housing | |
| CN104290003A (en) | Rotating chip optical lens polishing apparatus | |
| CN106826465A (en) | It is exclusively used in the Twp-sided polishing machine erratic star wheel of glass cylinder mirror processing | |
| CO5580156A1 (en) | MOUNTING UNIT TO BE USED WITH A ROTATING DRUM TO CUT GRANULAR MATERIAL AND ROTATING APPLIANCE TO CUT GRAINS | |
| BRPI0705040A2 (en) | apparatus for cleaning a fiber suspension for a papermaking process | |
| CN205438209U (en) | Pyramid prism's fixing device | |
| CN205003371U (en) | Suspension type stereoscopic image kaleidoscope | |
| IT201600088028A1 (en) | IMPROVED GLASS | |
| CN104536143B (en) | 3d film and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |