CN107514833A - A kind of attachment structure of semiconductor chilling plate - Google Patents
A kind of attachment structure of semiconductor chilling plate Download PDFInfo
- Publication number
- CN107514833A CN107514833A CN201710792445.1A CN201710792445A CN107514833A CN 107514833 A CN107514833 A CN 107514833A CN 201710792445 A CN201710792445 A CN 201710792445A CN 107514833 A CN107514833 A CN 107514833A
- Authority
- CN
- China
- Prior art keywords
- semiconductor chilling
- chilling plate
- fixture
- connection sheet
- attachment structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/00478—Air-conditioning devices using the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/023—Mounting details thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of attachment structure of semiconductor chilling plate, including fixture, multiple U-shaped connection sheets and multiple semiconductor chilling plates, the semiconductor chilling plate is shaped as rectangle, a line or multirow positioner are provided with the fixture, the positioner includes the multiple rectangular position fixing grooves set at equal intervals, and multiple rectangular position fixing grooves are located on straight line, U-shaped connection sheet is provided between the two neighboring rectangular position fixing groove, the semiconductor chilling plate is fixedly installed in the rectangular position fixing groove, and connected by the U-shaped connection sheet of the rectangular position fixing groove both sides, the U-shaped connection sheet lower surface is provided with connection sheet indent.The attachment structure of the semiconductor chilling plate of the present invention, it can be achieved to form multi-disc with the mode of clamping and be connected in series, it is simple in construction, be easily installed, production efficiency can be improved.
Description
Technical field
The present invention relates to semiconductor chilling plate field, particularly a kind of attachment structure of semiconductor chilling plate.
Background technology
Semiconductor chilling plate, thermoelectric module is also, is a kind of heat pump.Its advantages of is no slide unit, is applied
Some spaces are restricted, and reliability requirement is high, the occasion of no refrigerant pollution.Using the peltier effect of semi-conducting material,
When the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the both ends of galvanic couple and put
Go out heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, is characterized in movement-less part, can
It is also higher by property, it is widely used in the various aspects such as military affairs, medical treatment, experimental provision, daily life.
Air conditioning for automobiles is generally powered using the technology of steam compression type refrigeration circulation, using Vehicular accumulator cell, reaches automobile
The effect of driver's cabin refrigeration.When using air conditioning for automobiles, in order to improve the endurance of Vehicular accumulator cell, automobile engine needs
In starting state, the fossil energies such as gasoline, diesel oil, natural gas are converted into heat energy, reconvert is ultimately converted into mechanical energy
Electric energy charges for battery.And in automobile parking, air conditioning for automobiles is generally in closed mode, can not be automobile refrigerating, especially
It is when parking for a long time, it is that automobile cab cooling is uneconomical, dangerous, unrealistic to start air conditioning for automobiles.Thus on new energy
In the prior art, publication No. is in the A of CN 102897007 patent application document to source automobile, has invented a kind of new automobile
Sunshading cover technology, the technology can be realized without using vehicular energy, and automobile cab is reached for using semiconductor peltier effect
The purpose of refrigeration.
Semiconductor chilling plate on new-energy automobile when applying, it is necessary to which large number of semiconductor chilling plate is connected
Use.And prior art publication No. is in the A of CN 102897007 patent application document：Lead between multiple semiconductor chilling plates
Semiconductor chilling plate wired in series is crossed, two semiconductor chilling plates of head and the tail are connected by semiconductor chilling plate wire with control box
Connect, the semiconductor chilling plate connected is arranged in the heat-insulated canvas corresponding with automobile both sides vehicle window.Multiple semiconductor systems
Connected between cold using the mode of connection, because wiring difficulty is larger, be not easy to install and use, low production efficiency can be caused.In order to
The mode of connection is avoided to connect, invention is a kind of to be highly desirable for easy connected mode between semiconductor chilling plate, Ke Yili
Fixed with a kind of sheet metal element between adjacent semiconductor chilling plate, be sequentially connected in series, substitute traditional wire
Connected mode.
The content of the invention
In view of this, it is a primary object of the present invention to provide it is a kind of it is simple in construction, be easily installed, production efficiency can be improved
Semiconductor chilling plate attachment structure.
To reach above-mentioned purpose, the invention provides a kind of attachment structure of semiconductor chilling plate, including fixture, multiple U
Type connection sheet and multiple semiconductor chilling plates, the semiconductor chilling plate are shaped as rectangle, a line are provided with the fixture
Or multirow positioner, the positioner includes the multiple rectangular position fixing grooves set at equal intervals, and multiple rectangles are determined
Position groove is located on straight line, and U-shaped connection sheet, the semiconductor are provided between the two neighboring rectangular position fixing groove
Cooling piece is fixedly installed in the rectangular position fixing groove, and the U-shaped connection sheet for passing through the rectangular position fixing groove both sides
Connection, the U-shaped connection sheet lower surface is provided with connection sheet indent.
Preferably, the fixture is rectangular parallelepiped structure, and the fixture is set between two neighboring side along its length
There is positioner.
Preferably, a line is provided between the upper surface and adjacent thereto side of the fixture along its length to determine
Position device.
Preferably, the semiconductor chilling plate includes semiconductor chilling plate body, negative straps and positive strap, institute
The side for stating semiconductor chilling plate body bottom portion is fixedly connected with the negative straps, the semiconductor chilling plate body bottom portion
Opposite side be fixedly connected with the positive strap.
Preferably, it is fixedly connected with the negative straps on the left of the semiconductor chilling plate body bottom portion, described half
The positive strap is fixedly connected with the right side of conductor cooling piece body bottom portion.
Preferably, the U-shaped connection sheet is copper sheet, and the left side of the U-shaped connection sheet is described on the left of it with being located at
The positive strap contact connection of semiconductor chilling plate, the right side of the U-shaped connection sheet is with being located at described partly leading on the right side of it
The negative straps contact connection of body cooling piece.
The negative straps for being preferably located at first semiconductor chilling plate on the left of the fixture draw with positive source
Line connects, and the positive strap positioned at first semiconductor chilling plate on the right side of the fixture connects with negative wire
Connect.
Preferably, the negative straps and positive strap is L-type structure, and the negative straps and described half
The left surface of conductor cooling piece body and lower surface are engaged, the positive strap and the right side of the semiconductor chilling plate body
Side and lower surface are engaged.
Preferably, the fixture is square structure, and the fixture upper surface vertical direction it is first-class be arranged at intervals with it is more
Row positioner, and be connected with each other between positioner described in adjacent rows by the U-shaped connection sheet.
Preferably, the upper surface vertical direction of the fixture is first-class is arranged at intervals with five-element's positioner, often row positioning dress
Put including four rectangular position fixing grooves set at equal intervals.
The attachment structure of the semiconductor chilling plate of the present invention, it can be achieved to form multi-disc with the mode of clamping and be connected in series, tie
Structure is simple, is easily installed, and can improve production efficiency.
Brief description of the drawings
Fig. 1 is the structural representation of the first embodiment of the attachment structure of semiconductor chilling plate of the present invention；
Fig. 2 is the structural representation of the fixture in the present invention；
Fig. 3 is the structural representation of the semiconductor chilling plate in the present invention；
Fig. 4 is the structural representation of the second embodiment of the attachment structure of semiconductor chilling plate of the present invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described.
Embodiments of the invention are described below in detail, the example of embodiment is shown in the drawings, wherein identical from beginning to end
Or similar label represents same or similar element or the element with same or like function.Retouched below with reference to accompanying drawing
The embodiment stated is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
The first embodiment of the present invention：As shown in Figure 1 to Figure 3, the attachment structure of semiconductor chilling plate of the invention, including
Fixture 1, multiple U-shaped connection sheets 2 and multiple semiconductor chilling plates 3.Semiconductor chilling plate 3 is shaped as rectangle, is set on fixture 1
There are a line or multirow positioner 10, positioner 10 includes the multiple rectangular position fixing grooves 11 set at equal intervals, multiple rectangles
Detent 11 is located on straight line, and U-shaped connection sheet 2 is provided between two neighboring rectangular position fixing groove 11.Semiconductor
Cooling piece 3 is fixedly installed in rectangular position fixing groove 11, and is connected by the U-shaped connection sheet 2 of the both sides of rectangular position fixing groove 11.U
The lower surface of type connection sheet 2 is provided with connection sheet indent 12, and connection sheet indent 12 is arranged on fixture 1 and positioned at adjacent two
Between rectangular position fixing groove 11, U-shaped connection sheet 2 is clamped and is fixed on connection sheet indent 12.Fixture 1 is plastic material, has one
Fixed shrinkage, the length of rectangular position fixing groove 11 are slightly less than the length of semiconductor chilling plate, by the way that semiconductor chilling plate 3 is pressed
Enter in rectangular position fixing groove 11, make semiconductor chilling plate 3 and the tight fit connection of fixture 1.
Semiconductor chilling plate 3 includes semiconductor chilling plate body 30, negative straps 31 and positive strap 32, and negative pole connects
Contact pin 31 and positive strap 32 are respectively fixedly disposed at the both sides of the bottom of semiconductor chilling plate body 30.Wherein, semiconductor system
Negative straps 31 are fixedly connected with the left of the cold bottom of body 30, the right side of the bottom of semiconductor chilling plate body 30, which is fixed, to be connected
It is connected to positive strap 32.Negative straps 31 and positive strap 32 are L-type structure, and negative straps 31 and semiconductor
The left surface of cooling piece body 30 and lower surface are engaged, the right flank of positive strap 32 and semiconductor chilling plate body 30 and
Lower surface is engaged.
U-shaped connection sheet 2 is copper sheet, conductive.
Fixture 1 is rectangular parallelepiped structure, and fixture 1 is provided with positioner 10 between two neighboring side along its length,
It is specifically as follows between the upper surface and adjacent thereto side of fixture 1 along its length and is provided with a line positioner
10.The left side of U-shaped connection sheet 2 contacts connection, U-shaped company with the positive strap 32 of the semiconductor chilling plate 3 on the left of it
The right side of contact pin 2 contacts connection with the negative straps 31 of the semiconductor chilling plate 3 on the right side of it, so that multiple partly lead
It is connected in series between body cooling piece 3 by U-shaped connection sheet 2.Negative pole positioned at first, the left side of fixture 1 semiconductor chilling plate 3 connects
Contact pin 31 is connected with positive wire, positive strap 32 and power supply positioned at first semiconductor chilling plate 3 in the right side of fixture 1
Negative wire connects.
In the present embodiment, as shown in Figure 1 to Figure 2, a line positioner 10 on fixture 1 can include seven rectangles and position
Groove 11, U-shaped connection sheet 2 are provided with six, are connected in series between seven semiconductor chilling plates by U-shaped connection sheet 2.
Also there is second embodiment in the present invention, the difference of second embodiment and first embodiment is：As shown in figure 4, card
Tool 1 is square structure, and the upper surface vertical direction of fixture 1 is first-class to be arranged at intervals with multirow positioner 10, often adjacent the two of row
U-shaped connection sheet 2 is provided between individual rectangular position fixing groove 11, passes through U-shaped connection between positioner 10 described in adjacent rows
Piece 2 is connected with each other.The present embodiment is specifically as follows：The upper surface vertical direction of fixture 1 is first-class to be arranged at intervals with five-element's positioning dress
10 are put, the positioner 10 of often going includes four rectangular position fixing grooves 11 set at equal intervals；First square on the right side of the first row
U-shaped connection sheet 2 is provided with the right side of the row of shape detent 11 and second between first rectangular position fixing groove 11, the on the left of the second row
On the left of one rectangular position fixing groove 11 and the third line U-shaped connection sheet 2, the third line are provided between first rectangular position fixing groove 11
U-shaped connection sheet 2 is provided between first rectangular position fixing groove 11 on the right side of first, right side rectangular position fixing groove 11 and fourth line,
On the left of fourth line U-shaped company is provided between first rectangular position fixing groove 11 of first rectangular position fixing groove 11 and fifth line left side
Contact pin 2.It is connected in series so that passing sequentially through U-shaped connection sheet 2 between multiple semiconductor chilling plates 3.First on the left of the first row
First semiconductor chilling plate 3 on the right side of semiconductor chilling plate 3 and fifth line, i.e., from beginning to end two semiconductor chilling plates 3 respectively with electricity
Source positive wire connects with negative wire.
As can be seen here, the attachment structure of semiconductor chilling plate of the invention, can be achieved to form multi-disc string with the mode of clamping
Connection connection, it is simple in construction, be easily installed, production efficiency can be improved.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (10)
1. a kind of attachment structure of semiconductor chilling plate, it is characterised in that multiple lead including fixture, multiple U-shaped connection sheets and partly
Body cooling piece, the semiconductor chilling plate are shaped as rectangle, and a line or multirow positioner are provided with the fixture, described
Positioner includes the multiple rectangular position fixing grooves set at equal intervals, and multiple rectangular position fixing grooves are located at straight line
On, U-shaped connection sheet is provided between the two neighboring rectangular position fixing groove, the semiconductor chilling plate is fixedly installed on institute
State in rectangular position fixing groove, and connected by the U-shaped connection sheet of the rectangular position fixing groove both sides, the U-shaped connection sheet
Lower surface is provided with connection sheet indent.
2. a kind of attachment structure of semiconductor chilling plate as claimed in claim 1, it is characterised in that the fixture is cuboid
Structure, the fixture are provided with positioner between two neighboring side along its length.
3. a kind of attachment structure of semiconductor chilling plate as claimed in claim 2, it is characterised in that the fixture is along length side
To upper surface and adjacent thereto side between be provided with a line positioner.
4. the attachment structure of semiconductor chilling plate as claimed in claim 1, it is characterised in that the semiconductor chilling plate includes
Semiconductor chilling plate body, negative straps and positive strap, the side of the semiconductor chilling plate body bottom portion, which is fixed, to be connected
The negative straps are connected to, the opposite side of the semiconductor chilling plate body bottom portion is fixedly connected with the positive strap.
5. the attachment structure of semiconductor chilling plate as claimed in claim 4, it is characterised in that the semiconductor chilling plate body
The negative straps are fixedly connected with the left of bottom, are fixedly connected on the right side of the semiconductor chilling plate body bottom portion
State positive strap.
6. the attachment structure of semiconductor chilling plate as claimed in claim 5, it is characterised in that the U-shaped connection sheet is copper sheet,
And the left side of the U-shaped connection sheet contacts connection, institute with the positive strap of the semiconductor chilling plate on the left of it
The right side for stating U-shaped connection sheet contacts connection with the negative straps of the semiconductor chilling plate on the right side of it.
7. the attachment structure of semiconductor chilling plate as claimed in claim 5, it is characterised in that positioned on the left of the fixture first
The negative straps of the individual semiconductor chilling plate are connected with positive wire, and positioned at described in first on the right side of the fixture
The positive strap of semiconductor chilling plate is connected with negative wire.
8. the attachment structure of semiconductor chilling plate as claimed in claim 4, it is characterised in that the negative straps and positive pole
Connection sheet is L-type structure, and the negative straps match with the left surface of the semiconductor chilling plate body and lower surface
Close, the positive strap is engaged with the right flank of the semiconductor chilling plate body and lower surface.
9. the attachment structure of semiconductor chilling plate as claimed in claim 1, it is characterised in that the fixture is square structure,
And the fixture upper surface vertical direction it is first-class be arranged at intervals with multirow positioner, and positioner described in adjacent rows it
Between pass through the U-shaped connection sheet and be connected with each other.
10. the attachment structure of semiconductor chilling plate as claimed in claim 9, it is characterised in that erect the upper surface of the fixture
Nogata is provided with five-element's positioner at equal intervals upwards, and often it is recessed to include four rectangle set at equal intervals positioning for row positioner
Groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792445.1A CN107514833B (en) | 2017-09-05 | 2017-09-05 | Connection structure of semiconductor refrigeration piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710792445.1A CN107514833B (en) | 2017-09-05 | 2017-09-05 | Connection structure of semiconductor refrigeration piece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107514833A true CN107514833A (en) | 2017-12-26 |
| CN107514833B CN107514833B (en) | 2023-05-23 |
Family
ID=60725047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710792445.1A Active CN107514833B (en) | 2017-09-05 | 2017-09-05 | Connection structure of semiconductor refrigeration piece |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107514833B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107514833B (en) | 2023-05-23 |
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