CN107379661A - 一种多金属混杂陶瓷基复合材料 - Google Patents
一种多金属混杂陶瓷基复合材料 Download PDFInfo
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Abstract
本发明公开了一种多金属混杂陶瓷基复合材料,由C/SiC陶瓷基复合材料和金属薄板构成夹层结构,其特征在于该结构由外到内依次为C/SiC复合材料、Mo合金薄板、C/SiC复合材料,Ti合金薄板薄板、C/SiC复合材料、Al合金薄板和C/SiC复合材料,其中在与金属薄板接触的C/SiC复合材料表面有一层沿陶瓷基体内部方向呈梯度分布的金属涂层。该材料集合陶瓷基复合材料与金属材料的优点,使得该材料强韧性显著提高,缺口敏感性大为降低,大大提高了材料的强度及韧性。
Description
技术领域
本发明涉及一种复合材料,特别是涉及一种多金属混杂陶瓷基复合材料。
背景技术
目前C/SiC复合材料能够耐高温抗氧化,其高温性能非常优异,在飞机发动机,刹车盘,结构受力件等领域具有广泛的应用,然而由于碳化硅陶瓷脆性大,易碎裂,大大限制了其使用范围。即使通过碳纤维增韧,其韧性可达到合金水平,但是由于碳化硅材料的缺口敏感性大,断裂的临界缺陷太低,大约为10-3mm个数量级,远远低于金属及其合金缺陷临界值(约1mm级)。而Mo、Nb、Ti等难熔金属强度高,韧性高,其断裂的临界缺陷远高于碳化硅陶瓷。采用金属背衬,能大大提高材料的韧性。另外难熔金属的导热系数非常高,且比热容较小,可以很快疏散热量,起到对外表降温的作用。但是金属再高温的抗蠕变性能差,易软化,故再加一层C/SiC复合材料作为支撑结构,将该结构多层叠加制备出C/SiC复合材料与金属薄板的叠层结构材料,使的该材料具备优异的力学性能,综合了传统纤维复合材料和金属材料的特点,弥补了单一复合材料和金属材料的不足,不但具有高比刚度和比强度,优良的疲劳性能以及损伤容限性能,将显著提高材料的强韧性,大大降低材料的缺口敏感性,使其成为航空航天飞行器结构所需材料的理想选择。
一直以来,金属相增强陶瓷材料由于其优异的性能,各自的优缺点互补,一直是研究热点。文献“金属间化合物/陶瓷基复合材料发展现状与趋势,刘凡,何柏林.粉末冶金材料科学与工程,2007,12(1):8-12”揭示了金属间化合物增强陶瓷材料的现状,其中沈建兴等人介绍了一种镍铝合金增强氧化铝陶瓷材料,研究表明Ni3-Al对Al2O3陶瓷有明显的增韧作用。所得复合材料的抗弯强度与断裂韧性从室温至600℃范围内,随温度升高下降很少。但随着材料的进一步升高,由于金属材料的蠕变性能,使得材料的整体性能下降。张炳荣等人通过粉末冶金的方法制得,与纯Al2O3陶瓷相比,该复合材料直到1000℃仍保持了较高的断裂韧性。高明霞等人采用自发熔化渗透法制备了高TiC含量的NiAl/TiC和Ni3-Al/TiC复合材料,使材料的断裂韧性大大增加。可见这类材料通过各自的优点而弥补或部分弥补了彼此的缺点 , 具有优异的性能。然而此类材料中空隙难以完全消除,若加入过多烧结助剂势必影响材料的力学性能,特别是通过自发熔化渗透法制备出的材料,结构不均匀,且存在不能消除的气孔,大大降低了材料的断裂韧性。
文献“C/SiC复合材料与Nb合金的连接, 梁赤勇, 堵永国, 张为军. 宇航材料工艺, 2009” 介绍了C/SiC复合材料与Nb合金的连接。文献“SiC陶瓷与金属W的连接及工艺研究,魏倩倩. 武汉理工大学, 2012”介绍了SiC陶瓷与金属W的连接及工艺。以上文献所介绍的钎焊只适用小尺寸材料的链接,而像板材由于接触面积大,中心面积区域在焊接过程中结构难以控制,极易出现焊接缺陷,形成空洞。同时以上文献中并未有效解决陶瓷材料与金属材料热膨胀系数不匹配的问题,使得材料中存在较大残余应力。
发明内容
本发明的目的旨在克服现有技术的缺陷,提供了一种硬度高韧性好,能够耐高温抗氧化的一种多金属混杂陶瓷基复合材料。
为实现本发明的目的所采用的技术方案是:一种多金属混杂陶瓷基复合材料,由C/SiC陶瓷基复合材料和金属薄板构成夹层结构,其特征在于该结构由外到内依次为C/SiC复合材料、Mo合金薄板、C/SiC复合材料,Ti合金薄板薄板、C/SiC复合材料和Al合金薄板,其中在与金属薄板接触的C/SiC复合材料表面有一层沿陶瓷基体内部方向呈梯度分布的金属涂层。所述的C/SiC陶瓷基复合材料在叠层中的单层厚度为10-30mm,所述的呈梯度分布的金属涂层是向C/SiC陶瓷基体中渗入的金属Zr、Nb或Cu金属涂层,渗入涂层的全梯度厚度为1-60μm。所述的Mo、Ti和Al合金薄板厚度为0.1-5mm。
本发明的有益效果:(1)该材料集合陶瓷基复合材料与金属材料的优点,使得材料强韧性显著提高,缺口敏感性大为降低,大大提高了材料的强度及韧性;(2)该材料中由于难熔金属的导热系数非常高,且比热容较小,可以很快疏散热量,起到对外表降温的作用;(3)由于在与金属层接触的C/SiC复合材料表面制备有一层金属涂层,在热压条件下可使得复合材料层与金属层之间界面强结合,不易出现分层脱黏现象。(4) 采用三层结构,第一层为Mo合金,其密度为10.2g/cm3,第二层为Ti合金,其密度为4.5g/cm3,第三位Al合金,其密度为2.5g/cm3,越往后温度越低,故选择密度低的金属,以降低重量。
附图说明
图 1是一种C/SiC陶瓷基复合材料与金属混杂材料的截面图:
10为C/SiC陶瓷基复合材料; 20为金属涂层;30为Mo合金薄板;40为Ti合金薄板;50为Al合金薄板。
具体实施方式
下面结合具体实施例,进一步阐明本发明,应理解这些实施例仅用于说明本发明而不用于限制本发明的范围,在阅读了本发明之后,本领域技术人员对本发明的各种等价形式的修改均落于本申请所附权利要求所限定。
实施例一
结合附图说明,一种多金属混杂陶瓷基复合材料,由C/SiC陶瓷基复合材料和金属薄板构成夹层结构,其特征在于该结构由外到内依次为[10]C/SiC复合材料、[30]Mo合金薄板、[10]C/SiC复合材料,[40]Ti合金薄板薄板、[10]C/SiC复合材料、[50]Al合金薄板和[10]C/SiC复合材料,其中在与金属薄板接触的C/SiC复合材料表面制备有一层[20]金属Zr涂层,厚度为1-60μm。所述的C/SiC陶瓷基复合材料表面的金属涂层渗入到C/SiC内部,呈梯度分布。所述的Mo、Ti和Al合金薄板厚度为1mm。所述的每一层C/SiC复合材料厚度为20mm。
实施例二
一种多金属混杂陶瓷基复合材料,由C/SiC陶瓷基复合材料和金属薄板构成夹层结构,其特征在于该结构由外到内依次为C/SiC复合材料、Mo合金薄板、C/SiC复合材料,Ti合金薄板薄板、C/SiC复合材料、Al合金薄板和C/SiC复合材料,其中在与金属薄板接触的C/SiC复合材料表面制备有一层金属Cu涂层,厚度为1-60μm。金属Cu涂层渗入到C/SiC内部,呈梯度分布。所述的Mo、Ti和Al合金薄板厚度为0.1mm。所述的每一层C/SiC复合材料厚度为10mm。
Claims (2)
1.一种多金属混杂陶瓷基复合材料,由C/SiC陶瓷基复合材料和金属薄板构成夹层结构,其特征在于该结构由外到内依次为C/SiC复合材料、Mo合金薄板、C/SiC复合材料,Ti合金薄板薄板、C/SiC复合材料和Al合金薄板,其中在与金属薄板接触的C/SiC复合材料表面有一层沿陶瓷基体内部方向呈梯度分布的金属涂层,Mo、Ti和Al合金薄板厚度为0.1-5mm。
2.根据权利要求1所述的复合材料,其特征在于所述的C/SiC陶瓷基复合材料在叠层中的单层厚度为10-30mm,呈梯度分布的金属涂层是向C/SiC陶瓷基体中渗入的金属Zr、Nb、Cu金属涂层中的任一种,渗入涂层的全梯度厚度为1-60μm。
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