CN107507905A - 一种led器件 - Google Patents
一种led器件 Download PDFInfo
- Publication number
- CN107507905A CN107507905A CN201710599048.2A CN201710599048A CN107507905A CN 107507905 A CN107507905 A CN 107507905A CN 201710599048 A CN201710599048 A CN 201710599048A CN 107507905 A CN107507905 A CN 107507905A
- Authority
- CN
- China
- Prior art keywords
- separation layer
- led component
- line
- encapsulation glue
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims abstract description 96
- 238000005538 encapsulation Methods 0.000 claims abstract description 60
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000001301 oxygen Substances 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 10
- 229920000642 polymer Polymers 0.000 claims description 38
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 238000012423 maintenance Methods 0.000 claims description 19
- 238000004073 vulcanization Methods 0.000 claims description 17
- 229910020388 SiO1/2 Inorganic materials 0.000 claims description 12
- 229910020447 SiO2/2 Inorganic materials 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 11
- 229910052681 coesite Inorganic materials 0.000 claims description 10
- 229910052906 cristobalite Inorganic materials 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 10
- 229910052682 stishovite Inorganic materials 0.000 claims description 10
- 229910052905 tridymite Inorganic materials 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 125000001931 aliphatic group Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000001548 drop coating Methods 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000002386 leaching Methods 0.000 claims 1
- 238000010422 painting Methods 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 15
- 230000035939 shock Effects 0.000 abstract description 15
- 229910052709 silver Inorganic materials 0.000 abstract description 14
- 239000004332 silver Substances 0.000 abstract description 14
- 238000000576 coating method Methods 0.000 abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 8
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 5
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 114
- 230000004888 barrier function Effects 0.000 description 18
- 239000000463 material Substances 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 239000012044 organic layer Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 7
- 239000008367 deionised water Substances 0.000 description 5
- 229910021641 deionized water Inorganic materials 0.000 description 5
- 238000003618 dip coating Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 4
- 239000006101 laboratory sample Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000010189 synthetic method Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 229910052593 corundum Inorganic materials 0.000 description 3
- 238000002242 deionisation method Methods 0.000 description 3
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 125000004494 ethyl ester group Chemical group 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- -1 poly terephthalic acid 1,4 cyclohexane dimethanol ester Chemical class 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 229910001845 yogo sapphire Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical compound NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000004087 circulation Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000003677 Sheet moulding compound Substances 0.000 description 1
- 229910020487 SiO3/2 Inorganic materials 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- XOCUXOWLYLLJLV-UHFFFAOYSA-N [O].[S] Chemical compound [O].[S] XOCUXOWLYLLJLV-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-N benzene-dicarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007590 electrostatic spraying Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000005404 monopole Effects 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710599048.2A CN107507905A (zh) | 2017-07-21 | 2017-07-21 | 一种led器件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710599048.2A CN107507905A (zh) | 2017-07-21 | 2017-07-21 | 一种led器件 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107507905A true CN107507905A (zh) | 2017-12-22 |
Family
ID=60688776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710599048.2A Pending CN107507905A (zh) | 2017-07-21 | 2017-07-21 | 一种led器件 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107507905A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112694616A (zh) * | 2020-12-21 | 2021-04-23 | 清远慧谷新材料技术有限公司 | 一种高温高湿的led封装隔离聚合物及led器件 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006335845A (ja) * | 2005-06-01 | 2006-12-14 | Ge Toshiba Silicones Co Ltd | 高い屈折率の硬化物を与えるポリオルガノシロキサン組成物 |
US20110012497A1 (en) * | 2009-07-15 | 2011-01-20 | Kyowa Electric Wire Co., Ltd. | Plating structure and method for manufacturing electric material |
CN102947393A (zh) * | 2010-06-18 | 2013-02-27 | 东曹株式会社 | 含典型金属聚硅氧烷组合物、其制造方法、及其用途 |
JP2014125624A (ja) * | 2012-12-27 | 2014-07-07 | Shin Etsu Chem Co Ltd | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
CN105121556A (zh) * | 2013-02-22 | 2015-12-02 | 道康宁东丽株式会社 | 可固化有机硅组合物、其固化产物及光学半导体器件 |
CN204991763U (zh) * | 2015-08-10 | 2016-01-20 | 佛山市国星光电股份有限公司 | 一种led器件 |
CN106459587A (zh) * | 2014-04-29 | 2017-02-22 | 汉高股份有限及两合公司 | 包含聚碳硅氧烷的用于led封装剂的可固化组合物 |
CN206820020U (zh) * | 2017-07-21 | 2017-12-29 | 广州慧谷化学有限公司 | 一种led器件 |
-
2017
- 2017-07-21 CN CN201710599048.2A patent/CN107507905A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006335845A (ja) * | 2005-06-01 | 2006-12-14 | Ge Toshiba Silicones Co Ltd | 高い屈折率の硬化物を与えるポリオルガノシロキサン組成物 |
US20110012497A1 (en) * | 2009-07-15 | 2011-01-20 | Kyowa Electric Wire Co., Ltd. | Plating structure and method for manufacturing electric material |
CN102947393A (zh) * | 2010-06-18 | 2013-02-27 | 东曹株式会社 | 含典型金属聚硅氧烷组合物、其制造方法、及其用途 |
JP2014125624A (ja) * | 2012-12-27 | 2014-07-07 | Shin Etsu Chem Co Ltd | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
CN105121556A (zh) * | 2013-02-22 | 2015-12-02 | 道康宁东丽株式会社 | 可固化有机硅组合物、其固化产物及光学半导体器件 |
CN106459587A (zh) * | 2014-04-29 | 2017-02-22 | 汉高股份有限及两合公司 | 包含聚碳硅氧烷的用于led封装剂的可固化组合物 |
CN204991763U (zh) * | 2015-08-10 | 2016-01-20 | 佛山市国星光电股份有限公司 | 一种led器件 |
CN206820020U (zh) * | 2017-07-21 | 2017-12-29 | 广州慧谷化学有限公司 | 一种led器件 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112694616A (zh) * | 2020-12-21 | 2021-04-23 | 清远慧谷新材料技术有限公司 | 一种高温高湿的led封装隔离聚合物及led器件 |
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CB02 | Change of applicant information |
Country or region after: China Address after: 510000, No. 62 Xinye Road, Guangzhou Economic and Technological Development Zone, Luogang District, Guangzhou City, Guangdong Province Applicant after: Guangzhou Huigu New Materials Technology Co.,Ltd. Address before: No.62 Xinye Road, Guangzhou Economic and Technological Development Zone, Guangdong 510000 Applicant before: GUANGZHOU HUMAN CHEM Co.,Ltd. Country or region before: China |
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CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Country or region after: China Address after: No. 62 Xinye Road, Guangzhou Economic and Technological Development Zone, Guangzhou City, Guangdong Province, 510000 Applicant after: Guangzhou Huigu New Materials Technology Co.,Ltd. Address before: 510000, No. 62 Xinye Road, Guangzhou Economic and Technological Development Zone, Luogang District, Guangzhou City, Guangdong Province Applicant before: Guangzhou Huigu New Materials Technology Co.,Ltd. Country or region before: China |