CN208459468U

CN208459468U - Hall current sensor

Info

Publication number: CN208459468U
Application number: CN201820742605.1U
Authority: CN
Inventors: 李德来; 胡冬青; 张文江; 吴如兆; 郑华雄; 任浩; 刘志强
Original assignee: Ningbo CRRC Times Transducer Technology Co Ltd
Current assignee: Ningbo CRRC Times Transducer Technology Co Ltd
Priority date: 2018-05-18
Filing date: 2018-05-18
Publication date: 2019-02-01
Anticipated expiration: 2028-05-18

Abstract

Hall current sensor comprising skeleton, Hall subassembly, core assembly, encapsulating shell；The Hall subassembly includes Hall element, pcb board, stitch, encapsulating shell, and Hall element, stitch are respectively welded on pcb board, is molded outside pcb board and forms Hall encapsulating shell；The core assembly includes the iron core, pressing plate and bracket with air gap, and pressing plate and bracket clamp iron core and form core assembly, and core assembly forms encapsulating shell and retain air gap by external injection molding；Hall subassembly mounting groove is arranged in the skeleton, and Hall subassembly is fixed on mounting groove and its one end with stitch passes through mounting groove, and the other end passes through the air gap of core assembly, and skeleton is fixed on core assembly.Due to being welded by Hall element, stitch and pcb board, therefore Hall element, the position of stitch and quantity be can change, the diversification that output pin interface is realized by the variation of Hall subassembly stitch quantity and spacing, meets the needs of user is to multiple interfaces form.

Description

Hall current sensor

Technical field

The utility model relates to a kind of current sensors.

Background technique

The important composition component that current sensor is controlled and fed back as electric automobile energy, due to industry mainstream vendor couple Controller power density proposes higher requirement, and this requires current sensors to accomplish miniaturization, integrated while adaptation more Harsh use environment, especially vibration environment and high electromagnetic interference environment.

Existing Hall current sensor generally comprises core assembly, Hall element and shell, core assembly and shell, suddenly Your element and shell match, between cap and shell by being assembled to form product, produce that cumbersome, assembly relation is more, product is reliable Property is poor, and the debugging difficulty that will cause product is big, qualification rate is lower.Again in order to increase mechanical strength, usually adopted between all parts With whole encapsulating, but due to the effect of thermal stress, the air gap that may cause iron core changes, its measurement is made to deviate setting value. And pin output form is limited by Hall element and is not able to satisfy user's multiple demands.

Utility model content

Technical problem to be solved in the utility model is to overcome the above-mentioned insufficient of the prior art and provide a kind of Hall electricity Flow sensor can meet a variety of needs.

The technical scheme in the invention for solving the above technical problem are as follows:

Hall current sensor, it is characterised in that: including skeleton, Hall subassembly, core assembly, encapsulating shell；The Hall Component includes Hall element, pcb board, stitch, encapsulating shell, and Hall element, stitch are respectively welded on pcb board, is molded outside pcb board Form Hall encapsulating shell；The core assembly includes the iron core, pressing plate and bracket with air gap, and pressing plate and bracket clamp iron core shape At core assembly, core assembly forms encapsulating shell and retains air gap by external injection molding；The skeleton setting Hall subassembly is installed Slot, Hall subassembly is fixed on mounting groove and its one end with stitch passes through mounting groove, and the other end passes through the gas of core assembly Gap, skeleton are fixed on core assembly.

Preferably, above-mentioned Hall subassembly other end top on the package, skeleton and encapsulating shell be fixed together and by Hall Component is fixed.

Preferably, above-mentioned skeleton buckle is fixed on the package.

Preferably, it passes through the through-hole at core assembly center among above-mentioned skeleton and buckles on the package and fix.

Utility model has the advantages that

1) due to being welded by Hall element, stitch and pcb board, can change Hall element, stitch position and Quantity is realized the diversification of output pin interface by the variation of Hall subassembly stitch quantity and spacing, meets user to more The demand of kind interface form.

2) a series of encapsulation for passing through current sensor elements, to promote the vibration proof and insulating properties of current sensor Energy.

3) assembling link is reduced by way of overall package, promotes product reliability and reduces production logistics cost.

Detailed description of the invention

Fig. 1 is the assembling process schematic diagram of the utility model embodiment current sensor.

Fig. 2 is the structural representation of the utility model embodiment current sensor.

Fig. 3 is the exploded view of the utility model embodiment current sensor.

Specific embodiment

With reference to the accompanying drawing, the present invention will be further described for embodiment.

As shown in Figure 1, 2, 3, Hall current sensor includes skeleton 9, Hall subassembly 2, core assembly 3, encapsulating shell 8.

Above-mentioned Hall subassembly 2 includes Hall element 21, pcb board 22, encapsulating shell 23, stitch 24, Hall element 21, stitch 24 It is respectively welded on the corresponding position of pcb board 22, encapsulating shell 23 is encapsulated in outside pcb board 22 and forms Hall subassembly 2.

Since stitch 24 and Hall element 21 can be connected by welding on pcb board 22, it can be by changing needle The spacing of foot 4 and the layout on PCB and change the Hall subassembly stitch output definition and connection size.

Above-mentioned core assembly 3 includes iron core 36, pressing plate 35 and bracket 37, and iron core air gap 33,36 He of iron core is arranged in iron core 36 Pressing plate 35 is successively attached on bracket 37, and iron core 36 is pressed on bracket 37 by pressing plate 35, and the stabilizer blade 32 on bracket 37 passes through pressing plate 35 On through-hole 34, and be core assembly 3 by three assembling parts by the riveting point 32 on riveting-rack 37.

The core assembly 3 after above-mentioned installation is located on mold again, then is sealed by being moulded in be formed outside core assembly 3 Shell 8 is filled, the entirety after resulting in core assembly 3 and the encapsulation of encapsulating shell 8, and there are iron core air gaps 33.

Central through hole 91 corresponding with core assembly 3 is set among above-mentioned skeleton 9, and connection buckle is arranged in 91 edge of through-hole 92, buckle 92 be buckled on encapsulating shell 8 after passing through the central through hole 82 of the through-hole of core assembly, encapsulating shell 8 and by skeleton 9 and encapsulation Core assembly 3 afterwards is fixed.

Above-mentioned skeleton 9 also sets up 2 mounting groove 93 of Hall subassembly, and the one end 23 of Hall subassembly 2 with stitch is installed across skeleton 9 Slot 93,2 one end of Hall subassembly are stuck on mounting groove 93, and the other end passes through the air gap of core assembly and withstands on encapsulating shell 8, skeleton Core assembly 3 fixation and Hall subassembly 2 of the cooperation of buckle 81 by skeleton 9 and after encapsulating on buckle 94 and encapsulating shell 8 on 9 Fixation.

Claims

1. Hall current sensor, it is characterised in that: including skeleton, Hall subassembly, core assembly, encapsulating shell；The Hall group Part includes Hall element, pcb board, stitch, encapsulating shell, and Hall element, stitch are respectively welded on pcb board, and shape is molded outside pcb board At Hall encapsulating shell；The core assembly includes the iron core, pressing plate and bracket with air gap, and pressing plate and bracket are clamped iron core and formed Core assembly, core assembly form encapsulating shell and retain air gap by external injection molding；Hall subassembly mounting groove is arranged in the skeleton, Hall subassembly is fixed on mounting groove and its one end with stitch passes through mounting groove, and the other end passes through the air gap of core assembly, Skeleton is fixed on core assembly.

2. Hall current sensor according to claim 1, it is characterised in that: the Hall subassembly other end withstands on encapsulating shell On, skeleton is fixed together with encapsulating shell and fixes Hall subassembly.

3. Hall current sensor according to claim 2, it is characterised in that: and skeleton buckle is consolidated on the package It is fixed.

4. Hall current sensor according to claim 1 or 2 or 3, it is characterised in that: pass through iron core among the skeleton The through-hole at component center and buckle on the package and fix.