CN107388865A

CN107388865A - The heat exchange structure of heat abstractor

Info

Publication number: CN107388865A
Application number: CN201710613234.7A
Authority: CN
Inventors: 殷建武
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2017-07-25
Filing date: 2017-07-25
Publication date: 2017-11-24

Abstract

A kind of heat exchange structure of heat abstractor, comprising：One body, a cooling wafer；The body has at least one first space and connects at least one first aperture and at least one second aperture, first space and has an open sides, have cooling fluid in first space；The cooling wafer has a huyashi-chuuka (cold chinese-style noodles) and a hot face, docked with the open sides of the body in the hot face, the huyashi-chuuka (cold chinese-style noodles) contacts with an at least pyrotoxin, of the invention mainly directly to substitute conventional metals material heat conduction ground directly in a manner of active cooling directly to hair heating source cooling through by cooling wafer, its hot face is radiated by body interior cooling fluid and then lifts integral heat sink efficiency again.

Description

The heat exchange structure of heat abstractor

【Technical field】

A kind of heat exchange structure of heat abstractor, it is espespecially a kind of that hair pyrotoxin is entered using cooling wafer as active cooling interface Row cooling heat abstractor heat exchange structure.

【Background technology】

Tradition carries out antipyretic heat abstractor or heat radiation module mainly by single or plural heat-sink unit mutually group to hair pyrotoxin Conjunction is formed, and the heat-sink unit has radiator, temperature-uniforming plate, heat pipe etc., and wherein as the temperature-uniforming plate made by copper or aluminium material, heat Pipe uses mainly as the purposes of heat absorption thermally conductive heat.

Another person, also there are the structure for pyrotoxin radiate through water-cooling pattern, such a water-cooling pattern master in heat abstractor The conductive sole plate being made in bottom setting copper or the preferable material of aluminothermy conductive properties is passed through, and the conductive sole plate side is direct Contact heating source, the opposite side of the conductive sole plate set plural fin or fin post to be used as increase area of dissipation, and with multiple This side of number fin or fin post is set with corresponding group an of body with water containing chamber room, and the appearance of cooling liquid is full of by the body Water chamber radiates to it reaches the effect of radiating.

Water-cooled power converter cools down the heat that cooling liquid is adsorbed foregoing conductive sole plate through the mode of circulation And take away, and then the effect to radiate, but when the heat for sending out pyrotoxin is too high, and if water-cooled power converter can not be quick When the heat that conductive sole plate is adsorbed eliminates, then certainly will be unable to reach the effect of radiating, though therefore water-cooled power converter have There is preferably radiating effect, but as electronic equipment efficiency increasingly improves compared with air-cooling type radiating apparatus, be bound to internal electron member The heat that part is formed also improves therewith, how to provide a kind of water-cooled module with heat dissipation more preferably and is then somebody's turn to do to be familiar The personage of item skill is intended to the problem solved.

【The content of the invention】

Therefore, it is the shortcoming of the above-mentioned known technology of solution, the main purpose of the present invention, there is provided one kind can be substantially improved water-cooled and dissipate The heat exchange structure of thermal.

To provide a kind of heat exchange structure of heat abstractor up to above-mentioned purpose, the present invention, comprising：One body, a refrigeration Chip；

The body has at least one first space and connects at least one first aperture and at least one second aperture, and described first is empty Between there are an open sides；The cooling wafer has a huyashi-chuuka (cold chinese-style noodles) and a hot face, and the hot face is docked with the open sides of the body, institute Huyashi-chuuka (cold chinese-style noodles) is stated to contact with an at least pyrotoxin.

Through the present invention directly with cooling wafer substitute known to water-cooled power converter conductive sole plate directly to hair generate heat Source is radiated and antipyretic, and the huyashi-chuuka (cold chinese-style noodles) of cooling wafer for active its cooling effectiveness of cooling more preferably, and hot face is again by body Cooling fluid in first space in portion cool down antipyretic, it is possible to provide more preferably cooling performance person.

【Brief description of the drawings】

Fig. 1 is the body three-dimensional exploded view of the first embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 2 is the body assembled sectional view of the first embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 3 is the view of the first embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 4 is the assembled sectional view of the second embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 5 is the three-dimensional exploded view of the 3rd embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 6 is the assembled sectional view of the 3rd embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 7 is the three-dimensional exploded view of the fourth embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 8 is the assembled sectional view of the fourth embodiment of the heat exchange structure of heat abstractor of the present invention；

Fig. 9 a are the cooling wafer stereogram of the heat exchange structure of heat abstractor of the present invention；

Fig. 9 b are the cooling wafer stereogram of the heat exchange structure of heat abstractor of the present invention；

Fig. 9 c are the cooling wafer stereogram of the heat exchange structure of heat abstractor of the present invention.

Primary symbols explanation：

The heat exchange structure 1 of heat abstractor

Body 11

Part I 11a

Part II 11b

First space 111

First chamber 111a

Second chamber 111b

Second space 111c

Open sides 1111

First aperture 112

Second aperture 113

Cooling wafer 12

Huyashi-chuuka (cold chinese-style noodles) 121

Hot face 122

Radiator structure 1221

Runner 1222

Cooling fluid 2

Pyrotoxin 3

Pumping 4

Tank unit 5

First body 6

Second body 7

3rd body 8.

【Embodiment】

The above-mentioned purpose and its structure of the present invention and characteristic functionally, will be said according to the preferred embodiment of institute's accompanying drawings It is bright.

Fig. 1,2,3 are referred to, are the stereo decomposing and group of the first embodiment of the heat exchange structure of heat abstractor of the present invention Sectional view and use state diagram are closed, as illustrated, the heat exchange structure 1 of heat abstractor of the present invention, comprising：One body 11, One cooling wafer 12；

The body 11 has at least one first space 111 and connects at least one first aperture 112 and at least one second aperture 113, first space 111 has an open sides 1111, and first space 111 has cooling fluid 2.

The cooling wafer 12 has a huyashi-chuuka (cold chinese-style noodles) 121 and a hot face 122, and the hot face 122 and the open sides 1111 of the body 1 are right Connect, the huyashi-chuuka (cold chinese-style noodles) 121 contacts with an at least pyrotoxin 3, and the hot face 122 extends plural radiator structure 1221, the radiator structure 1221 are made up of plural fin.

The body 11 of the heat abstractor of the present embodiment is a water-cooling head structure, and the body 11 is the housing of water-cooling head structure, And the cooling wafer 12 substitutes the copper soleplate of known heat conduction, and the cooling wafer 12 is closed the open end 1111 of the body 11 and is somebody's turn to do The hot face 122 of cooling wafer 12 to should the first space 111, when carrying out radiating work, the cooling in first space 111 is flowed Body 2 is entered in first space 111 by first aperture 112, then is discharged first space 111 by second aperture 113 and left The body 11, and the huyashi-chuuka (cold chinese-style noodles) 121 of the cooling wafer 12 directly corresponds to the pyrotoxin 3 and directly carries out cooling down antipyretic, and refrigeration is brilliant Heat produced by the hot face 122 of piece 12 is conducted to the radiator structure, then by the inside of body 11 the first space 111 it is cold But fluid 2 carries out heat exchange cooling, by the cooling effectiveness that the huyashi-chuuka (cold chinese-style noodles) 121 of cooling wafer 12 provides is better than general water-cooled The cooling effectiveness of heat abstractor, therefore the radiating efficiency of entirety can be substantially improved, the present embodiment is mainly through an external pumping 4 and extremely A few tank unit 5, the pumping 4 connect the body 11 and the water tank list respectively through one first body 6 and one second body 7 Member 5, the tank unit 5 are connected through one the 3rd body 8 with the body 11, and the pumping 4 is as in driving first space 111 Portion's cooling fluid 2 passes in and out the body 11 and used, and then as cooling, the cooling fluid 2 is used the tank unit 5.

Referring to Fig. 4, the assembled sectional view of the second embodiment for the heat exchange structure of heat abstractor of the present invention, as schemed institute Show, the present embodiment part-structure is identical with aforementioned first embodiment, therefore will not be described in great detail herein, only the present embodiment and foregoing first Embodiment difference is that first space 111 has an an at least first chamber 111a and second chamber 111b, described first, Two chamber 111a, 111b upper and lower correspondings are set, described first and second chamber 111a, 111b and first and second aperture 112,113 phases It is intercommunicated, there is in the first chamber 111a pumping 4, the second chamber 111a to should open sides 1111, the cause The hot face 122 of cold chip 12 to should second chamber 111b set and the cooling wafer 12 close the open sides 1111.

The body 11 of the present embodiment is a water-cooled power converter, is provided with the pumping 4 in first chamber 111a, and by The pumping 4 drive the cooling fluid 2 in first and second chamber 111a, 111b enter in the body 11 to the cooling wafer 12 it Hot face 122 carries out heat exchange.

Fig. 5,6 are referred to, are stereo decomposing and the combination of the 3rd embodiment of the heat exchange structure of heat abstractor of the present invention Sectional view, as illustrated, the present embodiment part-structure is identical with aforementioned first embodiment, therefore it will not be described in great detail herein, only this reality Apply example and aforementioned first embodiment difference and be that the body 11 has an a Part I 11a and Part II 11b, this First, the horizontal corresponding connections of two part 11a, 11b are set, and the Part II 11b has a second space 111c, described first 111a the first space 111 is divided to be provided with a pumping 4,111c pairs of the second space of the cooling wafer 12 and Part II 11b It should connect and set and close second space 111c, first aperture 112 is located at first space 111 and connects first space 111, second aperture 113 is located at Part II 11b and connects second space 111c, the pumping 4 located at first space 111 Mainly as guiding first and second space 111, the cooling fluid 2 in 111c to carry out the effect of heat exchange circulation, when butting up against this The hot face 122 of Part II 11b cooling wafer 12 produces heat, can pass through cooling fluid 2 and carries out antipyretic work, and refrigeration The huyashi-chuuka (cold chinese-style noodles) 121 of chip 12 can then provide the chilling temperature of more below cooling fluid 2 pyrotoxin 3 cool down it is antipyretic, and then Reach radiating efficiency more preferably.

Fig. 7,8 are referred to, are stereo decomposing and the combination of the fourth embodiment of the heat exchange structure of heat abstractor of the present invention Sectional view, as illustrated, the present embodiment part-structure is identical with aforementioned first embodiment, therefore it will not be described in great detail herein, only this reality Apply example and aforementioned first embodiment difference and be that the hot face 122 extends plural radiator structure 1221, the radiator structure 1221 by Plural fin is formed, and has an at least runner 1222 between the fin, and the fin one end is correspondingly arranged on a pumping 4, described Pumping 4 guides the cooling fluid 2 to carry out heat exchange work to the fin, and passes through the runner 1222 and flowed to second aperture 113 It is dynamic to leave the body 11 and carry out cooling circulation.

Fig. 9 a, 9b, 9c are referred to, is the cooling wafer stereogram of the heat exchange structure of heat abstractor of the present invention, as schemed institute Showing, the present embodiment, which mainly discloses extension plural number on the hot face 122 of cooling wafer, can increase the radiator structure 1221 of heat exchanger effectiveness, The radiator structure 1221 can be plural fin post such as Fig. 9 a, or plural fin such as Fig. 9 b or by plural fin post with fin is mashed up forms Aspect such as Fig. 9 c.

It is of the invention to be mainly used as substitution water-cooled power converter through using the cooling wafer 12 of the effect with directly cooling The copper bottom plate that heat transfer uses, directly to pyrotoxin 3 cool down antipyretic, can reduce heat transfer this step and directly hair is sent out Thermal source cools down, and is effectively increased the heat dissipation of water-cooled power converter entirety and can prevent from sending out the feelings of pyrotoxin accumulated heat Thing occurs.

In the present embodiment be directed to water-cooled power converter in guide cooling fluid cell descriptions embodiment using pumping as Illustrate, but do not regard it as and be limited, the construction unit of cooling fluid can be also driven for other.

Claims

1. a kind of heat exchange structure of heat abstractor, it is characterised in that include：

One body, there is at least one first space and connect at least one first aperture and at least one second aperture, described first is empty Between there are an open sides, first space has cooling fluid；

One cooling wafer, there is a huyashi-chuuka (cold chinese-style noodles) and a hot face, the hot face is docked with the open sides of the body, the huyashi-chuuka (cold chinese-style noodles) with least One pyrotoxin contacts.

2. the heat exchange structure of heat abstractor according to claim 1, it is characterised in that first space has at least One first chamber and a second chamber, the first and second chamber upper and lower corresponding are set, first and second chamber with this first, Two apertures are interconnected, and have a pumping in the first chamber.

3. the heat exchange structure of heat abstractor according to claim 1, it is characterised in that the hot face extension plural number radiating Structure, the radiator structure are made up of plural fin post.

4. the heat exchange structure of heat abstractor according to claim 1, it is characterised in that the body has one first Divide and a Part II, first and second part of horizontal connection are correspondingly arranged, the Part II has a second space, described First space of Part I is provided with a pumping, and connect corresponding with the second space of the Part II of the cooling wafer sets.

5. the heat exchange structure of heat abstractor according to claim 1, it is characterised in that the body has one first Divide and a Part II, first and second part of horizontal connection are correspondingly arranged, the Part II has a second space, described First space of Part I is provided with a pumping and plural convex body, and the convex body is spaced and an at least water is formed between the convex body Road, the pumping are correspondingly arranged at one end of the convex body, and connect corresponding with the second space of the Part II of the cooling wafer sets, described The hot face of cooling wafer extends plural radiator structure, and the radiator structure is made up of plural fin post.

6. the heat exchange structure of heat abstractor according to claim 1, it is characterised in that there is a pumping and an at least water Box unit, the pumping connect the body and the tank unit respectively through one first body and one second body, the water tank list Member is connected through one the 3rd body with the body, and as driving, the first interior volume cooling fluid passes in and out the body for the pumping Use, then as cooling, the cooling fluid is used the tank unit.