CN107520533A - The welding method of target material assembly - Google Patents

The welding method of target material assembly Download PDF

Info

Publication number
CN107520533A
CN107520533A CN201610458855.8A CN201610458855A CN107520533A CN 107520533 A CN107520533 A CN 107520533A CN 201610458855 A CN201610458855 A CN 201610458855A CN 107520533 A CN107520533 A CN 107520533A
Authority
CN
China
Prior art keywords
face
weld
target
backboard
welding method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610458855.8A
Other languages
Chinese (zh)
Inventor
姚力军
潘杰
相原俊夫
王学泽
李响
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Jiangfeng Electronic Material Co Ltd
Original Assignee
Ningbo Jiangfeng Electronic Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Jiangfeng Electronic Material Co Ltd filed Critical Ningbo Jiangfeng Electronic Material Co Ltd
Priority to CN201610458855.8A priority Critical patent/CN107520533A/en
Publication of CN107520533A publication Critical patent/CN107520533A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/12Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
    • B23K20/122Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding

Abstract

A kind of welding method of target material assembly, including:There is provided target and backboard, the target has first face of weld, and the backboard has second face of weld;First face of weld and second face of weld are welded using friction-welding technique.The welding method of the target material assembly improves the welding performance and welding efficiency of target and backboard, and Environmental Safety.So as to improve the soldering reliability of target material assembly.

Description

The welding method of target material assembly
Technical field
The present invention relates to field of semiconductor manufacture, more particularly to a kind of welding method of target material assembly.
Background technology
In the semiconductor industry, target material assembly needs to meet sputtering performance, the target material assembly include target, And combined with target and there is the backboard of certain bond strength.Backboard is assembled in the target material assembly to be splashed Penetrate in base station and play a supporting role, and there is the effect of conduction heat.
In magnetron sputtering membrane process, target material assembly is in high voltage electric field and the larger magnetic field of magnetic field intensity In, target sputters under the ion bombardment effects of high-energy, the neutral atom gone out from target as sputter Or molecule deposition forms film on substrate.In whole sputter procedure, the target material assembly is in height In warm environment, and the sputter face of target is positioned in high vacuum environment, and the back side of backboard needs to be held Continuous high-pressure cooling water is impacted to improve the heat radiation function of target material assembly.It can be seen that in magnetron sputtering technique, Huge pressure differential be present in target and backboard both sides.Thus, the bond strength between target and backboard needs Meet certain requirement, to ensure being smoothed out for magnetron sputtering technique.
At present, the combination between target and backboard is realized by welding.The welding of conventional target material assembly Technique includes electro-beam welding process, hot isostatic press welding technique, soldering processes.
However, using the welding method of target material assembly in the prior art, the soldering reliability of target material assembly has Wait to improve.
The content of the invention
The present invention solves the problems, such as to be to provide a kind of welding method of target material assembly, to improve target material assembly Soldering reliability.
To solve the above problems, the present invention provides a kind of welding method of target material assembly, including:Target is provided Material and backboard, the target have first face of weld, and the backboard has second face of weld;Using friction welding Technique welds first face of weld and second face of weld.
Optionally, the target also has the sputter face relative with first face of weld;The backboard also have with The relative back side of second face of weld.
Optionally, the process of the friction-welding technique includes:The back of the body is fixed using the first rolling clamp Plate, first rolling clamp are used to make backboard rotate around the axis of backboard;Fixed using movable clamp The target, first face of weld are set towards second face of weld, the axis of the axis of the target and the backboard Overlap;Start movable clamp to move to the first rolling clamp;After first face of weld contacts second face of weld, First face of weld is rubbed and heat with respect to second face of weld;After friction terminates, movable clamp revolves towards first Turn fixture feeding upset.
Optionally, the process of the friction-welding technique includes:The target is fixed using the second rolling clamp Material, second rolling clamp are used to make target rotate around the axis of target;Fixed using movable clamp The backboard, first face of weld are set towards second face of weld, the axis of the axis of the backboard and the target Overlap;Start movable clamp to move to the second rolling clamp;After first face of weld contacts second face of weld, First face of weld is rubbed and heat with respect to second face of weld;After friction terminates, movable clamp revolves towards second Turn fixture feeding upset.
Optionally, in addition to:After first face of weld contacts second face of weld, start the rotation of the first rolling clamp, First face of weld is set to be rubbed with respect to second face of weld;Or before first face of weld contacts second face of weld, start First rolling clamp rotates.
Optionally, in addition to:After first face of weld contacts second face of weld, start the rotation of the second rolling clamp, First face of weld is set to be rubbed with respect to second face of weld;Or before first face of weld contacts second face of weld, start Second rolling clamp rotates.
Optionally, during first face of weld is rubbed with respect to second face of weld, first face of weld and The area that second face of weld is in contact is less than or equal to 1600 square centimeters;The rotating speed of first rolling clamp is 100 revs/min~8000 revs/min.
Optionally, the material of the target is aluminium;The material of the backboard is aluminium alloy.
Optionally, during the movable clamp is towards the first rolling clamp feeding upset, application Pressure is 10 MPas~100 MPas, and the dwell time is 0 second~10 seconds.
Optionally, the material of the target is titanium or copper, and the material of the backboard closes for aluminium alloy or copper Gold.
Optionally, during the movable clamp is towards the first rolling clamp feeding upset, application Pressure is 20 MPas~150 MPas, and the dwell time is 0 second~20 seconds.
Optionally, during first face of weld is rubbed with respect to second face of weld, first face of weld and The area that second face of weld is in contact is less than or equal to 1600 square centimeters;The rotating speed of second rolling clamp is 100 revs/min~8000 revs/min.
Optionally, the material of the target is aluminium;The material of the backboard is aluminium alloy.
Optionally, during the movable clamp is towards the second rolling clamp feeding upset, application Pressure is 10 MPas~100 MPas, and the dwell time is 0 second~10 seconds.
Optionally, the material of the target is titanium or copper, and the material of the backboard closes for aluminium alloy or copper Gold.
Optionally, during the movable clamp is towards the second rolling clamp feeding upset, application Pressure is 20 MPas~150 MPas, and the dwell time is 0 second~20 seconds.
Optionally, during first face of weld is rubbed with respect to second face of weld, friction pressure is 10,000,000 Pa~100 MPa, fraction time are 2 seconds~20 seconds, and it is the mm/second of 0.1 mm/second~1 to rub to progress.
Optionally, during first face of weld is rubbed with respect to second face of weld, friction pressure is 20,000,000 Pa~150 MPa, fraction time are 2 seconds~30 seconds, and it is the mm/second of 0.2 mm/second~3 to rub to progress.
Compared with prior art, technical scheme has advantages below:
The welding method of target material assembly provided by the invention, the first of target is welded using friction-welding technique Second face of weld of face and backboard welds together.The friction-welding technique utilizes contact of the target with backboard Relative motion between face, frictional heat and plastic deformation heat are produced in contact surface and near zone, The contact surface of target and backboard and the temperature of near zone is set to rise towards but be melted less than target and backboard The temperature range of point, reduce the resistance of deformation of target and backboard, plasticity improves.During friction, The material that target and backboard contact surface nearby soften is plastically deformed and flowed, hence in so that target and the back of the body The molecule of plate contact surface is diffused and recrystallized, so as to realize the welding to target and backboard.So that institute The solder bond intensity for stating friction-welding technique is larger.
The friction-welding technique fast and flexible, can be completed in a relatively short time, improve process efficiency.
For the friction-welding technique in welding, the material of target and backboard contact surface is in soft state, The problem of will not melting, therefore the material of target and backboard will not be caused to volatilize and produce weld defect.Institute State friction-welding technique and be distributed only over contact of the target with backboard in locally generation heat, caused heat Near face, therefore the region that caused heat influences is small, and to the interior tissue of target and backboard without shadow Ring.This improves the welding performance of target material assembly.
The friction-welding technique during welding, will not produce pernicious gas, pacify without solder flux Loopful is protected.
To sum up, the soldering reliability of the friction-welding technique is improved.
Brief description of the drawings
Fig. 1 is the flow chart of the welding method of target material assembly in one embodiment of the invention;
Fig. 2 to Fig. 7 is the structural representation of target material assembly welding process in one embodiment of the invention.
Embodiment
As described in background, using the welding method of target material assembly in the prior art, target material assembly Soldering reliability is poor.
The welding method of target material assembly includes:Using electro-beam welding process, diffusion technology for welding or soldering Technique welds together target and backboard.
The electro-beam welding process is:Using high-power electron beam as processing thermal source, with high-energy-density The material of the contact surface of beam bombardment target and backboard, make the material melts of the contact surface of target and backboard, Then target and backboard are cooled down rapidly to reach the purpose of welding target and backboard.
However, the electro-beam welding process needs to carry out under vacuum conditions, the requirement to equipment is high; Secondly, vacuumizing needs longer time, and welding efficiency is relatively low;Again, because beam temperature is high, Therefore when the material of target or backboard is more active metal, gas is easily produced, causes butt welding Cause defect in the place of connecing.
The diffusion technology for welding is:Target and backboard are brought into close contact, protected under certain temperature and pressure A period of time is held, makes the atom phase counterdiffusion of the contact surface of target and backboard and is incorporated in target and backboard Together.
Requirement of the diffusion technology for welding to equipment is high;Welding sequence is complicated, and cost is high;To welding temperature The requirement of degree is higher, causes internal organizational structure easily to change.
The soldering processes are:, will using the low-melting metal material than target and backboard as solder Target and backboard and solder heat are to the fusing point higher than solder and less than the temperature of target and the fusing point of backboard Degree, the contact surface of solder wetting target and backboard after thawing, filling target and backboard contact surface gap, And with target and backboard phase counterdiffusion, so as to realize the welding of target and backboard.
The soldering processes need solder flux, generally operate in atmosphere, and solder flux is easy during welding The harmful material of volatilization, it is harmful;Secondly, need to carry out carefully target and backboard before soldering processes Processing and strict cleaning are caused, removes target and greasy dirt and the blocked up oxide-film of back plate surface, ensures interface Fit-up gap, therefore the early-stage preparations to soldering processes require higher;Again, weld defect rate is big, right Operation requires high.
It can be seen that in the above method, the soldering reliability of target material assembly is poor.
On this basis, the present invention provides a kind of welding method of target material assembly, including:There is provided target and Backboard, the target have first face of weld, and the backboard has second face of weld;Using friction-welding technique Weld first face of weld and second face of weld.
Using first face of weld of friction-welding technique welding target and second face of weld of backboard so that target group The soldering reliability of part improves.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings The specific embodiment of the present invention is described in detail.
Fig. 1 is the flow chart of the welding method of target material assembly in one embodiment of the invention, is comprised the following steps:
S01:There is provided target and backboard, the target has first face of weld, and the backboard has second face of weld;
S02:First face of weld and second face of weld are welded using friction-welding technique.
The above method is described in detail below in conjunction with the accompanying drawings.
With reference to figure 2, there is provided target 100 and backboard 110.
The purity of the target 100 is more than 4N5, specifically, the purity of the target 100 be 5N or 6N, wherein, 5N represents that purity is 99.999%, and 6N represents that purity is 99.9999%.
In the present embodiment, the target 100 is aluminium target.
In other embodiments, the target can also be tantalum target, copper target material or titanium target material.It is described Target is also an option that the target of other materials.
In the present embodiment, the shape of the target 100 thinks cylinder as example.In other embodiments In, the shape of the target can select other shapes.
The target 100 has relative first face of weld 101 and sputter face 102.
In the present embodiment, the material of the backboard 110 is aluminium alloy.In other embodiments, the back of the body The material of plate can also be copper.The material of the backboard is also an option that other materials.
The size of the backboard 110 needs to have according to the size and actual magnetron sputtering apparatus of target 100 Body designs.
The backboard 110 has the second relative face of weld 111 and the back side 112.
The area of corresponding contact surface is less than or equal to after the follow-up face of weld 111 of first face of weld 101 and second contact 1600 square centimeters so that hot caused by heat caused by the central area of the contact surface and fringe region Amount difference is smaller.And cause that heat transfer is to connecing caused by the fringe region of contact surface in the short period of time The central area of contacting surface so that heat contact surface fringe region and central area distribution more Uniformly.And then make it that the contact surface is preferable in the uniformity of the welding situation of regional.
Specifically, after the contact of the follow-up face of weld 111 of first face of weld 101 and second corresponding contact surface area Can be 1600 square centimeters, 1000 square centimeters, 500 square centimeters, 100 square centimeters, it is 50 flat Square centimetre.
In the present embodiment, in addition to:Cleaning treatment is carried out to the target 100 and backboard 110, to go Except target 100 and the impurity on the surface of backboard 110.Specifically, by first face of weld 101 and second face of weld 111 impurity removes.
Cleaning the method for target 100 and backboard 110 can be:Target 100 and backboard are cleaned using acid solution 110;Afterwards, target 100 and backboard 110 are cleaned using organic solvent.The acid solution can be hydrofluoric acid, One kind or its combination in nitric acid, hydrochloric acid, sulfuric acid.The organic solvent can be alcohol, isobutanol, Isopropanol or one kind in mixed propyl alcohol or its combination.
In the present embodiment, after cleaning target 100 and backboard 110, first is welded using friction-welding technique The face of weld 111 of the face of weld 101 and second.
The friction-welding technique is a kind of solid welding method.Contacted using target 100 and backboard 110 Relative motion between face, friction is produced in the contact surface and near zone of target 100 and backboard 110 Heat and plastic deformation heat, make the contact surface of target 100 and backboard 110 and the temperature of near zone Rise towards but less than the temperature range of target 100 and the fusing point of backboard 110, make target 100 and backboard 110 resistance of deformation reduces, plasticity improves.In the presence of upsetting force, target 100 and backboard 110 The material that contact surface nearby softens is plastically deformed and flowed, hence in so that target 100 and backboard 110 The molecule of contact surface is diffused and recrystallized and realizes the welding to target 100 and backboard 110.
The detailed process of friction-welding technique is described in detail below.
With reference to figure 3, the backboard 110, first rolling clamp are fixed using the first rolling clamp 120 120 are used to make backboard 110 rotate around the axis of backboard 110.
In the present embodiment, after fixing the backboard 110 using the first rolling clamp 120, and follow-up Before one face of weld 101 contacts second face of weld 111, start the first rolling clamp 120 and rotate, make the back of the body Plate 110 is rotated with the first rolling clamp 120.
In other embodiments, can be opened after follow-up first face of weld 101 contacts second face of weld 111 Dynamic first rolling clamp rotation.
First rolling clamp 120 needs have suitable rotating speed.First rolling clamp 120 Rotating speed is set according to the size of corresponding contact surface after follow-up target 100 and the contact of backboard 110.
If the area of corresponding contact surface is smaller after follow-up target 100 and backboard 110 contact, the first rotation The rotating speed that fixture 120 needs is relatively small;Connect if follow-up target 100 and backboard 110 are corresponding after contacting The area of contacting surface is larger, and the rotating speed that the first rolling clamp 120 needs is relatively large.
Corresponding contact area is less than or equal to 1600 squares lis after follow-up first face of weld and second face of weld contact Rice, accordingly, the rotating speed of the first rolling clamp 120 is 100 revs/min~8000 revs/min, such as 100 Rev/min, 500 revs/min, 1000 revs/min, 2000 revs/min, 5000 revs/min, 8000 turns/ Minute.
With reference to figure 4, the target 100, first face of weld 101 towards second are fixed using movable clamp 130 The face of weld 111 is set, and the axis of the target 100 and the axis of the backboard 110 overlap.
The movable clamp 130 can move towards the first rolling clamp 120.
With reference to figure 5, start movable clamp 130 and moved to the first rolling clamp 120.
With reference to figure 6, after first face of weld 101 contacts second face of weld 111, first face of weld 101 relative the Two faces of weld 111 are rubbed and heat.
, it is necessary to select to close during first face of weld 101 is rubbed with respect to second face of weld 111 Suitable friction parameter, such as rub pressure, fraction time and friction are to progress.
The friction pressure and target 100 of the friction process are relevant with the hardness of backboard 110, if the target The hardness of material 100 and backboard 110 is bigger, it is necessary to which the friction pressure applied is bigger.
The friction pressure is bigger, and caused frictional heat is more in the unit interval.The fraction time is got over More, caused frictional heat is more.It is described friction pressure it is bigger, it is corresponding rub it is bigger to progress.Production Raw frictional heat is more, and the material near the contact surface of first face of weld 101 and second face of weld 111 more holds Easily softening.
If caused frictional heat is very few, the temperature of the contact surface softening of target 100 and backboard 110 is not reached Degree, it is difficult to by target 100 and the material softening of the contact surface of backboard 110.
If caused frictional heat is excessive, the temperature for causing to reach connects with respect to target 100 and backboard 110 The temperature of contacting surface softening is higher, so as to cause the material shape near the contact surface of target 100 and backboard 110 Become larger, even resulting in the material near the contact surface of target 100 and backboard 110 turns into liquid.So as to The material for causing to soften between target 100 and backboard 110 overflows, and is unfavorable for target 100 and backboard 110 Combination.
Therefore in the present embodiment, during first face of weld, 101 relative second face of weld 111 is rubbed, rub Wipe pressure be 10 MPas~100 MPas, fraction time be 2 seconds~20 seconds, rub to progress be 0.1 millimeter/ Second~1 mm/second.
In other embodiments, when the material of target is titanium or copper, the material of the backboard for aluminium alloy or During person's copper alloy, accordingly, friction pressure is 20 MPas~150 MPas, and fraction time is 2 seconds~30 seconds, It is the mm/second of 0.2 mm/second~3 to rub to progress.
With reference to figure 7, after friction terminates, movable clamp 130 feeds upset towards the first rolling clamp 120.
The feed upset is act as:In the presence of upsetting force so that target 100 and backboard 110 The material that contact surface nearby softens is plastically deformed and flowed, and then causes target 100 and backboard 110 The molecule of contact surface is diffused and recrystallized.
, it is necessary to select during the movable clamp 130 feeds upset towards the first rolling clamp 120 Select suitable pressure and dwell time.
If the pressure in the feeding upset is excessive, cause the deformation of target 100 and backboard 110 larger, And the material for causing to soften in target 100 and backboard 110 overflows, and is unfavorable for target 100 and backboard 110 Combination;If the pressure in the feeding upset is small, cause the bond strength of target 100 and backboard 110 Reduce.
The pressure maintaining period causes point of the material softened in target 100 and the material softened in backboard 110 Son diffusion enhancing.However, if the dwell time is long, cause to reduce process efficiency.
Therefore in the present embodiment, during feeding upset is carried out, the pressure of application is 10 MPas~100 MPa, the dwell time is 0 second~10 seconds, such as 2 seconds, 5 seconds, 8 seconds, 10 seconds.
In other embodiments, when the material of target is titanium or copper, the material of the backboard for aluminium alloy or During person's copper alloy, accordingly, during movable clamp is towards the first rolling clamp feeding upset, apply The pressure added be 20 MPas~150 MPas, the dwell time be 0 second~20 seconds, such as 2 seconds, 5 seconds, 8 seconds, 10 seconds, 15 seconds, 20 seconds.
It should be noted that in other implementations, the friction-welding technique includes:Using the second rotation Fixture fixes the target, and second rolling clamp is used to make target rotate around the axis of target;Adopt Fix the backboard with movable clamp, first face of weld is set towards second face of weld, the axis of the backboard and The axis of the target overlaps;Start movable clamp to move to the second rolling clamp;First face of weld connects After touching second face of weld, first face of weld is rubbed and heat with respect to second face of weld;It is mobile after friction terminates Fixture feeds upset towards the second rolling clamp.
After the target being fixed using the second rolling clamp, and before first face of weld contacts second face of weld, Start the rotation of the second rolling clamp, the target is rotated with the second rolling clamp.Or After one face of weld contacts second face of weld, start the rotation of the second rolling clamp, make target with the second rolling clamp Rotated.
The rotating speed of second rolling clamp refers to the rotating speed of the first rolling clamp.
First face of weld, with reference to foregoing teachings, is no longer described in detail with respect to the parameter that second face of weld is rubbed.
Movable clamp is towards movable clamp in the parameter foregoing teachings of the second rolling clamp feeding upset towards the One rolling clamp is fed the parameter of upset, is no longer described in detail.
Technical scheme has the advantages that:
The welding method of target material assembly provided by the invention, the first of target is welded using friction-welding technique Second face of weld of face and backboard welds together.The friction-welding technique utilizes target and backboard contact surface Between relative motion, produce frictional heat and plastic deformation heat in contact surface and near zone, make The temperature of the contact surface and near zone of target and backboard rises towards but is less than target and backboard fusing point Temperature range, make the resistance of deformation of target and backboard reduce, plasticity improve.During friction, The material that target and backboard contact surface nearby soften is plastically deformed and flowed, hence in so that target and the back of the body The molecule of plate contact surface is diffused and recrystallized, so as to realize the welding to target and backboard.So that institute The solder bond intensity for stating friction-welding technique is larger.
The friction-welding technique fast and flexible, can be completed in a relatively short time, improve process efficiency.
For the friction-welding technique in welding, the material of target and backboard contact surface is in soft state, The problem of will not melting, therefore the material of target and backboard will not be caused to volatilize and produce weld defect.Institute State friction-welding technique and be distributed only over contact of the target with backboard in locally generation heat, caused heat Near face, therefore the region that caused heat influences is small, and to the interior tissue of target and backboard without shadow Ring.This improves the welding performance of target material assembly.
The friction-welding technique during welding, will not produce pernicious gas, pacify without solder flux Loopful is protected.
To sum up, the soldering reliability of the friction-welding technique is improved.
Although present disclosure is as above, the present invention is not limited to this.Any those skilled in the art, Without departing from the spirit and scope of the present invention, can make various changes or modifications, therefore the guarantor of the present invention Shield scope should be defined by claim limited range.

Claims (18)

  1. A kind of 1. welding method of target material assembly, it is characterised in that including:
    There is provided target and backboard, the target has first face of weld, and the backboard has second face of weld;
    First face of weld and second face of weld are welded using friction-welding technique.
  2. 2. the welding method of target material assembly according to claim 1, it is characterised in that the target also has There is the sputter face relative with first face of weld;The backboard also has the back side relative with second face of weld.
  3. 3. the welding method of target material assembly according to claim 2, it is characterised in that the friction welding The process of technique includes:
    The backboard is fixed using the first rolling clamp, first rolling clamp is used to make backboard surround backboard Axis rotation;
    The target is fixed using movable clamp, first face of weld is set towards second face of weld, the axle of the target The axis of line and the backboard overlaps;
    Start movable clamp to move to the first rolling clamp;
    After first face of weld contacts second face of weld, first face of weld is rubbed and heat with respect to second face of weld;
    After friction terminates, movable clamp feeds upset towards the first rolling clamp.
  4. 4. the welding method of target material assembly according to claim 2, it is characterised in that the friction welding The process of technique includes:
    The target is fixed using the second rolling clamp, second rolling clamp is used to make target surround target Axis rotation;
    The backboard is fixed using movable clamp, first face of weld is set towards second face of weld, the axle of the backboard The axis of line and the target overlaps;
    Start movable clamp to move to the second rolling clamp;
    After first face of weld contacts second face of weld, first face of weld is rubbed and heat with respect to second face of weld;
    After friction terminates, movable clamp feeds upset towards the second rolling clamp.
  5. 5. the welding method of target material assembly according to claim 3, it is characterised in that also include:First After the face of weld contacts second face of weld, start the rotation of the first rolling clamp, make first face of weld with respect to second face of weld Rubbed;Or before first face of weld contacts second face of weld, start the rotation of the first rolling clamp.
  6. 6. the welding method of target material assembly according to claim 4, it is characterised in that also include:First After the face of weld contacts second face of weld, start the rotation of the second rolling clamp, make first face of weld with respect to second face of weld Rubbed;Or before first face of weld contacts second face of weld, start the rotation of the second rolling clamp.
  7. 7. the welding method of target material assembly according to claim 3, it is characterised in that in the first face of weld phase During being rubbed to second face of weld, the area that first face of weld and second face of weld are in contact is small In equal to 1600 square centimeters;The rotating speed of first rolling clamp be 100 revs/min~8000 turns/ Minute.
  8. 8. the welding method of target material assembly according to claim 7, it is characterised in that the material of the target Expect for aluminium;The material of the backboard is aluminium alloy.
  9. 9. the welding method of target material assembly according to claim 8, it is characterised in that in the mobile folder During tool feeds upset towards the first rolling clamp, the pressure of application is 10 MPas~100 MPas, Dwell time is 0 second~10 seconds.
  10. 10. the welding method of target material assembly according to claim 7, it is characterised in that the material of the target Expect that for titanium or copper, the material of the backboard is aluminium alloy or copper alloy.
  11. 11. the welding method of target material assembly according to claim 10, it is characterised in that in the mobile folder During tool feeds upset towards the first rolling clamp, the pressure of application is 20 MPas~150 MPas, Dwell time is 0 second~20 seconds.
  12. 12. the welding method of target material assembly according to claim 4, it is characterised in that in the first face of weld phase During being rubbed to second face of weld, the area that first face of weld and second face of weld are in contact is small In equal to 1600 square centimeters;The rotating speed of second rolling clamp be 100 revs/min~8000 turns/ Minute.
  13. 13. the welding method of target material assembly according to claim 12, it is characterised in that the material of the target Expect for aluminium;The material of the backboard is aluminium alloy.
  14. 14. the welding method of target material assembly according to claim 13, it is characterised in that in the mobile folder During tool feeds upset towards the second rolling clamp, the pressure of application is 10 MPas~100 MPas, Dwell time is 0 second~10 seconds.
  15. 15. the welding method of target material assembly according to claim 12, it is characterised in that the material of the target Expect that for titanium or copper, the material of the backboard is aluminium alloy or copper alloy.
  16. 16. the welding method of target material assembly according to claim 15, it is characterised in that in the mobile folder During tool feeds upset towards the second rolling clamp, the pressure of application is 20 MPas~150 MPas, Dwell time is 0 second~20 seconds.
  17. 17. the welding method of the target material assembly according to claim 8 or 13, it is characterised in that in the first weldering During face is rubbed with respect to second face of weld, friction pressure is 10 MPas~100 MPas, friction Time is 2 seconds~20 seconds, and it is the mm/second of 0.1 mm/second~1 to rub to progress.
  18. 18. the welding method of the target material assembly according to claim 10 or 15, it is characterised in that first During the face of weld is rubbed with respect to second face of weld, friction pressure is 20 MPas~150 MPas, is rubbed It is 2 seconds~30 seconds to wipe the time, and it is the mm/second of 0.2 mm/second~3 to rub to progress.
CN201610458855.8A 2016-06-22 2016-06-22 The welding method of target material assembly Pending CN107520533A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610458855.8A CN107520533A (en) 2016-06-22 2016-06-22 The welding method of target material assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610458855.8A CN107520533A (en) 2016-06-22 2016-06-22 The welding method of target material assembly

Publications (1)

Publication Number Publication Date
CN107520533A true CN107520533A (en) 2017-12-29

Family

ID=60735529

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610458855.8A Pending CN107520533A (en) 2016-06-22 2016-06-22 The welding method of target material assembly

Country Status (1)

Country Link
CN (1) CN107520533A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108994444A (en) * 2018-10-08 2018-12-14 宁波顺奥精密机电有限公司 A kind of sputtering target material welding method
CN111822847A (en) * 2020-07-11 2020-10-27 宁波晶成机械制造有限公司 Rotary friction welding method for target assembly
CN114054991A (en) * 2021-11-25 2022-02-18 宁波江丰热等静压技术有限公司 Welding method of target assembly
CN114273771A (en) * 2022-01-11 2022-04-05 先导薄膜材料有限公司 Friction welding method of target assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000265265A (en) * 1999-03-12 2000-09-26 Kojundo Chem Lab Co Ltd Integrated structure type sputtering target
CN1537698A (en) * 2003-04-17 2004-10-20 北京芳兴多功能床厂 Copper-aluminium thin wall pipe friction welding technology
CN101844271A (en) * 2010-05-20 2010-09-29 西北工业大学 Friction welding method of titanium-aluminum alloy turbine and 42CrMo quenched and tempered steel shaft
CN202894589U (en) * 2012-10-26 2013-04-24 陕西理工学院 Friction welding device
CN105149764A (en) * 2015-08-24 2015-12-16 有研亿金新材料有限公司 Target material and backboard welding method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000265265A (en) * 1999-03-12 2000-09-26 Kojundo Chem Lab Co Ltd Integrated structure type sputtering target
CN1537698A (en) * 2003-04-17 2004-10-20 北京芳兴多功能床厂 Copper-aluminium thin wall pipe friction welding technology
CN101844271A (en) * 2010-05-20 2010-09-29 西北工业大学 Friction welding method of titanium-aluminum alloy turbine and 42CrMo quenched and tempered steel shaft
CN202894589U (en) * 2012-10-26 2013-04-24 陕西理工学院 Friction welding device
CN105149764A (en) * 2015-08-24 2015-12-16 有研亿金新材料有限公司 Target material and backboard welding method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108994444A (en) * 2018-10-08 2018-12-14 宁波顺奥精密机电有限公司 A kind of sputtering target material welding method
CN111822847A (en) * 2020-07-11 2020-10-27 宁波晶成机械制造有限公司 Rotary friction welding method for target assembly
CN114054991A (en) * 2021-11-25 2022-02-18 宁波江丰热等静压技术有限公司 Welding method of target assembly
CN114273771A (en) * 2022-01-11 2022-04-05 先导薄膜材料有限公司 Friction welding method of target assembly
CN114273771B (en) * 2022-01-11 2023-09-05 先导薄膜材料(安徽)有限公司 Friction welding method for target assembly

Similar Documents

Publication Publication Date Title
CN107520533A (en) The welding method of target material assembly
CN110756937A (en) Brazing method for target and back plate
CN101518851B (en) Structure and method for welding target material and backboard
CN101648308A (en) Manufacturing method of target material assembly
CN101811209A (en) Manufacture method of target assembly
CN103785911B (en) The welding method of target material assembly
CN101543935B (en) Method for preparing target material component
CN111590190B (en) Ultrasonic friction welding forming method for large-size amorphous alloy
CN102500908A (en) Welding method of tungsten target assembly
CN105618886A (en) Manufacturing method for target material assembly
JP2006348380A (en) Electron beam welding for sputtering target tile
CN103567583A (en) Method for welding aluminum target assemblies
CN101648307A (en) Manufacturing method of target material assembly
CN102366856A (en) Welding method of cobalt target assembly
CN107511599A (en) The welding method of tantalum target component
CN102363237A (en) Method for welding thick aluminum alloy plate
CN108637447A (en) A kind of dissimilar metal electron beam soldering method of titanium alloy and kovar alloy
JP2015193937A (en) Method for bonding components of sputtering target, bonded assembly of sputtering target components and use thereof
CN107984075A (en) A kind of frictional diffusion soldering method of aluminium target material assembly
JP2015120975A (en) Production method of sputtering target, and sputtering target
CN106624235A (en) Target material assembly and manufacturing method thereof
CN104690410A (en) Preparation method for target material component
CN104014923B (en) A kind of aluminium alloy diffusion connection method
CN109664015A (en) Target material assembly manufacturing method
CN107570905A (en) The manufacture method of target material assembly

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20171229

RJ01 Rejection of invention patent application after publication