CN107525766A - The device and method of object thermal imaging under a kind of high temperature - Google Patents
The device and method of object thermal imaging under a kind of high temperature Download PDFInfo
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- CN107525766A CN107525766A CN201710656941.4A CN201710656941A CN107525766A CN 107525766 A CN107525766 A CN 107525766A CN 201710656941 A CN201710656941 A CN 201710656941A CN 107525766 A CN107525766 A CN 107525766A
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- high temperature
- imaging system
- under high
- light irradiation
- thermal imaging
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N2021/0106—General arrangement of respective parts
- G01N2021/0112—Apparatus in one mechanical, optical or electronic block
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- Optics & Photonics (AREA)
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Abstract
The invention provides a kind of device of object thermal imaging under high temperature, belong to the technical field of processing equipment such as powder metallurgy, refractory material, ceramics, building materials, including a parallel light irradiation device and an imaging system, an electric tube furnace is provided between parallel light irradiation device and imaging system, a heat-insulated optical filter is respectively equipped between electric tube furnace and parallel light irradiation device and imaging system, a narrow band pass filter is provided between one of them heat-insulated optical filter and imaging system, imaging system connects a computer equipment.The image definition that the present invention arrives lens shooting is high, sharpness of border, uniform throughout, more conveniently calculates the change of the shape and size of material, reduces experimental error.
Description
Technical field
The present invention relates to the technical field of processing equipment such as powder metallurgy, refractory material, ceramics, building materials, are specifically a kind of high
The device and method of the lower object thermal imaging of temperature.
Background technology
The sintering study of ceramics is most important ceramic research field, understands the physico of ceramic post sintering process generation
It is most important to learn change.Sintering process is studied, its most important affecting parameters is exactly sintering temperature and sintering time, accurately
Holding both data just can the maximally effective quality for controlling product.But all there is the blind burning of high temperature not in the research of the overwhelming majority at present
It can be seen that the problem of, it is only limited to the table to microstructure after the pattern of sintering ceramic powder and the sign and sintering of property
Sign, all multi informations of sintering process are difficult to measure and caught, and turn into serious the problem of perplexing ceramic research scholar.If it can use
The method of optical measurement is directly observed in the sintering phenomenon and sintering process that ceramic material occurs in sintering process in a furnace
Shape and size change, and then it will be a significantly thing to calculate the linear shrinkage ratio of sample and cubical contraction,
Ceramic sintered compact curve can be obtained, directly instructs the sintering of ceramics, the research for ceramic sintering process has important
Meaning.
The sintering that ceramic material occurs in sintering process in a furnace is intuitively observed using the method for above-mentioned optical measurement to show
As and sintering process in shape and size change, be that the material in sintering is observed and shot using camera lens, but
Material sintering process is heated to more than 1300 DEG C, and object itself can also light, and camera lens can not shoot normal clearly image,
Image definition is poor, and image is uneven everywhere, therefore can not also calculate the change of the shape and size of material, therefore high temperature
The sintering experiment of the lower material of operation can not be normally carried out.
The content of the invention
In view of this, the present invention is intended to provide under a kind of high temperature object thermal imaging device and method, can will in height
Light caused by temperature is lower filters out, and the image definition for arriving lens shooting is high, sharpness of border, uniform throughout, more convenient to calculate
Go out the change of the shape and size of material, reduce experimental error.
To reach above-mentioned purpose, the technical proposal of the invention is realized in this way:The dress of object thermal imaging under a kind of high temperature
Put, including a parallel light irradiation device and an imaging system, a pipe is provided between the parallel light irradiation device and imaging system
Formula electric furnace, a heat-insulated optical filter is respectively equipped between the electric tube furnace and parallel light irradiation device and imaging system, wherein one
A narrow band pass filter is provided between individual heat-insulated optical filter and imaging system, the imaging system connects a computer equipment.
Further, the parallel light irradiation device is a LED, and the light that LED is sent is blue visible light.
Further, the imaging system includes an industrial camera, and the industrial camera is provided with a doubly telecentric industry mirror
Head, the doubly telecentric industrial lens are provided with a ccd sensor.
Further, the sintering temperature in the electric tube furnace is 1600~2000 DEG C.
Further, the light wave width that the narrow band pass filter allows to pass through is less than 50nm.
Further, the narrow band pass filter includes a sheet glass, is plated on the sheet glass coated with one layer of crystal glass
Film.
Further, the size of the sheet glass is 60*60mm, and the thickness of the sheet glass is 1mm, the crystal glass
The thickness of plated film is 0.2mm.
Further, angle between the directional light that the narrow band pass filter is sent with parallel light irradiation device for 45~
90°。
Further, the precision of the imaging is less than 8 μm.
Present invention also offers the imaging method of said apparatus, comprise the following steps:Sample is placed in electric tube furnace
Row sinters, and the sample in sintering is under the irradiation of parallel light irradiation device, by heat-insulated optical filter and narrow band pass filter, by being imaged
It is recorded in after system imaging on computer equipment.
Relative to prior art, the present invention has the advantage that:
The present invention can be distinguished using the visible directional light of blueness as light source with light caused by the object under high temperature, not by
The influence for the light that object itself is sent under high temperature, doubly telecentric industrial lens can improve the depth of field of measurement, ccd image sensor energy
Enough precision for improving measurement, narrow band pass filter can filter out the light that object at high temperature is sent itself, and only allow light
Light of the wave width less than 50nm is by the way that the image definition for arriving lens shooting is high, sharpness of border, and uniform throughout is more convenient
The change of the shape and size of material is calculated, the precision of imaging is less than 8 μm, reduces experimental error.
Brief description of the drawings
The accompanying drawing for forming the part of the present invention is used for providing a further understanding of the present invention, schematic reality of the invention
Apply example and its illustrate to be used to explain the present invention, do not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the structural representation of the narrow band pass filter of the present invention.
Fig. 3 is the image shot without using imaging system during the present invention.
Fig. 4 is the image that imaging system is shot when using of the invention.
In figure:1st, LED;2nd, industrial camera;3rd, doubly telecentric industrial lens;4th, ccd sensor;5th, electric tube furnace;6th, every
Heat filter;7th, narrow band pass filter;71st, sheet glass;72nd, crystal glass plated film;8th, computer equipment.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " on ", " under ",
The orientation or position relationship of the instruction such as "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer " are
Based on orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than instruction or dark
Show that the device of meaning or element there must be specific orientation, with specific azimuth configuration and operation, thus it is it is not intended that right
The limitation of the present invention.In addition, term " first ", " second " etc. are only used for describing purpose, and it is not intended that instruction or hint phase
To importance or the implicit quantity for indicating indicated technical characteristic.Thus, the feature for defining " first ", " second " etc. can
To express or implicitly include one or more this feature.In the description of the invention, unless otherwise indicated, " multiple "
It is meant that two or more.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can
To be mechanical connection or electrical connection;Can be joined directly together, can also be indirectly connected by intermediary, Ke Yishi
The connection of two element internals.For the ordinary skill in the art, above-mentioned term can be understood by concrete condition
Concrete meaning in the present invention.
Describe the present invention in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
As shown in Figure 1, 2, under a kind of high temperature object thermal imaging device, including a parallel light irradiation device and one imaging system
System, parallel light irradiation device is a LED 1, and the light that LED 1 is sent is blue visible light, and imaging system includes an industrial camera
2, industrial camera 2 is provided with a doubly telecentric industrial lens 3, and doubly telecentric industrial lens 3 are provided with a ccd sensor 4, and directional light shines
It is provided with an electric tube furnace 5 between injection device and imaging system, the sintering temperature in electric tube furnace 5 is 1600~2000 DEG C, tubular type
A heat-insulated optical filter 6 is respectively equipped between electric furnace 5 and parallel light irradiation device and imaging system, one of them heat-insulated optical filter 6
A narrow band pass filter 7 is provided between imaging system, between the directional light that narrow band pass filter 7 is sent with parallel light irradiation device
Angle is 90 °, and narrow band pass filter 7 includes a sheet glass 71, and one layer of crystal glass plated film 72, sheet glass are coated with sheet glass 71
71 size is 60*60mm, and the thickness of sheet glass 7/1 is 1mm, and the thickness of crystal glass plated film 72 is 0.2mm, narrow band pass filter
The 7 light wave width for allowing to pass through are less than 50nm, and the precision of imaging is less than 8 μm, and imaging system connects a computer equipment 8.
The imaging method of said apparatus, comprises the following steps:Sample is placed in electric tube furnace 5 and is sintered, in sintering
Sample under the irradiation of parallel light irradiation device, by heat-insulated optical filter 6 and narrow band pass filter 7, after imaging system images
It is recorded on computer equipment 8.
As shown in figure 3, when without using the present invention, material sinters to more than 1300 DEG C in electric tube furnace 5, object itself
It can light, be imaged after the irradiation of parallel light irradiation device, the image definition of imaging system shooting is poor, and obscure boundary is clear, respectively
Locate change that is uneven, therefore can not also calculating the shape and size of material.
As shown in figure 4, when without using the present invention, material sinters to more than 1300 DEG C in electric tube furnace 5, object itself
It can light, by object, caused light filters out optical filter at high temperature, is imaged after the irradiation of parallel light irradiation device, imaging system
The image definition photographed is high, sharpness of border, uniform throughout, more conveniently calculates the change of the shape and size of material,
Reduce experimental error.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.
Claims (10)
- A kind of 1. device of object thermal imaging under high temperature, it is characterised in that:Including a parallel light irradiation device and an imaging system, Be provided with an electric tube furnace between the parallel light irradiation device and imaging system, the electric tube furnace and parallel light irradiation device and A heat-insulated optical filter is respectively equipped between imaging system, an arrowband is provided between one of them heat-insulated optical filter and imaging system and is filtered Mating plate, the imaging system connect a computer equipment.
- 2. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:The parallel light irradiation device For a LED, the light that LED is sent is blue visible light.
- 3. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:The imaging system includes one Industrial camera, the industrial camera are provided with a doubly telecentric industrial lens, and the doubly telecentric industrial lens sense provided with a CCD Device.
- 4. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:Burning in the electric tube furnace Junction temperature is 1600~2000 DEG C.
- 5. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:The narrow band pass filter allows The light wave width passed through is less than 50nm.
- 6. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:The narrow band pass filter includes One sheet glass, one layer of crystal glass plated film is coated with the sheet glass.
- 7. the device of object thermal imaging under high temperature according to claim 6, it is characterised in that:The size of the sheet glass is 60*60mm, the thickness of the sheet glass is 1mm, and the thickness of the crystal glass plated film is 0.2mm.
- 8. the device of object thermal imaging under high temperature according to claim 3, it is characterised in that:The narrow band pass filter is with putting down Angle between the directional light that row light irradiation device is sent is 45~90 °.
- 9. the device of object thermal imaging under high temperature according to claim 1, it is characterised in that:The precision of the imaging is less than 8μm。
- It is 10. a kind of such as the imaging method of any one of claim 1-9 described device, it is characterised in that:Comprise the following steps:Will examination Sample is placed in electric tube furnace and is sintered, and the sample in sintering is under the irradiation of parallel light irradiation device, by heat-insulated optical filter And narrow band pass filter, by being recorded in after imaging system images on computer equipment.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113074854A (en) * | 2021-03-31 | 2021-07-06 | 天津中环电炉股份有限公司 | Method for evaluating high-temperature internal stress of ceramic coating |
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CN1370375A (en) * | 1999-08-31 | 2002-09-18 | Og技术公司 | Optical observation device and method for observing articles at elevated temperatures |
CN103556199A (en) * | 2013-08-19 | 2014-02-05 | 青岛聚蚨源机电有限公司 | Crystal film and coating technology thereof |
CN104748678A (en) * | 2015-03-08 | 2015-07-01 | 大连理工大学 | Method of compensating image quality during high-temperature object measurement |
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2017
- 2017-08-03 CN CN201710656941.4A patent/CN107525766A/en active Pending
Patent Citations (3)
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CN1370375A (en) * | 1999-08-31 | 2002-09-18 | Og技术公司 | Optical observation device and method for observing articles at elevated temperatures |
CN103556199A (en) * | 2013-08-19 | 2014-02-05 | 青岛聚蚨源机电有限公司 | Crystal film and coating technology thereof |
CN104748678A (en) * | 2015-03-08 | 2015-07-01 | 大连理工大学 | Method of compensating image quality during high-temperature object measurement |
Non-Patent Citations (3)
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黄燕超: "PECVD法制备SiO2增透减反涂层的研究", 《中国优秀硕士学位论文全文数据库 信息科技辑》 * |
Cited By (1)
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CN113074854A (en) * | 2021-03-31 | 2021-07-06 | 天津中环电炉股份有限公司 | Method for evaluating high-temperature internal stress of ceramic coating |
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Application publication date: 20171229 |