CN107424723B

CN107424723B - Swinging device inductance PCB assembly, preparation method and application thereof

Info

Publication number: CN107424723B
Application number: CN201710303690.1A
Authority: CN
Inventors: 燕军波
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-05-03
Filing date: 2017-05-03
Publication date: 2020-09-08
Anticipated expiration: 2037-05-03
Also published as: CN107424723A

Abstract

The coil positioning framework comprises a winding post, an upper positioning surface and a lower positioning surface which are respectively arranged at two ends of the winding post, at least one positioning column is arranged on the bottom surface of the lower positioning surface, at least two pin needles are arranged on the side surface of the lower positioning surface, the coil is wound on the winding post, two free ends of the coil are respectively wound on the pin needles, at least one positioning hole is formed in the PCB, the positioning column penetrates through the positioning hole, the lower positioning surface is attached to the PCB, the pin needles are welded on the PCB, the coil positioning framework comprises the winding post, the upper positioning surface and the lower positioning surface which are respectively arranged at two ends of the winding post, the coil is wound on the winding post, the coil can adopt an extremely thin wire, and the required large impedance can be achieved without extra series resistance, so that the current is reduced, and the energy is saved; the processing is convenient, and the two free ends of coil twine respectively on the pin needle, through the pin needle welding replace the welding wire on the PCB board, processing is convenient, and the yield is high.

Description

Swinging device inductance PCB assembly, preparation method and application thereof

Technical Field

The invention relates to the technical field of inductance PCB components, in particular to an inductance PCB component of a swinging device, a preparation process and application thereof.

Background

The invention has the patent number 201520032308.4, and is named as 'swinging LED electronic candle' which comprises the following steps: the LED lamp swinging device comprises a swinging LED lamp, a magnet and an inductance PCB board, wherein the magnet is used for driving the LED lamp to swing, the inductance PCB board is matched with the magnet and fixed on the fixing device, and the LED lamp is movably connected with the fixing device; the main control module comprises a main control PCB board, the main control PCB board is electrically connected with the LED lamp and the inductance PCB board, and the inductance PCB board is a core component in the swing device.

The prior inductance PCB has the following defects: 1. the inductance PCB comprises a coil and a PCB, the former processing procedure is to prepare the PCB, then to patch and bond, and finally to assemble the coil, in order to increase impedance, a thinner wire is usually expected, however, when the thin wire is welded with the PCB, the wire is easy to break, the assembly is very difficult, the processing is troublesome, and the loss is high; in order to reduce loss, the conventional method in the industry at present is to use a thicker wire to manufacture a coil, then add a resistor, and connect the resistor in series with the coil to improve impedance, however, the method increases production cost because of the increase of resistor components and the increase of the process of installing the resistor; 2. when a coil of the conventional inductance PCB is installed, the polarity of the coil needs to be distinguished as an N pole or an S pole, once the judgment is wrong, the coil needs to be detached and installed again, time and labor are wasted, the coil does not have a positioning reference on the PCB, the installation position is inaccurate, the magnetic force distribution is uneven, and the swinging effect is influenced; 3. IC on the PCB board of inductance PCB board all is through sticky fixed at present, in case certain IC destroys, can't dismantle the change, and whole inductance PCB board has all been scrapped, causes very big waste.

Disclosure of Invention

To overcome the above disadvantages and shortcomings, it is an object of the present invention to provide a rocking device inductor PCB assembly.

The invention also aims to provide a preparation method of the swing device inductance PCB assembly.

The invention further aims to provide application of the swing device inductance PCB assembly.

The purpose of the invention is realized by the following technical scheme:

device inductance PCB subassembly sways, including PCB board, coil and coil location skeleton, coil location skeleton includes the wrapping post, locates respectively the last locating surface and the lower locating surface at wrapping post both ends, the bottom surface of locating surface is equipped with at least one reference column down, the side of locating surface is equipped with two at least pin needles down, the coil is around on the wrapping post, the two free ends of coil twine respectively on the pin needle, be equipped with at least one locating hole on the PCB board, the reference column passes the locating hole, the locating surface down with the laminating of PCB board, the pin needle welding is in on the PCB board.

In one embodiment, the pin is horizontally disposed.

In one embodiment, the tail end of the pin is bent downwards, and the tail end of the pin is attached to the PCB.

In one embodiment, the pin needle is formed with an "L" shaped bend, and the vertical part of the "L" shaped bend penetrates through the PCB board.

In one embodiment, a patch type IC is disposed on the PCB.

The preparation method of the swing device inductance PCB assembly comprises the following steps:

1. preparing a PCB (printed circuit board), a coil and a coil positioning framework, winding the coil on a winding post of the coil positioning framework, and winding two free ends of the coil on the pin needles respectively;

2. and fixing a coil positioning framework wound with a coil in a positioning hole of the PCB through a positioning column, and welding and fixing the pin needle and the PCB to obtain the required inductance PCB assembly of the swinging device.

In one embodiment, the method for preparing the oscillating device inductance PCB assembly comprises the following steps: and 2, simultaneously packaging the IC on the PCB, and then welding and fixing the pin, the IC and the PCB together with the coil positioning framework wound with the coil at one time to obtain the required inductance PCB assembly of the swing device.

Use of a rocking device inductance PCB assembly for making a rocking electronic candle, a rocking electronic apple flower and a rocking electronic doll.

Compared with the prior art, the inductance PCB assembly of the swinging device has the following beneficial effects:

1. the coil positioning framework comprises a winding post, an upper positioning surface and a lower positioning surface which are respectively arranged at two ends of the winding post, the coil is wound on the winding post, the coil can adopt an extremely fine lead, and the required large impedance can be achieved without extra series resistance, so that the current is reduced, and the energy is saved;

2. the processing is convenient, two free ends of the coil are respectively wound on the pin needles and are welded on the PCB through the pin needles, welding wires are replaced, the processing is convenient, and the yield is high;

3. the coil is positioned by the coil positioning framework, the polarity of the lead of the coil is determined by forward winding or backward winding, and the positioning column plays a role in guiding besides a positioning role during installation, so that the polarity is easy to determine, the coil is accurate in installation position, uniform in magnetic force distribution and good in swinging effect, and the product quality is improved;

4. the assembly process is simplified, the IC and the coil are fixed on the PCB together, and the assembly is completed by one-time welding, so that the efficiency is greatly improved, and the production cost is reduced;

5. the swinging device has wide application and can be used for swinging electronic candles, electronic apple flowers, electronic toys, and the like.

Drawings

Fig. 1 is a schematic structural diagram of an inductor PCB assembly of a swing device according to the present invention.

Fig. 2 is another schematic structural diagram of the inductance PCB assembly of the swing device of the present invention.

Fig. 3 is a schematic view of another structure of the inductance PCB assembly of the swing device of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, the inductance PCB assembly 4 of the swing device includes a PCB 1, a coil 2 and a coil positioning frame 3, wherein the coil positioning frame 3 includes a winding post 31, an upper positioning surface 32 and a lower positioning surface 33 respectively disposed at two ends of the winding post 31, the bottom surface of the lower positioning surface 33 is provided with at least one positioning post 331, the side surface of the lower positioning surface 33 is provided with at least two pin pins 332, the coil 2 is wound on the winding post 31, two free ends of the coil 2 are respectively wound on the pin pins 332, the PCB 1 is provided with at least one positioning hole 11, the positioning post 331 passes through the positioning hole 11, the lower positioning surface 33 is attached to the PCB 1, and the pin pins 332 are welded to the PCB 1.

Referring to fig. 1, the pin 332 is horizontally disposed, so that the pin 332 is flush with the PCB 1 and can be directly fixed on the PCB 1 by soldering.

Referring to fig. 2, the tail end of the pin 332 is bent downward, and the tail end of the pin 332 is attached to the PCB 1, so that the tail end of the pin 332 is closely attached to the board surface of the PCB 1 without any gap, and thus, the soldering is easier and the stability is better.

Referring to fig. 3, the pin 332 is formed with an "L" shaped bend 3321, and a vertical portion of the "L" shaped bend 3321 passes through the PCB 1 and is directly soldered and fixed to a back surface of the PCB.

In one embodiment, the PCB 1 is provided with the patch type IC, the patch type IC can be detached, the whole PCB cannot be affected once the patch type IC is damaged, and the patch type IC can be synchronously welded with the coil during welding, so that the production steps are saved, and the production cost can be greatly reduced.

Example 2

The method for manufacturing the inductance PCB assembly of the swing device in embodiment 1 includes the following steps:

1. preparing a PCB (printed circuit board) 1, a coil 2 and a coil positioning framework 3, winding the coil 2 on a winding post 31 of the coil positioning framework 3, and winding two free ends of the coil 2 on the pin needles 332 respectively;

2. and fixing the coil positioning framework 3 wound with the coil in the positioning hole 11 of the PCB 1 through the positioning column 331, and welding and fixing the pin 332 and the PCB 1 to obtain the required inductance PCB component 4 of the swinging device.

In one embodiment, the method for preparing the oscillating device inductance PCB assembly comprises the following steps: in the step 2, the IC is packaged on the PCB board 1, and then the pin 332, the IC and the PCB board 1 are welded and fixed together with the coil positioning frame 2 around which the coil is wound, so as to obtain the required inductance PCB assembly 4 of the swing device. Therefore, the bonding link in the traditional preparation method is not needed, the IC packaging and the pin 332 are welded at one time, the production steps are reduced, the production efficiency is improved, the production cost is greatly reduced, the surface-mounted IC can be detached, once the surface-mounted IC is damaged, the whole PCB cannot be influenced, and the loss is greatly reduced.

Example 3

The application of the swing device inductance PCB assembly 4 is that the swing device inductance PCB assembly 4 is used for manufacturing swing electronic candles, swing electronic apple flowers and swing electronic toys, is wide in application and can greatly improve the quality of products.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The manufacturing method of the swinging device inductance PCB assembly is characterized in that the swinging device inductance PCB assembly comprises a PCB board, a coil and a coil positioning framework, the coil positioning framework comprises a winding post, an upper positioning surface and a lower positioning surface which are respectively arranged at two ends of the winding post, the bottom surface of the lower positioning surface is provided with at least one positioning column, the side surface of the lower positioning surface is provided with at least two pin needles, the coil is wound on the winding post, two free ends of the coil are respectively wound on the pin needles, the PCB board is provided with at least one positioning hole, the positioning column penetrates through the positioning hole, the lower positioning surface is attached to the PCB board, the pin needles are welded on the PCB board, the tail ends of the pin needles are bent downwards, the tail ends of the pin needles are attached to the PCB board, and the PCB board is provided with a surface-mounted IC; the swinging device inductor PCB assembly is used for manufacturing a swinging electronic candle, a swinging electronic apple flower and a swinging electronic doll; the preparation method of the swing device inductance PCB assembly comprises the following steps:

(1) preparing a PCB (printed circuit board), a coil and a coil positioning framework, winding the coil on a winding post of the coil positioning framework, and winding two free ends of the coil on the pin needles respectively;

(2) then encapsulate IC on the PCB board to the coil location skeleton that will wind the coil passes through the reference column to be fixed in the locating hole of PCB board, at last with pin needle, IC and PCB board once only welded fastening, obtain required device inductance PCB subassembly that sways.