CN107408593A - Distribution sheet material, structure and light electricity generation module - Google Patents

Distribution sheet material, structure and light electricity generation module Download PDF

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Publication number
CN107408593A
CN107408593A CN201680008691.7A CN201680008691A CN107408593A CN 107408593 A CN107408593 A CN 107408593A CN 201680008691 A CN201680008691 A CN 201680008691A CN 107408593 A CN107408593 A CN 107408593A
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China
Prior art keywords
copolymer
resin
sheet material
distribution
ethene
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CN201680008691.7A
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CN107408593B (en
Inventor
礒川素朗
远藤结
佐藤纪彦
关主税
一关主税
中田之
中田一之
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Dow Mitsui Polychemicals Co Ltd
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Du Pont Mitsui Polychemicals Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/02002Arrangements for conducting electric current to or from the device in operations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/048Encapsulation of modules
    • H01L31/0481Encapsulation of modules characterised by the composition of the encapsulation material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Photovoltaic Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

The present invention provides a kind of distribution sheet material, structure and light electricity generation module.The distribution sheet material of the present invention has resin sheet (10) and is arranged at the fine distribution (20) on a surface of the resin sheet (10), and is more than 70% according to the light transmittance under the 350nm of the JIS K7105 resin sheets (10) determined wavelength.

Description

Distribution sheet material, structure and light electricity generation module
Technical field
The present invention relates to a kind of distribution sheet material, structure and light electricity generation module.
Background technology
The semiconductor element (light generating element) for converting light energy into electric energy is generally equipped with light electricity generation module.For Conventional representational smooth electricity generation module, in order to suppress the reduction of power generation characteristics possessed by the module, and utilize resin sheet will Above-mentioned smooth generating element sealing, to prevent above-mentioned smooth generating element from being contacted with extraneous gas or apply to above-mentioned smooth generating element Impact etc..In order to which luminous energy is effectively supplied to light generating element, and the transparency is required to the resin sheet.Also, as shape The material of resin sheet material, consider from viewpoints such as the transparency, flexibility, cementability, tensile strength, weatherability and cost balances, Preferably with there is vinyl-vinyl acetate copolymer (EVA).
In recent years, the technical level required by the various characteristics of light electricity generation module is increasingly uprised.It is especially right in recent years In light electricity generation module, improve the requirement such as generating efficiency and cost degradation and improve constantly.In order to meet this requirement, and to resin sheet The composition of material has carried out various researchs.
As the technology for the composition for being conceived to resin sheet, such as there is following technology.
Have a kind of resin seal sheet material disclosed in patent document 1, its include vinyl-vinyl acetate copolymer (EVA) and Ultra-violet absorber, and carried out processing by ionization property radioactive ray.
Conventional art document
Patent document
Patent document 1:Japanese Patent Publication 2014-141542 publications
Patent document 2:Japanese Patent Publication 2011-210891 publications
The content of the invention
The invention technical task to be solved
Above-mentioned conventional resin sheet is suppressing the ultraviolet of resin due to using the composition comprising ultra-violet absorber Effect to a certain degree can be expected in terms of the long durability of line deterioration.In this way, on conventional resin sheet, in order to realize The long durability of the resin sheet, and use light, the i.e. ultraviolet for preventing the wavelength region less than 380nm to be incident in light generating The composition of the situation of element in itself.Therefore, there is limitation in terms of the generating efficiency of light electricity generation module is improved.
In view of the foregoing, at present, in order to further improve generating efficiency, and it is strongly required to possess and removes from visible ray Beyond luminous energy, the luminous energy from ultraviolet can be also set to be converted into the light electricity generation module of the composition of electric energy.
In recent years, suppress the UV degradation of the adjoint resin of above-mentioned long-term use in order to obtain and source can be utilized From the resin sheet of the luminous energy of ultraviolet, and to carrying out the technology containing fluorescent material equiwavelength's conversion agent in the resin sheet Various researchs (patent documents 2 etc.).But the following opinion of the acquisition such as the present inventor:On containing above-mentioned wavelength-shifting agent Resin sheet, when the wavelength of the ultraviolet to being absorbed is changed, micro luminous energy can be lost.
Therefore, the luminous energy from ultraviolet is made also can efficiently to contribute to generate electricity it is an object of the invention to provide a kind of Distribution sheet material, the structure and light electricity generation module that possess the distribution sheet material.
For solving the means of technical task
The considerations such as the present inventor in recent years to the problem of the cost degradation required by light electricity generation module after, to can be used in i.e. Just the resin material for the distribution sheet material that long-term irradiation ultraviolet will not also deteriorate has made intensive studies.Its result is learnt:Distribution The friendship of characteristic possessed by sheet material species of resin, the density of resin, the melt flow rate (MFR) of resin, resin used in The combinations of various factors such as connection state, the species of additive or use level and delicate change occurs.Accordingly, it is difficult to vague generalization advise The fixed feature for being used to form the resin material of the involved distribution sheet material of this case invention.
Therefore, the present inventor etc. can make the luminous energy from ultraviolet efficiently contribute to the distribution piece to generate electricity to realize Material and the result furtherd investigate, find the standard of light transmittance of resin sheet at 350nm wavelength as design pointer More effectively, so as to complete the present invention.
According to the present invention, there is provided a kind of distribution sheet material, it has resin sheet and is arranged at one of the resin sheet The fine distribution in face, and be 70% according to the light transmittance at the 350nm of the JIS-K7105 resin sheets determined wavelength More than.
Moreover, according to the present invention, there is provided a kind of structure, it includes above-mentioned distribution sheet material and encapsulant, the sealing Material is formed by the resin material comprising any of following (A) and (B),
(A) ethene and the copolymer of unsaturated carboxylic acid or the ionomer of the copolymer are included,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
And then according to the present invention, there is provided a kind of smooth electricity generation module, it possesses light-transmitting substrate and above-mentioned distribution sheet material.
Invention effect
In accordance with the invention it is possible to provide a kind of distribution for making the luminous energy from ultraviolet also can efficiently contribute to generating Sheet material, the structure for possessing the distribution sheet material and light electricity generation module.
Brief description of the drawings
Above-mentioned purpose and other objects, features and advantages by preferred embodiment as described below and its are attached The following drawings and further become clear and definite.
Fig. 1 is one of the sectional view for representing the distribution sheet material involved by the 1st embodiment.
Fig. 2 is one of the top view for representing the distribution sheet material involved by the 1st embodiment.
Fig. 3 is one of the sectional view for representing the structure involved by the 1st embodiment.
Fig. 4 is one of the sectional view for representing the light electricity generation module involved by the 1st embodiment.
Fig. 5 is one of the sectional view for representing the distribution sheet material involved by the 2nd embodiment.
Fig. 6 is one of the schematic cross sectional views for the Rotating fields for representing the light electricity generation module involved by the 2nd embodiment.
Embodiment
(the 1st embodiment)
The > > of < < distributions sheet material 100
Fig. 1 is one of the sectional view for representing the distribution sheet material 100 involved by present embodiment.
As shown in figure 1, the distribution sheet material 100 involved by present embodiment has resin sheet 10 and is arranged at above-mentioned resin The fine distribution 20 in one face of sheet material 10.Also, according to the 350nm of JIS-K7105 above-mentioned resin sheets 10 determined Light transmittance at wavelength is more than 70%.By in such manner, it is possible to which realizing makes the luminous energy from ultraviolet also can efficiently help In the distribution sheet material 100 of generating.
The luminous energy from ultraviolet in present embodiment, refer to the luminous energy for being derived from the light of the wavelength region less than 380nm.
As described in the item of background technology, in recent years, for light electricity generation module, generating efficiency and cost degradation etc. are improved It is required that level improves constantly.In light of this situation, in recent years, in order to realize in addition to the luminous energy from visible ray, can also make Luminous energy from ultraviolet is converted into the light electricity generation module of electric energy, and to making to change containing fluorescent material equiwavelength in resin sheet The technology of agent has carried out various researchs.But the following opinion of the acquisition such as the present inventor:Even if make containing wavelength to turn in resin sheet Agent is changed, when the wavelength of the ultraviolet to being absorbed is changed, can also lose micro luminous energy.Specifically, the present inventor Deng discovery:In the case where using the resin sheet containing conventional wavelength-shifting agent, can produce can not be by from being absorbed A part for the luminous energy of ultraviolet is converted into the collection electrical loss of electric energy.
Also, to sealing light generating element in light electricity generation module and using to be configured at the light electricity generation module Resin sheet premised on smooth surface (plane of incidence) side is general to require the following 6 kinds of performances enumerated.Performance required by 1st For for making more light transmissive transparencys.Performance required by 2nd is the flexibility for preventing light generating element from rupturing. Performance required by 3rd is the journey can prevent air from being invaded outside light electricity generation module and be contacted with light generating element Degree, the cementability of above-mentioned smooth generating element and the closely sealed state of the resin sheet can be realized.Performance required by 4th is can Prevent the tensile strength for causing the degree of resin expansion or contraction because of the temperature change in the use environment of light electricity generation module.The Performance required by 5 is that can suppress the weatherability for the degree that resin material deteriorates by ultraviolet.Property required by 6th It can be the long-term humidity resistance of the degree for the performance reduction or failure that light generating element can be prevented in the use of electricity generation module.
Herein, as described above, the distribution sheet material 100 involved by present embodiment is to employ resin sheet 10 to make spy The distribution sheet material of the wavelength 350nm of the quantitative above light transmissive composition.Therefore, the distribution piece according to involved by present embodiment Material 100, not the wavelength of the ultraviolet to being absorbed changed and can utilize from above-mentioned ultraviolet luminous energy.Thus, with Conventional resin sheet is compared, and can realize the light electricity generation module for improving generating efficiency.In addition, matching somebody with somebody involved by present embodiment Line sheet material 100 naturally meets that above-mentioned 6 kinds require characteristic.
On the distribution sheet material 100 involved by present embodiment, according to the JIS-K7105 resin sheets 10 determined Light transmittance at 350nm wavelength is more than 70%, but preferably more than 75%, more preferably more than 80%.By so, energy It is enough further effectively to make the luminous energy from ultraviolet help to generate electricity.
On the distribution sheet material 100 involved by present embodiment, the above-mentioned resin sheet 10 determined according to JIS-K7105 Total light transmittance be preferably more than 80%, more preferably more than 85%.It can be made each by so, being not limited to ultraviolet light The light of kind wavelength region efficiently contributes to generate electricity.In addition, according to JIS-K7105 total light transmittance measure in use comprising The white light of ultraviolet light, visible ray and infrared light.
The fine > of distribution 20 of <
As shown in figure 1, on distribution sheet material 100, a part for preferably fine distribution 20 is embedded in resin sheet 10. By in such manner, it is possible to make the engagement state of fine distribution 20 and resin sheet 10 become firm.Therefore, it is possible to relax because in Impact that light generating element 400 (reference picture 4) in the state of after being sealed using distribution sheet material 100 is applied and it is caused Influence.
Fig. 2 is one of the top view for representing the distribution sheet material 100 involved by present embodiment.
As shown in Fig. 2 from the viewpoint of the cost degradation of light electricity generation module, the distribution sheet material involved by present embodiment Fine distribution 20 in 100 is preferably to be formed by the more wires abreast configured.By in such manner, it is possible to reduce use In the amount for the metal material for forming fine distribution 20.As the metal material for forming fine distribution 20, can enumerate:Silver, copper, indium and Tin etc..Among these, the preferably alloy of indium, tin or indium and tin.In addition, from the viewpoint of current collecting efficiency, formed fine The above-mentioned metal wire of distribution 20 is preferably diameter more than 50 μm and less than 500 μm of metal wire, more preferably more than 100 μm of diameter And less than 300 μm of metal wire.
The > of < resin sheets 10
As being used for solving described in the means of technical task, possessed by the distribution sheet material 100 involved by present embodiment The characteristic species of resin, the density of resin, the melt flow rate (MFR) of resin, the cross-linked state of resin, addition used in The combination of the various factors such as the species or use level of agent and change, but the resin sheet 10 in the distribution sheet material 100 is preferred For by the ionomer of the copolymer comprising (A) ethene and unsaturated carboxylic acid or the copolymer of ethene and unsaturated carboxylic acid and (B) comprising ethene with appointing in the copolymer of (methyl) glycidyl acrylate (also referred to as glycidol (methyl) acrylate) The resin material of one is formed.By the way that even if in such manner, it is possible to realize long-term use of light electricity generation module, resin is not easy to because ultraviolet Line and the distribution sheet material 100 deteriorated.As its reason, can enumerate:Above-mentioned each resin material is the higher tree of the transparency Fat, and to be not easily susceptible to the excellent resin material of the mechanical properties such as influence and the tensile strength of ultraviolet.Therefore, to upper State resin material be combined into carry out height control in the case of, can realize can make from ultraviolet luminous energy efficiently Contribute to the possibility of the resin sheet 10 of generating higher.In addition, on formed resin sheet 10 resin material it is detailed in Appearance will be explained hereinafter.
On resin sheet 10, under the conditions of room temperature (25 DEG C), determined according to JIS-K7125 and using D type hardness tester meters The Shore D hardness of material of the formation resin sheet 10 be preferably more than 25 and less than 200, more preferably more than 30 and 200 Hereinafter, more preferably more than 45 and less than 200, and then more preferably more than 48 and less than 100.By so, being sent out in light In electric module, it can relax because being applied to the light generating element 400 in the state of after being sealed using distribution sheet material 100 The impact that adds and caused influence.Therefore, the Shore D hardness determined under given conditions to specific region according to possessing is above-mentioned The distribution sheet material 100 of resin sheet 10 in number range, it is possible to increase the durability of light electricity generation module.Also, due to setting When forming fine distribution 20 on fat sheet material 10, it can moderately control fine distribution 20 embedded in resin sheet 10, therefore Suitable for that can make to become good with the connection of light generating element 400 during light electricity generation module.Thus, according to involved by present embodiment And distribution sheet material 100, can further improve generating efficiency.
On resin sheet 10, forming storage elastic modulus E' of the material of the resin sheet 10 at 60 DEG C is preferably More than 1MPa and below 1000MPa, more preferably more than 10MPa and below 1000MPa, more preferably more than 20MPa and Below 500MPa.By that so, in light electricity generation module, can relax because to after being sealed using distribution sheet material 100 In the state of the impact that is applied of light generating element 400 and caused influence, and then, fine distribution 20 can be buried tune Save as appropriate scope.Therefore, the storage elastic modulus E' determined under given conditions to specific region according to possessing is above-mentioned The distribution sheet material 100 of resin sheet 10 in number range, it is possible to increase the durability of light electricity generation module, and improve generating effect Rate.
On resin sheet 10, the material to forming the resin sheet 10, under the conditions of room temperature (25 DEG C), according to JIS- The modulus of flexural rigidity that K7106 is determined is preferably more than 10MPa and below 400MPa, more preferably more than 30MPa and Below 400MPa, more preferably more than 50MPa and below 400MPa, so more preferably more than 100MPa and 300MPa with Under.By in such manner, it is possible to effectively further suppress the temperature change in the use environment because of light electricity generation module to cause resin Expansion or shrinkage.
Resin sheet 10 is preferably to be stretched according to JIS-K7127 under conditions of 25 DEG C, loading speed 200mm/min The tensile modulus of elasticity value obtained during experiment meets the value of following condition.Specifically, will according to JIS-K7127 25 DEG C, The tensile elasticity mould in the MD directions of the resin sheet 10 obtained when carrying out tension test under conditions of loading speed 200mm/min Amount is set to TSM, will be obtained according to JIS-K7127 when carrying out tension test under conditions of 25 DEG C, loading speed 200mm/min The tensile modulus of elasticity in TD directions of resin sheet 10 be set to TSTWhen, TSM/TSTValue be preferably more than 0.9 and less than 1.1, More preferably more than 0.95 and less than 1.05.By in such manner, it is possible to which the universe throughout resin sheet 10 assigns uniform draw Stretch characteristic.Thus, even if in the case of the temperature in use condition generation of light electricity generation module is jumpy, also can effectively press down System causes power generation characteristics possessed by the light electricity generation module to change because of the expansion or shrinkage of resin material.
On resin sheet 10, the moisture permeable coefficient of the resin sheet 10 under 85 DEG C, 90%RH is preferably 0gmm/m2· More than day and 100gmm/m2Below day, more preferably 0gmm/m2More than day and 70gmm/m2·day Below.By in such manner, it is possible to realize the more excellent distribution sheet material 100 of long-term humidity resistance.
Next, the resin material for forming the resin sheet 10 involved by present embodiment is illustrated.
As described above, the resin sheet 10 involved by present embodiment is preferably by including any of following (A) and (B) Resin material formed,
(A) ion of the copolymer comprising ethene and unsaturated carboxylic acid or the copolymer comprising ethene and unsaturated carboxylic acid Polymer,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
Resin material for forming resin sheet 10, according to JIS-K7210-1999 in 190 DEG C, load 2169g bar The melt flow rate (MFR) determined under part is preferably more than 0.1g/10min and below 50g/10min, more preferably 0.5g/ More than 10min and below 30g/10min, most preferably more than 1g/10min and below 20g/10min.By that so, can improve The processability of sheet material, therefore the spilling of resin can be suppressed, and realize good cementability when making light electricity generation module.
As ethene and unsaturated carboxylic acid copolymer or ethene and unsaturated carboxylic acid copolymer ionomer in Unsaturated carboxylic acid composition, can enumerate:Acrylic acid, methacrylic acid, ethylacrylic acid, fumaric acid, maleic acid, maleic acid list first Ester, maleic anhydride etc..Wherein, it is preferably (methyl) acrylic acid as unsaturated carboxylic acid composition.Therefore, as ethene and insatiable hunger With the copolymer of carboxylic acid, preferably ethene/(methyl) acrylic copolymer.In addition, ethene/insatiable hunger involved by present embodiment The bipolymer of ethene and unsaturated carboxylic acid is not limited to polymers of carboxylic acid, also comprising ethene/unsaturated carboxylic acid/insatiable hunger With the multiple copolymer comprising ethene and unsaturated carboxylic acid such as carboxylate copolymer.As above-mentioned ethene/unsaturated carboxylic acid/insatiable hunger With the esters of unsaturated carboxylic acids composition in carboxylate copolymer, the various carboxylics used as above-mentioned unsaturated carboxylic acid composition can be enumerated The Arrcostab of the carbon number 1~20 of acid.Specifically, as alkyl, can enumerate:Methyl, ethyl, n-propyl, isopropyl, just Butyl, isobutyl group, 2- ethylhexyls, iso-octyl etc..
On (the first in the ethene involved by present embodiment and the copolymer of unsaturated carboxylic acid or its ionomer Base) the unsaturated carboxylic acid unit such as acrylic acid units content, from the viewpoint of excellent UV transmissive is realized, be preferably More than 2 weight % and below 30 weight %, more preferably more than 4 weight % and below 25 weight %, more preferably 9 weights More than % and below 25 weight % are measured, most preferably more than 12 weight % and below 20 weight %.
Also, in the case where copolymer contains esters of unsaturated carboxylic acids, esters of unsaturated carboxylic acids is relative to copolymer total amount Content is preferably more than 1 weight % and below 35 weight %, more preferably more than 3 weight % and below 32 weight %, further Preferably more than 5 weight % and below 30 weight %.
In the ionomer of ethene and the copolymer of unsaturated carboxylic acid, can contain be derived from the alkali metal such as lithium, sodium, The metal species of the polyvalent metals such as calcium, magnesium, cerium, zinc, aluminium etc.., can be preferably with sodium, magnesium, zinc among these.Generally, Know the transparent excellent of ionomer, and the storage elastic modulus E' under high temperature is higher.Also, involved by present embodiment The degree of neutralization of the ionomer of the copolymer of ethene and unsaturated carboxylic acid is preferably less than 80%, is examined from the viewpoint of cementability Consider, more preferably less than 60%, most preferably less than 40%.
Also, in the ionic polymerization of the copolymer by ethene and unsaturated carboxylic acid or the copolymer of ethene and unsaturated carboxylic acid In the case that thing forms the resin sheet 10 involved by present embodiment, from the transparent and good cementability sight for making copolymer Point considers that unsaturated carboxylic acid is preferably more than 1 weight % relative to the content of copolymer total amount, more preferably more than 2 weight %, More preferably more than 3 weight %.On the other hand, from the viewpoint of hygroscopicity is reduced, unsaturated carboxylic acid is relative to copolymerization The content of thing total amount is preferably below 20 weight %, more preferably below 15 weight %.
It is also, good from the transparency and cementability for making copolymer in the case where copolymer contains esters of unsaturated carboxylic acids From the viewpoint of, esters of unsaturated carboxylic acids is preferably more than 1 weight % more preferably 3 weights relative to the content of copolymer total amount More than % is measured, more preferably more than 5 weight %.On the other hand, in the case where copolymer contains esters of unsaturated carboxylic acids, from From the viewpoint of reducing hygroscopicity, esters of unsaturated carboxylic acids is preferably below 35 weight %, more relative to the content of copolymer total amount Preferably below 32 weight %, more preferably below 30 weight %.
In the present embodiment, the fusing point of the copolymer of ethene and unsaturated carboxylic acid is preferably more than 55 DEG C, further excellent Elect more than 60 DEG C, most preferably more than 70 DEG C as.By in such manner, it is possible to suppress what is risen when using light electricity generation module in temperature In the case of resin sheet 10 deform or when manufacturing light electricity generation module resin material outflow or produce burr.
The copolymer of ethene and unsaturated carboxylic acid involved by present embodiment can be by entering under high temperature, condition of high voltage Row free radicals copolymerization reaction and obtain.Also, the ionomer of the copolymer of ethene and unsaturated carboxylic acid can be by making second The copolymer of alkene and unsaturated carboxylic acid is reacted and obtained with metallic compound.
Ethene and (methyl) glycidyl are included contained by resin sheet 10 involved by present embodiment (methyl) glycidyl acrylate included in the copolymer of ester, refer to GMA or acrylic acid contracting At least one of water glyceride.
As the copolymer comprising ethene Yu (methyl) glycidyl acrylate, such as can enumerate selected from ethene/(first Base) glycidyl acrylate copolymer, ethene/(methyl) glycidyl acrylate/vinyl acetate copolymer and ethene/ It is more than one or both of (methyl) glycidyl acrylate/(methyl) acrylate copolymer etc..
(methyl) glycidyl is derived from copolymer comprising ethene and (methyl) glycidyl acrylate The content ratio of the Component units of ester is preferably more than 2 weight % and below 30 weight %, more preferably more than 3 weight % and 25 Below weight %.
If the content ratio of the Component units from (methyl) glycidyl acrylate is within the above range, can make The cementability of the resin sheet 10 obtained or the balance of flexibility, operability, processability etc. become better.
Containing comprising ethene and the Component units of ethene " be derived from " in the copolymer of (methyl) glycidyl acrylate Proportional is preferably more than 65 weight %, more preferably more than 70 weight %, especially preferably more than 80 weight %.Now, wrap Copolymer containing ethene and (methyl) glycidyl acrylate can be included further except ethene, the shrink of (methyl) acrylic acid are sweet Other monomers unit (for example, vinyl acetate, (methyl) acrylate etc.) beyond grease.
Specifically, except the composition list for containing the Component units from ethene with being derived from (methyl) glycidyl acrylate Beyond the copolymer of member, it can also enumerate in addition to 2 kinds of Component units, containing the Component units from vinyl acetate and be derived from Copolymer of at least one of the Component units of (methyl) acrylate etc..
The content ratio of Component units from vinyl acetate and the Component units from (methyl) acrylate is preferred For below 30 weight %, more preferably below 20 weight %.
Under the content ratio of Component units from vinyl acetate and the Component units from (methyl) acrylate There is no particular restriction for limit value, it may be desirable to preferably more than 0.1 weight %, more preferably more than 0.5 weight %, more preferably More than 1 weight %.And then the Component units from vinyl acetate or the Component units from (methyl) acrylate contain Ratio is preferably the scope of 0.1~30 weight % scope, more preferably 0.5~20 weight %, and especially preferably 1~20 Weight % scope.
Copolymer comprising ethene and (methyl) glycidyl acrylate can be used alone a kind or by copolymerization ratio etc. no With two or more of the different copolymer of two or more or monomeric species of copolymer be combined and use.
At least a portion comprising ethene and the copolymer of (methyl) glycidyl acrylate also can be through silane coupler It is modified.
The content of silane coupler is in the weight % of copolymer 1 00 comprising ethene and (methyl) glycidyl acrylate Preferably 0.01~5 weight %.
In resin sheet 10, as long as containing any one of above-mentioned (A) and (B), but be preferably in resin sheet Above-mentioned (A) and (B) containing total more than 30 weight % in the 10 weight % of resin component 100, more preferably containing 40 weights More than % is measured, more preferably containing more than 50 weight %.There is no particular restriction for higher limit, in the situation containing above-mentioned (B) Under, preferably below 80 weight %, more preferably below 60 weight %.
Also, other resins can also be included by forming the resin material of the resin sheet 10 involved by present embodiment.As Other resins, such as propylene resin or vinylite etc. can be enumerated.
As vinylite, the content ratio that can enumerate the Component units of the alpha-olefin from carbon number 3~20 is 5 Mole % is less than 50 moles of % ethylene/alpha-olefin copolymer or ethylene/polar monomer copolymer etc..
As the concrete example of the alpha-olefin of above-mentioned carbon number 3~20, can enumerate:Propylene, 1- butylene, 1- amylenes, 1- oneself Alkene, 1- heptene, 1- octenes, 1- nonenes, 1- decene, 1- endecatylenes, 1- dodecylenes, 1- tridecylenes, tetradecene, 1- α-alkene of the straight-chains such as 15 carbenes, cetene, 1- heptadecenes, 1- vaccenic acids, the carbenes of 1- 19,1- eicosylenes Hydrocarbon;3-methyl-1-butene, 3- Methyl-1-pentenes, 4-methyl-1-pentene, 2- ethyl -1- hexenes, 2,2,4- trimethyls -1- penta Alpha-olefin of the branched such as alkene etc., these also can combine 2 kinds and use.
Wherein, from the aspect of versatility (cost and production or the easiness of acquisition), the carbon of above-mentioned alpha-olefin is former Subnumber is preferably 3~10, and more preferably 3~8.
As ethylene/alpha-olefin copolymer, preferably ethylene/propene copolymer, Ethylene/1-butene copolymer, ethene/4- Methyl-1 pentene copolymer, ethene/1- hexene copolymers, ethene/1- octene copolymers, any ethylene/alpha-olefin copolymer are equal The content ratio for referring to the Component units from ethene is 50 moles of more than %.
Ethylene/alpha-olefin copolymer for example can be by using metallocene series catalysts slurry polymerization, polymerisation in solution Method, block polymerization, gaseous polymerization etc. and manufacture.
Ethylene/polar monomer copolymer can for example enumerate ethylene/vinyl ester copolymers and ethene/esters of unsaturated carboxylic acids copolymerization Thing etc..Polar monomer refers to the monomer with functional group in the present embodiment.
As ethylene/vinyl ester copolymers, such as can use selected from ethylene/vinyl acetate, ethylene/propylene acid One or both of vinyl ester copolymers, ethene/vinyl butyrate copolymer, ethene/vinyl stearate copolymer etc. with On.
Ethene/unsaturated carboxylic acid ester copolymer involved by present embodiment be by ethene and esters of unsaturated carboxylic acids at least 1 kind carries out the polymer that copolymerization forms.
Specifically, the copolymer of the Arrcostab comprising ethene and unsaturated carboxylic acid can be illustrated.
As the unsaturated carboxylic acid in esters of unsaturated carboxylic acids, such as can enumerate:Acrylic acid, methacrylic acid, ethyl propylene Acid, crotonic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride etc..
As the alkyl portion in the Arrcostab of unsaturated carboxylic acid, the alkyl portion of carbon number 1~12 can be enumerated, more Specifically, can illustrate:It is methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, sec-butyl, 2- ethylhexyls, different The alkyl such as octyl group.In the present embodiment, the carbon number of the alkyl portion of Arrcostab is preferably 1~8.
As esters of unsaturated carboxylic acids, preferably include selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (first Base) isopropyl acrylate, (methyl) n-propyl, (methyl) isobutyl acrylate, (methyl) n-butyl acrylate, (first Base) it is more than one or both of (methyl) acrylate such as Isooctyl acrylate monomer, (methyl) 2-EHA etc..This A little esters of unsaturated carboxylic acids can be used alone a kind, can also use two or more combination.Among these, more preferably comprising choosing From (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) isopropyl acrylate, (methyl) n-propyl, (first Base) it is more than one or both of isobutyl acrylate and (methyl) n-butyl acrylate etc..
In the present embodiment, preferable ethene/unsaturated carboxylic acid ester copolymer is ethene/(methyl) acrylic ester copolymer Thing.Wherein, preferably comprising the copolymer a kind of compound as (methyl) acrylate.As this copolymer, can enumerate: Ethene/(methyl) methyl acrylate copolymer, ethene/(methyl) ethyl acrylate copolymer, ethene/(methyl) acrylic acid isopropyl Ester copolymer, ethene/(methyl) n-propyl copolymer, ethene/(methyl) isobutyl acrylate copolymer, ethene/(first Base) n-butyl acrylate copolymers, ethene/(methyl) Isooctyl acrylate monomer copolymer, ethene/(methyl) acrylic acid 2- ethyl hexyls Ester copolymer etc..
Ethylene/polar monomer copolymer is preferably to include selected from ethylene/vinyl acetate, ethene/(methyl) third E pioic acid methyl ester copolymer, ethene/(methyl) ethyl acrylate copolymer, ethene/(methyl) isopropyl acrylate copolymer, second Alkene/(methyl) n-propyl copolymer, ethene/(methyl) isobutyl acrylate copolymer, ethene/(methyl) acrylic acid are just More than one or both of acrylate copolymer, more preferably comprising ethylene/vinyl acetate.
In addition, in the present embodiment, ethylene/polar monomer copolymer can be used alone, also can be by two or more combinations And use.
These other resins also can be through silane coupler modified.
The content of silane coupler is preferably 0.01~5 weight % in other resin components 100 weight %.
Also, in the resin material for forming the resin sheet 10 involved by present embodiment, such as it can also coordinate quinhydrones The heat stabilizers such as the antioxidants such as single benzyl oxide, triphenyl phosphite, lead stearate, barium laurate, light stabilizer, antioxidant, The fillers such as silane coupler, particulate titanium dioxide, zinc oxide, pigment, dyestuff, lubrication prescription, antiblocking agent, foaming agent, blowing promotor, The various additives such as crosslinking agent, crosslinking coagent, ultra-violet absorber, fire retardant, inorganic filler.Especially by distribution sheet material In the case that 100 are configured at back cover sheet material side, imitated due to not requiring the distribution sheet material 100 transparency, therefore from improving to generate electricity From the viewpoint of rate, preferably coordinate pigment, dyestuff, inorganic filler.As above-mentioned light stabilizer, such as hindered amine can be used The light stabilizer of system.The content of each composition is preferably 0.005~2 relative to the parts by weight of resin component 100 in resin sheet 10 Parts by weight, more preferably 0.008~1 parts by weight.
As the concrete example for the amine system light stabilizer that is obstructed, can enumerate:4- acetoxyl group -2,2,6,6- tetramethyl piperidines, 4- Stearoyl-oxy -2,2,6,6- tetramethyl piperidines, 4- acryloxy -2,2,6,6- tetramethyl piperidines, 4- benzoyloxy -2, 2,6,6- tetramethyl piperidines, 4- hexamethylene acyloxy -2,2,6,6- tetramethyl piperidines, 4- (adjacent chlorobenzoyl epoxide) -2,2,6,6- Tetramethyl piperidine, 4- (phenoxyacetyl epoxide) -2,2,6,6- tetramethyl piperidines, the azepine -7,7,9,9- tetramethyls of 1,3,8- tri- - 2,4- dioxies -3- n-octyls-spiral shell [4,5] decane, bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, double (2,2,6,6- Tetramethyl -4- piperidyls) terephthalate, double (1,2,2,6,6- pentamethyl -4- piperidyls) sebacates, three (2,2,6, 6- tetramethyl -4- piperidyls) benzene -1,3,5- front threes acid esters, three (2,2,6,6- tetramethyl -4- piperidyls) -2- acetoxyl groups third Alkane -1,2,3- front threes acid esters, three (2,2,6,6- tetramethyl -4- piperidyls) -2- hydroxy propane -1,2,3- front threes acid esters, three (2, 2,6,6- tetramethyl -4- piperidyls) triazine -2,4,6- front threes acid esters, three (2,2,6,6- tetramethyl -4- piperidines) phosphite esters, Three (2,2,6,6- tetramethyl -4- piperidyls) butane -1,2,3- front threes acid esters, four (2,2,6,6- tetramethyl -4- piperidyls) third Alkane -1,1,2,3- tetraformic ethers, four (2,2,6,6- tetramethyl -4- piperidyls) butane -1,2,3,4- tetraformic ethers etc..
As antioxidant, the antioxidant of various hindered phenol series or phosphite ester system can be enumerated.As above-mentioned hindered phenol It is the concrete example of antioxidant, can enumerates:2,6- di-t-butyls-paracresol, the 2- tert-butyl group -4- metoxyphenols, the 3- tert-butyl groups - 4- metoxyphenols, 2,6- di-t-butyl -4- ethyl -phenols, 2,2' methylene bis (4- methyl-6-tert-butylphenols), 2,2'- Methylene-bis(4-ethyl-6-t-butyl phenol), 4,4' methylene bis (2,6 di t butyl phenol), 2,2' methylene bis [6- (1- methylcyclohexyls)-paracresol], double [double (4- hydroxyl -3- tert-butyl-phenyls) butyric acid of 3,3-] diol esters, 4,4'- Aden Base double (the 6- tert-butyl groups-metacresol), 2,2'- ethylenebis (4- sec-butyl -6- tert-butyl phenols), 2,2'- ethylenebis (4,6- DI-tert-butylphenol compounds), 1,1,3- tri- (2- methyl -4- hydroxyl -5- tert-butyl-phenyls) butane, 1,3,5- tri- (3,5- di-t-butyls - 4- hydroxybenzyls) -2,4,6- trimethylbenzenes, 2,6- diphenyl -4- octade-cyloxyphenols, the four [methylene -3- (uncles of 3,5- bis- Butyl -4- hydroxy phenyls) propionic ester] methane, n-octadecane base -3- (3,5- di-tert-butyl-hydroxy phenyls) propionic ester, 4, Double [1,1- dimethyl -2- [the β-(3- tertiary butyl-4-hydroxies -5- of 4'- thiobis (the 6- tert-butyl groups-metacresol), tocopherol, 3,9- Aminomethyl phenyl) propionyloxy] ethyl] -2,4,8,10- four oxaspiro [5,5] hendecane, (3,5- di-t-butyls-the 4- of 2,4,6- tri- Hydroxyl benzylthio) -1,3,5- triazines, pentaerythrite four [3- (3,5- di-tert-butyl-hydroxy phenyls) propionic ester] etc..
Also, as the concrete example of phosphite ester system antioxidant, it can enumerate:3,5- di-tert-butyl-4-hydroxyl benzyl phosphines Hydrochlorate (phosphanate) dimethyl ester, double (3,5- di-tert-butyl-4-hydroxyl benzyls phosphinic acid ethyl esters), three (2,4- di-tert-butyls Base) phosphonate (phosphanate) etc..
As silane coupler, can enumerate with vinyl, amino or epoxy radicals and such as silicon of the hydrolysising group of alkoxy Alkane coupling agent and titanium coupling agent etc..As the concrete example of this silane coupler, can enumerate:Vinyltrimethoxy silane, γ- Methyl allyl acyloxypropyl trimethoxysilane, gamma-methyl allyl acyloxypropyl methyl dimethoxysilane, γ-acryloyl-oxy Propyl trimethoxy silicane, γ-glycidoxypropyltrime,hoxysilane, 3- glycidoxypropyl dimethoxy silicon Alkane, 3- glycidoxypropyls diethoxy silane, N- (2- amino-ethyls) -3- TSL 8330s, N- (2- amino-ethyls) -3-amino propyl methyl diethoxy silane, N- (2- amino-ethyls) -3- amino propyl methyl dimethoxys Silane, 3- TSL 8330s, APTES, N- phenyl -3- aminopropyl trimethoxies Silane and N- phenyl-APTES etc..
As ultra-violet absorber, such as following absorbent can be used:ESCALOL 567,2,2'- bis- Hydroxyl -4- methoxy benzophenones, 2- hydroxyl -4- methoxyl group -2- carboxyl benzophenones and 2- hydroxyl -4- n-octyloxy hexichol first The benzophenone series such as ketone;2- (2'- hydroxyls -3', 5'- di-tert-butyl-phenyl) BTA, 2- (2'- hydroxy-5-methyl bases phenyl) BTA and 2- (2'- hydroxyl -5- t-octyls phenyl) BTA, the tertiary pentyls of 2- (2H- BTA -2- bases) -4,6- two The enumerate BTA systems such as phenol;The absorbent of the salicylate such as phenyl salicylate and p-octylphenyl salicylate system.
As pigment, can enumerate:The blue pigments such as the Chinese white such as titanium oxide or calcium carbonate, ultramarine, the black of such as carbon black Pigment etc..Especially from the viewpoint of the insulaion resistance reduction for preventing light electricity generation module, preferably coordinate the nothing such as titanium oxide Machine pigment.
Formed present embodiment involved by resin sheet 10 resin material in, such as also can arbitrarily coordinate cadmium, The soap of the metals such as barium is as anti-blushing agent.
Additionally, it is preferred that the surface for the face of the fine distribution 20 of configuration to resin sheet 10 assigns bonding agent composition, to prevent The only position skew of fine distribution 20.Also, resin sheet 10 is alternatively and forms the resin sheet that sandwich construction forms.Resin sheet The gross thickness of material 10 is preferably more than 10 μm and less than 500 μm, more preferably more than 25 μm and less than 200 μm.
It is preferably 3-tier architecture in the case where resin sheet 10 is sandwich construction.Now, the thickness of top layer (one side) is preferred For more than 1 μm and less than 100 μm, the thickness in intermediate layer is preferably more than 4 μm and less than 400 μm.
The manufacture method > of < distributions sheet material 100
The manufacture method of distribution sheet material 100 involved by present embodiment is different from conventional manufacture method, it is necessary to height Control forms the joint method with being combined into or on resin sheet 10 and fine distribution 20 of the resin material of resin sheet 10 Condition.That is, the manufacture method of the various factors involved by following 2 conditions is controlled by height, foundation can be obtained The value of light transmittance at the 350nm for the resin sheet 10 that JIS-K7105 is determined wavelength meets the distribution of above-mentioned specified conditions Sheet material 100.
(1) selection of the resin material of resin sheet 10 is formed
(2) joint method of resin sheet 10 and fine distribution 20
Hereinafter, one of the manufacture method of the distribution sheet material 100 involved by present embodiment is illustrated.But this The manufacture method of the distribution sheet material 100 of embodiment is not limited to following example.Also, on the distribution sheet material of present embodiment One of 100 manufacture method, is specifically described in the following embodiments.
(1) selection of the resin material of resin sheet 10 is formed
As described in the item for the means of above-mentioned solution technical task, even if can be used to obtain in long-term irradiation purple The resin material for the distribution sheet material 100 that outside line will not also deteriorate, it is necessary to by the species of used resin, the density of resin, tree The various factors such as the cross-linked state of fat, the species of additive or use level carry out appropriately combined.Also, it is according to the resin material This point of the excellent resin material of the mechanical properties such as the influence of ultraviolet and intensity is not easily susceptible to, is formed involved by present embodiment And resin sheet 10 resin material be preferably comprising any one in following (A) and (B),
(A) ion of the copolymer comprising ethene and unsaturated carboxylic acid or the copolymer comprising ethene and unsaturated carboxylic acid Polymer,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
(2) joint method of resin sheet 10 and fine distribution 20
In order to obtain the distribution sheet material 100 involved by present embodiment, such as can be micro- with being formed by the roller of resin sheet 10 The metal wire of thin distribution 20 carries out caking and obtained.Also, in the distribution sheet material 100 involved by manufacture present embodiment When, it is necessary to by the temperature that the heating and temperature control of press section is the melt surface for only making resin sheet 10.Specifically, it is preferably It it is more than 50 DEG C and less than 120 DEG C by the heating and temperature control of above-mentioned press section.By in such manner, it is possible to which realizing prevents fine distribution The distribution sheet material 100 of 20 position skew.Also, the engagement of resin sheet 10 and fine distribution 20 for example can also be used Japanese special Described method is carried out in the open 2005-536894 publications of profit.
The > > of < < structures 200
Fig. 3 is one of the sectional view for representing the structure 200 involved by present embodiment.
As shown in figure 3, the structure 200 involved by present embodiment is by above-mentioned distribution sheet material 100 and encapsulant 50 The structure of composition, the encapsulant 50 are formed by specific resin material.Herein, as the resin for forming encapsulant 50 Material, as long as the resin with sealability, then can unrestrictedly use, but it is preferably comprising any in following (A) and (B) Individual resin material.Also, in the case where structure 200 is configured at into unit rear side, from the viewpoint for improving generating efficiency Consider, preferably coordinate Chinese white in the resin material for forming encapsulant 50.In addition, form the resin of encapsulant 50 Material can be identical with the resin material of above-mentioned formation resin sheet 10, or different cooperations,
(A) ion of the copolymer comprising ethene and unsaturated carboxylic acid or the copolymer comprising ethene and unsaturated carboxylic acid Polymer,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
Next, the resin material for forming the encapsulant 50 involved by present embodiment is illustrated.
As described above, the encapsulant 50 involved by present embodiment is preferably by including any of following (A) and (B) Resin material formed,
(A) ion of the copolymer comprising ethene and unsaturated carboxylic acid or the copolymer comprising ethene and unsaturated carboxylic acid Polymer,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
As ethene and unsaturated carboxylic acid contained in the encapsulant 50 involved by present embodiment copolymer or Unsaturated carboxylic acid composition in the ionomer of the copolymer of ethene and unsaturated carboxylic acid, can be enumerated:Acrylic acid, metering system Acid, ethylacrylic acid, fumaric acid, maleic acid, monomethyl maleate, maleic anhydride etc..Wherein, as unsaturated carboxylic acid composition, Preferably (methyl) acrylic acid.Therefore, as ethene and the copolymer of unsaturated carboxylic acid, preferably ethene/(methyl) acrylic acid Copolymer.In addition, ethene/copolymers of unsaturated carboxylic acids involved by present embodiment is not limited to ethene and unsaturated carboxylic acid Bipolymer, also include ethene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer etc. and include ethene and unsaturated carboxylic acid Multiple copolymer.As the esters of unsaturated carboxylic acids composition in above-mentioned ethene/unsaturated carboxylic acid/unsaturated carboxylic acid ester copolymer, The Arrcostab of the carbon number 1~20 of the various carboxylic acids used as above-mentioned unsaturated carboxylic acid composition can be enumerated.Specifically, As alkyl, can enumerate:Methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, 2- ethylhexyls, iso-octyl etc..
On ethene and unsaturated carboxylic acid contained in the encapsulant 50 involved by present embodiment copolymer or The content of the unsaturated carboxylic acid units such as (methyl) acrylic acid units in its ionomer, from realizing excellent ultraviolet (uv) transmission From the viewpoint of property, preferably more than 2 weight % and below 30 weight %, more preferably more than 4 weight % and 25 weight % with Under, more preferably more than 9 weight % and below 25 weight %, most preferably more than 12 weight % and below 20 weight %.
Also, in the case where copolymer contains esters of unsaturated carboxylic acids, the content of esters of unsaturated carboxylic acids is relative to copolymer Total amount is preferably more than 1 weight % and below 35 weight %, more preferably more than 3 weight % and below 32 weight %, further Preferably more than 5 weight % and below 30 weight %.
The copolymerization of contained ethene in the encapsulant 50 involved by present embodiment and unsaturated carboxylic acid can be made Contain the metal species for being derived from the polyvalent metals such as alkali metal, calcium, magnesium, cerium, zinc, the aluminium such as lithium, sodium etc. in the ionomer of thing. , can be preferably with sodium, magnesium, zinc among these.It is known that, conventionally, ionomer is transparent excellent, and the storage under high temperature Elastic modulus E ' higher.Also, the ethene and unsaturated carboxylic acid contained by the encapsulant 50 involved by present embodiment The degree of neutralization of the ionomer of copolymer is preferably less than 80%, from the viewpoint of cementability, more preferably 60% Hereinafter, most preferably less than 40%.
Also, in the ionic polymerization of the copolymer by ethene and unsaturated carboxylic acid or the copolymer of ethene and unsaturated carboxylic acid In the case that thing forms the encapsulant 50 involved by present embodiment, from transparent and cementability the viewpoint for improving copolymer Consider, unsaturated carboxylic acid is preferably more than 1 weight % relative to the content of copolymer total amount, more preferably more than 2 weight %, is entered One step is preferably more than 3 weight %.On the other hand, from the viewpoint of hygroscopicity is reduced, unsaturated carboxylic acid is relative to copolymer The content of total amount is preferably below 20 weight %, more preferably below 15 weight %.
Also, in the case where copolymer contains esters of unsaturated carboxylic acids, from the transparency and cementability for improving copolymer Viewpoint considers that esters of unsaturated carboxylic acids is preferably more than 1 weight % more preferably 3 weight % relative to the content of copolymer total amount More than, more preferably more than 5 weight %.On the other hand, in the case where copolymer contains esters of unsaturated carboxylic acids, from reduction From the viewpoint of hygroscopicity, esters of unsaturated carboxylic acids is preferably below 35 weight %, further relative to the content of copolymer total amount Preferably below 30 weight %.
The fusing point of the copolymer of contained ethene and unsaturated carboxylic acid in encapsulant 50 involved by present embodiment Preferably more than 55 DEG C, more preferably more than 60 DEG C, most preferably more than 70 DEG C.By in such manner, it is possible to suppress using During light electricity generation module temperature rise in the case of resin sheet 10 deform or manufacturing light electricity generation module when resin material Outflow produces burr.
The copolymer of contained ethene and unsaturated carboxylic acid can lead in encapsulant 50 involved by present embodiment Cross and carry out free radicals copolymerization reaction under high temperature, condition of high voltage and obtain.Also, the copolymer of ethene and unsaturated carboxylic acid from Sub- polymer can be by making the copolymer of ethene and unsaturated carboxylic acid be reacted with metallic compound to obtain.
Ethene and (methyl) glycidyl are included contained by encapsulant 50 involved by present embodiment (methyl) glycidyl acrylate included in the copolymer of ester, refer to GMA or acrylic acid contracting At least one of water glyceride.
As the copolymer comprising ethene Yu (methyl) glycidyl acrylate, such as can enumerate selected from ethene/(first Base) glycidyl acrylate copolymer, ethene/(methyl) glycidyl acrylate/vinyl acetate copolymer and ethene/ It is more than one or both of (methyl) glycidyl acrylate/(methyl) acrylate copolymer etc..
(methyl) glycidyl is derived from copolymer comprising ethene and (methyl) glycidyl acrylate The content ratio of the Component units of ester is preferably more than 2 weight % and below 30 weight %, more preferably more than 3 weight % and 25 Below weight %.
If the content ratio of the Component units from (methyl) glycidyl acrylate is within the above range, can make The cementability of the encapsulant 50 obtained or the balance of flexibility, operability, processability etc. become better.
Containing comprising ethene and the Component units of ethene " be derived from " in the copolymer of (methyl) glycidyl acrylate Proportional is preferably more than 65 weight %, more preferably more than 70 weight %, especially preferably more than 80 weight %.Now, wrap Copolymer containing ethene and (methyl) glycidyl acrylate can be included further except ethene, the shrink of (methyl) acrylic acid are sweet Other monomers unit (for example, vinyl acetate, (methyl) acrylate etc.) beyond grease.
Specifically, except the composition containing the Component units from ethene, with being derived from (methyl) glycidyl acrylate It beyond the copolymer of unit, can also enumerate in addition to 2 kinds of Component units, further contain the composition list from vinyl acetate Copolymer of at least one of Component units first and from (methyl) acrylate etc..
The content ratio of Component units from vinyl acetate and the Component units from (methyl) acrylate is preferred For below 30 weight %, more preferably below 20 weight %.
Under the content ratio of Component units from vinyl acetate and the Component units from (methyl) acrylate There is no particular restriction for limit value, it may be desirable to preferably more than 0.1 weight %, more preferably more than 0.5 weight %, more preferably More than 1 weight %.And then the Component units from vinyl acetate or the Component units from (methyl) acrylate contain Ratio is preferably the scope of 0.1~30 weight % scope, more preferably 0.5~20 weight %, and especially preferably 1~20 Weight % scope.
Copolymer comprising ethene and (methyl) glycidyl acrylate can be used alone a kind or by copolymerization ratio etc. no With two or more of the different copolymer of two or more or monomeric species of copolymer be combined and use.
At least a portion comprising ethene and the copolymer of (methyl) glycidyl acrylate also can be through silane coupler It is modified.
The content of silane coupler is in the weight % of copolymer 1 00 comprising ethene and (methyl) glycidyl acrylate Preferably 0.01~5 weight %.
In encapsulant 50, as long as containing any one of above-mentioned (A) and (B), but be preferably in encapsulant Above-mentioned (A) and (B) containing total more than 30 weight % in the 50 weight % of resin component 100, more preferably containing 40 weights More than % is measured, more preferably containing more than 50 weight %.There is no particular restriction for higher limit, but in the feelings containing above-mentioned (B) Under condition, preferably below 80 weight %, more preferably below 60 weight %.
Also, other resins can also be included by forming the resin material of the encapsulant 50 involved by present embodiment.As Other resins, such as propylene resin or vinylite etc. can be enumerated.
As vinylite, the content ratio that can enumerate the Component units of the alpha-olefin from carbon number 3~20 is 5 Mole % is less than 50 moles of % ethylene/alpha-olefin copolymer or ethylene/polar monomer copolymer etc..
As the concrete example of the alpha-olefin of above-mentioned carbon number 3~20, can enumerate:Propylene, 1- butylene, 1- amylenes, 1- oneself Alkene, 1- heptene, 1- octenes, 1- nonenes, 1- decene, 1- endecatylenes, 1- dodecylenes, 1- tridecylenes, tetradecene, 1- α-alkene of the straight-chains such as 15 carbenes, cetene, 1- heptadecenes, 1- vaccenic acids, the carbenes of 1- 19,1- eicosylenes Hydrocarbon;3-methyl-1-butene, 3- Methyl-1-pentenes, 4-methyl-1-pentene, 2- ethyl -1- hexenes, 2,2,4- trimethyls -1- penta Alpha-olefin of the branched such as alkene etc., these also can be combined 2 kinds and use.
Wherein, from the aspect of versatility (cost and production or the easiness of acquisition), the carbon of above-mentioned alpha-olefin is former Subnumber is preferably 3~10, and more preferably 3~8.
As ethylene/alpha-olefin copolymer, preferably ethylene/propene copolymer, Ethylene/1-butene copolymer, ethene/4- Methyl-1 pentene copolymer, ethene/1- hexene copolymers, ethene/1- octene copolymers, any ethylene/alpha-olefin copolymer are equal The content ratio for referring to the composition from ethene is 50 moles of more than %.
Ethylene/alpha-olefin copolymer for example can be by using metallocene series catalysts slurry polymerization, polymerisation in solution Method, block polymerization, gaseous polymerization etc. and manufacture.
Ethylene/polar monomer copolymer can for example enumerate ethylene/vinyl ester copolymers and ethene/esters of unsaturated carboxylic acids copolymerization Thing etc..Polar monomer refers to the monomer with functional group in the present embodiment.
As ethylene/vinyl ester copolymers, such as can use selected from ethylene/vinyl acetate, ethylene/propylene acid One or both of vinyl ester copolymers, ethene/vinyl butyrate copolymer, ethene/vinyl stearate copolymer etc. with On.
Ethene/unsaturated carboxylic acid ester copolymer involved by present embodiment is to make in ethene and esters of unsaturated carboxylic acids extremely Few a kind carries out the polymer that copolymerization forms.
Specifically, the copolymer of the Arrcostab comprising ethene and unsaturated carboxylic acid can be illustrated.
As the unsaturated carboxylic acid in esters of unsaturated carboxylic acids, such as can enumerate:Acrylic acid, methacrylic acid, ethyl propylene Acid, crotonic acid, fumaric acid, maleic acid, maleic anhydride, itaconic acid, itaconic anhydride etc..
As the alkyl portion in the Arrcostab of unsaturated carboxylic acid, the alkyl portion of carbon number 1~12 can be enumerated, more Specifically, can illustrate:It is methyl, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, sec-butyl, 2- ethylhexyls, different The alkyl such as octyl group.In the present embodiment, the carbon number of the alkyl portion of Arrcostab is preferably 1~8.
As esters of unsaturated carboxylic acids, preferably include selected from (methyl) methyl acrylate, (methyl) ethyl acrylate, (first Base) isopropyl acrylate, (methyl) n-propyl, (methyl) isobutyl acrylate, (methyl) n-butyl acrylate, (first Base) it is more than one or both of (methyl) acrylate such as Isooctyl acrylate monomer, (methyl) 2-EHA etc..This A little esters of unsaturated carboxylic acids can be used alone a kind, can also use two or more combination.Among these, more preferably comprising choosing From (methyl) methyl acrylate, (methyl) ethyl acrylate, (methyl) isopropyl acrylate, (methyl) n-propyl, (first Base) it is more than one or both of isobutyl acrylate and (methyl) n-butyl acrylate etc..
In the present embodiment, preferable ethene/unsaturated carboxylic acid ester copolymer is ethene/(methyl) acrylic ester copolymer Thing.Wherein, preferably comprising the copolymer a kind of compound as (methyl) acrylate.As this copolymer, can enumerate: Ethene/(methyl) methyl acrylate copolymer, ethene/(methyl) ethyl acrylate copolymer, ethene/(methyl) acrylic acid isopropyl Ester copolymer, ethene/(methyl) n-propyl copolymer, ethene/(methyl) isobutyl acrylate copolymer, ethene/(first Base) n-butyl acrylate copolymers, ethene/(methyl) Isooctyl acrylate monomer copolymer, ethene/(methyl) acrylic acid 2- ethyl hexyls Ester copolymer etc..
Ethylene/polar monomer copolymer is preferably to include selected from ethylene/vinyl acetate, ethene/(methyl) third E pioic acid methyl ester copolymer, ethene/(methyl) ethyl acrylate copolymer, ethene/(methyl) isopropyl acrylate copolymer, second Alkene/(methyl) n-propyl copolymer, ethene/(methyl) isobutyl acrylate copolymer, ethene/(methyl) acrylic acid are just More than one or both of acrylate copolymer, more preferably comprising ethylene/vinyl acetate.
In addition, in the present embodiment, ethylene/polar monomer copolymer can be used alone, also can be by two or more combinations And use.
These other resins also can be through silane coupler modified.
The content of silane coupler is preferably 0.01~5 weight % in other resin components 100 weight %.
Also, in the resin material for forming the encapsulant 50 involved by present embodiment, such as it can also coordinate quinhydrones The heat stabilizers such as the antioxidants such as single benzyl oxide, triphenyl phosphite, lead stearate, barium laurate, particulate titanium dioxide, zinc oxide etc. Filler, pigment, dyestuff, lubrication prescription, antiblocking agent, foaming agent, blowing promotor, crosslinking agent, crosslinking coagent, ultra-violet absorber, The various additives such as fire retardant, inorganic filler.The content of each composition is relative to the weight of resin component 100 in encapsulant 50 Part is preferably to contain 0.005~2 parts by weight, more preferably containing 0.008~1 parts by weight.
It is particularly due to not require the encapsulant 50 for being used in back cover sheet material side the transparency, therefore is imitated from improving to generate electricity From the viewpoint of rate, preferably coordinate pigment, dyestuff, inorganic filler.As above-mentioned pigment, can enumerate:Titanium oxide or carbonic acid The black pigment of the blue pigments such as the Chinese whites such as calcium, ultramarine, such as carbon black.Especially from the insulated electro for preventing light electricity generation module From the viewpoint of resistance reduces, preferably coordinate the inorganic pigment such as titanium oxide.The use level of above-mentioned inorganic pigment is relative to sealing The contained parts by weight of resin component 100 in material 50, preferably more than 0 parts by weight and below 100 parts by weight, further preferably For more than 0.5 parts by weight and below 50 parts by weight, most preferably more than 4 parts by weight and below 50 parts by weight.
In the resin material for forming the encapsulant 50 involved by present embodiment, such as it can arbitrarily coordinate cadmium, barium Soap Deng metal is as anti-blushing agent.Also, in the case where encapsulant 50 is sandwich construction, at least 1 layer is served as reasons The layer that above-mentioned various resins are formed, also can all layers formed by above-mentioned various resins.
The thickness of encapsulant 50 be preferably more than 50 μm and less than 1000 μm, more preferably more than 100 μm and 500 μm with Under.It is preferably according to JIS-K7105 in addition, being configured at the encapsulant 50 of smooth surface (light entrance face) side of light electricity generation module Light transmittance at the 350nm determined wavelength is more than 70%.By in such manner, it is possible to which realizing makes the luminous energy from ultraviolet The module to generate electricity can efficiently be contributed to.
In the case where encapsulant 50 is sandwich construction, preferably 3-tier architecture.Now, the thickness of top layer (one side) is excellent Elect more than 10 μm and less than 500 μm as, the thickness in intermediate layer is preferably more than 50 μm and less than 1000 μm.
< < light electricity generation module 300-1 > >
Fig. 4 is one of the sectional view for representing the light electricity generation module 300-1 involved by present embodiment.
As shown in figure 4, the light electricity generation module 300-1 involved by present embodiment possesses light-transmitting substrate 70, above-mentioned distribution Sheet material 100 and encapsulant 50.As described above, the light electricity generation module 300-1 is due to possessing the tree in 350nm wavelength region The light transmittance of fat sheet material 10 is more than 70% distribution sheet material 100, therefore the luminous energy from ultraviolet can be made efficiently to help In generating.Therefore, the generating efficiencies compared with conventional light electricity generation module of the light electricity generation module 300-1 involved by present embodiment are excellent It is different.
As above-mentioned light-transmitting substrate 70, can enumerate:Glass, acrylic resin, makrolon, polyester, fluorine resin etc.. Wherein, from the viewpoint of more luminous energy is contributed to generating, preferably glass.
As the light generating element 400 in the light electricity generation module 300-1 involved by present embodiment, can enumerate:Monocrystalline silicon, The Group III-V compound semiconductor system elements such as the silicon systems such as polysilicon, non-crystalline silicon, heterojunction type, gallium-arsenic, copper-indium-selenium, cadmium-tellurium Or II-VI group group compound semiconductor system element.
As the back cover sheet material 80 suitable for the light electricity generation module 300-1 involved by present embodiment, for example, can enumerate by The heat such as the inorganic material such as the metals such as tin, aluminium, stainless steel or glass, polyester, inorganic matter evaporation polyester, fluorine resin, polyolefin can The sheet material of formed 1 layer of plastic resin or multilayer.Wherein, exclude insulation processing from manufacturing process and reduce light generating mould From the viewpoint of block 300-1 manufacturing cost, the back cover sheet material 80 formed using the material in addition to aluminium is preferably set to.
Also, on the mode of the light electricity generation module involved by present embodiment, as long as it can make from ultraviolet Luminous energy efficiently contributes to the light electricity generation module to generate electricity, then can be either type.
Specifically, as the light electricity generation module involved by present embodiment, can enumerate:As light-transmitting substrate 70/ is matched somebody with somebody The smooth back cover sheet material 80 (protection materials) of 400/ distribution sheet material of generating element 100/ of line sheet material 100/ is such with 2 distribution pieces of utilization The light electricity generation module that the mode that material 100 clamps the two sides of light generating element 400 seals;Such as the encapsulant 50/ of light-transmitting substrate 70/ The back cover sheet material 80 (protection materials) of 100/ encapsulant of the smooth 400/ distribution sheet material of generating element of distribution sheet material 100/ 50/ it is such with The mode on the two sides for clamping light generating element 400 using 2 distribution sheet materials 100 seals, and makes encapsulant 50 between printing opacity Light electricity generation module between property substrate 70 and distribution sheet material 100;Use the light being previously formed on the surface of light-transmitting substrate 70 Generating element 400, with the side of the smooth back cover sheet material 80 (protection materials) of 400/ distribution sheet material of generating element 100/ of light-transmitting substrate 70/ The light electricity generation module that formula is formed;On light-transmitting substrate 70, amorphous light is made such as on fluororesin system sheet material by sputter Generating element 400, and form on its amorphous light generating element 400 distribution sheet material 100 and back cover sheet material 80 (protection materials) Light electricity generation module of composition etc..
Also, as other kinds of smooth electricity generation module, also there is the light on back cover sheet material 80 (protection materials) is formed at The light electricity generation module of composition formed with distribution sheet material 100 and light-transmitting substrate 70 on generating element 400, it is being formed at translucency The light hair of composition formed with distribution sheet material 100 and back cover sheet material 80 (protection materials) on light generating element 400 on substrate 70 Electric module etc..Specifically, it can enumerate and amorphous light generating element 400 is made by sputter etc. on glass, and in its amorphous light The light electricity generation module of the composition of distribution sheet material 100 and back cover sheet material 80 is formed on generating element 400.
(the 2nd embodiment)
The > > of < < distributions sheet material 100
Fig. 5 is one of the sectional view for representing the distribution sheet material 100 involved by present embodiment.
It is with the difference of the 1st embodiment, the distribution sheet material 100 shown in Fig. 5 is in resin sheet 10 with being bonded to The surface layer of the opposite side in face of fine distribution 20 is laminated with substrate layer 30.Specifically, the distribution sheet material 100 shown in Fig. 5 is in resin sheet The face of the opposite side in the face with being provided with fine distribution 20 of material 10 has substrate layer 30, and the substrate layer 30 is by comprising selected from by fluorine More than a kind of material in the group that resin and acrylic resin are formed is formed.Herein, for formed substrate layer 30 material, At ambient temperature, the Shore D hardness determined using D type hardness tester meters according to JIS-K7125 be preferably more than 10 and 100 with Under, more preferably more than 20 and less than 100.By the way that the Shore D hardness for forming the material of substrate layer 30 is set into above-mentioned number In the range of value, embedment of the fine distribution 20 in resin sheet 10 can be suitably carried out, therefore can further improve generating Efficiency.Also, the thickness of substrate layer 30 be preferably more than 5 μm and less than 100 μm, more preferably more than 10 μm and 80 μm with Under.It is preferably according to JIS-K7105 institutes in addition, being configured at the substrate layer 30 of smooth surface (light entrance face) side of light electricity generation module Light transmittance at the 350nm of measure wavelength is more than 70%.By in such manner, it is possible to which realizing makes the luminous energy from ultraviolet also can Enough modules for efficiently contributing to generate electricity.
As above-mentioned fluororesin, can enumerate:Tetrafluoroethylene/ethylene copolymer (ETFE), tetrafluoroethylene/hexafluoropropylene copolymerization Thing (FEP), tetrafluoroethylene/perfluoro alkyl vinyl ether copolymer (PFA), polytrifluorochloroethylene (PCTFE), chlorotrifluoroethylene/second Alkene copolymer (PCTFEE), polyvinyl fluoride (PVF) and Kynoar (PVDF) etc..Wherein, it is preferably selected from including tetrafluoro second 1 kind in the group of alkene/ethylene copolymer (ETFE), tetrafluoroethylene/hexafluoropropylene copolymer (FEP) and polyvinyl fluoride (PVF) with On.
As aforesaid propylene acid resin, polymer of the polymer of acrylate, methacrylate etc. can be enumerated.Its In, the methacrylic resin preferably using methyl methacrylate units as the polymer of principal component.As the methyl-prop Olefin(e) acid resin, copolymer of polymethyl methacrylate (PMMA), methyl methacrylate and other monomers etc. can be enumerated.
These fluororesin or acrylic resin can carry out corona to improve with the closely sealed of encapsulant 50 to surface Discharge process, plasma-based discharge process, flame treatment etc. are surface-treated or used bonding agent.And then as bonding agent, it is preferably The bonding agent of excellent water resistance, such as can enumerate:The silane-modified body or maleic anhydride modified body of olefin polymer, amino first Acetoacetic ester system resin, silicone-based resin etc..
< < light electricity generation module 300-2 > >
It is with the difference of the 1st embodiment, the light electricity generation module 300-2 involved by present embodiment is used with upper State the distribution sheet material 100 of substrate layer 30.Specifically, the light electricity generation module 300-2 involved by present embodiment can for example be set To possess the mode of following heterojunction type light generating element 400.But the light electricity generation module 300-2 involved by present embodiment It is not limited to the example for possessing following heterojunction type light generating element 400.
Fig. 6 is the one of the schematic cross sectional views for the Rotating fields for representing the light electricity generation module 300-2 involved by present embodiment Example.
As shown in fig. 6, the light electricity generation module 300-2 involved by present embodiment possesses heterojunction type light generating element 400.
Light generating element 400 possesses the 1st conductivity type crystalline semiconductor substrate 11, and the one of crystalline semiconductor substrate 11 Individual surface side sequentially possesses the 1st noncrystalline based semiconductor film 12, the noncrystalline based semiconductor film 13 of the 1st conductivity type the 2nd, the 1st translucency The electrode 15 of electrode film 14 and the 1st.
Light generating element 400 also sequentially possesses intrinsic 3rd noncrystalline system in another surface side of crystalline semiconductor substrate 11 Semiconductor film 16, the noncrystalline based semiconductor film 17 of the 2nd conductivity type the 4th, the 2nd optically transparent electrode film 18 and the 2nd electrode 19.
1st noncrystalline based semiconductor film 12 be impurity concentration less than the 2nd noncrystalline based semiconductor film 13 the 1st conductivity type, Or it is intrinsic.
Light electricity generation module 300-2 is also equipped with:More 1st fine distributions 21, these are engaged by the 1st resin sheet 22 and fixed The 1st electrode 15 in a face of light generating element 400;1st substrate layer 23, it is between a face of light generating element 400 More 1st fine distributions 21 are accompanied, and a face of light generating element 400 is engaged in via the 1st resin sheet 22;Translucency Substrate 70;And the 1st sealant 500, it is filled between the substrate layer 23 of light-transmitting substrate 70 and the 1st.
Light electricity generation module 300-2 is also equipped with:More 2nd fine distributions 51, these are engaged by the 2nd resin sheet 52 and fixed The 2nd electrode 19 in another face of light generating element 400;2nd substrate layer 53, its another face with light generating element 400 Between accompany more 2nd fine distributions 51, and another face of light generating element 400 is engaged in via the 2nd resin sheet 52; 2nd protective layer 600;And the 2nd sealant 60, it is filled between the 2nd protective layer 600 and the 2nd substrate layer 53.
If being illustrated to the conductivity type of each inscape of light generating element 400, crystalline semiconductor substrate 11 is for example For n-type.Now, the 2nd noncrystalline based semiconductor film 13 is n-type, and the 1st noncrystalline based semiconductor film 12 is that (impurity is dense for intrinsic or n-type N-type of the degree less than the 2nd noncrystalline based semiconductor film 13), the 4th noncrystalline based semiconductor film 17 is p-type.
, can as long as the crystalline solid with N-type semiconductor characteristic, then be not particularly limited as crystalline semiconductor substrate 11 Use known crystalline semiconductor substrate.As the n-type crystal semiconductor for forming crystalline semiconductor substrate 11, silicon can be enumerated (Si) consider and SiC, SiGe, SiN etc., but from productivity ratio etc., preferably silicon.Crystalline semiconductor substrate 11 can be single Crystal, or polycrystal.
Also, the 1st noncrystalline based semiconductor film 12, the 2nd noncrystalline based semiconductor film 13, the 3rd noncrystalline based semiconductor film 16 and the 4th noncrystalline based semiconductor film 17 can be set to silicon thin film.
1st noncrystalline based semiconductor film 12 is laminated in a face (upper surface in Fig. 6) for crystalline semiconductor substrate 11.
2nd noncrystalline based semiconductor film 13 is laminated in a face (upper table in Fig. 6 of the 1st noncrystalline based semiconductor film 12 Face).
Total thickness of 1st noncrystalline based semiconductor film 12 and the 2nd noncrystalline based semiconductor film 13 can for example be set to 1nm Above and below 20nm.
1st optically transparent electrode film 14 is laminated in a face (upper surface in Fig. 6) for the 2nd noncrystalline based semiconductor film 13.
As the concrete example for the transparent electrode material for forming the 1st optically transparent electrode film 14, can enumerate:Indium tin oxide (Indium Tin Oxide:ITO), indium oxide (the Indium Tungsten Oxide of Doped Tungsten:IWO the indium of cerium), is adulterated Oxide (Indium Cerium Oxide:ICO), IZO (indium-zinc oxide, Indium Zinc Oxide), AZO (adulterated als ZnO, Aluminum-doped Zinc Oxide), GZO (ZnO of doped gallium, Gallium-doped Zinc Oxide) etc. Known material.
3rd noncrystalline based semiconductor film 16 is laminated in another face (lower surface in Fig. 6) of crystalline semiconductor substrate 11. 4th noncrystalline based semiconductor film 17 is laminated in another face (lower surface in Fig. 6) of the 3rd noncrystalline based semiconductor film 16.Change Yan Zhi, the 3rd noncrystalline based semiconductor film 16 is between the noncrystalline based semiconductor film 17 of crystalline semiconductor substrate 11 and the 4th.3rd The thickness of noncrystalline based semiconductor film 16 can for example be set to more than 1nm and below 10nm.4th noncrystalline based semiconductor film 17 Thickness can for example be set to more than 1nm and below 20nm.
2nd optically transparent electrode film 18 is laminated in a face (lower surface in Fig. 6) for the 4th noncrystalline based semiconductor film 17. The material for forming the 2nd optically transparent electrode film 18 is identical with the 1st optically transparent electrode film 14.
Herein, it is intrinsic to refer to not purposely impurity.Therefore, in intrinsic noncrystalline based semiconductor film, also include and deposit In script comprising the impurity in the feed or in the fabrication process noncrystalline based semiconductor film of mixed impurity unintentionally.
Also, noncrystalline system refers to not only include amorphous body, also comprising microcrystal.
N-type noncrystalline semiconductor film refers to relative to silicon contain in terms of the number density ratio of element contained in film 10-5The noncrystalline semiconductor film of impurity more than left and right.
1st electrode 15 is, for example, finger electrodes, or to be formed at another face of the 1st optically transparent electrode film 14 (in Fig. 6 Upper surface) entire surface metal film.
Similarly, the 2nd electrode 19 is finger electrodes, or is another face (Fig. 6 for being formed at the 2nd optically transparent electrode film 18 In lower surface) entire surface metal film.
As the material for the finger electrodes for forming the 1st electrode 15 and the 2nd electrode 19, the electric conductivity such as silver paste can be used to glue Connect the plain conductors such as agent or copper cash.The width of finger electrodes is, for example, more than about 20 μm and less than 80 μm.
Also, as the metal film for forming the 1st electrode 15 and the 2nd electrode 19, the conductive adhesives such as silver paste can be used. The more wires or conductive bar that more 1st fine distributions 21 for example, configure in parallel to each other.
Light electricity generation module involved by present embodiment can for example make by the following method.In addition, with above-mentioned Fig. 6 institutes Exemplified by the light electricity generation module 300-2 shown, one of the manufacture method of light electricity generation module is illustrated.
First, light generating element 400 can obtain in the following way:On a face of crystalline semiconductor substrate 11 sequentially The 1st noncrystalline based semiconductor film 12, the 2nd noncrystalline based semiconductor film 13 and the 1st optically transparent electrode film 14 are formed, on the other hand, The 3rd noncrystalline based semiconductor film 16, the 4th noncrystalline based semiconductor are sequentially formed on another face of crystalline semiconductor substrate 11 The optically transparent electrode film 18 of film 17 and the 2nd, and then, respectively on a face (upper surface in Fig. 6) for the 1st optically transparent electrode film 14 The 1st electrode 15 is formed, the 2nd electrode 19 is formed on another face (lower surface in Fig. 6) of the 2nd optically transparent electrode film 18.
Next, prepare form the 1st substrate layer 23, the 22 and the 1st fine integration of distribution 21 of the 1st resin sheet the 1st 1st sealant 500 of multi-thread part, light-transmitting substrate 70 and sheet.
Then, the 1st multi-thread part is made between the 1st electrode 15 and light-transmitting substrate 70 in a face of light generating element 400 Between, and make the 1st sealant 500 between the 1st multi-thread part and light-transmitting substrate 70.
Similarly, form the 2nd substrate layer 53, the 52 and the 2nd fine integration of distribution 51 of the 2nd resin sheet the 2nd is prepared 2nd sealant 60 of multi-thread part, the 2nd protective layer 600 and sheet.
Then, the 2nd multi-thread part is made between the 2nd electrode 19 in another face of light generating element 400 and the 2nd protective layer Between 600, and make the 2nd sealant 60 between the 2nd multi-thread part and the 2nd protective layer 600.
Then, by heating these and being pressurizeed from two sides together, and it is fine by the 1st via the 1st resin sheet 22 Distribution 21 is welded in the 1st electrode 15, and welds the 1st substrate layer 23 with light-transmitting substrate 70 via the 1st sealant 500, warp The 2nd fine distribution 51 is welded in the 2nd electrode 19 by the 2nd resin sheet 52, and via the 2nd sealant 60 by the 2nd substrate layer 53 weld with the 2nd protective layer 600.In this way, light electricity generation module 300-2 can be obtained.
In addition, the present invention is not limited to the embodiment, repairing in the range of it can realize the purpose of the present invention Change, improve etc. and being contained in the present invention.
More than, embodiments of the present invention are illustrated referring to the drawings, but these are the illustration of the present invention, also can Using various compositions than that described above.
Embodiment
Hereinafter, the present invention is illustrated by embodiment and comparative example, but the present invention is not limited to these examples.
Raw material used in embodiment and comparative example is as follows.
< raw materials >
- 1. resins-
(A) layer resin
Ionomer 1:The zinc of ethylene/methacrylic acid (methacrylic acid unit content=15 weight %) Ionomer (degree of neutralization 23%, MFR5g/10 minutes)
Ionomer 2:Ethylene/methacrylic acid/butyl acrylate terpolymer (methacrylic acid unit content =5 weight %, the weight % of butyl acrylate 7) zinc ionomer (degree of neutralization 10%, MFR11g/10 minutes)
Ionomer 3:Ethylene/methacrylic acid (methacrylic acid unit content=8.5 weight %) Zinc ionomer (degree of neutralization 18%, MFR6g/10 minutes)
(B) layer resin
Ionomer 4:Ethylene/methacrylic acid-butyl acrylate terpolymer (methacrylic acid unit content =5 weight %, the weight % of butyl acrylate 7) zinc ionomer (degree of neutralization 10%, MFR11g/10 minutes)
Ionomer 5:The zinc of ethylene/methacrylic acid (methacrylic acid unit content=12 weight %) Ionomer (degree of neutralization 36%, MFR1.5g/10 minutes)
- 2. additives-
Antioxidant:Pentaerythrite four [3- (3,5- di-tert-butyl-hydroxy phenyls) propionic ester] (BASF AG's system Make, Irganox1010)
Ultra-violet absorber:2- (2H- BTA -2- bases) -4,6- di-tert-pentyl phenols
Light stabilizer:Bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate
Silane coupler:N- (2- amino-ethyls) -3- amino propyl methyl dimethoxysilanes.
In addition, as the stable masterbatch 1 for A layers and B layers, following masterbatch has been used:Will be identical with each layer resin Resin, antioxidant, ultra-violet absorber and light stabilizer with resin/antioxidant/ultra-violet absorber/light stabilizer= 93.7/0.3/4/2 weight ratio is mixed, and advances with the masterbatch that biaxial extruder extrusion forms.
Also, as the stable masterbatch 2 for A layers and B layers, following masterbatch is used:Will be identical with each layer resin Resin, antioxidant and light stabilizer mixed with the weight ratio of resin/antioxidant/light stabilizer=96/2/2, and Advance with the masterbatch that biaxial extruder is made.As white master material, following masterbatch has been used:By Dainichiseika White master material PE-M 13N4700/ antioxidants/ultra-violet absorber of Color&Chemicals Mfg.Co., Ltd. manufactures/ Light stabilizer is mixed with specified weight ratio, and advances with the masterbatch that biaxial extruder is made.
Also, as the stable masterbatch 3 for A layers, following masterbatch is used:By based on the ethylene/alpha of resin- Olefin copolymer (TafmerA-4090S of Mitsui Chemicals, Inc. manufactures), antioxidant, light stabilizer are with basis The weight ratio of resin/antioxidant/light stabilizer=96/2/2 is mixed, and advances with what biaxial extruder was made Masterbatch.
- 3. cooperations-
< A layers >
·(A)-1:Stable silane coupler=90/10/0.2 of masterbatch 1/ of ionomer 1/
·(A)-2:Stable silane coupler=90/10/0.2 of masterbatch 1/ of ionomer 2/
·(A)-3:Stable silane coupler=90/10/0.2 of masterbatch 2/ of ionomer 2/
·(A)-4:1/ white master material of the stable masterbatch of ionomer 3//silane coupler=85/10/5/0.2
·(A)-5:The stable masterbatch 3=90/10 of EVA1/
·(A)-6:The stable masterbatch 3=90/10 of EMA1/
·(A)-7:The stable masterbatch 3=90/10 of EOC1/
·(A)-8:The stable masterbatch 3=90/10 of EOC2/.
(EVA1 preparation)
In advance by ethylene/methacrylic acid ethylene oxidic ester-vinyl acetate copolymer (EGMAVA, Sumitomo Chemical Co., Ltd.s manufacture, BONDFAST7B, ethylene contents:83 weight %, GMA content: 12 weight %, vinyl acetate content:5 weight %, MFR (190 DEG C, 2160g load):7g/10 minutes):49.1 parts by weight, second Alkene/vinyl acetate copolymer (vinyl acetate content:10 weight %):49.1 parts by weight, 3- methacryloxypropyls three Methoxy silane (Shin-Etsu Chemica.Co., Ltd. manufactures, trade name " KBM503 "):1.5 parts by weight and 2,5- diformazans Base -2,5- bis- (t-butylperoxy) hexane (ARKEMA Yoshitomi, Ltd. manufactures, trade name " Luperox 101 "): 0.3 parts by weight are mixed, and make by the use of 40mm φ single axle extruding machines the 3- as silane coupler at 220 DEG C of melting temperature Methyl allyl acyloxypropyl trimethoxysilane carries out graft modification to EGMAVA and ethylene/vinyl acetate, thus Obtain through the silane coupler modified EVA1 comprising ethene with (methyl) glycidyl acrylate.
(EMA1 preparation)
When preparing EVA1, EMA is used:Ethylene/methacrylic acid methyl terpolymer (ethylene contents:80 weight %, methyl Methyl acrylate content:20 weight %) replace ethylene/vinyl acetate, in addition, with EVA1 identical sides Formula obtains EMA1.
(EOC1 preparation)
When preparing EVA1, EOC1 is used:Ethylene/alpha-olefin copolymer (Mitsui Chemicals, Inc. manufactures TAFMERA-4090S ethylene/vinyl acetate) is replaced, in addition, is obtained in a manner of with EVA1 identicals EOC1。
(EOC2 preparation)
When preparing EVA1, EOC2 is used:Ethylene/alpha-olefin copolymer (Mitsui Chemicals, Inc. manufactures TAFMERH-5030S ethylene/vinyl acetate) is replaced, in addition, is obtained in a manner of with EVA1 identicals EOC2。
< B layers >
·(B)-1:The stable masterbatch 1=90/10 of ionomer 4/
·(B)-2:The stable masterbatch 2=90/10 of ionomer 4/
·(B)-3:Stable white master material=85/10/5 of masterbatch 1/ of ionomer 5/.
Resin sheet 1:The top layer (A) -1 of -1/ intermediate layer (B) of top layer (A) -1/
Resin sheet 2:The top layer (A) -2 of -2/ intermediate layer (B) of top layer (A) -1/
Resin sheet 3:The top layer (A) -3 of -3/ intermediate layer (B) of top layer (A) -2/
Resin sheet 4:Individual layer (A) -3
Resin sheet 5:The top layer (A) -4 of -4/ intermediate layer (B) of top layer (A) -3/
Resin sheet 6:Individual layer (A) -5
Resin sheet 7:Individual layer (A) -6
Resin sheet 8:Individual layer (A) -7
Resin sheet 9:Individual layer (A) -8
Resin sheet 10:The ethylene/vinyl acetate system encapsulant (weight of vinyl acetate unit content=28 Measure %).
The making > of < resin sheets
The multi-layer resinous sheet material of resin sheet 1~3 and 5 is by using 2 kinds 3 layers of multilayer cast molding machine respectively (TANABE PLASTICS MACHINERY CO., LTD. manufacture), feed block (feed block) type (EDI Japan Ltd. Manufacture), 40mm φ single axle extruding machines and die width 500mm extruders be shaped to sheet at 140 DEG C of processing temperature and carry out Make.
Also, the single-layer resin sheet material of resin sheet 4,6~10 is to use individual layer T type matrix forming machines (TANABE PLASTICS MACHINERY CO., LTD. manufacture), 40mm φ single axle extruding machines, die width 500mm extruders and above-mentioned tree Fat sheet material 1~3,5 is similarly shaped to sheet at 140 DEG C of processing temperature and made.
Moreover, when making by the use of fluorine system film or acrylic films as the multilayer wired sheet material of substrate layer, from upper The supply portion supply film of forming machine is stated, heating pressure is carried out using niproll when being molded resin sheet 3~4 and 6~9 Connect, thus manufactured multi-layer sheet.
The distribution sheet material of embodiment and comparative example has been made using above-mentioned resin sheet 3~4 and 6~10.Manufacture method As described below.
The > of < embodiments 1
The metal superfine distribution of 300 μm of diameter is equally spaced arranged on the surface of 100 μm of resin sheet 3 of thickness and gone forward side by side Row heating crimping, has thus made distribution sheet material 1.The distribution sheet material 1 obtained is embedded with metal wire in resin sheet 3.
The > of < embodiments 2
Use the resin sheet 4 of 75 μm of thickness and being formed by tetrafluoroethylene/ethylene copolymer (ETFE) for 25 μm of thickness Sheet material replace resin sheet 3, in addition, distribution sheet material 2 has been made using method same as Example 1.Obtained Distribution sheet material 2 be embedded with metal wire in resin sheet 4.
The > of < embodiments 3
Use the resin sheet 4 of 50 μm of thickness and being formed by tetrafluoroethylene/ethylene copolymer (ETFE) for 25 μm of thickness Sheet material replace resin sheet 3, in addition, distribution sheet material 3 has been made using method same as Example 1.Obtained Distribution sheet material 3 be embedded with metal wire in resin sheet 4.
The > of < embodiments 4
Use the resin sheet 4 of 25 μm of thickness and being formed by tetrafluoroethylene/ethylene copolymer (ETFE) for 25 μm of thickness Sheet material replace resin sheet 3, in addition, distribution sheet material 4 has been made using method same as Example 1.Obtained Distribution sheet material 4 be embedded with metal wire in resin sheet 4.
The > of < embodiments 5
Using by the resin sheet 4 of 50 μm of thickness be adhered to 50 μm of thickness by polymethyl methacrylate (PMMA) institute shape Into sheet material two sides and the sheet material that obtains replaces resin sheet 3, in addition, utilize method system same as Example 1 Distribution sheet material 5 is made.The distribution sheet material 5 obtained is embedded with metal wire in resin sheet 4.
The > of < embodiments 6
Using by the resin sheet 6 of 60 μm of thickness be adhered to 50 μm of thickness by polymethyl methacrylate (PMMA) institute shape Into sheet material one side and the sheet material that obtains replaces resin sheet 3, in addition, utilize method system same as Example 1 Distribution sheet material 6 is made.The distribution sheet material 6 obtained is embedded with metal wire in resin sheet 6.
The > of < embodiments 7
Using by the resin sheet 7 of 60 μm of thickness be adhered to 50 μm of thickness by polymethyl methacrylate (PMMA) institute shape Into sheet material one side and the sheet material that obtains replaces resin sheet 3, in addition, utilize method system same as Example 1 Distribution sheet material 7 is made.The distribution sheet material 7 obtained is embedded with metal wire in resin sheet 7.
The > of < embodiments 8
Using by the resin sheet 8 of 60 μm of thickness be adhered to 50 μm of thickness by polymethyl methacrylate (PMMA) institute shape Into sheet material one side and the sheet material that obtains replaces resin sheet 3, in addition, utilize method system same as Example 1 Distribution sheet material 8 is made.The distribution sheet material 8 obtained is embedded with metal wire in resin sheet 8.
The > of < embodiments 9
Using by the resin sheet 9 of 60 μm of thickness be adhered to 50 μm of thickness by polymethyl methacrylate (PMMA) institute shape Into sheet material one side and the sheet material that obtains replaces resin sheet 3, in addition, utilize method system same as Example 1 Distribution sheet material 9 is made.The distribution sheet material 9 obtained is embedded with metal wire in resin sheet 9.
The > of < comparative examples 1
Resin sheet 3 is replaced using resin sheet 10, in addition, is made using method same as Example 1 Distribution sheet material 10.The distribution sheet material 10 obtained is embedded with metal wire in resin sheet 10.
On using measure and the evaluation of obtained distribution sheet material 1~10 and progress, it is described in detail below.
The light transmittance of resin sheet at 350nm wavelength:Under conditions of 25 DEG C, according to JIS-K7105 to resin Light transmittance at the 350nm of sheet material wavelength is determined.In addition, unit has been set as %.
Total light transmittance:Under conditions of 25 DEG C, the total light transmittance of resin sheet is surveyed according to JIS-K7105 It is fixed.In addition, unit has been set as %.
Shore D hardness:Under the conditions of room temperature (25 DEG C), according to JIS-K7125 using D type hardness testers meter to forming resin sheet The Shore D hardness of the material of material is determined.
Modulus of flexural rigidity:According to JIS-K7106, manufactured automatic reading out type " Ao Er is made using Toyo Seiki Gloomy formula rigidity tester " is determined to the modulus of flexural rigidity of resin sheet.In addition, unit has been set as MPa.
Evaluation result on above-mentioned assessment item is shown in table 1 below.
[table 1]
Using above-mentioned distribution sheet material 1~10, light electricity generation module has been made by the following method.
The preparation method > of < light electricity generation modules
As described in Table 2, light-transmitting substrate has sequentially been loaded, smooth surface encapsulant (uses resin sheet 2,3 and 10 As encapsulant), distribution sheet material, light generating element.Next, sequentially loaded on light generating element distribution sheet material, it is non-by Smooth surface encapsulant (using resin sheet 1,5 and 10 to be used as encapsulant), back cover sheet material, and carry out layer using vacuum laminator Pressure, and made the light electricity generation module of embodiment 10~19 and comparative example 2.
On use obtained light electricity generation module and the measure carried out and evaluation, be described in detail below.
Distribution connection is good and bad (EL images):Distribution on light electricity generation module connect it is good and bad, by EL (electroluminescent, Electroluminescence) method is evaluated.That is, its luminous state is made to each smooth electricity generation module input current Lower acquisition EL images, the evaluation of quality is carried out.
On the acquisition of the EL images of each smooth electricity generation module, EL image testing devices (ITES CO., LTD. systems have been used Make, PVX100).Also, on the condition determination for obtaining EL images, employ following condition:Aperture time 15 seconds, aperture 8th, ISO sensitivity 800, the input voltage 0.73V to light electricity generation module, the input current 8A to light electricity generation module.
Then, visually to confirm obtained EL images, the good and bad evaluation of distribution connection has been carried out.
Evaluation result has been set as A:Shadow-free (connection is good), C:There is shade (a part of existing defects of distribution connection).
Maximum output (Pmax):Maximum output (Pmax) is determined to the light electricity generation module obtained.
That is, while changing the bias to each smooth electricity generation module input, while the data obtained are painted by measure electric current System, it thereby is achieved I-V curve (diagram is omitted).
Herein, the measure on electric current, Sumitomo Heavy Industries, Ltd. solar cell IV have been used Determine device No.M130-DDYTB383J-JA.
Also, be biased in the range of -0.1V to 0.8V and be changed, within the range, -0.1V to 0.4V be with 0.02V is that unit changes bias, and 0.4V to 0.8V is that bias is changed in units of 0.01V.
Also, as condition determination, using AM1.5G, 1SUN, it is determined at 25 DEG C.
Then, on the I-V curve obtained, having obtained the product of voltage and electric current turns into maximum point, i.e. " maximum output (Pmax)”。
Fill factor (FF):And then using above-mentioned maximum output (Pmax) measurement result, to the light generating mould obtained Block has obtained fill factor (FF).
Herein, electric current when voltage is 0V is referred to as short circuit current (short-circuit current=Isc), and light generates electricity Voltage when electric current is not flowed through in module is referred to as open-circuit voltage (open-circuit voltage=Voc).
Fill factor (FF) has been calculated according to following formula.
Formula:Fill factor (FF)=maximum output (Pmax)/(Voc × Isc).
Evaluation result on above-mentioned assessment item is shown in table 2 below.
[table 2]
The light electricity generation module of embodiment 10 is due to being the light for having used the smooth surface encapsulant containing ultra-violet absorber Electricity generation module, therefore be slightly poor light electricity generation module in the viewpoint of generating efficiency compared with the light electricity generation module of embodiment 11. But the light electricity generation module of embodiment 10 (includes the resinous wood of ionomer 2 due to possessing to have by specific resin material Material) the distribution sheet material 1 of resin sheet 3 that is formed, thus it is shown that good distribution connectivity.Also, embodiment 10 Light electricity generation module is more excellent light electricity generation module in the viewpoint of generating efficiency compared with the light electricity generation module of comparative example 2.
The application advocates the priority based on 2 months 2015 Japanese patent applications filed in 6 days the 2015-022069th, Its entire disclosure is applied in this explanation.

Claims (11)

1. a kind of distribution sheet material, it has:
Resin sheet;And
Fine distribution, it is arranged at a face of the resin sheet,
It is more than 70% according to the light transmittance at the 350nm of the JIS-K7105 resin sheets determined wavelength.
2. distribution sheet material according to claim 1, wherein,
Total light transmittance according to the JIS-K7105 resin sheets determined is more than 80%.
3. distribution sheet material according to claim 1 or 2, wherein,
The resin sheet is formed by the resin material comprising any of following (A) and (B),
(A) ethene and the copolymer of unsaturated carboxylic acid or the ionomer of the copolymer are included,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
4. distribution sheet material according to any one of claim 1 to 3, wherein,
The fine distribution is formed by the more wires abreast configured.
5. distribution sheet material according to any one of claim 1 to 4, wherein,
At ambient temperature, the material of the formation resin sheet determined according to JIS-K7125 and using D type hardness tester meters Shore D hardness is more than 25 and less than 200.
6. distribution sheet material according to any one of claim 1 to 5, wherein,
A part for the fine distribution is embedded in the resin sheet.
7. distribution sheet material according to any one of claim 1 to 6, wherein,
The resin sheet has sandwich construction.
8. distribution sheet material according to claim 7, wherein,
Have on the surface of the opposite side in the surface with being provided with the fine distribution of the resin sheet by comprising selected from by fluorine The layer that more than a kind of material in the group that resin and acrylic resin are formed is formed.
9. a kind of structure, it includes the distribution sheet material and encapsulant any one of claim 1 to 8, the sealing Material is formed by the resin material comprising any of following (A) and (B),
(A) ethene and the copolymer of unsaturated carboxylic acid or the ionomer of the copolymer are included,
(B) copolymer comprising ethene with (methyl) glycidyl acrylate.
10. structure according to claim 9, wherein,
The encapsulant includes Chinese white.
11. a kind of smooth electricity generation module, it possesses:
Light-transmitting substrate;And
Distribution sheet material any one of claim 1 to 8.
CN201680008691.7A 2015-02-06 2016-02-05 Wiring sheet, structure, and photovoltaic module Active CN107408593B (en)

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018046112A (en) * 2016-09-13 2018-03-22 パナソニックIpマネジメント株式会社 Solar cell module
ES2790729T3 (en) * 2017-04-14 2020-10-29 Meyer Burger Switzerland Ag Photovoltaic module, photovoltaic encapsulant and production method of a photovoltaic module
KR20190038969A (en) * 2017-10-02 2019-04-10 엘지전자 주식회사 Solar cell panel and method for manufacturing the same
EP3708595A4 (en) * 2017-12-26 2020-12-30 Lg Chem, Ltd. Olefin-based polymer
JP2021034659A (en) * 2019-08-28 2021-03-01 パナソニック株式会社 Solar cell module
CN116867812A (en) * 2021-03-29 2023-10-10 三井化学株式会社 Graft modified vinyl polymer, polyamide composition containing graft modified vinyl polymer and use thereof
GB202119068D0 (en) * 2021-12-29 2022-02-09 Rec Solar Pte Ltd A unitary film for an electrode assembly of a solar cell

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000186114A (en) * 1998-10-16 2000-07-04 Du Pont Mitsui Polychem Co Ltd Sealing compound for solar cell and solar cell module
JP2000243990A (en) * 1999-02-18 2000-09-08 Dainippon Printing Co Ltd Solar-cell cover film and manufacture thereof, and solar-cell module using same
CN101425546A (en) * 2002-08-29 2009-05-06 达伊4能量有限公司 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
CN101993514A (en) * 2009-08-18 2011-03-30 财团法人工业技术研究院 Polymer, optical component containing same and photoelectric device
CN102428138A (en) * 2009-05-19 2012-04-25 专业技术资源公司 Encapsulant compositions, methods of manufacture and uses thereof
KR20120089909A (en) * 2010-12-21 2012-08-16 에스케이씨 주식회사 Seaing material sheet for photovoltaic module and photovoltaic module comprising the same
CN103140940A (en) * 2010-10-08 2013-06-05 三井化学株式会社 Encapsulating material for solar cell and solar cell module

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040234889A1 (en) * 2001-12-28 2004-11-25 Shunsuke Okuyama Laminated film
AU2002255303B2 (en) 2002-05-02 2006-07-06 Sphelar Power Corporation Light-Receiving panel or light-emitting panel, and manufacturing method thereof
JP3995626B2 (en) * 2003-04-03 2007-10-24 ミドリ安全株式会社 helmet
JP5366109B2 (en) * 2004-12-28 2013-12-11 三井化学東セロ株式会社 Solar cell encapsulant
JP2006186233A (en) * 2004-12-28 2006-07-13 Du Pont Mitsui Polychem Co Ltd Solar cell sealing material
GB0623936D0 (en) * 2006-11-29 2007-01-10 Univ Strathclyde Polymers with transmission into the ultraviolet
US20110070462A1 (en) * 2008-05-16 2011-03-24 Showa Denko K.K. Pattern forming method
US20100112354A1 (en) * 2008-10-31 2010-05-06 E. I. Du Pont De Nemours And Company Articles with abrasion-resistant terionomer layers
JP2010251611A (en) * 2009-04-17 2010-11-04 Fujifilm Corp Solar cell and method of manufacturing the same
JP5820109B2 (en) * 2010-11-30 2015-11-24 シーアイ化成株式会社 Sealing film for solar cell module and solar cell module using the same
JPWO2012090674A1 (en) * 2010-12-27 2014-06-05 旭硝子株式会社 Surface material for solar cell, coating material for solar cell, and solar cell module
JP2012138467A (en) * 2010-12-27 2012-07-19 Dainippon Printing Co Ltd Solar battery sealing material, and solar battery module using the same
JP5623325B2 (en) * 2011-03-30 2014-11-12 リンテック株式会社 Protective sheet for solar cell, method for producing the same, and solar cell module
WO2012138986A1 (en) * 2011-04-07 2012-10-11 Specialized Technology Resources, Inc Encapsulant for terrestrial photovoltaic modules
KR20130011128A (en) * 2011-07-20 2013-01-30 주식회사 원익아이피에스 Solar cell module
CN104321885A (en) * 2012-05-16 2015-01-28 三井化学东赛璐株式会社 Solar cell module
JP2014015544A (en) * 2012-07-10 2014-01-30 Bridgestone Corp Ethylene-vinyl acetate copolymer sheet, and intermediate film for laminated glass, laminated glass, sealing film for solar cell, and solar cell using the ethylene-vinyl acetate copolymer sheet
CN102775549B (en) * 2012-08-02 2014-03-19 江西省科学院应用化学研究所 High-ultraviolet transmissivity electronic packaging material and preparation method thereof
WO2014045909A1 (en) * 2012-09-22 2014-03-27 株式会社ノリタケカンパニーリミテド Solar cell module, and method for producing same
CN203589047U (en) * 2013-11-08 2014-05-07 蚌埠玻璃工业设计研究院 Amorphous silicon film solar cell core board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000186114A (en) * 1998-10-16 2000-07-04 Du Pont Mitsui Polychem Co Ltd Sealing compound for solar cell and solar cell module
JP2000243990A (en) * 1999-02-18 2000-09-08 Dainippon Printing Co Ltd Solar-cell cover film and manufacture thereof, and solar-cell module using same
CN101425546A (en) * 2002-08-29 2009-05-06 达伊4能量有限公司 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
CN102428138A (en) * 2009-05-19 2012-04-25 专业技术资源公司 Encapsulant compositions, methods of manufacture and uses thereof
CN101993514A (en) * 2009-08-18 2011-03-30 财团法人工业技术研究院 Polymer, optical component containing same and photoelectric device
CN103140940A (en) * 2010-10-08 2013-06-05 三井化学株式会社 Encapsulating material for solar cell and solar cell module
KR20120089909A (en) * 2010-12-21 2012-08-16 에스케이씨 주식회사 Seaing material sheet for photovoltaic module and photovoltaic module comprising the same

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