CN101625178A - Semiconductor refrigerating and heating equipment and air conditioner - Google Patents
Semiconductor refrigerating and heating equipment and air conditioner Download PDFInfo
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- CN101625178A CN101625178A CN200910090702A CN200910090702A CN101625178A CN 101625178 A CN101625178 A CN 101625178A CN 200910090702 A CN200910090702 A CN 200910090702A CN 200910090702 A CN200910090702 A CN 200910090702A CN 101625178 A CN101625178 A CN 101625178A
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Abstract
The invention discloses semiconductor refrigerating and heating equipment which comprises a semiconductor chip, a first heat exchanger, a second heat exchanger, a working medium circulator and a water pump, wherein the semiconductor chip comprises a first end face and a second end face; the first heat exchanger is jointed with the first end face and carries out heat exchange with the first end face for carrying out the heat exchange with outside; the second heat exchanger is jointed with the second end face and carries out the heat exchange with the second end face; the working medium circulator is connected with the second heat exchanger; and the water pump is connected with a working medium circulation pipe. The refrigerating and heating equipment utilizes working media to carry out the heat exchange with the second heat exchanger, and heat generated during refrigerating and cold energy generated during heating are absorbed, taken away and stored in a liquid working medium through the first heat changer. The energy exchange of the cold energy required during refrigerating and the heat required during heating are finished through the heat exchange of the first heat exchanger with a space. Meanwhile, the separation of the cold energy and the heat in the same space is realized, thereby improving the effects of refrigerating and heating, and the refrigerating and heating efficiency is high.
Description
Technical field
The present invention relates to a kind of refrigeration, heating equipment, relate in particular to a kind of semiconductor refrigerating, heating equipment and air-conditioning.
Background technology
Existing refrigeration plant mostly is mechanical compression refrigeration greatly, but the volume of these mechanical refrigeration equipments is all very huge, and weight is also very heavy, so can't adapt to small-sized and local refrigeration.
At present, small-sized refrigerating for the part can use semiconductor refrigerating, it utilizes the Peltier effect, passes to direct current on semiconductor chip, can produce the phenomenon of the cold end heat of an end, produce heat in the hot junction,, then make cold junction temperature reduce when its heat is lost by exchange, produce refrigeration at cold junction, realize electronic cooling.
The existing semiconductor refrigerating equipment (for example small semiconductor electronics air-conditioning) that utilizes is the heat that the hot junction produces to be utilized with cross-ventilation by various radiators (for example aluminium fin radiator or bend pipe radiator) carry out heat exchange, with exchange heat in air, so must use radiator.
Semiconductor refrigerating is followed conservation of energy principle, be that heating capacity equals refrigerating capacity and electric input power energy sum, therefore heating capacity is necessarily greater than refrigerating capacity, and because the heat that the semiconductor hot junction produces also is to exchange in air, so the heat that produces and the cold of generation all are to disseminate in air, therefore when radiator and refrigerating part coexist as the same space, can cause an effect, that is exactly that part, whole space is cold and the bulk temperature space is more and more higher.The requirement that can't reach the overall space refrigeration or heat.
Summary of the invention
The objective of the invention is defective at existing semiconductor refrigerating equipment, a kind of semiconductor refrigerating, heating equipment and air-conditioning are provided, can realize separating so that the hot and cold amount that two ends produce is not mixed in the same communal space mutually, refrigeration, heating effect is good, the efficient height.
For achieving the above object, the application provides a kind of semiconductor refrigerating, heating equipment, and described equipment comprises:
Semiconductor chip has first end face and second end face, and described semiconductor chip is used for energising back and heats or freeze at described first end face and second end face;
First heat exchanger with described first end joined, and carries out heat exchange with described first end face, is used for carrying out heat exchange with the external world;
Second heat exchanger with described second end joined, and carries out heat exchange with described second end face;
Working medium circulator is connected with described second heat exchanger, comprises the working medium circulation pipe.Liquid refrigerant in the described working medium circulation pipe carries out heat exchange in described second heat exchanger, semiconductor chip second end face is transported to the energy exchange of second heat exchanger in described liquid refrigerant.
Water pump is connected with described working medium circulation pipe, the liquid refrigerant of the described working medium circulator that is used for circulating.
For achieving the above object, the application provides a kind of air-conditioning that uses above-mentioned semiconductor refrigerating, heating equipment.
The present invention's refrigeration, heating equipment and air-conditioning, utilize the working medium and second heat exchanger to carry out heat exchange, semiconductor refrigeration chip is transported to lot of energy in second heat exchanger, take away and be stored in the big quantity of fluid in the reservoir by liquid refrigerant with big thermal capacity, having avoided energy to carry out heat exchange by the radiator and the external world exchanges in the air, because the thermal capacity of liquid is big, the energy of taking away is many, the second heat exchanger heat exchange efficiency height, make semiconductor refrigeration chip freeze, the heating efficiency height, and the energy overwhelming majority of exchange is stored in and lessly in the liquid distributes to air, has improved the refrigeration of overall space, heating effect.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the accompanying drawing of required use is done to introduce simply in will describing embodiment below, apparently, accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of refrigeration of the present invention, heating equipment embodiment one;
Fig. 2 is the structural representation of refrigeration of the present invention, heating equipment embodiment two;
Fig. 3 is the structural representation of refrigeration of the present invention, heating equipment embodiment three;
Fig. 4 A is the appearance assumption diagram of refrigeration of the present invention, heating equipment second heat exchanger;
Fig. 4 B is the structural representation of refrigeration of the present invention, an embodiment of heating equipment second heat exchanger;
Fig. 4 C is the structural representation of refrigeration of the present invention, heating equipment second another embodiment of heat exchanger;
Fig. 4 D is one of structural representation of refrigeration of the present invention, heating equipment second another embodiment of heat exchanger;
Fig. 4 E be refrigeration of the present invention, heating equipment second another embodiment of heat exchanger structural representation two;
Fig. 5 A is one of structural representation of refrigeration of the present invention, heating equipment embodiment four;
Fig. 5 B be refrigeration of the present invention, heating equipment embodiment four structural representation two;
Fig. 6 A is one of part work schematic diagram of refrigeration of the present invention, heating equipment;
Fig. 6 B be refrigeration of the present invention, heating equipment part work schematic diagram two;
Fig. 6 C be refrigeration of the present invention, heating equipment part work schematic diagram three;
Fig. 6 D be refrigeration of the present invention, heating equipment part work schematic diagram four;
Fig. 7 A is for being one of structural representation of refrigeration of the present invention, heating equipment fan and the setting of first heat exchanger;
Fig. 7 B is two of the structural representation that is provided with for refrigeration of the present invention, heating equipment fan and first heat exchanger;
Fig. 7 C is three of the structural representation that is provided with for refrigeration of the present invention, heating equipment fan and first heat exchanger.
The specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that is obtained under the creative work prerequisite.
Semiconductor refrigerating of the present invention, heating equipment, mainly utilize the liquid refrigerant and second heat exchanger to carry out heat exchange, semiconductor refrigeration chip is outputed to lot of energy in second heat exchanger, take away and be stored in a large amount of liquid working substances in the reservoir by liquid refrigerant with big thermal capacity, promptly by second heat exchanger the unwanted energy (heat that produces when promptly freezing, the cold that produces when perhaps heating) is stored in the liquid refrigerant, the useful energy that the needs (cold that produces when promptly freezing, the heat that produces when perhaps heating) finishes energy exchange by first interchanger and space heat exchange, thereby realize that cold separates in the same space with heat, avoided the heat exchange of while with a space, because reservoir is open, the variable size of its volume, and the liquid working substance in the reservoir is replaceable, so capacity of liquid in the reservoir, temperature can change, the thermal capacity of its liquid is big, the energy of taking away is many, the second heat exchanger heat exchange efficiency height, make semiconductor chip freeze, the heating efficiency height, and the energy overwhelming majority of exchange is stored in the liquid working substance, and lessly distribute to air, improved the refrigeration of overall space, heating effect.If utilize water as working medium, because energy is stored in the water, finished heating, the refrigeration of water, so can utilize the water after heating or the refrigeration, saved the energy.
Fig. 1 is the structural representation of refrigeration of the present invention, heating equipment embodiment one.As shown in Figure 1, this refrigeration, heating equipment embodiment one comprise semiconductor chip 1, first heat exchanger 21, second heat exchanger 22, working medium circulator 9 and water pump 5.
In the time of work, to semiconductor chip 1 energising, can produce temperature difference at first end 11 and second end 12 like this, an end temperature wherein raises, and other end temperature reduces.First end face 11 can carry out heat exchange with first heat exchanger 21, and first heat exchanger 21 carries out heat exchange with the external world again
Finish refrigeration, heat, and second end face 12 can carry out heat exchange with second heat exchanger 22, and second heat exchanger 22 utilizes the liquid refrigerant in the working medium circulator 9 to carry out heat exchange, the energy that second end face 12 of semiconductor chip 1 is passed to second heat exchanger 22 is taken away by working medium, be stored in the liquid refrigerant, such second heat exchanger 22 just need not equally with first heat exchanger 21 also carry out energy exchange to the external world, get final product but only carry out heat exchange with liquid refrigerant, so heat or the cold that passes to second heat exchanger 22 can be carried out the energy transmission by liquid refrigerant at circulator 9, and, in liquid working substance, can finish energy exchange through the moving system of liquid circulation flow, storage.
The present invention is freezed like this, first heat exchanger 21 of heating equipment embodiment one is different with the heat exchange channel of second heat exchanger 22, realize that cold separates in the same space with heat, avoided the heat exchange of while with a space, because (the reservoir volume size is variable for the capacity of liquid in the reservoir, liquid in the reservoir is replaceable) can change, the thermal capacity of its liquid is big, the energy of taking away is many, second heat exchanger, 22 heat exchange efficiency height, make semiconductor refrigeration chip 1 freeze, the heating efficiency height, and the energy overwhelming majority of second interchanger, 22 exchanges is stored in the liquid working substance, lessly distribute the overall space refrigeration to air, heating effect is good.
Fig. 2 is the structural representation of refrigeration of the present invention, heating equipment embodiment two.As shown in Figure 2, this refrigeration, heating equipment embodiment two comprise semiconductor chip 1, first heat exchanger 21, second heat exchanger 22, working medium circulator and water pump 5, and the working medium circulator of present embodiment comprises working medium circulation pipe 3 and reservoir 4.
In the time of work, to semiconductor chip 1 energising, can reduce and 120 heat temperature and raise at cold junction 110 cryogenic temperatures like this in the hot junction, the generation temperature difference end 110 and first heat exchanger 21 carry out heat exchange, the temperature of the heat exchanger 21 of winning is reduced, first heat exchanger 21 again and extraneous (for example air) carry out heat exchange, reduce the temperature of surrounding air, produce the effect of refrigeration.
And the hot junction 120 and second heat exchanger 22 carry out heat exchange, make the temperature of second heat exchanger 22 raise, and its temperature rise is littler, and the refrigeratory capacity of semiconductor chip 1 is bigger, so the heat that needs hot junction 120 to be flowed to second heat exchanger 22 is taken away as early as possible.And the liquid refrigerant in second heat exchanger 22 and the working medium circulation pipe 3 carries out heat exchange, the exchange heat that hot junction 120 is transmitted to second heat exchanger 22 is to the liquid refrigerant of working medium circulation pipe 3, the liquid refrigerant temperature raises, and carries out the heat transmission, takes away and stores in the liquid of reservoir 4 so the thermal capacitance of the Btu utilization liquid refrigerant in second heat exchanger 22 can be exchanged and follows endless tube 3
, finish the transfer of heat that semiconductor chip 1 hot junction 120 passes to second heat exchanger 22.Second heat exchanger 22 just need not equally with first heat exchanger 21 carry out heat exchange with air thus, but carry out heat exchange with working medium, the energy that second end face 120 of semiconductor chip 1 is passed to second heat exchanger 22 is taken away by working medium, is stored in reservoir 4 liquid refrigerants.Water pump 5 can provide power, liquid refrigerant in the working medium circulation pipe 3 is circulated, liquid refrigerant in the working medium circulation pipe 3 enters the reservoir 4 through circulating from an end of working medium circulation pipe 3, and water pump 5 with the working medium in the reservoir 4 again from the other end suction of working medium circulation pipe 3, circulate again.Water pump can place reservoir, also can place outside the reservoir, is determined on a case-by-case basis.
Can utilize water as working medium, utilize the work of refrigeration of the present invention, heating equipment can promote the temperature of water like this, rather than heat is dispersed in the air, like this can energy savings, hot water can be used as other purposes, for example laundry, bathing etc.
First heat exchanger of refrigeration of the present invention, heating equipment embodiment two is different with the heat exchange channel of second heat exchanger, and the heat of second heat exchanger is conducted in the liquid refrigerant, rather than is conducted in the air.First heat exchanger is with the heat absorption in the surrounding air, reduce the temperature of surrounding air, finish process of refrigerastion like this, realized that simultaneously cold separates in the same space with heat, and the energy overwhelming majority of exchange is stored in and lessly in the liquid distributes the overall space good refrigeration effect to air.
Fig. 3 is the structural representation of refrigeration of the present invention, heating equipment embodiment three.As shown in Figure 3, this refrigeration, heating equipment embodiment three comprise semiconductor chip 1, first heat exchanger 21, second heat exchanger 22, working medium circulator and water pump 5, and the working medium circulator of present embodiment comprises working medium circulation pipe 3 and reservoir 4.
In work time, to semiconductor chip 1 energising, like this can be in the hot junction 111 heats temperature and rises and reduce at cold junction 121 cryogenic temperatures, produces temperature difference.Heat exchange can be carried out with first heat exchanger 21 in hot junction 111, and the temperature of the heat exchanger 21 of winning is raise, first heat exchanger 21 again and extraneous (for example air) carry out heat exchange, increase the temperature of surrounding air, produce the effect that heats.
And the cold junction 121 and second heat exchanger 22 carry out heat exchange, make the temperature of second heat exchanger 22 reduce, its temperature drop is littler, the quantity of heat production of semiconductor chip 1 is bigger, so the cold that needs cold junction 121 to be flowed to second heat exchanger 22 is taken away as early as possible, and the liquid refrigerant in second heat exchanger 22 and the working medium circulation pipe 3 carries out heat exchange, the liquid refrigerant of working medium circulation pipe 3 conducts to heat in second heat exchanger 22, the liquid refrigerant temperature reduces, can improve the temperature of second heat exchanger 22 like this, semiconductor chip 1 hot junction 111 and the temperature difference of cold junction 121 are reduced, and the quantity of heat production in hot junction 111 increases.Utilize the thermal capacity of liquid refrigerant, take away, transmit, be stored in the cold in the liquid refrigerant in the liquid refrigerant of reservoir 4 by liquid refrigerant, second heat exchanger 22 just need not equally with first heat exchanger 21 carry out heat exchange with air thus, but carries out heat exchange with liquid refrigerant.Water pump 5 can provide power, liquid refrigerant in the working medium circulation pipe 3 is circulated, liquid refrigerant in the working medium circulation pipe 3 enters the reservoir 4 through the end of power cycle from working medium circulation pipe 3, and water pump 5 with the liquid refrigerant in the reservoir 4 again from the other end suction of working medium circulation pipe 3, carry out thermal cycle again.
Water pump can place reservoir, also can place outside the reservoir, is determined on a case-by-case basis.The present invention is freezed like this, first heat exchanger of heating equipment embodiment three is different with the heat exchange channel of second heat exchanger, the cold of second heat exchanger conducts in the liquid refrigerant, first heat exchanger and surrounding air heat-shift, improve the temperature of surrounding air, finish the process of heating, realized that simultaneously heat separates in the same space with cold, and the cold overwhelming majority of second interchanger 22 exchange is stored in and lessly in the liquid distributes to air, the overall space heating effect well like this can be so that the operating efficiency of semiconductor chip can not reduce, and heating effect is good.
Heat exchanger in above-mentioned heating equipment embodiment two and three can be built-in crooked conduit heat collector or fin heat collector.Fig. 4 A is the present invention's refrigeration, the appearance assumption diagram of heating equipment second heat exchanger 22, wherein the direction of arrow is the liquid refrigerant flow direction, and Fig. 4 B is the present invention's refrigeration, the structural representation of an embodiment of heating equipment second heat exchanger, shown in Fig. 4 B, this second heat exchanger 22 is a built-in crooked conduit heat collector, comprise a shell 220 and the crooked conduit 221 that is placed in the shell 220, when the liquid liquid refrigerant is flowed through crooked conduit 221, carry out heat exchange with second end of described semiconductor chip, flow out then, utilize crooked conduit to increase the area of heat exchange and the efficient of heat exchange.Fig. 4 C is the structural representation of refrigeration of the present invention, heating equipment second another embodiment of heat exchanger, shown in Fig. 4 C, this second heat exchanger 22 is a fin heat collector, comprise a shell 220 and the fin 222 that is placed in the shell 220, utilize fin 222 to increase heat exchange area and carry out heat exchange with the liquid liquid refrigerant, wherein the direction of arrow is the liquid refrigerant flow direction.Fig. 4 D and Fig. 4 E are the present invention's refrigeration, the structural representation of heating equipment second another embodiment of heat exchanger, shown in Fig. 4 D and Fig. 4 E, this second heat exchanger 22 is the passage heat collector, comprise shell 220 and the inner liquid passage 223 of flowing through, this passage 223 is made of the fin walls and the shell 220 of fin 222, heat exchange is carried out with second radiator in liquid working substance fluid passage 223 back of flowing through, utilize long fluid passage 223, fin walls increases the contact area of the liquid working substance and second radiator and the efficient of heat exchange, and wherein the direction of arrow is the liquid refrigerant flow direction.
Fig. 5 A and Fig. 5 B are the structural representation of refrigeration of the present invention, heating equipment embodiment four.Present embodiment is compared with embodiment three with embodiment two, fan 8, water tank 50, water spilage tray 10 and condensate pipe 19 have been increased, as shown in Figure 6, fan 8 is arranged on a side of first heat exchanger 21, is used for accelerating the heat exchange of first heat exchanger 21 and extraneous (as air).Water tank 50 is connected with working medium circulation pipe 3 with water pump 5, liquid refrigerant is provided when being used to water pump 5 initial starts work, in water pump 5 each initial start work, if water pump 5 (non-self prime pump) the inside does not have liquid refrigerant, just the liquid refrigerant that can not extract in the reservoir 4 circulates, so can utilize a water tank 50 that is equipped with liquid refrigerant, coming provides working medium for the initialization of water pump 5.
Water spilage tray 10 places the below of first heat exchanger 21, is used to collect the condensate water on first heat exchanger 21; In first end refrigeration of semiconductor chip, ambient air can be cooled off, thus in a lot of condensate water of the surface condensation of first heat exchanger 21, and utilize water spilage tray 10 to collect these condensate water.
Fig. 6 is this part work schematic diagram for refrigeration of the present invention, heating equipment, and as shown in Figure 6A, second heat exchanger 22, water pump 5 and water tank 7 are provided with respectively, are connected and conducting by working medium circulation pipe 3 respectively.Shown in Fig. 6 B, second heat exchanger 22 is provided with separately, and water pump 5 and water tank 7 are wholely set, and are connected and conducting by working medium circulation pipe 3.Shown in Fig. 6 C, water pump 5 is provided with separately, and second heat exchanger 22 and water tank 7 are wholely set, and are connected and conducting by working medium circulation pipe 3.Shown in Fig. 6 D, second heat exchanger 22, water pump 5 and water tank 7 are wholely set for another example, are connected and conducting with other parts by working medium circulation pipe 3.
The structural representation of Fig. 7 for being provided with for refrigeration of the present invention, heating equipment fan 8 and first heat exchanger 21.Shown in Fig. 7 A, first heat exchanger 21 is the fin heat collector, and fan 8 is an aerofoil fan, and fan 8 is arranged on a side of first heat exchanger, and the direction of arrow among the figure is the flow direction of wind.Shown in Fig. 7 B, first heat exchanger 21 is the fin heat collector, and fan 8 is an aerofoil fan, and fan 8 is arranged on the side of first heat exchanger 21, and the direction of arrow among the figure is the flow direction of wind.Shown in Fig. 7 C, first heat exchanger 21 is the fin heat collector, and fan 8 is a centrifugal fan, and fan 8 also is arranged on the side of first heat exchanger 21, and the direction of arrow among the figure is the flow direction of wind.
Can accelerate the efficient of first heat exchanger and surrounding air heat exchange like this, improve the operating efficiency of equipment, the effect that has also improved refrigeration and heated.
The present invention's refrigeration, heating equipment has adopted semiconductor refrigerating/heat technology, with the refrigeration is example, first end of semiconductor chip is a cold junction, second end is the hot junction, during the cold junction refrigeration, second heat exchanger that engages with the hot junction need not to use the radiator that carries out heat exchange with air, with the heat that produces in the process of refrigerastion by water pump, by interior second heat exchanger that liquid cycle fluid is arranged and be engaged in the hot junction, utilize liquid refrigerant such as water etc. that the semiconductor chip hot junction is produced, the heat of carrying is taken away and is stored in a large amount of liquid refrigerants, utilize a large amount of thermal capacitances of liquid refrigerant to sponge the generation of semiconductor chip hot junction, transfer heat, make the temperature rise of semiconductor chip hot junction less, the entire equipment refrigeratory capacity increases makes heat not be distributed to the temperature rise that causes air in the air simultaneously.And, can change the volume of liquid refrigerant or change reservoir at any time because reservoir is open, and hold, store, absorb more energy, help the increase of the first end refrigeratory capacity.
Equally, when semiconductor cooler polarity is opposite with above-mentioned energising polarity, first end of semiconductor chip is the hot junction, second end is a cold junction, refrigeration of the present invention, heating equipment are finished heat-production functions, mechanism is identical with refrigeration, just the cold of cold junction is stored in the bigger liquid refrigerant of thermal capacity, and the heat that the hot junction produces is extremely needed the space of heating by fan belt.
The present invention's refrigeration, during heating equipment work, with the refrigeration is example, first end of semiconductor chip is a cold junction, second end is the hot junction, pass to direct current to semiconductor chip, the heat that the semiconductor chip hot junction produces is by second end face, second heat exchanger carries out heat exchange at second heat exchanger, liquid refrigerant in the heat of second heat exchanger and the working medium circulation pipe carries out heat exchange, with heat delivery to liquid refrigerant, liquid refrigerant passes through the working medium circulation pipe by pump, reservoir circulates, heat absorption, be stored in the liquid refrigerant of reservoir and circulating line, this liquid refrigerant reservoir is open the connection with the working medium circulation pipe.The cold that the cold junction of semiconductor chip produces is stored in first heat exchanger, by means of fan cold is transferred out, and reaches the effect of refrigeration surrounding air, has realized heat and cold separating in the same space simultaneously, and whole space does not have temperature rise.Liquid refrigerant in the reservoir, for example water can use as needs temperature rise liquid because of input heat temperature raises, and for example is used for bathing, does washing and washes the dishes etc., has saved the energy thus, has reached the rational secondary of energy and has used.
Refrigeration of the present invention, when heating equipment heats, operation principle is close with refrigeration, just the energising polarity of semiconductor chip with freeze on the contrary, first end of semiconductor chip is the hot junction, second end is a cold junction, cold is stored in the liquid refrigerant.
Use refrigeration of the present invention, heating equipment can be used for making a minitype air conditioner.
The above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above only is the specific embodiment of the present invention; and be not intended to limit the scope of the invention; within the spirit and principles in the present invention all, any modification of being made, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. a semiconductor refrigerating, heating equipment is characterized in that described equipment comprises:
Semiconductor chip has first end face and second end face, and described semiconductor chip is used for energising back and heats or freeze at described first end face and second end face;
First heat exchanger with described first end joined, and carries out heat exchange with described first end face, is used for carrying out heat exchange with the external world;
Second heat exchanger with described second end joined, and carries out heat exchange with described second end face;
Working medium circulator is connected with described second heat exchanger, and the liquid refrigerant in the described working medium circulator carries out heat exchange in described second heat exchanger, and semiconductor chip second end face is passed to the energy exchange of second heat exchanger in described working medium;
Water pump is connected with described working medium circulation pipe, the liquid refrigerant of the described working medium circulator that is used for circulating.
2. semiconductor refrigerating according to claim 1, heating equipment is characterized in that, described working medium circulator comprises:
The working medium circulation pipe is connected with described second heat exchanger, and the liquid refrigerant in the described working medium circulation pipe carries out heat exchange in described second heat exchanger, and semiconductor chip second end face is transported to the energy exchange of second heat exchanger in described liquid refrigerant;
Reservoir, this reservoir are open reservoir, are connected with described working medium circulation pipe, are used to hold liquid refrigerant, storage power.
3. semiconductor refrigerating according to claim 1, heating equipment, it is characterized in that described first end face is the hot junction, described semiconductor chip energising back heats in described hot junction, described second end face is a cold junction, and described semiconductor chip energising back is in described cold junction refrigeration.
4. semiconductor refrigerating according to claim 1, heating equipment, it is characterized in that described first end face is a cold junction, described semiconductor chip energising back is in described cold junction refrigeration, described second end face is the hot junction, and described semiconductor chip energising back heats in described hot junction.
5. semiconductor refrigerating according to claim 1, heating equipment is characterized in that, described second heat exchanger is built-in crooked conduit heat collector, perhaps fin heat collector, perhaps passage heat collector; Described water pump is a self prime pump.
6. semiconductor refrigerating according to claim 1, heating equipment is characterized in that, described equipment also comprises: water tank, be connected with working medium circulator with described water pump, and liquid refrigerant is provided when being used to water pump initial start work.
7. semiconductor refrigerating according to claim 6, heating equipment is characterized in that, described water pump and described water tank are for being wholely set; The perhaps described water tank and second heat exchanger are for being wholely set; Perhaps described water pump, water tank and second heat exchanger are for being wholely set.
8. semiconductor refrigerating according to claim 1, heating equipment is characterized in that, also comprise:
Water spilage tray places the below of described first heat exchanger, is used to collect the condensate water on described first heat exchanger;
Condensate pipe is conducted with described water spilage tray and working medium circulator, is used for the condensate water that described water spilage tray connects is flowed into described working medium circulator.
9. semiconductor refrigerating according to claim 1, heating equipment is characterized in that described equipment also comprises fan, are used to accelerate described first heat exchanger and extraneous heat exchange.
10. air-conditioning that uses the described semiconductor refrigerating of above-mentioned arbitrary claim, heating equipment.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100907022A CN101625178B (en) | 2009-08-06 | 2009-08-06 | Semiconductor refrigerating and heating equipment and air conditioner |
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| CN2009100907022A CN101625178B (en) | 2009-08-06 | 2009-08-06 | Semiconductor refrigerating and heating equipment and air conditioner |
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| CN101625178A true CN101625178A (en) | 2010-01-13 |
| CN101625178B CN101625178B (en) | 2011-07-27 |
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| CN2629559Y (en) * | 2003-07-30 | 2004-08-04 | 叶永丰 | Semiconductor electronic cold-heat generator |
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2009
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