CN107442942A - The method that laser scribing scanning material prepares large area periodic points configuration Surface Texture - Google Patents
The method that laser scribing scanning material prepares large area periodic points configuration Surface Texture Download PDFInfo
- Publication number
- CN107442942A CN107442942A CN201710578108.2A CN201710578108A CN107442942A CN 107442942 A CN107442942 A CN 107442942A CN 201710578108 A CN201710578108 A CN 201710578108A CN 107442942 A CN107442942 A CN 107442942A
- Authority
- CN
- China
- Prior art keywords
- laser
- texture
- speed
- sample surfaces
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The method that laser scribing scanning material prepares large area periodic points configuration Surface Texture belongs to surface micro-structure preparation field.In order to solve the problems, such as existing processing method exist under processing efficiency, complex process.This method, which is suitable for use with laser, can make the various materials of material damage.Texture unit size, material damage threshold value adjust laser parameter needed for before opening the light, first single texture unit is prepared in sample surfaces using single-pulse laser, using the cooperation of laser scanning speed, pulse frequency and dutycycle, dot matrix texture preparation can be carried out by scan mode of ruling in sample surfaces.The present invention can large area, prepare material surface periodic points configuration texture, and unit size and spacing-controllable more at high speed.Material surface texture is widely used, such as lithium ion battery, photovoltaic generation, infra-red material, mechanical seal.
Description
Technical field
Large area dot matrix texture is quickly prepared in various material surfaces using laser the present invention relates to one kind, utilizes we
Texture caused by method has that systematicness, periodicity, size are controllable, and main is to prepare speed to be much larger than other processing methods.
Surface Texture technology of preparing involved by this method belongs to laser micro/nano manufacture field.
Background technology
The research origin of material surface texture is in the bionical exploration to biological surface specific function, such as the hydrophobicity of lotus leaf,
Sharkskin is to drag reduction of water etc..Material surface texture is widely used, as Chinese invention patent CN201610534055.X is pointed out,
Battery electrode surface nano-structure is processed using femtosecond laser, electrode surface area can be increased substantially so that battery capacity increases
Add, charging rate is accelerated, life；Surface Texture is prepared by ultrafast laser in monocrystalline silicon or polysilicon surface, can be reduced
Reflectivity and then raising photoelectric conversion rate of the solar cell to light；Mechanical seal field, Surface Texture can significantly improve machine
The lubrication state of tool seal face, improve the bearing capacity of liquid film, the service life of prolonged mechanical sealing；Chalcogenide glass etc. is infrared
Permeable material causes larger reflection loss because surface is smooth, and Surface Texture can reduce reflection loss, increases transmitance and dredges
It is water-based.
Surface Texture preparation method is numerous, and the most frequently used includes machining, Electrolyzed Processing, ion etching, micro electric fire
Flower processing etc., but insoluble problem all be present in these methods：Machining accuracy is difficult to break through；Electrolyzed Processing is only applicable to
Metal material；Ion etching efficiency is low and cost is high；Miniaturized EDM machining tool export license etc..
Chinese invention patent CN 201310375277.8 discloses the preparation method of copper substrate superhydrophobic surface texture, the party
Method needs to make the photoresist layer for being attached to copper substrate surfaces form ordered porous array template by photoetching treatment, recycles two steps
Oxidation-reduction process obtains one layer of micro-nano double mesostructure with similar lotus leaf surface in copper metallic face, complex process,
Cost is high and efficiency bottom, is only suitable for the conductive materials such as metal.Chinese invention patent CN201611094510.5 discloses laser and beaten
Mark machine prepares aluminium alloy super hydrophobic functional surface by way of light beam is got ready one by one, and single dotting time is 2ms~5ms, most
Silanization treatment, processing efficiency are low again afterwards.As the fast development of laser technology, and the ripe of supporting precision instrument are applied,
Laser technology is used for into the preparation of material surface texture turns into study hotspot, but there is no scan mode company of directly being rule using laser
Continue the report of quick property performance period dot matrix texture preparation method, laser scribing scan method is used for preparing striated or net more
Prepared by grating texture surface, dot matrix surface texture, and less efficient structure preparation method, pin are obtained except laser etches point by point
Preparation to the periodic dot matrix surface texture of large area then has no direct preparation method, generally requires more complicated compound
Preparation technology, and exist efficiency is low, process repeatability is low, to material universality difference the shortcomings of.
The content of the invention
The present invention is intended to provide one kind quickly prepares large area periodic points configuration texture using laser in material surface
Method.This method is the direct preparation method of dot matrix texture, can be carried out in ambient air environment, and technique is simply, again
Renaturation is strong, pollution-free, and suitable for various materials, prepared lattice structure has in military and national defense and national product widely should
Use potentiality.
1. present disclosure includes content in detail below：
1) sample to be processed is fixed on processing platform after surface cleaning, according to dot matrix depth and sample surfaces,
Defocusing amount is adjusted, ensures that focus to the spacing-controllable on surface, adjusts beam transmission direction or processing platform angle, ensures laser
Beam and sample surfaces angle are controllable；
2) the material damage threshold value of sample, the Effective depth penetration of incident light are determined；
3) the Effective depth penetration regulation of dot matrix texture unit size, material damage threshold value, incident light swashs needed for
Optical parameter, texture unit is prepared using individual pulse laser vertical sample surfaces, measures its size；If obtain texture unit size
It is different from target size, laser parameter can be finely tuned according to result, repeat to prepare texture unit, until its size and target size phase
Together, it is determined that preparing laser parameter needed for texture；
4) the vertical score direction unit spacing L and size of texture needed for basis, laser beam scan path, path are set
For some parallel segments, covering to be prepared texture all areas, between adjacent segments at intervals of L, at laser action point
Laser beam is vertical with material surface；
5) laser pulse frequency f is adjusted between 50kHz~1MHz, according to required line direction unit spacing H and laser
Pulse frequency f, regulation laser line scanning speed V1, laser is acted on a pulse, sample surfaces in sample surfaces every spacing H
Texture unit can be produced centered on laser action focus, two pulse intervals is set as 1/f, calculates to obtain scan velocity V1
=H × f；Empty hop rate degree V is set2, it is 2000mm/s~20000mm/s；
6) selection processing initial point, using step 2,3,4,5 technological parameters, by scan mode of ruling in sample table
Face prepares texture, sets H and L to be more than or equal to the diameter R of texture unit, then can prepare periodic points configuration Surface Texture.
2. the laser is femtosecond laser, picosecond laser and nanosecond laser isopulse laser, and optical maser wavelength be 100nm~
1064nm, laser pulse frequency are 50kHz~1MHz, and pulse duty factor is less than 1%.
3. the sweep speed is the progress texture preparation of laser emission sample surfaces, focal position of laser translational speed,
Its scope is in 200mm/s~20000mm/s；Laser does not go out laser by focal position of laser after sample surfaces scan a line
Next scan lines starting point is moved to, the translational speed is empty hop rate degree, and its scope is in 2000mm/s~10000mm/s.
4. the material surface can be plane, curved surface, folding face.
5. the line scanning can be linear scanning, curve surface sweeping, zigzag scanning.
6. if required texture area is more than single process maximum area, texture can be divided into several units, pass through spelling
Connect and process one by one, obtain required wide area surface texture.
Compared with conventional laser prepares surface dot matrix texture, beneficial effects of the present invention are：
1st, the present invention directly prepares dot matrix Surface Texture, laser one in line scanning using laser in sample table upper thread scanning
It is straight to open, using pulse laser dutycycle very little, within the individual pulse time, realize on the whole path that laser spot is passed by only
Have has laser emission less than 1%, if one geometric point when laser spot is regarded as, in line scanning process, realizes laser in sample
Surface pulse is processed point by point, is set H and L to be more than or equal to R, then can be prepared periodic points configuration Surface Texture, using sharp
Optical pulse frequency is very high, and laser scanning speed is exceedingly fast so for preparing dot matrix Surface Texture speed faster；
2nd, this method is carried out in ambient air environment, and technique is simple, easily realizes practical production；
3rd, Surface Texture unit size and spacing-controllable, different functions of surface is obtained, adapts to different surfaces application requirement；
4th, the prepared lattice structure cycle is good, and uniformity is strong, has high technology controllability and repeatability；
5th, this method suitable material scope is wide, and the various materials of material damage can be made by being suitable for use with laser.
Brief description of the drawings
Fig. 1：For preparation process schematic diagram；
Fig. 2：The Surface Texture prepared at a high speed in glass surface using picosecond laser provided for the embodiment of the present invention 1 is swashed
Light is copolymerized burnt photo；
Fig. 3：The Surface Texture prepared at a high speed in glass surface using picosecond laser provided for the embodiment of the present invention 2 is swashed
Light is copolymerized burnt photo；
Fig. 4：The table prepared at a high speed on aluminium nitride ceramic substrate surface using picosecond laser provided for the embodiment of the present invention 3
The laser co-focusing photo of plane texture.
Embodiment
Below in conjunction with accompanying drawing, clear, complete description is carried out to the technical scheme in the present invention, it is clear that the implementation
Example is the part of the embodiment of the present invention, is not whole embodiments, all within the essence and general principle of the present invention, is done
Any modification, equivalent substitution and improvements etc., should be included in the scope of the protection.
In embodiment, picosecond laser introduces high-speed vibrating mirror after some speculums, makes Laser Focusing in sample upper surface,
By setting high-speed vibrating mirror to control laser scanning surface path, continuously rapidly realize large area periodically by the way of line scans
It is prepared by dot matrix texture.
Preparation process, from line segment left end, is opened the light as shown in figure 1, galvanometer control laser path and starts to rule, in scratching process
Pulse laser is always on, after line segment length reaches requirement, closes light and jumps to Article 2 line segment left end, then opens the light and start to draw second
Bar line, every linear scanning direction is all identical, and control line is intersegmental away from so repetition, until texture prepares completion.
According to required dot matrix texture unit size, material damage threshold value, incident light Effective depth penetration, adjust laser
Parameter (wavelength, single pulse energy, defocusing amount), material surface is acted on using single-pulse laser, texture unit is prepared, measures it
Size；If it is different from target size to obtain texture unit size, laser parameter can be adjusted again, repeat to prepare texture unit, directly
It is identical with target size to resulting texture unit size, measuring unit diameter R, join it is determined that preparing laser needed for Surface Texture
Number, as requested, unit spacing H, unit spacing L on vertical score direction on line direction are set.If required preparation texture is big
In the range of small single process, texture length and wide respectively b, a, laser pulse frequency f, then scan velocity V can be calculated1
V1=f × H
H=L=R is set, is made all tangent between unit in texture；Set H>R or L>R, then mutually from,；Set H<R or L<R, then
It is intersecting.If empty hop rate degree is V2, calculate texture processing Theory time t
From formula, on the premise of texture size requires constant, laser pulse frequency and galvanometer sky hop rate degree are improved
It can reduce and prepare texture elapsed time.Due to that may also have other times consumption in galvanometer process, therefore final institute's used time
Between T and theoretical time t have certain difference, but other times consumption is the sub-fraction of final time used.
Embodiment 1：
Surface dot matrix texture is carried out to glass to prepare.
(1) sample is immersed into alcohol-pickled ultrasonic cleaning 10 minutes, dried up using the compressed air that air pressure is 2bar, then it is solid
Determine on a mobile platform；
(2) laser used in is picosecond laser, pulsewidth 10ps, wavelength 355nm, and frequency is set to 200kHz, and hot spot focuses on
Size is about 20 μm afterwards, sets laser parameter according to so awful damage threshold and incident light Effective depth penetration, mean power is
0.1W, Laser Focusing is in sample surfaces.First in glass surface using pulse processing texture unit, it is 18.2 μ to measure its major axis
M, short axle are 13 μm；
(3) texture size needed for is 8 × 8mm, tangent between texture unit, then passes through calculating and setting scan rate of vibrating mirror
For 3640mm/s, distance is 13 μm, a length of 8mm of every line segment between adjacent segments, and line direction needs altogether along transverse direction
Line 615, empty hop rate degree is 5000mm/s, and processing initial point is chosen by mobile processing platform；
(4) Surface Texture prepared by is as shown in Fig. 2 used time 3.65s, process velocity 17.53mm2/ s, it is average per second
Clock prepares 74000 points；And with same laser parameter, using galvanometer by way of the point-by-point pulse exposure of laser, set
Galvanometer sky hop rate degree is 5000mm/s, prepares 150 × 200 μm of texture used time 6.76s, processing efficiency 0.0044m2/ s,
It can therefore be seen that the method speed exposed point by point relative to laser by scan method preparation texture of ruling significantly improves.
Embodiment 2：
Surface dot matrix texture is carried out to glass to prepare.
(1) alcohol-pickled ultrasonic cleaning 10 minutes will be being immersed, dried up using the compressed air that air pressure is 2bar, then fix
On a mobile platform；
(2) laser used in is picosecond laser, pulsewidth 10ps, wavelength 355nm, and frequency is set to 200kHz, and hot spot focuses on
Size is about 20 μm afterwards, sets laser parameter according to so awful damage threshold and incident light Effective depth penetration, mean power is
0.9W, Laser Focusing is in sample surfaces.First in glass surface using pulse processing texture unit, it is 13.5 μ to measure its major axis
M, short axle are 6.8 μm；
(3) texture size needed for is 8 × 8mm, tangent between texture unit, then passes through calculating and setting scan rate of vibrating mirror
For 2700mm/s, distance is 6.8 μm, a length of 8mm of every line segment between adjacent segments, and line direction needs altogether along transverse direction
Rule 1176, empty hop rate degree is 5000mm/s, and processing initial point is chosen by mobile processing platform；
(4) Surface Texture prepared by is as shown in figure 3, used time 7.14s, processing efficiency 8.96mm2/ s, average each second
Prepare 97600 points.
Embodiment 3：
Surface dot matrix texture is carried out to AlN ceramic substrate to prepare.
(1) alcohol-pickled ultrasonic cleaning 10 minutes will be being immersed, dried up using the compressed air that air pressure is 2bar, then fix
On a mobile platform；
(2) laser used in is picosecond laser, pulsewidth 10ps, wavelength 355nm, and frequency is set to 200kHz, and hot spot focuses on
Size is about 20 μm afterwards, sets laser parameter according to so awful damage threshold and incident light Effective depth penetration, mean power is
24.0W, Laser Focusing is in sample surfaces.First circular diameter is measured as 60 μm using pulse processing texture unit in glass surface；
(3) texture size needed for is 30 × 30mm, tangent between texture unit, then passes through calculating and setting vibration mirror scanning speed
Spend for 12000mm/s, distance is 60 μm, a length of 30mm of every line segment between adjacent segments, needs line 500, empty hop rate degree altogether
For 5000mm/s, processing initial point is chosen by mobile processing platform；
(4) Surface Texture prepared by is as shown in figure 4, used time 4.2s, processing efficiency 214.29mm2/ s, it is average per second
Clock prepares 60000 points.
Several embodiments, which can be seen that this method material surface periodic points configuration can be prepared with large area, more than knits
Structure, in three embodiments, process velocity is up to 214.29mm2/ s, average highest per second can prepare 97600 points.Pattern
Effect most preferably glass, is homogeneous amorphous structure, and the non-homogeneous microstructure of no material itself influences；Ceramic material is polycrystalline knot
Structure, grain size and distribution, crystal boundary thickness and distribution and glass phase, gas phase and impurity, which can all turn into, influences cycle hole array matter
The reason for amount, but totally see, this method, which is applicable laser described in claim, can make the various materials of material damage.
Claims (6)
1. the method that laser scribing scanning material prepares large area periodic points configuration Surface Texture, it is characterised in that specific step
Suddenly include：
1) sample to be processed is fixed on processing platform after surface cleaning, according to dot matrix depth and sample surfaces, regulation
Defocusing amount, ensure that focus arrives the spacing-controllable on surface, adjust beam transmission direction or processing platform angle, ensure laser beam and
Sample surfaces angle is controllable；
2) the material damage threshold value of sample, the Effective depth penetration of incident light are determined；
3) dot matrix texture unit size, material damage threshold value, the Effective depth penetration regulation laser ginseng of incident light needed for
Number, texture unit is prepared using individual pulse laser vertical sample surfaces, measures its size；If obtain texture unit size and mesh
Dimensioning is different, and laser parameter is finely tuned according to result, repeats to prepare texture unit, until its size is identical with target size, really
Laser parameter needed for the standby texture of customization；
4) the vertical score direction unit spacing L and size of texture needed for basis, laser beam scan path is set, if path is
Dry bar parallel segment, covering to be prepared texture all areas, between adjacent segments at intervals of L, the laser at laser action point
Beam is vertical with material surface；
5) laser pulse frequency f is adjusted between 50kHz~1MHz, according to required line direction unit spacing H and laser pulse
Frequency f, regulation laser line scanning speed V1, laser is acted on a pulse in sample surfaces every spacing H, sample surfaces can be with
Texture unit is produced centered on laser action focus, two pulse intervals is set as 1/f, calculates to obtain scan velocity V1=H
×f；Empty hop rate degree V is set2Pulse duty factor is set to be less than 1% for 2000mm/s~20000mm/s；
6) selection processing initial point, use step 2) -5) technological parameter, by rule scan mode sample surfaces prepare knit
Structure, set H and L to be more than or equal to the diameter R of texture unit, prepare periodic points configuration Surface Texture.
2. the method that laser high-speed as claimed in claim 1 prepares material surface texture, it is characterised in that：The laser is femtosecond
Laser, picosecond laser or nanosecond laser, and optical maser wavelength is 100nm~1064nm.
3. the method that laser high-speed as claimed in claim 1 prepares material surface texture, it is characterised in that：Sweep speed is laser
When radiation sample surface carries out texture preparation, focal position of laser translational speed, its scope is in 200mm/s~20000mm/s；Swash
Light does not go out laser and focal position of laser is moved into next scan lines starting point, the shifting after sample surfaces scan a line
Dynamic speed is empty hop rate degree, and its scope is in 2000mm/s~10000mm/s.
4. the method that laser high-speed as claimed in claim 1 prepares material surface texture, it is characterised in that：Material surface is flat
Face, curved surface or folding face.
5. the method that laser high-speed as claimed in claim 1 prepares material surface texture, it is characterised in that：Line scanning is straight line
Scanning, curve surface sweeping or zigzag scanning.
6. the method that laser high-speed as claimed in claim 1 prepares material surface texture, it is characterised in that：If required texture area
More than single process maximum area, texture is divided into several units, is processed one by one by splicing, obtains required wide area surface
Texture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710578108.2A CN107442942B (en) | 2017-07-16 | 2017-07-16 | The method that laser scribing scanning material prepares dot matrix Surface Texture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710578108.2A CN107442942B (en) | 2017-07-16 | 2017-07-16 | The method that laser scribing scanning material prepares dot matrix Surface Texture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107442942A true CN107442942A (en) | 2017-12-08 |
| CN107442942B CN107442942B (en) | 2019-02-26 |
Family
ID=60488745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710578108.2A Active CN107442942B (en) | 2017-07-16 | 2017-07-16 | The method that laser scribing scanning material prepares dot matrix Surface Texture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107442942B (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565248A (en) * | 2018-04-25 | 2018-09-21 | 大族激光科技产业集团股份有限公司 | Laser-processing system and method |
| CN108680922A (en) * | 2018-05-22 | 2018-10-19 | 闽江学院 | A kind of fish finding device using linear frequency modulation technology |
| CN109848551A (en) * | 2018-12-04 | 2019-06-07 | 北京航空航天大学 | A kind of method that ultrafast laser processing carbide-base ceramics surface micro-nano structure reduces light reflectivity |
| CN110102960A (en) * | 2019-05-30 | 2019-08-09 | 北京兆维科技开发有限公司 | A kind of method that laser scribing scanning display screen repairs light leakage defect |
| CN110614439A (en) * | 2019-08-30 | 2019-12-27 | 江苏大学 | High-reflectivity material laser connection method and device |
| CN111830605A (en) * | 2019-04-18 | 2020-10-27 | 上旸光学股份有限公司 | Optical lens with laser-induced periodic surface microstructure |
| CN112522663A (en) * | 2020-11-05 | 2021-03-19 | 浙江工业大学 | Titanium alloy surface texturing synchronous nitriding process based on scanning galvanometer |
| CN113146051A (en) * | 2021-04-23 | 2021-07-23 | 吉林大学 | High-flexibility preparation method of large-area microstructure on surface of amorphous alloy |
| CN113695748A (en) * | 2021-08-23 | 2021-11-26 | 西安交通大学 | Rapid sharkskin surface structure preparation method based on spatial light modulator |
| CN113798665A (en) * | 2021-09-17 | 2021-12-17 | 中国科学院上海光学精密机械研究所 | Laser processing method of round pits on metal surface |
| CN114147363A (en) * | 2021-12-07 | 2022-03-08 | 吉林大学 | Laser-induced amorphous carbon surface micro-nano composite structure and peripheral defect repair method |
| CN114260559A (en) * | 2021-12-22 | 2022-04-01 | 江苏大学 | Nanosecond laser scanning induction preparation method of random micropore surface |
| CN114273783A (en) * | 2022-01-06 | 2022-04-05 | 吉林大学 | Preparation method of amorphous alloy large-area super-hydrophobic surface based on nanosecond laser |
| CN115728310A (en) * | 2022-11-23 | 2023-03-03 | 北京工业大学 | Ultrafast laser material damage testing method based on point array online analysis |
| WO2023168794A1 (en) * | 2022-03-08 | 2023-09-14 | 江苏大学 | Method for regulating stress and texture morphology of superhydrophobic aluminum alloy surface prepared by laser etching |
| US12017302B2 (en) | 2022-03-08 | 2024-06-25 | Jiangsu University | Stress and texture morphology controlling method for preparing super-hydrophobic surface of aluminum alloy by laser etching |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101219770A (en) * | 2008-01-07 | 2008-07-16 | 江苏大学 | Laser modeling method for semiconductor material micro-nano multi-scale function surface |
| CN102000912A (en) * | 2010-09-21 | 2011-04-06 | 中国科学院理化技术研究所 | Laser micro/nano processing system and method |
| CN102468153A (en) * | 2010-10-29 | 2012-05-23 | 株式会社电装 | Manufacturing method of semiconductor device |
| CN102500923A (en) * | 2011-09-21 | 2012-06-20 | 长春理工大学 | Preparation device for preparing functional micro-nano materials on silicon surfaces based on femtosecond laser and method |
| CN102581478A (en) * | 2012-01-20 | 2012-07-18 | 哈尔滨工业大学 | Device and method for ultrafast picosecond pulse laser machining of super-hydrophobicity micro-structure surface |
| DE102011111998A1 (en) * | 2011-08-31 | 2013-02-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for structuring a surface |
| CN103018799A (en) * | 2012-12-17 | 2013-04-03 | 西安交通大学 | Method for preparing quasi-periodic micro-lens arrays through femtosecond laser wet etching |
| CN103521929A (en) * | 2013-10-22 | 2014-01-22 | 清华大学 | Metal die for coining super-hydrophobic micro-nanometer surface and laser manufacturing method thereof |
-
2017
- 2017-07-16 CN CN201710578108.2A patent/CN107442942B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101219770A (en) * | 2008-01-07 | 2008-07-16 | 江苏大学 | Laser modeling method for semiconductor material micro-nano multi-scale function surface |
| CN102000912A (en) * | 2010-09-21 | 2011-04-06 | 中国科学院理化技术研究所 | Laser micro/nano processing system and method |
| CN102468153A (en) * | 2010-10-29 | 2012-05-23 | 株式会社电装 | Manufacturing method of semiconductor device |
| DE102011111998A1 (en) * | 2011-08-31 | 2013-02-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Process for structuring a surface |
| CN102500923A (en) * | 2011-09-21 | 2012-06-20 | 长春理工大学 | Preparation device for preparing functional micro-nano materials on silicon surfaces based on femtosecond laser and method |
| CN102581478A (en) * | 2012-01-20 | 2012-07-18 | 哈尔滨工业大学 | Device and method for ultrafast picosecond pulse laser machining of super-hydrophobicity micro-structure surface |
| CN103018799A (en) * | 2012-12-17 | 2013-04-03 | 西安交通大学 | Method for preparing quasi-periodic micro-lens arrays through femtosecond laser wet etching |
| CN103521929A (en) * | 2013-10-22 | 2014-01-22 | 清华大学 | Metal die for coining super-hydrophobic micro-nanometer surface and laser manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 吕晓占等: "皮秒激光-化学复合法制备高效减反射晶硅表面", 《中国激光》 * |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565248A (en) * | 2018-04-25 | 2018-09-21 | 大族激光科技产业集团股份有限公司 | Laser-processing system and method |
| CN108680922B (en) * | 2018-05-22 | 2023-10-27 | 闽江学院 | Fish finder adopting linear frequency modulation technology |
| CN108680922A (en) * | 2018-05-22 | 2018-10-19 | 闽江学院 | A kind of fish finding device using linear frequency modulation technology |
| CN109848551A (en) * | 2018-12-04 | 2019-06-07 | 北京航空航天大学 | A kind of method that ultrafast laser processing carbide-base ceramics surface micro-nano structure reduces light reflectivity |
| CN111830605A (en) * | 2019-04-18 | 2020-10-27 | 上旸光学股份有限公司 | Optical lens with laser-induced periodic surface microstructure |
| CN110102960A (en) * | 2019-05-30 | 2019-08-09 | 北京兆维科技开发有限公司 | A kind of method that laser scribing scanning display screen repairs light leakage defect |
| CN110614439A (en) * | 2019-08-30 | 2019-12-27 | 江苏大学 | High-reflectivity material laser connection method and device |
| CN112522663A (en) * | 2020-11-05 | 2021-03-19 | 浙江工业大学 | Titanium alloy surface texturing synchronous nitriding process based on scanning galvanometer |
| CN113146051A (en) * | 2021-04-23 | 2021-07-23 | 吉林大学 | High-flexibility preparation method of large-area microstructure on surface of amorphous alloy |
| CN113695748A (en) * | 2021-08-23 | 2021-11-26 | 西安交通大学 | Rapid sharkskin surface structure preparation method based on spatial light modulator |
| CN113798665A (en) * | 2021-09-17 | 2021-12-17 | 中国科学院上海光学精密机械研究所 | Laser processing method of round pits on metal surface |
| CN113798665B (en) * | 2021-09-17 | 2024-04-12 | 中国科学院上海光学精密机械研究所 | Laser processing method for round pits on metal surface |
| CN114147363A (en) * | 2021-12-07 | 2022-03-08 | 吉林大学 | Laser-induced amorphous carbon surface micro-nano composite structure and peripheral defect repair method |
| CN114147363B (en) * | 2021-12-07 | 2024-03-22 | 吉林大学 | Laser-induced amorphous carbon surface micro-nano composite structure and peripheral defect repairing method |
| CN114260559A (en) * | 2021-12-22 | 2022-04-01 | 江苏大学 | Nanosecond laser scanning induction preparation method of random micropore surface |
| CN114273783A (en) * | 2022-01-06 | 2022-04-05 | 吉林大学 | Preparation method of amorphous alloy large-area super-hydrophobic surface based on nanosecond laser |
| WO2023168794A1 (en) * | 2022-03-08 | 2023-09-14 | 江苏大学 | Method for regulating stress and texture morphology of superhydrophobic aluminum alloy surface prepared by laser etching |
| US12017302B2 (en) | 2022-03-08 | 2024-06-25 | Jiangsu University | Stress and texture morphology controlling method for preparing super-hydrophobic surface of aluminum alloy by laser etching |
| CN115728310A (en) * | 2022-11-23 | 2023-03-03 | 北京工业大学 | Ultrafast laser material damage testing method based on point array online analysis |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107442942B (en) | 2019-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107442942B (en) | The method that laser scribing scanning material prepares dot matrix Surface Texture | |
| Phillips et al. | Ultrafast laser processing of materials: a review | |
| CN102017088B (en) | Engineering flat surfaces on materials doped via pulsed laser irradiation | |
| Chen et al. | Multi-scale micro-nano structures prepared by laser cleaning assisted laser ablation for broadband ultralow reflectivity silicon surfaces in ambient air | |
| CN102528276B (en) | Laser-assisted surface treatment method for increasing light transmittance of TCO film | |
| CN103658993A (en) | Crystal silicon surface femtosecond laser selective ablation method based on electron dynamic control | |
| CN101652866B (en) | Method for manufacturing photovoltaic device | |
| CN105834589A (en) | Device and method for preparing microstructure on surface of silicon crystal through femtosecond laser filaments | |
| CN102336393A (en) | Method for preparing hydrophobic micro-structure on surface of organic glass through femtosecond laser | |
| CN102581478A (en) | Device and method for ultrafast picosecond pulse laser machining of super-hydrophobicity micro-structure surface | |
| CN1720117A (en) | Device and method for laser processing | |
| CN101971363A (en) | Partially transparent solar panel | |
| CN102581484B (en) | Method for preparing silicon-based surface light trapping structure by utilizing ultrashort pulse laser | |
| CN102791419A (en) | Method and apparatus for scribing a line in a thin film using a series of laser pulses | |
| CN207057852U (en) | A kind of laser marking machine | |
| CN110014224A (en) | The femtosecond laser high efficient production device of infrared anti-reflection micro-structure | |
| CN104625417A (en) | Method for controlling topography of nickel surface through femtosecond laser based on electronic dynamic control | |
| CN109483058A (en) | A method of rapid large-area remotely prepares super-hydrophobic antireflex structure on irregular metal curved surface | |
| CN101502919A (en) | Device and method for preparing polyvinylidene fluoride with ultra-hydrophobic surface | |
| Wang et al. | Direct fabrication of cone array microstructure on monocrystalline silicon surface by femtosecond laser texturing | |
| CN107999976A (en) | One kind has wearability and hydrophobic metal surface micro-structure preparation method | |
| CN102893409A (en) | Manufacturing method and manufacturing device for photovoltaic device | |
| CN110142510A (en) | Laser soldering device and its method for metal nano element | |
| CN104900487A (en) | Method and apparatus for preparing black silica by adopting lattice scanning | |
| CN103848392B (en) | The manufacture method of the black silicon of large area that a kind of micro structure cycle is controlled |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |