CN107470588B - In the method for aluminium gold hard rock composite material surface covering copper foil - Google Patents
In the method for aluminium gold hard rock composite material surface covering copper foil Download PDFInfo
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- CN107470588B CN107470588B CN201710842759.8A CN201710842759A CN107470588B CN 107470588 B CN107470588 B CN 107470588B CN 201710842759 A CN201710842759 A CN 201710842759A CN 107470588 B CN107470588 B CN 107470588B
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- copper foil
- indentation
- aluminium
- diamond
- diamond powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/16—Casting in, on, or around objects which form part of the product for making compound objects cast of two or more different metals, e.g. for making rolls for rolling mills
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D18/00—Pressure casting; Vacuum casting
- B22D18/02—Pressure casting making use of mechanical pressure devices, e.g. cast-forging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D19/00—Casting in, on, or around objects which form part of the product
- B22D19/0063—Casting in, on, or around objects which form part of the product finned exchangers
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Manufacture Of Alloys Or Alloy Compounds (AREA)
Abstract
A method of copper foil being covered in aluminium gold hard rock composite material surface, will be covered on outside diamond powder by the copper foil of indentation processing, it is made to link together securely with aluminium diamond in press casting procedure;It is carved with dent in one surface of copper foil, copper foil is first close to two opposite medial surfaces of casting forming mold, then diamond powder is poured between two copper foils, the copper foil surface handled by indentation is towards diamond powder, vibrating compacting diamond powder, and be embedded in it in dent of copper foil, then be loaded into the casting forming mold of diamond powder and copper foil and be put into heating furnace and preheat, shaping dies after preheating must be put into die casting cover die, and carry out aluminising die casting.For the molten aluminum of fusing under the extruding of pressure head, the gap for penetrating into diamond powder forms aluminium diamond composite, and copper foil, aluminum melting and bortz powder is made firmly to combine together, and being formed in aluminium diamond surface can process, can carry out the uniform layers of copper of the processing such as nickel plating.
Description
Technical field
The present invention relates to radiating element technology fields, especially cover copper in aluminium gold hard rock composite material surface
The method of foil, resulting is high power semiconductor chip prepared by the aluminium diamond composite of surface covering copper alloy layer
Radiating element.
Background technique
Aluminium diamond has thermal conductivity is high, thermal expansion coefficient is adjustable, light weight, rigidity is big, mechanical strength is moderate etc.
Advantage, it has also become the following multi-chip module and the optimal heat dissipating substrate material of high-current power module.
Multi-chip module and high-current power module are space flight and aviation, national defense construction, civilian traffic, power transmission and transformation system etc.
Core component, high-end at present multi-chip module and high-current power module have started to radiate using aluminium diamond composite
Base material.Heat-radiating substrate made of aluminium diamond composite, it usually needs welding encapsulation work is carried out with chip material, therefore
There is higher flatness processing request to its surface and implements the requirement of the coatings such as nickel plating processing, and diamond is a kind of high hard material
Material, it is extremely difficult to carry out machining to it, is also difficult to be directly realized by nickel plating etc. in aluminium gold hard rock composite material surface at present and applies
Plating processing, it is therefore desirable to aluminium diamond surface be stably formed one layer can carry out machining be able to achieve again coating process
Metal.Since multi-chip module and high-current power module have high reliability requirement to heat dissipating substrate material, with aluminium
The metal layer that diamond is connected must be firmly combined together with matrix composite, and cold and hot can follow multiple
In ring, Joint failure does not occur, does not occur separation and peels off, phenomena such as bulge occurs.
Summary of the invention
Copper is a kind of good metal material of heating conduction, and the aluminium gold hard rock composite material surface of covering can sufficiently be sent out
The excellent heating conduction of aluminium diamond is waved, but the hot expansibility due to copper and aluminium gold hard rock differ greatly, in order to keep away
Exempt from both materials and occur Joint failure in cohesive process, does not occur separation and peel off, the defects of bulge occur, the applicant mentions
For a kind of method in aluminium gold hard rock composite material surface covering copper foil, to the copper of the aluminium coating diamond surface in press casting procedure
Foil carries out prior indentation processing, and then it is wrapped on the outside of diamond powder, seeps it in diamond powder high pressure die casting
During aluminium, melting phenomenon and being formed between composite material is generated with die casting aluminium well and is firmly connect, ensure that pair
The machining and coating process demand of the heat dissipating substrate material surface of multi-chip module and high-current power module.
The technical solution adopted in the present invention is as follows:
A method of copper foil, including following operating procedure are covered in aluminium gold hard rock composite material surface:
Step 1: being placed on to be processed on vacuum chuck with a thickness of the copper foil of 0.1-0.5mm, the vacuum chuck installation
In on platen;
Step 2: being equipped with two groups of blade row components, respectively the first blade row seat, the first blade row seat in the top of copper foil
Upper parallel interval is equipped with multiple first icking tools, the second blade row seat parallel with the first blade row seat, puts down on the second blade row seat
Row interval is equipped with multiple second icking tools;
Step 3: dedicated platen moves in a straight line along the X direction with copper foil, make two groups of blade row components in copper
Two groups are formed on foil has towards different, alternate the first indentation of pawl shape each other;Copper foil surface incision indentation depth be
0.05-0.2mm;
Step 4: dedicated platen is rotated by 90 ° together with copper foil, after the first indentation completion of processing to copper
Foil surface carries out indentation processing identical with third step, which is processed the second indentation;
Step 5: being required to cut copper foil according to the size of die casting heat-radiating substrate;
Step 6: by the upper edge of copper foil to the side bending 2-10mm of non-indentation;
Step 7: two panels copper foil is fitted into the shaping dies of die casting heat-radiating substrate, the non-indentation of copper foil is facing towards forming
On the outside of mold, diamond powder is packed into the cavity between two copper foils, and the processed copper-clad surface of indentation is vibrated towards diamond powder
It is compacted diamond powder, in the indentation for making diamond powder insertion copper foil, the shaping dies for installing powder, which is put into preheating furnace, to be added
Heat, the temperature of preheating furnace are set as 450 degree of -750 degree;
Step 8: shaping dies is put into die casting cover die, by the aluminium of fusing after the shaping dies equipped with powder is preheated
Liquid injects cover die, squeezes molten aluminum, infiltrates through aluminum solutions in the gap of diamond powder, while also penetrating into groove at copper foil indentation
In;After molten aluminum solidification, copper foil surface and die casting aluminium are formed indenting occlusive state, aluminium gold hard rock complex matrix
The surface of material is formed one layer of fine copper alloy-layer being connected firmly.
As a further improvement of the above technical scheme:
In second step, the angle of the first icking tool and copper foil surface is 45 ° -75 °, and the angle of the second icking tool and copper foil surface is
105°-135°。
In 7th step, the outside of copper foil is shaping dies, and the outside of shaping dies is provided with die casting cover die, further includes pressure
Head, the pressure head press to molten aluminum.
Beneficial effects of the present invention are as follows:
Structure of the invention is compact, reasonable, easy to operate, is wrapped in bortz powder by using the copper foil by indentation processing
Material outside, copper foil is merged with the generation of aluminium gold hard rock matrices of composite material in press casting procedure, realizes firm connection.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention.
Fig. 2 is main view of the invention.
Fig. 3 is the side view of Fig. 2.
Fig. 4 is the top view of Fig. 2.
Fig. 5 is the machining sketch chart after copper foil of the present invention is rotated by 90 °.
Fig. 6 is the structural schematic diagram after copper foil indentation of the present invention.
Fig. 7 is the machining sketch chart of the 7th step of the invention.
Fig. 8 is the machining sketch chart of the 8th step of the invention.
Wherein: 1, the first blade row seat;2, copper foil;3, the first indentation;4, the second indentation;5, diamond powder;6, finishing die
Tool;7, pressure head;8, molten aluminum;9, die casting cover die;10, the first icking tool;11, the second blade row seat;12, the second icking tool;13, vacuum is inhaled
Disk.
Specific embodiment
Specific embodiments of the present invention will be described below with reference to the accompanying drawings.
As Figure 1-Figure 8, the method in aluminium gold hard rock composite material surface covering copper foil of the present embodiment, including it is as follows
Operating procedure:
Step 1: being placed on to be processed on vacuum chuck 13 with a thickness of the copper foil 2 of 0.1-0.5mm, vacuum chuck 13 is pacified
Loaded on platen;(or copper foil is fixed on the table with pressing plate);
Step 2: in the top of copper foil 2, two groups of blade row components are housed, respectively the first blade row seat 1, on the first blade row seat 1
Parallel interval is equipped with multiple first icking tools 10, the second blade row seat 11 parallel with the first blade row seat 1, puts down on the second blade row seat 11
Row interval is equipped with multiple second icking tools 12;
Step 3: dedicated platen moves in a straight line along the X direction with copper foil 2, two groups of blade row components is made to exist
Two groups are formed on copper foil 2 has towards different, alternate the first indentation of pawl shape 3 each other;Cut 0.05- in 2 surface of copper foil
The depth of 0.15mm;
Step 4: be rotated by 90 ° dedicated platen together with copper foil 2 after 3 completion of processing of the first indentation, it is right
2 surface of copper foil carries out indentation processing identical with third step, which is processed the second indentation 4;
Step 5: being required to cut copper foil 2 according to the size of die casting heat-radiating substrate;
Step 6: by the upper edge of copper foil 2 to the side bending 2-10mm of non-indentation;
Step 7: two panels copper foil 2 is fitted into the shaping dies 6 of die casting heat-radiating substrate, the non-indentation of copper foil 2 facing towards at
On the outside of shape mold, diamond powder 5 is packed into the cavity between two copper foils 2, and the processed copper foil 2 of indentation is facing towards diamond powder
5, vibrating compacting diamond powder 5, make diamond powder 5 be embedded in copper foil 2 indentation in, install powder shaping dies be put into it is pre-
It is heated in hot stove, the temperature of preheating furnace is set as 450 degree of -750 degree;
Step 8: shaping dies is put into die casting cover die 9, by fusing after the shaping dies equipped with powder is preheated
Molten aluminum 8 injects cover die, squeezes molten aluminum 8, infiltrates through aluminum solutions in the gap of diamond powder 5, while also penetrating into 2 indentation of copper foil
Locate in groove;After the solidification of molten aluminum 8, copper foil surface and die casting aluminium are formed indenting occlusive state, aluminium gold hard rock
The surface of compound matrix material is formed one layer of fine copper alloy-layer being connected firmly.
In second step, the angle on the first icking tool 10 and 2 surface of copper foil is 45 ° -75 °, the second icking tool 12 and 2 surface of copper foil
Angle is 105 ° -135 °.
In 7th step, the outside of copper foil 2 is shaping dies 6, and the outside of shaping dies 6 is provided with die casting cover die 9, further includes
Pressure head 7, pressure head 7 press to molten aluminum 8.
Since there are cutters intersect and different directions to carve the dent come on copper foil 2 surface, when diamond powder 5 is inlayed
Enter in dent, and penetrated at dent in the molten aluminum die casting of fusing, it is existing that the molten aluminum of thawing can generate slightly soluble in 2 convex portion of copper foil
As, and go deep into dent and copper foil shape 2 into engaged state, melting copper foil 2, aluminum melting and diamond powder 5 firmly is one
Body forms the uniform layers of copper that can be processed in aluminium diamond surface.As shown in the figure.
Above description is explanation of the invention, is not intended to limit the invention, and limited range of the present invention is referring to right
It is required that within protection scope of the present invention, any type of modification can be made.
Claims (3)
1. a kind of method in aluminium gold hard rock composite material surface covering copper foil, it is characterised in that: including following operating procedure:
Step 1: the copper foil (2) to be processed with a thickness of 0.1-0.5mm is placed on vacuum chuck (13), the vacuum chuck
(13) it is installed on platen;
Step 2: being equipped with two groups of blade row components, respectively the first blade row seat (1), first blade row in the top of copper foil (2)
Parallel interval is equipped with multiple first icking tools (10), the second blade row seat (11) parallel with first blade row seat (1), institute on seat (1)
It states parallel interval on the second blade row seat (11) and multiple second icking tools (12) is installed;
Step 3: the platen moves in a straight line along the X direction with copper foil (2), make two groups of blade row components in copper foil
(2) two groups are formed on has towards different, alternate the first indentation of pawl shape (3) each other;The depth of copper foil (2) surface incision indentation
Degree is 0.05-0.2mm;
Step 4: the platen is rotated by 90 ° together with copper foil (2), after the first indentation (3) completion of processing to copper
Foil (2) surface carries out indentation processing identical with third step, which is processed the second indentation (4);
Step 5: being required to cut copper foil (2) according to the size of die casting heat-radiating substrate;
Step 6: by the upper edge of copper foil (2) to the side bending 2-10mm of non-indentation;
Step 7: the copper foil (2) that the 6th step of two panels obtains is fitted into the shaping dies (6) of die casting heat-radiating substrate, copper foil (2)
Non- indentation is facing towards shaping dies outside, and diamond powder (5) is packed into the cavity between two copper foils (2), the processed copper of indentation
Foil (2) makes the quarter of diamond powder (5) insertion copper foil (2) facing towards diamond powder (5), vibrating compacting diamond powder (5)
In trace, the shaping dies for installing powder, which is put into preheating furnace, to be heated, and the temperature of preheating furnace is set as 450 degree of -750 degree;
Step 8: shaping dies (6) is put into die casting cover die, by the aluminium of fusing after the shaping dies equipped with powder is preheated
Liquid (8) injects cover die, squeezes molten aluminum (8), infiltrates through molten aluminum (8) in the gap of diamond powder, while also penetrating into copper foil (2)
At indentation in groove;After molten aluminum (8) solidification, copper foil surface and die casting aluminium are formed indenting occlusive state, aluminium
The surface of diamond compound matrix material is formed one layer of layers of copper being connected firmly.
2. as described in claim 1 in the method for aluminium gold hard rock composite material surface covering copper foil, it is characterised in that: second step
In, the angle on the first icking tool (10) and copper foil (2) surface is 45 ° -75 °, and the second icking tool (12) and the angle on copper foil (2) surface are
105°-135°。
3. as described in claim 1 in the method for aluminium gold hard rock composite material surface covering copper foil, it is characterised in that: the 7th step
In, the outside of copper foil (2) is shaping dies (6), and it further includes pressure head that the outside of shaping dies (6), which is provided with die casting cover die (9),
(7), the pressure head (7) presses to molten aluminum (8).
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CN201710842759.8A CN107470588B (en) | 2017-09-18 | 2017-09-18 | In the method for aluminium gold hard rock composite material surface covering copper foil |
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CN114582730B (en) * | 2022-02-28 | 2022-11-04 | 江南大学 | Method for preparing high-performance aluminum matrix composite heat dissipation substrate |
CN118417532B (en) * | 2024-07-03 | 2024-09-06 | 广州众山精密科技有限公司 | Preparation process of aluminum-copper integrated die-casting composite radiator for laser chip and radiator |
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