CN107388213B - 散热装置及具有该散热装置的光照射装置 - Google Patents
散热装置及具有该散热装置的光照射装置 Download PDFInfo
- Publication number
- CN107388213B CN107388213B CN201710190474.0A CN201710190474A CN107388213B CN 107388213 B CN107388213 B CN 107388213B CN 201710190474 A CN201710190474 A CN 201710190474A CN 107388213 B CN107388213 B CN 107388213B
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- China
- Prior art keywords
- heat
- main surface
- support member
- linear portion
- light irradiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 55
- 230000004048 modification Effects 0.000 description 30
- 238000012986 modification Methods 0.000 description 30
- 230000005855 radiation Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 15
- 238000011144 upstream manufacturing Methods 0.000 description 14
- 239000012530 fluid Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
- B41J29/377—Cooling or ventilating arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP2016-073749 | 2016-03-31 | ||
JP2016073749 | 2016-03-31 | ||
JP2017025339A JP6599379B2 (ja) | 2016-03-31 | 2017-02-14 | 放熱装置及びそれを備える光照射装置 |
JPJP2017-025339 | 2017-02-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107388213A CN107388213A (zh) | 2017-11-24 |
CN107388213B true CN107388213B (zh) | 2021-01-15 |
Family
ID=60046300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710190474.0A Active CN107388213B (zh) | 2016-03-31 | 2017-03-28 | 散热装置及具有该散热装置的光照射装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6599379B2 (enrdf_load_stackoverflow) |
KR (1) | KR20170113127A (enrdf_load_stackoverflow) |
CN (1) | CN107388213B (enrdf_load_stackoverflow) |
TW (1) | TWI658235B (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019151291A1 (ja) * | 2018-01-31 | 2019-08-08 | 古河電気工業株式会社 | ヒートシンク |
KR102590340B1 (ko) * | 2018-08-21 | 2023-10-17 | 주식회사 디오 | 임플란트의 표면처리용 자외선 조사장치 |
JP7012674B2 (ja) * | 2019-01-27 | 2022-02-14 | Hoya株式会社 | 放熱装置、及びそれを備える光照射装置 |
KR102611062B1 (ko) * | 2019-01-30 | 2023-12-07 | 교세라 가부시키가이샤 | 광조사 장치 및 인쇄 장치 |
JP6815562B1 (ja) * | 2019-12-02 | 2021-01-20 | 三菱電機株式会社 | ヒートシンク |
KR102402027B1 (ko) * | 2021-12-09 | 2022-05-26 | 주식회사 유브이플러스 | Led uv 경화기 |
JP2024008339A (ja) * | 2022-07-08 | 2024-01-19 | ウシオ電機株式会社 | 光源ユニット、光源装置及び光源ユニットの形成方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117787A (zh) * | 2009-12-29 | 2011-07-06 | 富士通株式会社 | 散热器 |
CN102454971A (zh) * | 2010-10-22 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置及应用该散热装置的发光二极管灯具 |
JP2013030736A (ja) * | 2011-06-21 | 2013-02-07 | Furukawa Electric Co Ltd:The | 冷却装置 |
CN103672471A (zh) * | 2012-09-19 | 2014-03-26 | 珍通能源技术股份有限公司 | 主动式散热led照明灯具 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3857774B2 (ja) * | 1997-03-19 | 2006-12-13 | 株式会社フジクラ | ヒートパイプの保持構造 |
JP3454761B2 (ja) * | 1999-10-29 | 2003-10-06 | 古河電気工業株式会社 | 電子機器用冷却装置および冷却方法 |
TW520146U (en) * | 2002-06-13 | 2003-02-01 | Hon Hai Prec Ind Co Ltd | Heat pipe assembly |
US7021368B2 (en) * | 2003-11-12 | 2006-04-04 | Cpumate Inc. | Heat dissipating device with uniform heat points |
US7650929B2 (en) * | 2007-09-30 | 2010-01-26 | Tsung-Hsien Huang | Cooler module |
TW200928201A (en) * | 2007-12-21 | 2009-07-01 | Foxconn Tech Co Ltd | LED lamp |
JP2011094888A (ja) * | 2009-10-30 | 2011-05-12 | Fujitsu Ltd | 放熱装置、放熱装置の製造方法 |
JP5333161B2 (ja) * | 2009-11-11 | 2013-11-06 | 富士通株式会社 | ヒートシンク |
CN201652263U (zh) * | 2009-11-23 | 2010-11-24 | 四川新力光源有限公司 | 一种led照明灯具的散热装置 |
TWM392311U (en) * | 2010-05-20 | 2010-11-11 | Leader Trend Technology Corp | LED lamp and heat dissipation structure thereof |
CN102970851B (zh) * | 2012-11-16 | 2015-07-22 | 东莞汉旭五金塑胶科技有限公司 | 热管散热器 |
CN105276411B (zh) * | 2014-06-30 | 2018-12-18 | 豪雅冠得股份有限公司 | 光照射装置 |
-
2017
- 2017-02-14 JP JP2017025339A patent/JP6599379B2/ja active Active
- 2017-03-16 KR KR1020170033046A patent/KR20170113127A/ko not_active Ceased
- 2017-03-21 TW TW106109408A patent/TWI658235B/zh active
- 2017-03-28 CN CN201710190474.0A patent/CN107388213B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102117787A (zh) * | 2009-12-29 | 2011-07-06 | 富士通株式会社 | 散热器 |
CN102454971A (zh) * | 2010-10-22 | 2012-05-16 | 富准精密工业(深圳)有限公司 | 散热装置及应用该散热装置的发光二极管灯具 |
JP2013030736A (ja) * | 2011-06-21 | 2013-02-07 | Furukawa Electric Co Ltd:The | 冷却装置 |
CN103672471A (zh) * | 2012-09-19 | 2014-03-26 | 珍通能源技术股份有限公司 | 主动式散热led照明灯具 |
Also Published As
Publication number | Publication date |
---|---|
JP2017187269A (ja) | 2017-10-12 |
TWI658235B (zh) | 2019-05-01 |
JP6599379B2 (ja) | 2019-10-30 |
KR20170113127A (ko) | 2017-10-12 |
TW201736775A (zh) | 2017-10-16 |
CN107388213A (zh) | 2017-11-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200903 Address after: No. 10-1, liudingmu, Shinjuku, Tokyo, Japan Applicant after: HOYA Corp. Address before: Saitama Prefecture, Japan Applicant before: HOYA CANDEO OPTRONICS Corp. |
|
TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |