CN107502221A - A kind of compound mould release membrance of high barrier and adhesive tape - Google Patents
A kind of compound mould release membrance of high barrier and adhesive tape Download PDFInfo
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- CN107502221A CN107502221A CN201710928931.1A CN201710928931A CN107502221A CN 107502221 A CN107502221 A CN 107502221A CN 201710928931 A CN201710928931 A CN 201710928931A CN 107502221 A CN107502221 A CN 107502221A
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- layer
- barrier
- mould release
- release membrance
- barrier film
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/005—Presence of polyolefin in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/045—Presence of homo or copolymers of ethene in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/10—Presence of homo or copolymers of propene
- C09J2423/105—Presence of homo or copolymers of propene in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2477/00—Presence of polyamide
- C09J2477/005—Presence of polyamide in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/085—Presence of polyamine or polyimide polyimide in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses a kind of compound mould release membrance of high barrier and adhesive tape, should include the first parting agent layer, the first barrier film layer, water imbibition adhesive layer, the second barrier film layer and the second parting agent layer stacked gradually from top to bottom.The compound mould release membrance of the high barrier can be used for the release layer of web-like pressure-sensitive tape, and in use, coiled material shape adhesive tape can be good at uncoiling;Meanwhile it is but also with excellent high-barrier and high water absorption function, can be obstructed in transportation and absorption air in aqueous vapor, prevent pressure-sensitive adhesive layer from touching aqueous vapor.It may be used as requiring very high to aqueous vapor barrier, such as the separated type material of OLED screen envelope frame high-barrier pressure-sensitive tape.
Description
Technical field
The present invention relates to tape technology field, in particular to a kind of compound mould release membrance of high barrier and adhesive tape.
Background technology
As the consumption electronic products such as smart mobile phone, Intelligent bracelet, TV, computer are towards the direction such as frivolous, portable, intelligent
Fast development, its display screen also experiencing the rapid evolution and iteration of " sphere screen-plane screen-flexible screen ".In sphere screen
Epoch, CRT are uniquely to select;In the plane screen epoch, LCD turns into undisputed king;Future the flexible screen epoch,
OLED (Organic Light Emitting Diode) is due to simple in construction, ultra-thin, color saturation and high, low in energy consumption, the easy reality of contrast
The advantages such as existing Flexible Displays, turn into the emphasis of industrial circle and academia's investment and research.
But on the other hand, because organic luminescence polymer material is easily influenceed by oxygen and humidity, for example, the oxygen of component
Luminescent system such as electroluminescent lamp (EL lamps) or organic light-emitting diodes can seriously be reduced within the very short time by changing reaction
The luminous power (luminosity power) of (OLED) is managed, reduces the contrast in the case of electrophoretic display device (EPD) (EP displays)
Degree, or the efficiency in the case of solar cell, thus cause the current OLED thin-film light emittings time to maintain 1 year left side
It is right.Therefore, in OLED whole service life, packaging protection material is required.
For flexible display screen, traditional envelope frame technology, as rigid metal or glass cover-plate (or are dried plus fluid sealant
Agent) it cannot be used for encapsulating.At this moment it is necessary that using thin film encapsulation technology.Thin film encapsulation technology is except can be applied to flexible display
Outside module, also produce the advantage that:
(1) compared with using rigid substrates, film weight and thickness can be greatly lowered, and also make the super rich display of production
Device is possibly realized;
(2) mechanical encapsulation part is substituted with film separation layer, cost can be substantially reduced;
(3) if thin film packaging material is high grade of transparency material, in addition to bottom-emission mode, top can also be used to send out
Light mode, so as to effectively improve luminous efficiency and resolution ratio;
Thin-film package can be divided into inorganic thin film encapsulation, organic film encapsulation, inorganic-organic hybrid film envelope by encapsulating material
Dress etc..Wherein inorganic-organic hybrid thin film encapsulation technology is the most advanced, and it compensate for leaning on single inorganic matter or organic matter packaging belt
The defects of coming, it is considered to be a kind of encapsulation technology most with prospects.
In thin film encapsulation technology in addition to application function Obstruct membrane, it is also necessary to which these multilayer materials are compounded in into one
Rise, this requires the pressure sensitive adhesive tape of binding function, while also requires that pressure sensitive adhesive tape must be the high high optical lens of water oxygen obstruction
Lightness.Barrier adhesive tape in OLED requires special function and optical property to ensure with OLED display and photograph
There is flexible flexible performance in the final equipment of bright equipment.Encapsulation of the adhesive tape for OLED is obstructed to steam with higher waterproof
Gas and oxygen performance.
Chinese patent CN106240001A has invented a kind of high-barrier pharmaceutical pack composite membrane, and the composite membrane uses Double-layer aluminum
Paper tinsel composite construction, prevent the pin hole problems of foil laminated film substantially, and because the buffering of two layers of aluminium foil elastic attachment adhesive layer is made
With, therefore pin hole is not likely to produce when by crimping, improve the barrier of foil laminated film.But the composite membrane is only avoided that macroscopically
Water penetration caused by pin hole, and steam microdialysis can not be avoided well.
The content of the invention
The inventors discovered that the pressure-sensitive adhesive layer of OLED encapsulation adhesive tapes would generally be used to the strong Acrylate pressure sensitive of polarity
Glue or PUR, these adhesive also aqueous vapor in easy absorption air, and this does not allow in OLED encapsulation.This is just
Need a part using the separated type material of high-barrier high-hydroscopicity as pressure sensitive adhesive tape.On the one hand, transporting and storing
During can obstruct aqueous vapor and enter pressure-sensitive adhesive layer, on the other hand, the pressure sensitive adhesive tape of web-like can be untied easily when in use.
In view of this, a kind of compound mould release membrance of high barrier provided by the invention and adhesive tape, preferably overcome above-mentioned existing
The problem of with the presence of technology and defect, the compound mould release membrance of the high barrier can be used for the release layer of web-like pressure-sensitive tape, make
During, coiled material shape adhesive tape being capable of uncoiling well;, can meanwhile it is but also with excellent high-barrier and high water absorption function
Aqueous vapor in transportation in barrier and absorption air, prevents pressure-sensitive adhesive layer from touching aqueous vapor.It may be used as obstructing aqueous vapor
It is required that it is very high, such as the separated type material of OLED screen envelope frame high-barrier pressure-sensitive tape.
A kind of compound mould release membrance of high barrier, including stack gradually from top to bottom the first parting agent layer, first barrier it is thin
Film layer, water imbibition adhesive layer, the second barrier film layer and the second parting agent layer.
Further, the material of first parting agent layer and second parting agent layer be organosilicon, fluoridated silicone,
One or more of mixtures in Organosiliconcopolymere, fluoropolymer, polyolefin.
Further, the material of the first barrier film layer and the second barrier film layer is polyvinyl chloride, poly- second
Alkene, polyethylene terephthalate, polyimides, polypropylene, polyamide, PEN, poly- inclined two chloroethene
One kind in alkene, ethylene-vinyl alcohol copolymer, vinylidene chloride-vinyl chloride copolymer, vinylidene chloride-acrylonitrile copolymer
Or at least two compound.
Further, the material of the water imbibition adhesive layer is the mixture of water-absorbing resins and adhesive.
Further, it is provided with the first high-barrier between the first barrier film layer and the water imbibition adhesive layer
Layer, the material of first high-obstruction is inorganic metal or metallic compound.
Further, it is provided with the second high-barrier between the second barrier film layer and the water imbibition adhesive layer
Layer, the material of second high-obstruction is inorganic metal or metallic compound.
Further, the thickness of first parting agent layer and second parting agent layer is 0.2~5.0 μm.
Further, the thickness of the first barrier film layer and the second barrier film layer is 15~100 μm.
Further, the thickness of the water imbibition adhesive layer is 10~50 μm.
Present invention also offers a kind of adhesive tape, including pressure-sensitive adhesive oxidant layer and it is arranged at the pressure-sensitive adhesive oxidant layer at least one
The compound mould release membrance of side;The compound mould release membrance is the above-mentioned compound mould release membrance of high barrier.
Compared with prior art, the beneficial effect of the compound mould release membrance of a kind of high barrier of the invention and adhesive tape is:
(1) two layers of barrier film layer is bonded together by the present invention using water imbibition adhesive layer, and microdialysis crosses barrier
The aqueous vapor of film layer will be absorbed by the water imbibition adhesive layer, greatly reduce moisture permeability;The high barrier is compound release
Film can be used for the release layer of web-like pressure-sensitive tape, and in use, coiled material shape adhesive tape being capable of uncoiling well;Meanwhile by
Possess excellent high-barrier and high water absorption function in the compound mould release membrance of the high barrier, can obstruct and inhale in transportation
The aqueous vapor in air is received, avoids minor amount of water air infiltration through touching formation of pressure-sensitive adhesive layer after barrier film and parting agent layer, can be with
As requiring very high to aqueous vapor barrier, such as the separated type material of OLED screen envelope frame high-barrier pressure-sensitive tape.
(2) structure of the compound mould release membrance of high barrier of the invention and adhesive tape is simple, and production cost is relatively low.
In summary, the special structure of the present invention, it has the advantages of above-mentioned many and practical value, and in like product
In there are no similar method and publish or use and really belong to innovation, generate handy and practical effect, more existing skill
Art has the multinomial effect promoted, and so as to more be suitable to practicality, and has extensive industrial value.
To enable the above objects, features and advantages of the present invention to become apparent, preferred embodiment cited below particularly, and coordinate
Appended accompanying drawing, is described in detail below.
Brief description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by embodiment it is required use it is attached
Figure is briefly described, it will be appreciated that the following drawings illustrate only certain embodiments of the present invention, therefore be not construed as pair
The restriction of scope, for those of ordinary skill in the art, on the premise of not paying creative work, can also be according to this
A little accompanying drawings obtain other related accompanying drawings.
Fig. 1 is the structural representation of the first embodiment of the compound mould release membrance of high barrier of the present invention;
Fig. 2 is the structural representation of second of embodiment of the compound mould release membrance of high barrier of the present invention.
Main element symbol description:
The compound mould release membrances of 1-;
The parting agent layers of 100- first;
200- the first barrier film layers;
The high-obstructions of 300- first;
400- water imbibition adhesive layers
The high-obstructions of 500- second;
600- the second barrier film layers;
The parting agent layers of 700- second.
Embodiment
For the ease of understanding the present invention, the compound mould release membrance of high barrier and adhesive tape are carried out more below with reference to relevant drawings
Comprehensive description.The embodiment of the compound mould release membrance of high barrier and adhesive tape is given in accompanying drawing.But high barrier is compound release
Film and adhesive tape can be realized in many different forms, however it is not limited to embodiment described herein.On the contrary, provide these
The purpose of embodiment is to make the disclosure more thorough and comprehensive to the compound mould release membrance of high barrier and adhesive tape.
Hereinafter, disclosed in the term " comprising " that can be used in various embodiments of the present invention or " may include " instruction
Function, operation or the presence of element, and do not limit the increase of one or more functions, operation or element.In addition, such as exist
Used in various embodiments of the present invention, term " comprising ", " having " and its cognate are meant only to represent special characteristic, number
Word, step, operation, the combination of element, component or foregoing item, and be understood not to exclude first one or more other
Feature, numeral, step, operation, element, component or foregoing item combination presence or one or more features of increase, numeral,
Step, operation, element, component or foregoing item combination possibility.
In various embodiments of the present invention, " A or/and B " include any combinations or the institute of the word listed file names with for statement
There is combination, such as, it may include A, it may include B or may include A and B both.
In the description of the invention, it is to be understood that term " longitudinal direction ", " transverse direction ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " transverse direction ", " top ", " bottom ", " interior ", " outer " is based on accompanying drawing institutes
The orientation or position relationship shown, it is for only for ease of the description present invention and simplifies description, rather than instruction or the dress for implying meaning
Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the invention
System.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Necessarily refer to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be any
One or more embodiments or example in combine in an appropriate manner.
Refering to Fig. 1, the invention provides a kind of compound mould release membrance 1 of high barrier, including stacked gradually from top to bottom
One parting agent layer 100, the first barrier film layer 200, water imbibition adhesive layer 400, the second barrier film layer 600 and second are release
Oxidant layer 700.
Further, the material of first parting agent layer 100 and second parting agent layer 700 is organosilicon, fluorination
One or more of mixtures in organosilicon, Organosiliconcopolymere, fluoropolymer, polyolefin.
Preferably, the material of first parting agent layer 100 and second parting agent layer 700 is organosilicon or polyene
Hydrocarbon.It should be noted that being directed to different types of silicone release agent, different coating embodiments can be used by mould release
Layer is attached to barrier film layer (carrier layer), such as:The coating methods such as two rods, nick, scraper plate can be used to be used for solvent-type organosilicon
Mould release (such as platinum catalystSolvent-borne type mould release) coating, five rollers and above coating method can be used to be used for nothing
Solvent-type organosilicon is coated with, and for emulsion-type organosilicon, can use the coating methods such as two rods, air knife, bar.
Further, the material of the first barrier film layer 200 and the second barrier film layer 600 is polychlorostyrene second
Alkene, polyethylene (PE), polyethylene terephthalate (PET), polyimides, polypropylene, polyamide (PA), poly- naphthalenedicarboxylic acid
Glycol ester, polyvinylidene chloride (PVDC), ethylene-vinyl alcohol copolymer (EVOH), vinylidene chloride-vinyl chloride copolymer,
One kind or at least two compound in vinylidene chloride-acrylonitrile copolymer.
It should be noted that the material of the first barrier film layer 200 and the second barrier film layer 600 can be selected
With monolayer polymer film, such as polyvinyl chloride, polyethylene, polyethylene terephthalate, polyimides, polypropylene, polyamides
Amine, PEN or polyvinylidene chloride etc.;Copolymer film, such as ethylene vinyl alcohol copolymer can also be selected
Thing, vinylidene chloride-vinyl chloride copolymer or film made of vinylidene chloride-acrylonitrile copolymer.
It is highly preferred that the first barrier film layer 200 and the second barrier film layer 600 use MULTILAYER COMPOSITE technology,
Two or more material in the molten state, in a die head coextru-lamination be welded together to obtain.The co-extrusion is answered
The base resin of conjunction is typically using resins such as HDPE or PP, and barrier resins are mainly using PA, EVOH or PVDC etc..Due to obstructing material
The compatibility of material and heat-sealable material is typically very poor, it is therefore necessary to the compatilizer chosen is considered, such as the copolymerization tree of esters of acrylic acid
Fat.Wherein, barrier resins requirement has preferable processing characteristics, has the need of good fluidity to adapt to coextru-lamination head requirement
Will, mobility is too poor or several resins between mobility difference it is too big, the resistance of composite membrane can be all reduced due to the formation of laminar flow
Separating performance.Coextru-lamination is in general by the symmetric design of five layers of ABCBA and ABCDCBA seven-layer structures, its barrier and compound
Intensity is best.
Further, the material of the water imbibition adhesive layer 400 is the mixture of water-absorbing resins and adhesive.
It is to be appreciated that the effect of water imbibition adhesive layer 400 mainly has two aspects:On the one hand it is that will penetrate first
The micro aqueous vapor of barrier film is absorbed, and the water imbibition adhesive layer 400 has excellent water retention property, that is, is absorbed water
The micro-moisture that resin is absorbed is not easy to isolate from water-absorbing resin, when the release layer as web-like pressure-sensitive tape, energy
Minor amount of water air infiltration is enough avoided to touch formation of pressure-sensitive adhesive layer after passing through the second barrier film and peeling agent layer.On the other hand it is to pass through
First barrier film and the second barrier film are combined with each other by the water imbibition adhesive layer 400.
It is made it should be noted that the gluing oxidant layer of high-hydroscopicity mainly there are water-absorbing resins to be scattered in adhesive.Wherein, inhale
Water-base resin can with starch series, cellulose series and synthetic resin series or protein series, other natural goodses and
The blend and compound system of its derivative system or these resins.It is preferred that high-hygroscopicity resin is synthetic resin series, it is such as poly-
Acrylates, polyvinyl alcohol, polyoxygenated alkanes, inorganic polymeric species etc.;Adhesive can be hydrophilic pressure sensitive or
PUR.
Further, as shown in Fig. 2 being set between the first barrier film layer 200 and the water imbibition adhesive layer 400
The first high-obstruction 300 is equipped with, the material of first high-obstruction 300 is inorganic metal or metallic compound.
Further, as shown in Fig. 2 being set between the second barrier film layer 600 and the water imbibition adhesive layer 400
The second high-obstruction 500 is equipped with, the material of second high-obstruction 500 is inorganic metal or metallic compound.
It is understood that the above-mentioned high-obstruction 500 of first high-obstruction 300 and second is saturating for further obstructing aqueous vapor
Cross barrier film layer.
The above-mentioned high-obstruction 500 of first high-obstruction 300 and second can by by metal or metallic compound in normal pressure
Under, it is plated to barrier film layer surface by the methods of corona, flame pyrolysis and obtains;Can also in the case of vacuum or decompression,
By chemical vapour deposition technique, physical vaporous deposition, plasma enhanced chemical vapour deposition process the methods of be deposited on resistance
Every being obtained on thin-film surface.
The thickness of the above-mentioned high-obstruction 500 of first high-obstruction 300 and second is
Further, the thickness of first parting agent layer 100 and second parting agent layer 700 be 0.2~5.0 μm such as
0.2 μm, 0.5 μm, 1.0 μm, 1.5 μm, 2.0 μm, 2.5 μm, 3.0 μm, 3.5 μm, 4.0 μm, 4.5 μm or 5.0 μm etc..
Preferably, the thickness of first parting agent layer 100 and second parting agent layer 700 is 0.5~2.5 μm.
Further, the thickness of the first barrier film layer 200 and the second barrier film layer 600 is 15~100 μ
Such as 15 μm, 20 μm, 25 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 75 μm, 80 μm, 90 μm or 100 μm of m etc..
Preferably, the thickness of the first barrier film layer 200 and the second barrier film layer 600 is 25~75 μm
Further, the thickness of the water imbibition adhesive layer 400 be 10~50 μm such as 10 μm, 20 μm, 30 μm, 40 μm or
50 μm etc..
Seen from the above description, two layers of barrier film layer is bonded together by the present invention using water imbibition adhesive layer 400,
The aqueous vapor that microdialysis crosses barrier film layer will be absorbed by the water imbibition adhesive layer 400, greatly reduce moisture permeability;Should
The compound mould release membrance 1 of high barrier can be used for the release layer of web-like pressure-sensitive tape, and in use, coiled material shape adhesive tape can be very
Good uncoiling;Simultaneously as the compound mould release membrance 1 of the high barrier possesses excellent high-barrier and high water absorption function, can transport
Aqueous vapor during defeated in barrier and absorption air, minor amount of water air infiltration is avoided to touch pressure after passing through barrier film and parting agent layer
Sensitive adhesive layer, may be used as to aqueous vapor barrier require it is very high, as OLED screen envelope frame with high-barrier pressure-sensitive tape from
Section bar material.
Present invention also offers a kind of adhesive tape, including pressure-sensitive adhesive oxidant layer and it is arranged at the pressure-sensitive adhesive oxidant layer at least one
The compound mould release membrance 1 of side;The compound mould release membrance 1 is the above-mentioned compound mould release membrance 1 of high barrier.
For the ease of understanding the present invention, technical scheme is further illustrated with reference to embodiment.Applicant
Statement, the present invention illustrate the detailed process equipment of the present invention and technological process, but not office of the invention by above-described embodiment
It is limited to above-mentioned detailed process equipment and technological process, that is, does not mean that the present invention should rely on above-mentioned detailed process equipment and technique stream
Cheng Caineng is implemented.Person of ordinary skill in the field is it will be clearly understood that any improvement in the present invention, to each original of product of the present invention
The equivalence replacement of material and the addition of auxiliary element, the selection of concrete mode etc., all fall within protection scope of the present invention and open model
Within enclosing.
Embodiment 1
(1) barrier film layer is made using polyethylene terephthalate.
(2) by platinum catalystSolvent-borne type mould release is uniformly coated on above-mentioned barrier by nick coating method
The side of film layer, parting agent layer is formed in the side of barrier film layer, obtains a composite bed.
(3) method of same above-mentioned steps (1) and step (2) is made another compound containing barrier film layer and parting agent layer
Layer.
(4) the super-high relative molecular weight Sodium Polyacrylate water-absorbing resins that mass percent is 1% are dispersed in
In acrylate pressure-sensitive adhesive, the surface of the barrier film layer of a composite bed is then coated on, then dries, obtains water imbibition
Adhesive layer.
(5) surface on the surface of above-mentioned water imbibition adhesive layer and the barrier film layer of another composite bed is fitted in one
Rise, be combined into one by rewinding machine, produce the compound mould release membrance of high barrier.
Embodiment 2
(1) barrier film layer is made using polyethylene terephthalate.
(2) by platinum catalystSolvent-borne type mould release is uniformly coated on above-mentioned barrier by nick coating method
The side of film layer, parting agent layer is formed in the side of barrier film layer.
(3) aluminium wire of high-purity under high temperature (1100~1200 DEG C) is flashed to by gaseous state by vacuum aluminium plating process, made
The opposite side that gaseous aluminium molecule is deposited to above-mentioned barrier film layer forms high-obstruction, obtains one containing parting agent layer, barrier
The composite bed of film layer and high-obstruction.
(4) method of same above-mentioned steps (1) and step (2) is made another compound containing parting agent layer and barrier film layer
Layer.
(5) the super-high relative molecular weight Sodium Polyacrylate water-absorbing resins that mass percent is 1% are dispersed in
In acrylate pressure-sensitive adhesive, the surface of the high-obstruction of a composite bed is then coated on, is then dried, obtain water imbibition glue
Adhensive layer.
(6) surface on the surface of above-mentioned water imbibition adhesive layer and the barrier film layer of another composite bed is fitted in one
Rise, be combined into one by rewinding machine, produce the compound mould release membrance of high barrier.
Embodiment 3
Difference with embodiment 2 is:Barrier film layer is that polyethylene terephthalate and polyvinylidene chloride are answered
The film of conjunction.
Embodiment 4
Difference with embodiment 2 is:Barrier film layer is PE/EVOH/PA/EVOH/PE five-layer co-squeezing composite membranes.
Embodiment 5
(1) barrier film layer is made using polyethylene terephthalate.
(2) by platinum catalystIt is thin that solvent-borne type mould release by nick coating method is uniformly coated on above-mentioned barrier
The side of film layer, parting agent layer is formed in the side of barrier film layer.
(3) aluminium wire of high-purity under high temperature (1100~1200 DEG C) is flashed to by gaseous state by vacuum aluminium plating process, made
The opposite side that gaseous aluminium molecule is deposited to above-mentioned barrier film layer forms high-obstruction, obtains one containing parting agent layer, barrier
The composite bed of film layer and high-obstruction.
(4) method of same above-mentioned steps (1), step (2) and step (3) be made containing parting agent layer, barrier film layer and
Another composite bed of high-obstruction.
(5) the super-high relative molecular weight Sodium Polyacrylate water-absorbing resins that mass percent is 1% are dispersed in
In acrylate pressure-sensitive adhesive, the surface of the high-obstruction of a composite bed is then coated on, is then dried, obtain water imbibition glue
Adhensive layer.
(6) surface on the surface of above-mentioned water imbibition adhesive layer and the high-obstruction of another composite bed is fitted in one
Rise, be combined into one by rewinding machine, produce the compound mould release membrance of high barrier.
Embodiment 6
Difference with embodiment 5 is:Barrier film layer is that polyethylene terephthalate and polyvinylidene chloride are answered
The film of conjunction.
Embodiment 7
Difference with embodiment 5 is:Barrier film layer is PE/EVOH/PA/EVOH/PE five-layer co-squeezing composite membranes.
By three kinds of different types of pressure-sensitive adhesive agent be respectively coated high barrier made of above-described embodiment 1-7 it is compound from
On type film and common mould release membrance (as a comparison case), then drying forms pressure-sensitive adhesive oxidant layer, then in pressure-sensitive adhesive oxidant layer table
Face is accordingly bonded same mould release membrance, and pressure-sensitive tape is made.Above-mentioned pressure-sensitive tape is placed in temperature as 25 DEG C, relatively
Humidity is to be taken out in 85% baking oven after 24 hours, after peeling off mould release membrance, measures the content of moisture in pressure sensitive adhesive tape.
The measurement of the water content determines according to karr-Karl Fischer titration:With baking oven sampler (150 DEG C of oven temperature)
Measured on the karr to link together-Fischer voltameter.It is measured in every case with about 0.5g initial mass,
As a result it is as shown in table 1 below.
Table 1
Pressure sensitive adhesive tape 1 | Pressure sensitive adhesive tape 2 | Pressure sensitive adhesive 3 | |
Embodiment 1 | 527ppm | 436ppm | 187ppm |
Embodiment 2 | 356ppm | 357ppm | 207ppm |
Embodiment 3 | 245ppm | 187ppm | 105ppm |
Embodiment 4 | 50ppm | 39ppm | 29ppm |
Embodiment 5 | 138ppm | 126ppm | 108ppm |
Embodiment 6 | 48ppm | 36ppm | 23ppm |
Embodiment 7 | 32ppm | 23ppm | 18ppm |
Comparative example | 4836ppm | 2074ppm | 754ppm |
Being shown by the result of table 1, the compound mould release membrance of high barrier of the invention possesses excellent high-barrier and high water absorption function,
Can obstruct can fall the micro moisture sorption for penetrating barrier layer, keep away with the aqueous vapor in absorption air, water imbibition adhesive layer
Exempt from minor amount of water air infiltration through formation of pressure-sensitive adhesive layer is touched after barrier film and parting agent layer, be more suitable as press sensitive to aqueous vapor
The mould release membrance of sensitive tape, it is also used as requiring very high to aqueous vapor barrier, as OLED screen seals frame high-barrier pressure-sensitive adhesive
The mould release membrance of band.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.
Claims (10)
- A kind of 1. compound mould release membrance of high barrier, it is characterised in that:Including stack gradually from top to bottom the first parting agent layer, One barrier film layer, water imbibition adhesive layer, the second barrier film layer and the second parting agent layer.
- 2. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:First parting agent layer and described The material of second parting agent layer is one kind in organosilicon, fluoridated silicone, Organosiliconcopolymere, fluoropolymer, polyolefin Or several mixture.
- 3. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The first barrier film layer and institute State the material of the second barrier film layer for polyvinyl chloride, polyethylene, polyethylene terephthalate, polyimides, polypropylene, Polyamide, PEN, polyvinylidene chloride, ethylene-vinyl alcohol copolymer, vinylidene chloride-vinyl chloride are common Polymers, one kind in vinylidene chloride-acrylonitrile copolymer or at least two compound.
- 4. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The material of the water imbibition adhesive layer Matter is the mixture of water-absorbing resins and adhesive.
- 5. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The first barrier film layer and institute State and be provided with the first high-obstruction between water imbibition adhesive layer, the material of first high-obstruction is inorganic metal or metal Compound.
- 6. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The second barrier film layer and institute State and be provided with the second high-obstruction between water imbibition adhesive layer, the material of second high-obstruction is inorganic metal or metal Compound.
- 7. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:First parting agent layer and described The thickness of second parting agent layer is 0.2~5.0 μm.
- 8. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The first barrier film layer and institute The thickness for stating the second barrier film layer is 15~100 μm.
- 9. the compound mould release membrance of high barrier according to claim 1, it is characterised in that:The thickness of the water imbibition adhesive layer Spend for 10~50 μm.
- A kind of 10. adhesive tape, it is characterised in that:Including pressure-sensitive adhesive oxidant layer and it is arranged at the pressure-sensitive adhesive oxidant layer at least side Compound mould release membrance;The compound mould release membrance is the compound mould release membrance of high barrier described in any one of claim 1~9.
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CN112802977A (en) * | 2021-01-07 | 2021-05-14 | 深圳市华星光电半导体显示技术有限公司 | Packaging film, preparation method thereof and packaging method of flexible display panel |
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