CN107438897A - Carrier system for pending substrate - Google Patents
Carrier system for pending substrate Download PDFInfo
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- CN107438897A CN107438897A CN201580078653.4A CN201580078653A CN107438897A CN 107438897 A CN107438897 A CN 107438897A CN 201580078653 A CN201580078653 A CN 201580078653A CN 107438897 A CN107438897 A CN 107438897A
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- carrier
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
This document describes a kind of carrier system for pending substrate.The carrier system includes main carrier (100), and the main carrier (100) includes being used for one or more secondary carriers (400；800) it is couple to the secondary carrier coupling device (201) of main carrier (100).The main carrier (100) is included with the secondary carrier support component (120) with the mesh shape for intersecting grid (121), wherein secondary carrier coupling device (201) is provided at grid (121) place.The carrier system also includes being used for the secondary carrier (400 for supporting one or more pending substrates (500)；800), wherein secondary carrier (400；800) one or more openings (422) are included.Secondary carrier (400；800) also include being used for the substrate coupling device (430 for coupling substrate (500)；431), wherein substrate coupling device (430；431) it is arranged to substrate (500) being maintained at and secondary carrier (400；800) opening (422) partly overlapping position.
Description
Technical field
Embodiments of the present invention are related to a kind of carrier system for being used for bearing substrate during processing.The implementation of the present invention
Mode is specifically related to the carrier system with main carrier and secondary carrier, is particularly directed to carry in vacuum technology pending
Substrate, there is the carrier system of main carrier and secondary carrier.
Background technology
Become known for the several method in depositing materials on substrates.For example, physical vapour deposition (PVD) (PVD) work can be passed through
Skill, chemical vapor deposition (CVD) technique, plasma enhanced chemical vapor deposition (PECVD) technique etc. carry out coated substrate.It is logical
Often, the technique is carried out in the processing equipment or processing chamber housing that substrate to be coated is located at.It is heavy to provide in the apparatus
Product material.The oxide of multiple material or the multiple material, nitride or carbide, can be used for being deposited on base
On plate.
The material of coating can be used for some applications and neutralize in some technical fields.For example, in the application of microelectronic
In, such as generate semiconductor device.In addition, the substrate for display is generally coated by PVD.Other application includes
Insulation board, battery, Organic Light Emitting Diode (OLED) panel, the substrate with TET, colour filter or the like.
In coating processes or other depositing operations, substrate is usefully supported in the carrier.For example, substrate can be filled
Carry in the carrier, carrier is then transported through into substrate processing apparatus or depositing device, stacked with the sedimentary on substrate or layer.
Carrier can be used for one or more substrates during deposition.
Multiple smaller pieces that one or more substrates are wherein separated into the size corresponding to device to be manufactured also be present
(small substrate), and the small substrate corresponds to the processing substrate application of pending device size.For example, can be by layer or layer
It is 1m that stacking, which is deposited on size,2Or on smaller substrate.Deposition on multiple substrates with device size is advantageously still
Carried out in large area scale, i.e., corresponding to large-area substrates (such as 1.2m2Or it is bigger) processing region in carry out.One
, can be by the multiple substrates of carrier supported in a little systems, or the pending substrate of carrying can be provided and be coupled to main carrier
Secondary carrier.
In view of the foregoing, the purpose of each embodiment be to provide for carry pending one or more substrates, gram
Secondary carrier, main carrier and the carrier system of at least some problems in this area are taken.
The content of the invention
It is in view of above-mentioned, there is provided according to independent claims for the secondary carrier of pending substrate, for application of vacuum
Main carrier, the carrier system of equipment, and the method for transmitting heat.Other aspect, advantages and features are according to appurtenance
It is required that, specification and drawings it is apparent.
According to one, embodiment there is provided the secondary carrier for staying in the substrate handled in vacuum chamber.Secondary carrier bag
The substrate holding portion with substrate holding portion surface is included, it is one or more to be arranged to support for wherein substrate holding portion
Pending substrate.Substrate holding portion includes one or more be open.Secondary carrier also includes substrate coupling device, the substrate coupling
Connection device is arranged at least one substrate being maintained on substrate holding portion surface and substrate is open with one or more
Overlapping opening position at least in part.In addition, secondary carrier is configured as being coupled to main carrier.
Embodiment there is provided a kind of main carrier for vacuum treatment device according to another.Main carrier includes main carrier
Framework and the secondary carrier support component surrounded by main carrier framework.Secondary carrier support component has with the grid for intersecting grid
(grid) shape, the intersection grid are configured to support one or more secondary carriers for pending substrate.
Embodiment there is provided a kind of carrier system for pending substrate according to another.Carrier system includes main load
Body, the main carrier include being used for the secondary carrier coupling device that one or more secondary carriers are couple to main carrier.The main load
Body is included with the secondary carrier support component with the mesh shape for intersecting grid, wherein secondary carrier coupling device is provided in grid
Place.The carrier system also includes being used to support the secondary carrier of at least one pending substrate, wherein secondary carrier include one or
Multiple openings.Secondary carrier also includes being used for the substrate coupling device for coupling at least one substrate, wherein substrate coupling device
It is arranged to substrate being maintained at the opening portion of secondary carrier overlapping position.
According to it is another embodiment there is provided it is a kind of be used in carrier system transmit heat method.Methods described bag
Offer main carrier is included, the main carrier includes main carrier framework and secondary carrier support component, and the secondary carrier support component is by institute
Main carrier framework is stated to surround and be configured to support for waiting to locate with the mesh shape with intersection grid, the intersection grid
Manage at least one secondary carrier of substrate.Main carrier also includes the pair of a grid for being couple to secondary carrier in multiple grids
Carrier coupling device.Methods described also including the use of secondary carrier coupling device with secondary carrier side between the grid of main carrier
Secondary carrier is connected to main carrier by the opening position of mesh openings.
Embodiment further relates to the equipment for performing disclosed method and including for performing each methods described
The multiple equipment part of step.These method and steps can by hardware component, by appropriate software programming computer, pass through two
Any combinations of person perform in any other manner.In addition, embodiment can also relate to for making described equipment
The method of running.Methods described includes being used to perform the method and step of each function of equipment.
Brief description of the drawings
Therefore, can be by reference to embodiment in a manner of it the features described above of present disclosure can be understood in detail
The present disclosure of above-mentioned brief overview is more particularly described.Accompanying drawing is related to the embodiment of present disclosure, and
Describe below：
Fig. 1 shows the schematic diagram of the main carrier according to embodiment as described herein；
Fig. 2 a to Fig. 2 e show the schematic diagram of the details of the main carrier according to embodiment as described herein；
Fig. 3 shows the schematic diagram for the main carrier for having secondary carrier supported device according to embodiment as described herein；
Fig. 4 a and Fig. 4 b show the front side of secondary carrier and the schematic diagram of dorsal part according to embodiment as described herein；
Fig. 5 shows the schematic diagram of the secondary carrier according to embodiment as described herein；
Fig. 6 a to Fig. 6 c show the through hole in the secondary carrier according to embodiment as described herein
(breakthrough) schematic diagram of shape；
Fig. 7 a and Fig. 7 b show the schematic diagram of the baseplate support device of the secondary carrier according to embodiment as described herein；
Fig. 8 shows the schematic diagram of the secondary carrier with mask according to embodiment as described herein；
Fig. 9 a and Fig. 9 b show the schematic diagram of the carrier system according to embodiment as described herein；And
Figure 10 shows the stream for being used to transmit the method for heat in carrier system according to embodiment as described herein
Cheng Tu.
Embodiment
Various embodiments will be addressed in detail now, one or more examples of the embodiment are shown in Zhu Tuzhong.
In the following description of accompanying drawing, identical reference represents identical part.Generally, the difference of individual embodiments is only described
It is different.Each embodiment is by providing present invention explanation, and being not meant as limitation.In addition, as one
The feature that a part for embodiment shows or described can be used in other embodiment or combined with other embodiment
Using to produce another embodiment.Description is intended to include such modifications and variations.
In addition, in the following description, main carrier is construed as supporting the carrier of one or more secondary carriers.Root
According to some embodiments, the corresponding coupling that main carrier can provide for one or more secondary carriers to be couple to main carrier fills
Put.In one example, main carrier is not to be arranged to one or more substrates being couple to main carrier.The pair being mentioned above
Carrier is construed as the carrier of substrate, and the carrier can be couple to main carrier, such as to provide in the processing chamber.Will
Secondary carrier is couple to main carrier and may mean that secondary carrier can be moved through processing chamber housing together with main carrier or processing is set
It is standby.According to some embodiments, secondary carrier can provide the corresponding coupling device for being couple to main carrier.In some embodiment party
In formula, main carrier is adapted to be used to be moved through processing chamber housing or processing equipment, such as by including allowing to transmit main carrier
By the mobile device (such as guide rail) of processing chamber housing, for the connection for the transmission system being connected to main carrier in processing chamber housing
Device, slidingsurface, roller and analog.Generally, secondary carrier includes being used for the coupling device that substrate is couple to secondary carrier.
The coupling device being mentioned above is construed as the device for supporting, carrying, be attached or fix.Specifically,
Substrate can such as be coupled, be attached with adapted for being coupled a part, being attached or fixed to another part by coupling device
Or fixed to secondary carrier, or by secondary carrier coupling, be attached or fixed to main carrier.In one example, coupling device can be with
It is adapted to be used to substrate or secondary carrier are clamped into (grip) for example during depositing operation or be maintained at defined position.Coupling device
The weight for carrying the part (such as substrate or secondary carrier) being coupled to can be allowed.
In addition, grid is construed as with the pattern for intersecting grizzly bar and the opening between the intersection grizzly bar.Example
Such as, grid can have the more than one mesh openings surrounded by grid.In some embodiments, mesh openings can have
The shape of substantial rectangular.Generally, grid can be provided in about 90 ° between intersection grid of angle.According to some embodiments,
90 °, such as 80 °, 70 ° can be less than or less than 70 ° by intersecting the angle between grid.Generally, around the lattice of the angle less than 90 °
Grid can be included with other grids of (such as 100 °, 110 °, or the even above 110 °) intersections of angle higher than 90 °.At it
In his embodiment, mesh openings have the shape for deviateing rectangular shape, such as circle, triangle, polygon, asymmetrically shape
And analogous shape.
As set forth above, it is possible to substrate is transported through for performing the processing system of technique (such as depositing operation) or in institute
State in processing system and transmit.Heat may be undergone for some techniques, processing chamber housing or for the miscellaneous part of pending processing
Input, such as by heating chamber, or by using with the elevated temperature compared with the temperature outside processing chamber housing
Material.Pending substrate is also possible to be subjected to high temperature, such as by the temperature in processing chamber housing, or by being deposited on substrate and having
There are the deposition materials of high temperature.When substrate is subjected to high temperature, the characteristic of substrate may change, such as surface adhesive.If in addition,
Material with low melting point is deposited over on the substrate close to the temperature of the fusing point, then possibly can not be with gratifying
Mode adheres to material to be deposited on substrate, such as the viscosity of material to be deposited became on the substrate with high temperature
It is low.Embodiment as described herein refers to allow substrate temperature is maintained at into a range of carrier system during processing.
Embodiment there is provided a kind of main carrier for vacuum treatment device according to as described herein.Main carrier includes
Main carrier framework and the secondary carrier support component surrounded by main carrier framework.Generally, secondary carrier support component substantially has band
Intersect the mesh shape of grid, the intersection grid is configured to support one or more secondary carriers for pending substrate.
Fig. 1 shows the main carrier 100 according to embodiment as described herein.Main carrier 100 includes main carrier framework 110
With the secondary carrier support component 120 surrounded by main carrier framework 110.According to some embodiments as described herein, secondary carrier branch
Support part point 110 substantially has mesh shape.As it will be seen from figure 1 that secondary carrier support component 120 can include grid 121
With mesh openings 122.In some embodiments, grid 121 surrounds mesh openings.According to embodiment as described herein, net
Lattice include intersecting grid, as described in detail.Grid is shown as the mesh openings around substantial rectangular.This area
Technical staff will be understood that embodiment as described herein is not limited to the mesh openings shape of rectangle.The main carrier support of main carrier
Partial mesh openings can have any suitable shape, such as circle, triangle, polygon, asymmetrically shape and similar
Shape.Intersect the shape that grid can adapt to mesh openings.In one embodiment, the secondary carrier support component of main carrier
Can by the plate shape with opening into.
According to some embodiments, the grid of secondary carrier support component includes more than one opening.Fig. 1 embodiment is shown
12 mesh openings and corresponding surrounding grid are gone out.It will be understood by those skilled in the art that embodiment as described herein is unlimited
In the main carrier with 12 openings.It can be open according to the main carrier of embodiment described herein having less than 12, such as
10,8,6 or 2 openings.According to other embodiment, main carrier support section can include opening more than 12 grids
Mouthful, such as 16,24, or even more than 24 mesh openings, such as 50,60 or 80 mesh openings.
According to some embodiments, the grid of secondary carrier support component can be configured to be used in vacuum treatment device for support
In pending substrate one or more secondary carriers.For example, grid can have corresponding size, so as to by secondary carrier
One or more secondary carriers and substrate keep together (such as by sufficiently stable so that the weight of secondary carrier and substrate to be kept
Together).It is used to keep weight generally between 100g and 1kg, more generally in 200g and 1kg for example, grid can have
Between, even more typically in the size of the secondary carrier between 200g and 600g.In one embodiment, secondary carrier
Weight can be 300g.According to some embodiments, grid can with the adapted weight for being used to carry several secondary carriers,
It is usually such as 2 to 20 secondary carriers, more typically 4 to 16 secondary carriers, is even more typically 6 to 14 secondary carriers.
In one example, a grid is sized to carry the weight of eight secondary carriers.It will be apparent to one skilled in the art that lattice
Grid are not only sized to carry the weight of one or more secondary carriers, but also carrying is couple to the weight of the substrate of secondary carrier
Amount.In one example, substrate can have the weight in the range of several grams, such as usually less than 20g, be more typically less than 10g,
And even it is more typically less than 5g.
In one example, grid can be by suitable for carrying secondary carrier and base during the technique application of vacuum chamber
The material of plate is made.For example, grid can be made up of the material for bearing process conditions, the process conditions are such as to change temperature
Condition, heat input, pressure change, etch presence and the conditions of similarity of material.Such as, it may be considered that the ginseng related to vacuum technology
(such as outgassing rate, wearability, temperature tolerance and similar parameters) are counted to select material.According to some embodiments, main carrier (and/
Or secondary carrier) aluminium, stainless steel, ceramics, titanium and analog can be included.
According to some embodiments as described herein, the length of main carrier can be generally between 0.5m and 2.0m, more
Normally between 1.0m and 2.0m, and even more typically between 1.2m and 2.0m.In one example, main carrier
Length can be 1.6m.According to some embodiments described herein, the width of main carrier can be generally in 0.3m and 2.0m
Between, more generally between 0.5m and 1.8m, and even more typically between 1.0m and 1.5m.In one example,
The length of main carrier can be 1.25m.
In some embodiments, main carrier provides the secondary carrier coupling device for secondary carrier to be couple to main carrier.
Specifically, the grid of the grid of secondary carrier support component can with it is adapted be to include or have been attached to secondary carrier coupling device.
Generally, secondary carrier coupling device can be attached to main carrier, be such as soldered to main carrier, be attached to main load by adhesive
Body, it is clamped to main carrier, the part as main carrier, and similar fashion.Fig. 2 a to Fig. 2 e show Fig. 1 part A not
Same embodiment.Specifically, Fig. 2 a to Fig. 2 e show the different embodiments of secondary carrier coupling device, secondary carrier coupling device
Grid can be helped to keep secondary carrier during processing.
Fig. 2 a show the example for providing the secondary carrier coupling device 201 at main carrier 100.Secondary carrier coupling device
201 are provided as a type of hook (hook), and secondary carrier can be attached at the hook, such as passes through corresponding coupling device
(such as opening or groove).According to some embodiments, hook 201 can be used to keep secondary carrier with adapted, such as by through suitable
It is used in the weight for keeping secondary carrier and allows the size of secondary carrier to be kept by hook.Embodiment shown in Fig. 2 a shows two
Hook 201.It will be understood by those skilled in the art that the quantity of the hook as secondary carrier coupling device is not limited to the embodiment party shown in Fig. 2 a
Formula.For example, the quantity of the secondary carrier coupling device of a secondary carrier can be one or more than two, such as 3,4,5
Or more than 5 secondary carrier coupling devices.In one embodiment, the quantity of secondary carrier coupling device depends on master to be couple to
The size and weight of the secondary carrier of carrier.
Fig. 2 b show an embodiment of secondary carrier coupling device 202, and the secondary carrier coupling device 202 includes being used for
Secondary carrier is clamped to the fixture of main carrier 100.In one embodiment, fixture 202 can include being used in secondary carrier
Apply the clamping power apparatus of chucking power, such as spring or similar device.Clamping power apparatus can be arranged at least handling
Period applies sufficiently high chucking power to keep secondary carrier.Fixture 202 can include clamping surface, and the clamping surface is adapted
Into being contacted during processing with secondary carrier.For example, clamping surface can include the material with appropriate coefficient of friction, the material
Allow secondary carrier being maintained at clamping surface.
Fig. 2 c show an embodiment of the main carrier 100 with secondary carrier coupling device 203.Fig. 2 c embodiment
Shown in secondary carrier coupling device 203 include two grizzly bars or bar, the grizzly bar or bar allow by it is to be attached have it is corresponding
The secondary carrier of shape is couple to main carrier.For example, secondary carrier can include coupling opening, grizzly bar 203 can be bonded on the coupling
Connect in opening for the secondary carrier of holding.According to some embodiments, the grizzly bar, which can have, to be used to improve grizzly bar and secondary load
The structuring of contact between body or patterned surface.
Fig. 2 d show an embodiment of the main carrier 100 with secondary carrier coupling device 204.In Fig. 2 d embodiment party
The secondary carrier coupling device 204 shown in formula includes being used for two openings that secondary carrier is couple to main carrier 100.Opening 204
Can be with the adapted appropriate section for being used to receive secondary carrier, the grizzly bar or bar such as fitted in opening 204.According to some implementations
Mode, opening 204 can include hole and the fellow of the hole of substantial orthogonality, bent hole, structuring or patterning, for example, with
Coupling between the secondary carrier of improvement and main carrier.
Fig. 2 e show an embodiment of main carrier 100, and the main carrier has the mesh openings provided in main carrier
Secondary carrier coupling device in 122.Secondary carrier coupling device shown in Fig. 2 d embodiment includes two fins (flap)
205, the fin can be used for secondary carrier being couple to main carrier 100.In some embodiments, fin 205 can be through suitable
It is used between the clamping of secondary carrier, being attached or be fixed on each fin, such as secondary carrier to be provided in mesh openings 122
In.In one embodiment, fin 205 can include clamping surface, and the clamping surface is used to secondary carrier being clamped in respectively
Between fin 205.
According to some embodiments, on the feature of Fig. 2 a descriptions, all size, sizes as mentioned by secondary carrier coupling device
And quantity, the embodiment shown in Fig. 2 b to Fig. 2 e can also be applied to.In some embodiments, can combine on Fig. 2 a
The feature exemplarily described to Fig. 2 d, as long as the feature not contradiction each other.For example, clamping device can have in addition
For the multiple openings for the position for limiting secondary carrier.Can be that only there is a secondary load shown in Fig. 2 b in another example
The embodiment selection number of body coupling device is two secondary carrier coupling devices.
According to embodiment as described herein, a coupling device can be used to support a secondary carrier with adapted.At it
In his embodiment, a secondary carrier, such as Fig. 2 a, Fig. 2 c, figure can be coupled using more than one secondary carrier coupling device
Secondary carrier coupling device 201,203,204 and 205 shown in 2d and Fig. 2 e.
In some embodiments, to provide supported by main carrier secondary carrier to a mesh openings 122.One
In individual example, a secondary carrier is placed on before an opening of main carrier.According to some embodiments, a secondary carrier
It is also described as in face of an opening of main carrier or a superposition of end gap with main carrier.For example, in fig. 2 a, two
Secondary carrier coupling device 201 is adapted and/or is placed as being placed on before mesh openings 122 or in face of the net for carrying
One secondary carrier of lattice opening 122.In other embodiments, a secondary carrier can be placed on more than one mesh openings
Before, such as before two or three openings of main carrier or in face of described two or three openings.According to other realities
Mode is applied, the main carrier with mesh openings goes for different secondary carrier size and type so that a first kind
Secondary carrier can be placed on before a mesh openings, and the secondary carrier of a Second Type can be placed on more than one
Before individual mesh openings.In one example, secondary carrier coupling device could be applicable to the secondary carrier of different sizes and type.
The lattice of grid of the secondary carrier coupling device offer in main carrier are such as provided from Fig. 2 a to Fig. 2 e embodiment
At grid, the grid generally surrounds mesh openings 122.According to some embodiments, grid can be provided between mesh openings
And the mesh openings can be surrounded.According to embodiment as described herein, grid is adapted to be used to provide secondary carrier coupling
Device.In some embodiments, the outermost grid of secondary carrier support component is adjacent with main carrier framework, as Fig. 3 can example
Shown in property.
Fig. 3 shows main carrier 100, and the main carrier includes main carrier framework 110 and secondary carrier support component 120, institute
Stating secondary carrier support component has grid 121 and mesh openings 122.According to some embodiments, the lattice of outermost opening 122
Grid, the grid of the mesh openings of the first row 123 such as in each opening are adjacent with main carrier framework 110.Generally, grid
Secondary carrier coupling device is provided, and main carrier framework does not provide secondary carrier coupling device.According to some embodiments, main carrier
Framework 110 can with it is adapted be used for main carrier is transmitted by processing equipment, such as it is adapted be used for ensure to main carrier
Appropriate transmission.In one example, the framework of main carrier can include transmission enabled device.For example, the framework 110 of main carrier can
So that the region of main carrier can be caught including the part for engaging guide rail, guide rail or track, the roller connected, transport mechanism
Part and similar portions.
In one example, grid can be around mesh openings main carrier a part, and width be about 1cm extremely
About 20cm, more generally about 2cm is to about 15cm, and is even more typically about 3cm to about 10cm.Fig. 3 also show secondary load
Body coupling device 205, it is used to secondary carrier being couple to main load to the secondary carrier coupling device 205 such as Fig. 2 e exemplary descriptions
Body.According to some embodiments, secondary carrier support component can be recessed compared with carrier frame, or can include being used for secondary carry
The groove of body, such as a groove are used for a secondary carrier, wherein secondary carrier is fitted in the groove.
Embodiment there is provided the secondary carrier for staying in the substrate handled in vacuum chamber according to as described herein.It is secondary
Carrier includes the substrate holding portion with substrate holding portion surface.In addition, substrate holding portion is arranged to support one
Individual or multiple pending substrates.One or more be open is included according to the substrate holding portion of embodiment as described herein.It is secondary
Carrier also includes substrate coupling device, and the substrate coupling device is arranged to substrate being maintained at substrate holding portion surface
Upper and substrate and one or more opening positions overlapping at least in part that are open.Secondary carrier is further configured to be couple to main load
Body.
Fig. 4 a and Fig. 4 b show an embodiment of the secondary carrier according to implementations described herein.Fig. 4 a are shown
The front side of secondary carrier 400.Fig. 4 b show the rear side of secondary carrier 400.According to some embodiments as described herein, secondary carrier bag
Include the opening 422 in substrate holding portion 420 and substrate holding portion 420.Generally, when substrate is installed into secondary carrier, base
Plate support section 420 can contact with substrate at least in part.Substrate holding portion 420 generally includes substrate holding portion surface
421.Substrate holding portion surface is construed as the surface that can provide substrate thereon to be carried by secondary carrier.According to some
Embodiment, substrate holding portion surface are to face substrate by the surface for the technique being subjected to.For example, when will be carried by secondary carrier
When substrate will be subjected to depositing operation, substrate holding portion surface can be towards depositing operation.According to some embodiments, substrate branch
Support part point can be depression, or can include the groove for substrate, such as a groove is used for a substrate, wherein base
Plate is fitted in the groove.
According to some embodiments that will be described in detail below, secondary carrier 400 includes substrate coupling device, the substrate
Coupling device is positioned such that the substrate that substrate is on the substrate holding portion surface of secondary carrier is open with one or more
Overlapping position at least in part.
The substrate of " with superposition of end gap " is construed as the substrate towards opening, or the substrate before opening.
According to some embodiments, the substrate with superposition of end gap can be described as covering the opening.Specifically, only with opening portion
The overlapping substrate in ground might mean that the only a part and superposition of end gap of substrate.However, in some embodiments, only with opening
Partly opening can be completely covered in overlapping substrate.Another part of substrate can be with the substrate holding portion surface weight of secondary carrier
It is folded.The substrate coupling device of secondary carrier be placed and it is adapted be used for ensure suitably to position according to embodiment as described herein
Substrate.The foregoing description of term " overlapping " can also be applied to be described as the miscellaneous part to overlap each other, such as secondary carrier
With the opening of main carrier.
In some embodiments, secondary carrier or substrate holding portion can be used to support and secondary carrier or secondary load with adapted
The substrate support of body partially overlapping substrate.For example, secondary carrier or substrate holding portion are configured such that base
The boundary member of plate is overlapping with secondary carrier or substrate holding portion.In one example, the width of the boundary member of substrate can be with
Usually between 0.5mm and 10mm, more generally between 1mm and 8mm and even more typically in 1mm and 5mm it
Between.According to some embodiments, substrate holding portion surface can be through handling with overlapping with substrate, such as to be contacted with substrate.
In one example, substrate holding portion surface (or each several part on substrate holding portion surface) can be with surface treatment
Reason, with the roughness with determination, the hardness determined, the uniformity and similar aspect determined.
According to some embodiments, secondary carrier as described herein can be configured as being supported, be attached or fixed to master
Carrier, main carrier such as described above.Fig. 4 b show the rearview of the secondary carrier 400 shown in Fig. 4 a.In an embodiment party
In formula, when keeping secondary carrier by main carrier, the dorsal part of secondary carrier can also be represented as the side towards main carrier.Fig. 4 b show
Go out for allowing the main carrier coupling device for making secondary carrier be carried by main carrier.In the embodiment shown in Fig. 4 b, main load
Body coupling device 401 includes groove or opening, and the groove or opening go for receiving the secondary carrier coupling dress of main carrier
Put.For example, being designed as the secondary carrier coupling device 201 and 203 of hook or grizzly bar can be joined in opening 401.
Fig. 5 shows an embodiment of the dorsal part of secondary carrier 400.Secondary carrier 400 can be configured to couple to main load
Body and main carrier coupling device can be included.Main carrier coupling device shown in Fig. 5 can be provided in the form of groove 405,
Wherein secondary carrier coupling device (for example, the secondary carrier coupling device provided as fin 205) can be bonded in the groove
So that secondary carrier is couple into main carrier.
According to some embodiments, secondary carrier can include being used to allow the master for secondary carrier being coupled or being attached to main carrier
Carrier coupling device, such as exemplary description in Fig. 2 a to Fig. 2 e.However, main carrier coupling device and secondary carrier coupling device
It is not limited to shown embodiment.
According to embodiment as described herein, pending substrate that the opening of secondary carrier can be in vacuum technology is set
Meter.For example, the quantity of opening may rely on pending substrate.In one embodiment, secondary carrier be configured such that for
One substrate provides an opening.As set forth above, it is possible to corresponding substrate coupling device is provided, it is suitable with substrate to ensure to be open
Work as alignment.In some embodiments, more than one opening is provided as facing a substrate.For example, when substrate is couple to pair
During carrier, two openings 423,424 can be provided as being covered by a substrate (referring to Fig. 5 as example).The technology of this area
Personnel will be understood that more than two opening may be provided in by a substrate covering (for example, four are opened in some embodiments
Mouth is provided as being covered by a substrate).According to some embodiments, secondary carrier can be suitable for, such as by making base
Plate coupling device is suitable for various sizes of substrate.It is, for example, possible to use the substrate of a first kind covers the one of secondary carrier
Individual opening.The substrate of one Second Type can be with two or more superposition of end gap of secondary carrier.
In some embodiments, the position of the opening of secondary carrier may rely on the type of pending substrate.It is for example, secondary
The distance of the opening of carrier can select according to the quantity and size of pending substrate.In addition, the size of opening can rely on
In the type of pending substrate.According to some embodiments, the size of an opening is usual the 30% of size of substrate and 95%
Between, more generally between the 40% of size of substrate and 90% and even more typically in by by the base of secondary carrier supported
Between the 50% of the size of plate and 80%.In some embodiments, secondary carrier can also include being used to limit substrate position
Groove (for example, on substrate holding portion surface).It is in face of one when more than one opening is adapted in each embodiment
During substrate, for one substrate the more than one opening total size the size of substrate usual 30% with
Between 95%, more generally between the 40% of the size of substrate and 90% and even more typically in will be by secondary carrier
Between the 50% of the size of the substrate of support and 90%.For example, the total size of two openings of secondary carrier can be size of substrate
About 85%.
The size of substrate is construed as being intended to the size in the region for being subjected to technique.For example, it is subjected to the area of depositing operation
Domain is considered the size of substrate.According to some embodiments, before the size of opening can be described as be in secondary carrier
The area of opening at side, the front side can be towards the side of the technique.For example, the size of opening can be described as
In the plane with substrate, or in plane substantially parallel with substrate in the mounted state.In one embodiment,
It can measure the size of substrate in vertical direction if vertical process is performed, or can be if horizontal techniques are performed
The size of substrate is measured in horizontal direction.
According to some embodiments, the shape of opening may rely on pending substrate.Fig. 6 a to Fig. 6 c show secondary load
The different shape of the opening 122 of body.Fig. 6 a show the rectangular shape of the opening of secondary carrier, and Fig. 6 b show the circular shape of opening
Shape (such as similar round shape), and Fig. 6 c show the regular polygon shape of opening.It will be apparent to one skilled in the art that secondary carry
The opening of body can have any suitable shape for being used for that heat such as by heat radiation, to be conducted off to substrate.In addition, open
The shape of mouth may rely on the shape of pending substrate.According to some that can be combined with other embodiment as described herein
Embodiment, one or more openings of substrate holding portion can have than suitable for face at suitable for the side towards substrate
The diameter bigger to the side of main carrier.
Generally, opening can allow to carry out more preferable heat radiation to substrate, particularly in vacuum environment.During processing
Absorbed heat can be sent at least in part by the opening in carrier by being subjected to the substrate of elevated temperature.According to some realities
Mode is applied, substrate can be cooled down by the opening in secondary carrier and/or main carrier.For example, if the temperature of substrate becomes too high,
The technique to be carried out on substrate may lose quality.In one example, material deposition process will be performed on substrate.Such as
Fruit substrate have close to or material even above to be deposited fusing point temperature, then the material layer being deposited on material may be again
Secondary fusing, and only insufficient amount of material is adhered on substrate.
In some embodiments, the opening of secondary carrier can be configured and positioned such that the opening of secondary carrier and main load
The opening of body overlaps.By main carrier and the coinciding openings of secondary carrier, the heat radiation from substrate can be improved.For example, substrate
Secondary carrier can be couple in the opening position of substrate and the superposition of end gap of secondary carrier.In addition, according to the example, secondary carrier can be with coupling
Be connected to main carrier so that secondary carrier (and substrate together with secondary carrier during operation) in face of main carrier opening and/or
With the superposition of end gap of main carrier.The substrate for being couple to secondary carrier in the manner described and the secondary carrier for being couple to main carrier allow
Improve the heat radiation from substrate.
Fig. 7 a and Fig. 7 b show the substrate coupling device that is provided according to embodiment as described herein on secondary carrier
Each embodiment.Specifically, Fig. 7 a and Fig. 7 b show the enlarged drawing of the embodiment of part B as shown in fig. 4 a.Generally, base
Plate coupling device can be provided on the secondary carrier on substrate holding portion surface.In some embodiments, can be by attached
Connect, fix, welding, the glued or structure division by being used as secondary carrier provides substrate coupling device on secondary carrier.
Fig. 7 a show the substrate coupling device 430 provided by two fixtures.When substrate is clamped by fixture, fixture can be with
The clamping surface contacted with substrate is provided.According to some embodiments, a fixture can be provided for a substrate.According to other
Embodiment, more than one fixture, such as the more than one opening weight in substrate and secondary carrier can be provided for a substrate
In the case of folded.
Fig. 7 b show an embodiment of the substrate coupling device 431 by two tracks or guide rail offer.According to some
Embodiment, substrate can be supported at the first side (such as bottom side) place of substrate by the first track, and can be the of substrate
Two sides (such as top side) place is held in place in or is clamped by the second track.When using for substrate to be couple into secondary load
When the track or guide rail of body, the major part of substrate can significantly lose material through being subject to processing without the edge part office in substrate
Material.
Fig. 8 shows the mask when substrate is couple to secondary carrier with opening 422 and the part for masking substrate
One embodiment of 411 secondary carrier 400.According to some embodiments, mask 411 can be edge exclusion mask (edge-
exclusion mask)。
According to some embodiments that can be combined with other embodiment as described herein, substrate can support in substrate
Secondary carrier is attached at part surface, the substrate holding portion surface does not face the processing in processing equipment, is, for example, secondary carry
The dorsal part of body.In some embodiments, the opening of secondary carrier can serve as the mask of substrate, such as edge exclusion mask.
In some embodiments as described herein, substrate is described as being couple on substrate holding portion, specifically
On substrate holding portion surface.According to some embodiments, substrate, which is couple on surface, may mean that substrate by providing
Substrate coupling device on substrate holding portion surface and be couple to substrate holding portion surface.According to implementation alternatively or additionally
Mode, substrate, which is couple on surface, may mean that substrate contacts with substrate holding portion surface at least in part.For example,
It can not contacted with the substrate portion of superposition of end gap with substrate holding portion surface.In another example, substrate is in substrate
Limit and contacted at point or region with substrate holding portion surface, such as at 2 to 5 points of substrate and substrate holding portion surface
Contact.
In some embodiments, secondary carrier can have carries substantially perpendicular to the pair towards substrate in the mounted state
The thickness of body surface face (such as substrate holding portion surface) extension.Generally, the thickness of secondary carrier generally can be in 0.1mm to 2cm
In the range of, more generally in the range of 0.2mm to 1.5cm, and even more typically in 0.3mm to 1cm in the range of.
According to implementations described herein, the thickness of secondary carrier may rely on the stability of secondary carrier to select, secondary carrier it is steady
The qualitative material for depending on secondary carrier in one example.According to some embodiments described herein, the length of secondary carrier
Generally can between 10cm and 1m, more generally between 15cm and 50cm, and even more typically in 15cm and 30cm
Between.In one example, the length of secondary carrier can be 20cm.According to some embodiments described herein, secondary carrier
Width generally can between 5cm and 50cm, more generally between 5cm and 30cm, and even more typically in 10cm with
Between 20cm.In one example, the width of secondary carrier is 12cm.
According to some embodiments as described herein, secondary carrier can with it is adapted be used for bearing length 10cm and 50cm it
Between, more generally between 15cm and 40cm, and even more typically in the substrate between 15cm and 30cm.In some implementations
In mode, carrier can with it is adapted be used for width generally between 5cm and 30cm, more generally between 10cm and 25cm, with
And even more typically in the substrate between 15cm and 20cm.In one embodiment, secondary carrier goes for size and existed
Substrate between 10cm × 30cm and 15cm × 20cm.
In some embodiments, secondary carrier goes for supporting substrate generally between 1 and 30, more generally
Substrate of the ground between 2 and 20 and even more typically in the substrate between 2 and 18.According to some embodiment party
Formula, the quantity of opening may rely on the quantity of substrate.In one example, the quantity of opening corresponds to substrate to be supported
Quantity, in another example, the quantity of opening are twice of the quantity for the substrate to be supported.In some embodiments, main load
Body goes for supporting the secondary carrier generally between 5 and 50, the secondary carrier more generally between 10 and 50,
And even more typically in the secondary carrier between 15 and 40.
According to embodiment as described herein, secondary carrier goes for any kind of substrate, such as comprising paper tinsel, glass
Glass, metal, insulating materials, mica, the substrate of polymer and analog.In some instances, secondary carrier and main carrier can be used for
PVD deposition technique, CVD deposition, board structure trimming (substrate structuring edging), heating (example
Such as annealing) or any kind of processing substrate.The embodiment of secondary carrier and main carrier as described herein is for vertical orientated
Substrate nonstatic (i.e. continuous) processing substrate it is particularly useful.It will be apparent to one skilled in the art that secondary carrier and main load
The technique that body can be used for nonstatic.
In some embodiments, it is about that secondary carrier and main carrier, which can be used and go for technological temperature,
100 DEG C to about 600 DEG C of technique.According to some embodiments, secondary carrier and main carrier can be particularly used for technological temperature can
Can be higher than the technique for the fusion temperature for including material (such as deposition materials).In some embodiments, secondary carrier and main load
Body can be used for wherein substrate have for example to be deposited by the temperature in technological temperature or processing equipment to be heated to above
The risk of the temperature of the fusion temperature of material on substrate.In one embodiment, according to embodiment described herein
Secondary carrier and main carrier can be used for the lithium that deposition fusing point is about 160 DEG C.According to can be with other embodiment group as described herein
Some embodiments closed, main carrier and secondary carrier be may be advantageously used with depositing operation, and 1 is typically about with deposit thickness
μm to about 15 μm, more typically between about 1 μm and about 10 μm, and even more typically between about 5 μm and about 10 μm
Layer.
According to embodiment as described herein, substrate can undergo depositing operation, such as with deposition such as ceramics, metal, alkali
Metal (such as lithium), ITO, IZO, IGZO, AZO, SnO, AlSnO, InGaSnO, titanium, aluminium, copper, the material of molybdenum and combinations thereof
Material.
Fig. 9 a and Fig. 9 b show the carrier system according to embodiment as described herein.
The carrier system for the pending substrate being used for according to embodiment described herein in vacuum technology can include main load
Body, the main carrier include being used for the secondary carrier coupling device that one or more secondary carriers are couple to main carrier.Generally, main load
Body has secondary carrier support component, and the secondary carrier support component has with the mesh shape for intersecting grid.According to some implementations
Mode, secondary carrier coupling device are provided at grid.In some realities that can be combined with other embodiment as described herein
Apply in mode, main carrier can be main carrier as described above.
Also included being used to support one or more pending substrates according to the carrier system of embodiment as described herein
Secondary carrier.Generally, secondary carrier includes one or more be open.Secondary carrier generally also includes being used for the substrate coupling dress for coupling substrate
Put.It is configured as keeping substrate according to the substrate coupling device of the secondary carrier of the carrier system of embodiments described herein
In the opening portion with secondary carrier overlapping position.According to some embodiments, the secondary carrier of carrier system can be as above
State the secondary carrier described in embodiment.
Fig. 9 a show the carrier system for pending substrate.Carrier system is included with the opening 122 shown in dotted line
Main carrier 100.Before opening or opening top, secondary carrier 400 is couple to main carrier 100.In the implementation shown in Fig. 9 a
In mode, secondary carrier 400 is more than the opening 122 of main carrier.It will be appreciated by those skilled in the art that the opening of main carrier 100
122 can also be equal in magnitude with secondary carrier, or can even be more than secondary carrier, such as dependent on the secondary carrier for main carrier
Coupling device (example is shown in Fig. 2 a to Fig. 2 e).Secondary carrier 400 has opening 422.
The number of the number of the secondary carrier for being couple to main carrier shown in Fig. 9 a and Fig. 9 b and the opening of secondary carrier can manage
Solve to be merely illustrative, and be construed as not limiting the carrier system according to embodiment as described herein.
In figure 9b, substrate 500 is couple to secondary carrier 400, and the secondary carrier 400 is couple to main carrier 100.Substrate 500
It is located therein the position overlapping with the opening 422 of secondary carrier of substrate 500.By the opening 422 of the overlapping secondary carrier of substrate 500 with void
Line is shown.Such as from Fig. 9 b embodiment can be seen that substrate be in substrate it is overlapping with the opening 422 of secondary carrier 400 and with
The overlapping position of the opening 122 of main carrier 100.
Term " substantial " as used herein, which may mean that, to be existed necessarily with the characteristic represented with " substantial "
Deviation.For example, term " substantially rectangular in shape " refer to may and exact rectangular shape have the shape of certain deviation, such as deviation
About the 1% to 10% of general extension in one direction.According to another example, term " having substantial mesh shape " can be with
Refer to the shape with the grid of rule distance each other, but the rule distance for deviateing grid can be allowed.For example, " essence online
Trellis shape " can include about 1% to 15% deviation for deviateing the rule distance between two grids.
Substrate temperature during reduction processing is allowed according to the secondary carrier and main carrier of implementations described herein.Specifically
Ground, allowed to reduce place by increasing the heat radiation from substrate according to the secondary carrier and main carrier of embodiment as described herein
Substrate temperature during reason.Defective products less in preferably processing quality and final products can be produced by reducing the temperature of substrate.
In addition, allowed according to the main carrier of embodiment as described herein and secondary carrier within the temperature range of substrate is maintained at into regulation,
Cost without increasing processing, or not delay disposal.
Figure 10 is shown to be used to transmit heat in carrier system according to embodiment as described herein, is particularly used to pass
Send the flow chart 600 of the method for the heat from substrate.Methods described includes providing main carrier in block 610.Main carrier can be with
The secondary carrier support component surrounded including main carrier framework and by main carrier framework.As mentioned above for described in main carrier, pair carries
Body support section can have with the mesh shape for intersecting grid, wherein the cross battens grid are configured to support for pending
At least one secondary carrier of substrate.In addition, main carrier can include being used for a lattice being couple to secondary carrier in multiple grids
The secondary carrier coupling device of grid.According to some embodiments, secondary carrier coupling device can be the pair as shown in Fig. 2 a to Fig. 2 e
Carrier coupling device.It will be understood to those skilled in the art that secondary carrier coupling device is not limited to showing shown in Fig. 2 a to Fig. 2 e
Example.
Methods described be additionally included in frame 620 using secondary carrier coupling device with secondary carrier side to the grid between grid
Secondary carrier is connected to main carrier by the opening position of opening.In some embodiments, secondary carrier includes providing at least one opening
Substrate holding portion.According to some embodiments, when secondary carrier by cause secondary carrier towards main carrier opening in a manner of pacify
When being attached to main carrier, the heat from secondary carrier (or substrate) can be transmitted.Secondary carrier and main carrier can be collectively referred to as carrying
System is united.
According to some embodiments, methods described is additionally may included in secondary carrier and is couple to before main carrier or in secondary carrier
It is couple to after main carrier and substrate is couple to secondary carrier.In some embodiments, secondary carrier can include substrate coupling dress
Put, as described by for example on Fig. 7 a and Fig. 7 b.Substrate can be couple to secondary carrier so that real estate is to one in secondary carrier
Individual or multiple openings, to ensure the heat transfer from substrate.In some embodiments, substrate can couple in an opening position
To carrier system so that each substrate is towards at least one opening in secondary carrier and the opening in main carrier.To cause base
Plate face allows the opening and main carrier of secondary carrier transmission mode of the heat away from substrate to couple substrate.For example, can be at least
At dorsal part (dorsal part can be the side of the processing being not intended to be subjected in processing chamber housing of substrate) place of substrate, pass through master
Opening discharge substrate in carrier and secondary carrier.
In some embodiments that can be combined with other embodiment as described herein, main carrier and secondary carrier can be with
It is the carrier as described in above-mentioned embodiment.
According to some, embodiment there is provided the secondary carrier as described in embodiments herein, main carrier and/or carrier system
The purposes of system.
Although foregoing teachings are related to some embodiments of the present invention, can be in the case where not departing from base region
Other and further embodiment are designed, and scope is determined by claims below.
Claims (15)
- A kind of 1. secondary carrier (400 for being used to stay in the substrate (500) handled in vacuum chamber；800), the secondary carrier (400； 800) include：Substrate holding portion (420), the substrate holding portion include substrate holding portion surface (421), the substrate support Partly (420) are arranged to support at least one pending substrate (500), wherein the substrate holding portion (420) includes At least one opening (422)；Substrate coupling device (430；431), the substrate coupling device is arranged to protect at least one substrate (500) Hold on the substrate holding portion surface (421) and the substrate (500) and at least one opening (422) at least partly Overlapping position；Wherein described secondary carrier (400；800) it is arranged to be couple to main carrier (100).
- 2. secondary carrier (400 according to claim 1；800), wherein when the substrate (500) is installed to the secondary carrier (400；800) when, one opening (422) size the substrate (500) with the superposition of end gap size 40% with Between 90%.
- 3. secondary carrier (400 according to claim 1；800), wherein when the substrate (500) is couple to the secondary carrier (400；800) when, adapted more than one opening is in face of a substrate (500), and is wherein used for one substrate (500) total size of the more than one opening is between the 50% and 90% of the size of the pending substrate (500).
- 4. secondary carrier (400 according to any one of claim 1 to 3；800), wherein the secondary carrier (400；800) quilt The substrate (500) being supported between 5 and 15 is configured to, andWherein it is described opening (422) number at least with by the secondary carrier (400；800) number one of the substrate (500) of support Sample is high.
- 5. secondary carrier (400 according to any one of claim 1 to 4；800), wherein the secondary carrier (400；800) pass through It is adapted for being couple to the main carrier (100) according to any one of claim 7 to 11.
- 6. a kind of main carrier (100) for vacuum treatment device, the main carrier (100) includes：Main carrier framework (110)；Secondary carrier support component (120), the secondary carrier support component are surrounded by the main carrier framework (110) and have band Intersect the mesh shape of grid (121), the intersection grid is configured to support at least one of pending substrate (500) Secondary carrier (400；800).
- 7. main carrier (100) according to claim 6, wherein the secondary carrier (400；800) support section is configured to use In by least two rows and the two secondary carriers (400 of row；800) support to the main carrier (100).
- 8. the main carrier (100) according to any one of claim 6 to 7, further comprise being used for the secondary carrier (400；800) the secondary carrier coupling device (201 for a grid being couple in the grid (121)；202；203；204； 205), wherein the secondary carrier coupling device (201；202；203；204；205) allow to work as the secondary carrier (400；800) install During to the main carrier (100), in the secondary carrier (400；800) towards the position of the mesh openings between the grid (121) Place is put by the secondary carrier (400；800) it is couple to the main carrier (100).
- 9. the main carrier (100) according to any one of claim 6 to 8, wherein the main carrier (100) is applied to temperature Technique higher than 160 °.
- 10. the main carrier (100) according to any one of claim 6 to 9, wherein the secondary carrier support component (120) It is adapted to be used for the secondary carrier (400 of one or more according to any one of claim 1 to 5；800) it is fixed to described Main carrier (100).
- 11. one kind is used for the carrier system of pending substrate (500), including：Main carrier (100), the main carrier include being used for one or more secondary carriers (400；800) it is couple to the main carrier (100) secondary carrier coupling device (201；202；203；204；205), the main carrier (100) includes that there is band to intersect grid (121) the secondary carrier support component (120) of mesh shape, wherein the secondary carrier coupling device (201；202；203；204； 205) provide at the grid (121) place；For supporting the secondary carrier (400 of at least one pending substrate (500)；800), wherein the secondary carrier (400；800) Including at least one opening (422) and wherein described secondary carrier (400；800) include being used for the base for coupling the substrate (500) Plate coupling device (430；431), wherein the substrate coupling device (430；431) it is arranged to protect the substrate (500) Hold with the secondary carrier (400；800) the opening (422) partly overlapping position.
- 12. carrier system according to claim 11, wherein the main carrier (100) is according in claim 6 to 10 Main carrier (100) described in any one, and wherein described secondary carrier (400；800) it is according to any one of claim 1 to 5 Described secondary carrier (400；800).
- 13. the carrier system according to any one of claim 11 to 12, wherein the secondary carrier (400；800) described The size of one or more opening (422) is will be by the secondary carrier (400；800) size of the substrate (500) of support 40% to 90%, andThe secondary carrier (400 of wherein described main carrier (100)；800) coupling device is adapted is used to work as the substrate (500) It is installed to the secondary carrier (400；And the secondary carrier (400 800)；800) when being installed to the main carrier (100), treating It is coupled to the secondary carrier (400；800) opening position of the substrate (500) in face of the opening of the main carrier (100) By the secondary carrier (400；800) it is coupled to the main carrier (100).
- 14. the carrier system according to any one of claim 11 to 13, wherein the main carrier is arranged to support Secondary carrier (400 between 5 and 50；800), wherein each secondary carrier (400；800) it is arranged to support 2 to 20 Individual substrate (500), and wherein described secondary carrier (400；800) be specifically configured for support size in 10cm × 30cm and Substrate (500) between 15cm × 20cm.
- 15. a kind of method for being used to transmit heat in carrier system, methods described include：Main carrier is provided, the main carrier includes main carrier framework (110) and secondary carrier support component (120), the secondary carrier Support section (120) is surrounded by the main carrier framework (110) and with the mesh shape with intersection grid (121), described Intersection grid is configured to support at least one secondary carrier (400 for pending substrate (500)；800), the main carrier is also Including for by secondary carrier (400；800) the secondary carrier coupling device (201 for a grid being couple in the grid (121)； 202；203；204；205)；AndUsing the secondary carrier coupling device with the secondary carrier (400；800) grid between the grid (121) is faced Secondary carrier is connected to the main carrier by the opening position of opening.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2015/057768 WO2016162071A1 (en) | 2015-04-09 | 2015-04-09 | Carrier system for substrates to be processed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107438897A true CN107438897A (en) | 2017-12-05 |
Family
ID=52875140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580078653.4A Pending CN107438897A (en) | 2015-04-09 | 2015-04-09 | Carrier system for pending substrate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2018512740A (en) |
| KR (1) | KR20170137160A (en) |
| CN (1) | CN107438897A (en) |
| WO (1) | WO2016162071A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
| TWI220139B (en) * | 2001-10-15 | 2004-08-11 | Steag Hamatech Ag | Substrate holder |
| US20060006095A1 (en) * | 2004-07-08 | 2006-01-12 | White Robert J Jr | Universal storage tray for electronic components |
| DE202009001817U1 (en) * | 2009-01-31 | 2009-06-04 | Roth & Rau Ag | Substrate carrier for holding a plurality of solar cell wafers |
| JP2011026652A (en) * | 2009-07-23 | 2011-02-10 | Canon Inc | Apparatus for forming film on both surfaces |
| KR20150023202A (en) * | 2013-08-23 | 2015-03-05 | 강경순 | Process Module, Manufacturing method thereof and Processing method of Substrate using the Process Module |
| CN104451602A (en) * | 2013-09-18 | 2015-03-25 | 东京毅力科创株式会社 | Substrate processing apparatus and method for processing a substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5052017B2 (en) * | 2005-03-28 | 2012-10-17 | 京セラ株式会社 | Plasma device and method for manufacturing solar cell element using the same |
| US20150053336A1 (en) * | 2013-08-23 | 2015-02-26 | Yong Jin Lim | Process module, fabricating method thereof and substrate processing method using the process module |
-
2015
- 2015-04-09 KR KR1020177032565A patent/KR20170137160A/en not_active Application Discontinuation
- 2015-04-09 JP JP2017552832A patent/JP2018512740A/en active Pending
- 2015-04-09 CN CN201580078653.4A patent/CN107438897A/en active Pending
- 2015-04-09 WO PCT/EP2015/057768 patent/WO2016162071A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6227372B1 (en) * | 1998-04-30 | 2001-05-08 | Peak International, Inc. | Component carrier tray for high-temperature applications |
| TWI220139B (en) * | 2001-10-15 | 2004-08-11 | Steag Hamatech Ag | Substrate holder |
| US20060006095A1 (en) * | 2004-07-08 | 2006-01-12 | White Robert J Jr | Universal storage tray for electronic components |
| DE202009001817U1 (en) * | 2009-01-31 | 2009-06-04 | Roth & Rau Ag | Substrate carrier for holding a plurality of solar cell wafers |
| JP2011026652A (en) * | 2009-07-23 | 2011-02-10 | Canon Inc | Apparatus for forming film on both surfaces |
| KR20150023202A (en) * | 2013-08-23 | 2015-03-05 | 강경순 | Process Module, Manufacturing method thereof and Processing method of Substrate using the Process Module |
| CN104451602A (en) * | 2013-09-18 | 2015-03-25 | 东京毅力科创株式会社 | Substrate processing apparatus and method for processing a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170137160A (en) | 2017-12-12 |
| WO2016162071A1 (en) | 2016-10-13 |
| WO2016162071A8 (en) | 2017-11-02 |
| JP2018512740A (en) | 2018-05-17 |
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Application publication date: 20171205 |
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