CN107529288A - A kind of integrated circuit of chip bridge-set and light emitting diode - Google Patents
A kind of integrated circuit of chip bridge-set and light emitting diode Download PDFInfo
- Publication number
- CN107529288A CN107529288A CN201710843370.5A CN201710843370A CN107529288A CN 107529288 A CN107529288 A CN 107529288A CN 201710843370 A CN201710843370 A CN 201710843370A CN 107529288 A CN107529288 A CN 107529288A
- Authority
- CN
- China
- Prior art keywords
- chip
- pin
- pad
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012212 insulator Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 230000005611 electricity Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
The present invention relates to technical field of integrated circuits, more particularly to the integrated circuit of a kind of chip bridge-set and light emitting diode, including：Insulator foot；Paster pin, including Part I in insulator foot and the Part II that extends to outside insulator foot, Part II are connected with the first pad on the first printed circuit board；Second printed circuit board, including connection pin and the second pad；The Part I for connecting pin and paster pin connects；There is the lead of connection connection pin and the second pad on second printed circuit board；The chip pin of chip is connected with the second pad；Chip can easily be changed to adapt to the chip of different pins and size, production and R＆D cycle are short, and cost is low.
Description
Technical field
The present invention relates to technical field of integrated circuits, more particularly to a kind of chip bridge-set and light emitting diode is integrated
Circuit.
Background technology
LED (Light Emitting Diode light emitting diodes, abbreviation LED) is a kind of semiconducting solid luminescent device,
It is by the use of solid semiconductor chip as luminescent material, and when both ends add forward voltage, the carrier in semiconductor occurs multiple
Conjunction causes photon to launch and produce light.
LED power is one kind in power supply, is to the device of electronic equipment offer power, and power supply unit.It is logical
Transformer and rectifier are crossed, alternating current is become the device of direct current, this device is just called rectifier power source, is also driving electricity
Source.The electronic equipment that signal can be provided is called signal source.Lithium battery, dry cell, rectifier power source, signal source are sometimes referred to as electricity
Source.
Once existing LED power product design typification, to realize that a certain new function is wanted to change different types of core
Piece, because chip pin pitch or package dimension are different, generally require to remake printed circuit board corresponding with chip pin, production and
R＆D cycle is grown, and cost is high.
The content of the invention
In view of the above-mentioned problems, the present invention proposes a kind of chip bridge-set, applied to one first printed circuit board of bridge joint
On the first pad and a chip；Wherein, including：
Insulator foot；
Paster pin, including Part I in the insulator foot and extend to outside the insulator foot
Two parts, the Part II are connected with the first pad on first printed circuit board；
Second printed circuit board, including connection pin and the second pad；
The connection pin is connected with the Part I of the paster pin；
There is the lead for connecting the connection pin and second pad on second printed circuit board；
The chip pin of the chip is connected with second pad.
Above-mentioned chip bridge-set, wherein, the Part II of the paster pin is domed.
Above-mentioned chip bridge-set, wherein, the bottom of the insulator foot has bulge-structure, the bulge-structure
Top flushes with the bottom of the Part II of the paster pin.
Above-mentioned chip bridge-set, wherein, the paster pin also includes a Part III, and the one of the Part III
End is connected with the Part I of the insulator foot, and the Part III extends to institute backwards to one end of the Part I
State outside insulator foot；
The connection pin is connected by connecting the Part III with the Part I of the paster pin.
Above-mentioned chip bridge-set, wherein, the Part III is backwards to one end of the Part I formed with connecting
The neck that plug-in pin matches.
Above-mentioned chip bridge-set, wherein, the quantity of first pad is 8, described the of the paster pin
The quantity of two parts is 8, and each Part II corresponds to first pad respectively.
Above-mentioned chip bridge-set, wherein, the quantity of second pad is 8.
Above-mentioned chip bridge-set, wherein, the driving of LED power source is additionally provided with the first printed circuit board
Circuit.
A kind of integrated circuit of light emitting diode, wherein, including as above any described chip bridge-set.
Beneficial effect：The integrated circuit of a kind of chip bridge-set and light emitting diode proposed by the present invention, can facilitate
Chip is changed to adapt to the chip of different pins and size in ground, and production and R＆D cycle are short, and cost is low.
Brief description of the drawings
Fig. 1 is the structure principle chart of one embodiment of the invention chips bridge-set.
Embodiment
The present invention is further described with reference to the accompanying drawings and examples.
Embodiment one
In a preferred embodiment, as shown in Figure 1, it is proposed that a kind of chip bridge-set, can apply to bridge
The first pad and a chip 2 on one first printed circuit board 1；Wherein it is possible to including：
Insulator foot 10；
Paster pin 20, including Part I (not shown in accompanying drawing) in insulator foot 10 and extend to insulation
Part II 22 outside base 10, Part II 22 are connected with the first pad on the first printed circuit board 1；
Second printed circuit board 30, including the connection pad 32 of pin 31 and second；
Connection pin 31 is connected with the Part I of paster pin 20；
There is the lead of the connection connection pad of pin 31 and second on second printed circuit board 30；
The chip pin of chip 1 is connected with the second pad.
In above-mentioned technical proposal, the chip that is directly welded at originally on the printed circuit board of LED power source, use
After technical scheme in the present invention, chip 2 is connected by way of bridge joint with the first printed circuit board 1, can be conveniently by
Change chip bridge-set to change chip 1, without remaking printed circuit board.
Specifically, the material of paster pin 20 can be copper, can be prepared by metal plate bending.
In a preferred embodiment, the Part II 22 of paster pin 20 is domed (sea-gull pin shape), to reduce patch
Stress on piece pin 20.
In a preferred embodiment, the bottom of insulator foot 10 has bulge-structure, the top of bulge-structure and patch
The bottom of the Part II 22 of piece pin 20 flushes, so as to share the stress in paster pin 20 to a certain extent.
In a preferred embodiment, paster pin 20 also includes a Part III 23, and one end of Part III 23 is prolonged
Extend and be connected in insulator foot 10 with Part I, Part III 23 is extended to outside insulator foot 10 backwards to one end of Part I
Portion；
Connection pin 31 is connected by connecting Part III 23 with the Part I of paster pin 20；
In above-described embodiment, it is preferable that Part III 23 is backwards to one end of Part I formed with being connected the phase of pin 31
The neck of matching.
In above-mentioned technical proposal, Part III 23 can be multiple column structures in row or matrix arrangement, from each other
There can be certain intervals to form neck, the structure of connection pin 31 can match with neck, and such neck
Structure is easy to removal and installation；But neck is also only a kind of preferable situation, connection pin 31 and Part III 23 can be with
Connected by soldering.
Specifically, the Part I of paster pin 20, Part II 22 and Part III 23 can be molded together；Paster
The printed circuit board 30 of pin 20 and second can be that integrated injection molding forms.
In a preferred embodiment, the quantity of the first pad is 8, the quantity of the Part II 22 of paster pin 20
For 8, each Part II 22 corresponds to first pad respectively.
In a preferred embodiment, the quantity of the second pad can be 8, but be not limited only to 8, can be according to tool
The second pad that the chip manufacturing of body is adapted with chip pin quantity.
In above-mentioned technical proposal, can with previously prepared such chip bridge-set, and the first printed circuit board 1 not by
The limitation of chip so that the manufacture of the first printed circuit board 1 can be carried out independently, and design and manufacturing cycle shorten, efficiency high.
In a preferred embodiment, the drive of LED power source is also provided with the first printed circuit board 1
Dynamic circuit.
Embodiment two
In a preferred embodiment, it is also proposed that a kind of integrated circuit of light emitting diode, wherein, including such as take up an official post
One chip bridge-set.
In summary, the integrated circuit of a kind of chip bridge-set and light emitting diode proposed by the present invention, including：Insulation
Base；Paster pin, including Part I in insulator foot and the Part II that extends to outside insulator foot, second
Part is connected with the first pad on the first printed circuit board；Second printed circuit board, including connection pin and the second pad；
The Part I for connecting pin and paster pin connects；There is connection connection pin and second pad on second printed circuit board
Lead；The chip pin of chip is connected with the second pad；Chip can easily be changed to adapt to the core of different pins and size
Piece, production and R＆D cycle are short, and cost is low.
By explanation and accompanying drawing, the exemplary embodiments of the specific structure of embodiment are given, it is smart based on the present invention
God, it can also make other conversions.Although foregoing invention proposes existing preferred embodiment, however, these contents are not intended as
Limitation.
For a person skilled in the art, after reading described above, various changes and modifications undoubtedly will be evident.
Therefore, appended claims should regard whole variations and modifications of the true intention and scope that cover the present invention as.Weighing
Any and all scope and content of equal value, are all considered as still belonging to the intent and scope of the invention in the range of sharp claim.
Claims (9)
- A kind of 1. chip bridge-set, applied to the first pad and a chip on one first printed circuit board of bridge joint；Its feature It is, including：Insulator foot；Paster pin, including Part I in the insulator foot and extend to outside the insulator foot second Point, the Part II is connected with the first pad on first printed circuit board；Second printed circuit board, including connection pin and the second pad；The connection pin is connected with the Part I of the paster pin；There is the lead for connecting the connection pin and second pad on second printed circuit board；The chip pin of the chip is connected with second pad.
- 2. chip bridge-set according to claim 1, it is characterised in that the Part II of the paster pin is in Arch.
- 3. chip bridge-set according to claim 1, it is characterised in that the bottom of the insulator foot has raised tie Structure, the top of the bulge-structure flush with the bottom of the Part II of the paster pin.
- 4. chip bridge-set according to claim 1, it is characterised in that the paster pin also includes one the 3rd Point, one end of the Part III is extended in the insulator foot to be connected with the Part I, and the Part III is backwards One end of the Part I is extended to outside the insulator foot；The connection pin is connected by connecting the Part III with the Part I of the paster pin.
- 5. chip bridge-set according to claim 4, it is characterised in that the Part III is backwards to the Part I One end formed with the neck to match with being connected pin.
- 6. chip bridge-set according to claim 1, it is characterised in that the quantity of first pad is 8, described The quantity of the Part II of paster pin is 8, and each Part II corresponds to first pad respectively.
- 7. chip bridge-set according to claim 1, it is characterised in that the quantity of second pad is 8.
- 8. chip bridge-set according to claim 1, it is characterised in that be additionally provided with the first printed circuit board luminous The drive circuit of diode power source.
- 9. a kind of integrated circuit of light emitting diode, it is characterised in that including the chip bridge as described in claim 1~8 is any Connection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710843370.5A CN107529288A (en) | 2017-09-18 | 2017-09-18 | A kind of integrated circuit of chip bridge-set and light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710843370.5A CN107529288A (en) | 2017-09-18 | 2017-09-18 | A kind of integrated circuit of chip bridge-set and light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107529288A true CN107529288A (en) | 2017-12-29 |
Family
ID=60735951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710843370.5A Pending CN107529288A (en) | 2017-09-18 | 2017-09-18 | A kind of integrated circuit of chip bridge-set and light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107529288A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010059916A (en) * | 1999-12-30 | 2001-07-06 | 마이클 디. 오브라이언 | multi chip module semiconductor package |
| CN103841761A (en) * | 2012-11-22 | 2014-06-04 | 李川涛 | Plug port printed circuit board |
| US20170094791A1 (en) * | 2015-09-25 | 2017-03-30 | Raul Enriquez Shibayama | Bridge device for interfacing a packaged device with a substrate |
| CN206136452U (en) * | 2016-09-18 | 2017-04-26 | 歌尔股份有限公司 | A printed circuit board and printing dress matching board for switching |
| CN206422977U (en) * | 2017-02-10 | 2017-08-18 | 江西创致汽车配件有限公司 | A kind of new controller program change plug-in unit |
| CN207305126U (en) * | 2017-09-18 | 2018-05-01 | 宁波赛耐比光电科技股份有限公司 | A kind of integrated circuit of chip bridge-set and light emitting diode |
-
2017
- 2017-09-18 CN CN201710843370.5A patent/CN107529288A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010059916A (en) * | 1999-12-30 | 2001-07-06 | 마이클 디. 오브라이언 | multi chip module semiconductor package |
| CN103841761A (en) * | 2012-11-22 | 2014-06-04 | 李川涛 | Plug port printed circuit board |
| US20170094791A1 (en) * | 2015-09-25 | 2017-03-30 | Raul Enriquez Shibayama | Bridge device for interfacing a packaged device with a substrate |
| CN206136452U (en) * | 2016-09-18 | 2017-04-26 | 歌尔股份有限公司 | A printed circuit board and printing dress matching board for switching |
| CN206422977U (en) * | 2017-02-10 | 2017-08-18 | 江西创致汽车配件有限公司 | A kind of new controller program change plug-in unit |
| CN207305126U (en) * | 2017-09-18 | 2018-05-01 | 宁波赛耐比光电科技股份有限公司 | A kind of integrated circuit of chip bridge-set and light emitting diode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107393911B (en) | Energy-saving RGB-LED packaging body, packaging module and display screen thereof | |
| CN102072422A (en) | Packaging structure of high-power LED (light emitting diode) light source module | |
| TWI415309B (en) | Preform Molded Polycrystalline Bearing Modules with Lead Frame Type | |
| CN207398145U (en) | A kind of LED lamp bead of built-in IC | |
| CN103117263A (en) | Integrated circuit package | |
| US20100109041A1 (en) | High efficiency led structure | |
| CN207305126U (en) | A kind of integrated circuit of chip bridge-set and light emitting diode | |
| CN104470147A (en) | LED circuit | |
| CN210778596U (en) | LED drive IC packaging structure | |
| CN107529288A (en) | A kind of integrated circuit of chip bridge-set and light emitting diode | |
| CN203339216U (en) | Surface mounting type LED support, LED device and LED display screen | |
| US7233106B2 (en) | LED chip capping construction | |
| US8278680B2 (en) | Semiconductor package structure | |
| CN207896088U (en) | The lamp bead of IC built in a kind of more cup type holders | |
| CN203707109U (en) | Multi-integration triode | |
| CN204465503U (en) | General digital logical integrated circuit replacement module | |
| CN204213709U (en) | A kind of 9VLED lamp pearl 220V high pressure non-resistance LED | |
| CN102214771A (en) | Lead-frame-type multi-chip bearing module for precast mold molding | |
| CN103307470B (en) | Light emitting device | |
| CN207409486U (en) | A kind of built-in series resistance high-voltage LED | |
| CN218827125U (en) | Light-emitting device packaged with bare chip | |
| CN206116398U (en) | Mixed light source paster LED | |
| CN204927338U (en) | Paster LED packaging structure | |
| CN214208337U (en) | Heart rate module interface circuit, heart rate module and wearable equipment | |
| CN204424312U (en) | Directly accept the LED packaging element of alternating current |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No. 122315000 Jianlan Road, Gaoxin District, Ningbo, Zhejiang Applicant after: Ningbo sainaibi Photoelectric Technology Co.,Ltd. Address before: No.56 Keda Road, hi tech Zone, Ningbo City, Zhejiang Province, 315000 Applicant before: NINGBO SNAPPY OPTOELECTRONICS Co.,Ltd. |