CN107369609B - Wafer residual glue cleaning method and device - Google Patents
Wafer residual glue cleaning method and device Download PDFInfo
- Publication number
- CN107369609B CN107369609B CN201710059923.8A CN201710059923A CN107369609B CN 107369609 B CN107369609 B CN 107369609B CN 201710059923 A CN201710059923 A CN 201710059923A CN 107369609 B CN107369609 B CN 107369609B
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- pressing
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- 238000004140 cleaning Methods 0.000 title claims abstract description 68
- 239000003292 glue Substances 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims abstract description 38
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 238000007689 inspection Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 65
- 239000007788 liquid Substances 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 21
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000197 pyrolysis Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 34
- 238000004804 winding Methods 0.000 description 19
- 238000006073 displacement reaction Methods 0.000 description 14
- 230000008878 coupling Effects 0.000 description 10
- 238000010168 coupling process Methods 0.000 description 10
- 238000005859 coupling reaction Methods 0.000 description 10
- 238000007598 dipping method Methods 0.000 description 9
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 238000002791 soaking Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention provides a method and a device for cleaning wafer residual glue, comprising the following steps: an inspection step, the workpiece to be processed is inspected by a detection mechanism on a carrying platform; a wiping step of wiping the pair of wiping materials by a wiping mechanism; the workpiece to be processed is a wafer, the inspection step and the wiping step are performed on the wafer on the same platform on the same machine, the inspection mechanism inspects the residual glue condition of each die on the wafer one by one, and the wiping mechanism wipes the material by one and performs the wiping on the individual die with the detected residual glue one by one; thereby completing each die clean more exhaustively.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a cleaning method and apparatus, and more particularly, to a method and apparatus for cleaning residual glue on a wafer.
[ background of the invention ]
Conventionally, the wafer processing process usually uses adhesive to spray or spot on the die or its periphery, which is usually left on the die after the process is completed, and some of the adhesive must be cleaned or will affect the next process, and the adhesive is difficult to be completely cleaned no matter what solvent is used for cleaning; in the prior art, the cleaning operation is performed by wiping the whole wafer, so that the residual glue on the surface of the whole wafer is removed.
[ summary of the invention ]
In the prior art, the operation of wiping the whole wafer can only be suitable for the condition that the surface of the wafer has large residual glue and is only suitable for 2D wafers; since the conventional wafer process is developed to 3D process, the glue is still applied between the dies after the wafer has been cut into dies, so that many times the glue residue will not be generated in a large piece but only remain on some individual dies, and the cleaning of the whole wafer is difficult to effectively clean the individual dies.
Accordingly, it is an object of the present invention to provide a method for cleaning wafer adhesive residue that can clean individual die.
Another objective of the present invention is to provide an apparatus using the method for cleaning residual wafer glue.
Another objective of the present invention is to provide an apparatus for performing the wafer residue cleaning method.
The wafer residual glue cleaning method comprises the following steps: an inspection step, the workpiece to be processed is inspected by a detection mechanism on a carrying platform; a wiping step of wiping the pair of wiping materials by a wiping mechanism; wherein the workpiece to be processed is a wafer, the inspecting step and the wiping step are performed on the wafer on the same stage on the same machine, the inspecting mechanism inspects the residual glue condition of each die on the wafer one by one, and the wiping mechanism wipes the material one by one to perform individual die inspected with residual glue.
According to another aspect of the present invention, a wafer adhesive residue cleaning apparatus using the method comprises: the machine table is provided with a machine table top, and a transfer area is arranged on the machine table top; the gantry rail frame divides the machine station into a first working area and a second working area; the detection mechanism is arranged on one side of the gantry rail frame facing the first working area and is used for detecting the workpiece to be processed in the first working area; the pick-and-place mechanism is arranged in the first working area of the machine table and comprises two clamping seats arranged at intervals; the carrying platform is arranged on the machine table, can be driven by the second working area to move between the first working area and the second working area, and is used for carrying a workpiece to be worked from the taking and placing mechanism or delivering the workpiece to be worked to the taking and placing mechanism; the wiping mechanism is arranged on one side of the gantry rail frame facing the second working area and is provided with a pressing seat frame and a wiping material component; the pressing seat frame is provided with a first pressing component, and the wiping material component provides a wiping material to wind on the first pressing component; the first pressing component can be driven to pressTheThe material is wiped to clean the residual glue of the workpiece to be processed on the carrying platform.
According to another aspect of the present invention, a wafer residue cleaning apparatus comprises: the device is used for executing the wafer residual glue cleaning method.
According to the wafer residual glue cleaning method and device provided by the embodiment of the invention, the die is cleaned in a one-by-one glue wiping cleaning mode, so that the die with the detected residual glue can be cleaned independently, and the cleaning of the residual glue on the whole wafer can be completed efficiently and seamlessly.
[ description of the drawings ]
FIG. 1 is a schematic perspective view of a mechanism of a first working area side of a machine table of a wafer residue cleaning device according to an embodiment of the invention.
FIG. 2 is a schematic perspective view of a mechanism of a second working area side of a machine table of a wafer residue cleaning device in an embodiment of the invention.
Fig. 3 is a schematic front view of fig. 1 in an embodiment of the present invention.
Fig. 4 is a left side schematic view of fig. 1 in an embodiment of the present invention.
Fig. 5 is an exploded perspective view of the carrier in the embodiment of the invention.
Fig. 6 is a schematic diagram of air holes on a positioning plate of a carrier in an embodiment of the invention.
Fig. 7 is a schematic perspective view of a wiping mechanism in an embodiment of the invention.
FIG. 8 is a schematic perspective view of the back side of a wiping mechanism in an embodiment of the invention.
Fig. 9 is an exploded perspective view of the pressing seat frame and the pressing module according to the embodiment of the present invention.
Fig. 10 is an exploded perspective view of the pressing module and the first pressing assembly according to the embodiment of the present invention.
Fig. 11 is an exploded perspective view of an adjustment assembly in accordance with an embodiment of the present invention.
FIG. 12 is a schematic perspective view of a wiper assembly in accordance with an embodiment of the invention.
FIG. 13 is a schematic front view of a wipe with a wipe assembly according to an embodiment of the invention.
Fig. 14 is a perspective view of a wiping head of a first pressing component wiping a die of a wafer according to an embodiment of the present invention.
FIG. 15 is a schematic diagram of the detection of residual glue by the line laser beam of the laser height finder in the embodiment of the present invention.
[ detailed description ] embodiments
Referring to fig. 1 and 2, an embodiment of the invention can be illustrated by the wafer residue cleaning apparatus in the figures, which includes:
a machine A, which is provided with a machine table surface A1, wherein, the two sides of the machine table surface A1 at one end of the machine A are respectively provided with a convex table seat A2 with corresponding height, so that a concave shifting area A3 is formed between the two table seats A2, and the upper surface A21 of the two table seats A2 and the machine table surface A1 at the other end of the machine A without the table seat A2 form a height drop;
a gantry rail frame B, which is spanned and erected on two pedestals A2 of the machine A by two upright posts B1, a cross beam B2 is arranged between the two upright posts B1, the gantry rail frame B divides the machine A and plans a first working area A4 located on the machine platform A1 at the other end of the machine A without the pedestal A2 and a second working area A5 located on one side of the two pedestals A2, wherein the first working area A4 is used for picking and placing the workpiece W to be worked and detecting the workpiece W to be worked; the second working area a5 is used for performing a glue wiping operation on a workpiece W to be worked; the workpiece W to be processed is a wafer W3 which is adhered on a glue film W2 adhered on an annular steel frame W1, an annular space is kept between the wafer W3 and the annular steel frame W1, the wafer W3 is cut into tube cores W4 one by one, and residual glue is left on the tube cores W4 due to relevant processes;
a detection mechanism C, which is composed of a CCD lens, is arranged at one side of the gantry rail frame B facing the first working area A4, is driven by a first driving piece B3 on the gantry rail frame B and can make X-axis reciprocating displacement on an X-axis slide rail B4 of an upper beam B2 on the gantry rail frame B, and the CCD lens of the detection mechanism C inspects a workpiece W to be worked in the first working area A4 in a Z-axis downward direction;
the pick-and-place mechanism D is arranged on a machine table board A1 of a first working area A4 and comprises two clamping seats D1 which are arranged at intervals in the X axial direction, the two clamping seats D1 are respectively provided with embedded clamping pieces D3 which are oppositely and concavely provided with clamping parts D2, each embedded clamping piece D3 is respectively arranged on a fixed seat D5 supported by a plurality of pivots D4 which are arranged at intervals in the Y axial direction, the two embedded clamping pieces D3 are respectively driven by a driving piece D6 on the fixed seat D5 below the embedded clamping pieces D6 and can be used for clamping an annular steel frame W1 of a workpiece W to be worked in the X axial direction, and the workpiece W to be worked is horizontally spanned between the two embedded clamping pieces D3; the fixed seat D5 can link the embedded clamp D3 to be driven to lift along with the pivot D4, and link the clamped workpiece W to be processed to lift up and down; when the two clamping pieces D3 clamp and buckle the workpiece W to be worked, the height of the workpiece W to be worked is lower than the height of the upper beam B2 of the gantry rail frame B and the lower end of the detection mechanism C;
the rail seat E is arranged on the table board A1 in the Y-axis direction, one end of the rail seat E extends below a workpiece W to be processed of two clamping seats D1 in the picking and placing mechanism D in a first working area A4, the other end of the rail seat E passes through the lower part of the gantry rail frame B and extends into a concave transferring area A3 between two pedestals A2 of a second working area A5, and one end of the rail seat E is provided with a rail seat driving piece E1;
the liquid supply mechanism F is arranged on the table board A1 in the first working area A4, contains cleaning liquid and can be provided with a pipeline for conveying the cleaning liquid;
a carrying platform G, which is arranged on a rail seat E in a concave transferring section A3 between two pedestals A2 of the second working area A5, and can pass through the lower part of the gantry rail frame B in the Y-axis direction under the drive of a rail seat driving piece E1 on the rail seat E to move between the first working area A4 and the second working area A5; referring to fig. 3 and 4, when the gantry rail B moves through the gantry rail B and moves into the first working area a4, the carrier G moves into the position below the workpiece W to be worked of the two clamping bases D1 of the pick-and-place mechanism D, receives the workpiece W to be worked from the pick-and-place mechanism D, receives the workpiece W to be worked, moves to the position below the detection mechanism C for detection, then carries and moves the workpiece W to be worked into the second working area a5 for glue wiping operation, and delivers the workpiece W to be worked, which has been finished with the glue wiping operation, to the pick-and-place mechanism D when the workpiece W is moved back into the first working area a4 after the glue wiping operation is finished;
and the wiping mechanism H is arranged on a sliding seat B6 of an X-axis sliding rail B5 on the side of the cross beam B2 of the gantry rail frame B facing the second working area A5, is driven by a second driving part B7 on the gantry rail frame B to perform X-axis reciprocating displacement on the sliding rail B5, and performs glue wiping operation on the workpiece W to be worked, which is transferred to the second working area A5, in the Z-axis downward direction.
Referring to fig. 5, the carrier G includes:
a fixed seat G1 arranged on the rail seat E and driven by a rail seat driving piece E1 on the rail seat E to make Y-axis displacement, a carrying disc G2 arranged on the fixed seat G1 and driven by a driving piece (not shown) in the fixed seat G1 to make rotation, the carrying disc G2 is disc-shaped and provided with a plurality of supporting frames G22 (four in the embodiment) which protrude outwards and slightly raise above the upper surface G21 of the carrying disc G2 at equal parts of the periphery, the upper surface G21 of the carrying disc G2 is provided with a load measuring element G23 in the center, and the upper surface G21 of the carrying disc G2 is provided with two positioning pieces G24 at ninety-degree positions on the peripheral side of the load measuring element G23 respectively;
a fixing frame G3, which is arranged above the load measuring element G23 on the carrying disc G2 and is measured by the load measuring element G23, a seat surface G31 is attached to the load measuring element G23, and frame legs G32 which extend outwards and are convexly arranged at four corners are respectively arranged on a supporting frame G22 of the carrying disc G2, and a fixing frame G3 can be interlocked with the carrying disc G2 to rotate; four legs G32 of the fixing frame G3 are arranged in a manner of being separated by ninety degrees, and a side G311 of the seat surface G31 abutting between every two legs G32 forms a straight edge, a concave positioning section G33 is formed between the two legs G32 and a side G311 of the seat surface G31 abutting between the two legs G32, when the seat surface G31 of the fixing frame G3 abuts against the load measuring element G23, the two adjacent positioning sections G33 are just inserted and positioned by two positioning pieces G24 arranged at the outer periphery of the load measuring element G23 in a manner of being at an angle of ninety degrees;
a heating element G4 composed of multiple heating rods G41, wherein the heating rods G41 are arranged in parallel at intervals and horizontally above the fixing frame G3;
a positioning plate G5, which is arranged on the fixing frame G3, four corners of the positioning plate G5 are respectively supported by four legs G32 of the fixing frame G3, the heating element G4 is positioned between the positioning plate G5 and the fixing frame G3, and is attached to the lower surface of the positioning plate G5, so as to heat the positioning plate G5; the upper surface of the positioning plate G5 is provided with a plurality of annular concentric grooves G51 with intervals and linear grooves G52 crossed with each other at ninety degrees, the groove at the crossing of the groove G51 and the groove G52 is provided with an air hole G53 (please refer to fig. 6), and negative pressure is introduced into the air hole G53 to adsorb the object carried on the positioning plate G5.
Referring to fig. 2, 7 and 8, the wiping mechanism H includes:
a pressing seat frame H1, which is provided with a rectangular fixed seat H11 which is vertically arranged in the Z-axis direction, is fixedly arranged on a sliding seat B6 of an X-axis sliding rail B5 at one side of a cross beam B2 of the gantry rail frame B in the second working area A5, and can be driven by a second driving piece B7 to slide on the sliding rail B5 in the X-axis direction; a line laser height indicator H2 is fixedly arranged below the back side of the fixed seat H11, is interlocked with the fixed seat H11 and can project a linear laser beam H21 downwards; the front side of the fixing seat H11 is provided with a pressing module H3 which is composed of a first pressing component H31 and a second pressing component H32, wherein the first pressing component H31 is provided with a heat source; the pressing module H3 is driven by a driving member H12 above the fixing seat H11 of the seat frame H1 to move up and down;
a wiping material component H4 is provided with a fixing frame H41 which is slightly U-shaped, a hollow first section H411 which is open at the lower part is arranged below the fixing frame H41, a hollow second section H412 which is hollow is arranged above the fixing frame H41 and the hollow first section H411, a rib-shaped fixing part H413 is arranged between the first section H411 and the second section H412, and the wiping material component H4 is fixedly connected with the pressing seat frame H1 by the fixing part H413 of the fixing frame H41 and is linked with the pressing seat frame H1.
Referring to fig. 7 and 9, the pressing seat frame H1 is provided with a first Z-axis rail seat H13 at the front side of the fixed seat H11, the rail seat H13 is provided with a Z-axis sliding rail (not shown), the sliding rail is provided with a sliding seat H131, a linkage seat H14 is provided on the sliding seat H131 and is driven by the driving member H12 to slide in the Z-axis direction, and the linkage seat H14 is provided for fixing the fixing portion H413 of the fixing frame H41 of the wiping material assembly H4, so that the wiping material assembly H4 is driven by the driving member H12 to slide in the Z-axis direction and is linked with the pressing seat frame H1; a second rail seat H15 in the X axial direction is arranged on the sliding seat H131 below the linkage seat H14, the second rail seat H15 can move up and down in the Z axial direction on the first rail seat H13, a sliding rail H151 in the X axial direction is arranged on the second rail seat H15, and a sliding seat H152 capable of moving in the X axial direction on the sliding rail H151 is arranged on the sliding seat H15; x-axis rail rods H153 are arranged below the sliding rail H151 in parallel at intervals, a driving piece H154 capable of sliding on the rail rods H153 in the X-axis direction is arranged on the rail rods H152, elastic elements H155 consisting of springs with Z-axis elastic acting force are respectively arranged on the upper side and the lower side of the second rail seat H15 at intervals in the X-axis direction, and the elastic elements H155 enable the whole second rail seat H15 to have elastic buffering when moving upwards and downwards in the Z-axis direction; the pressing module H3 is supported on the driving member H154 by a seat frame H33 at the bottom and can move in the X-axis direction under the driving of the driving member H154, and the back side of the seat frame H33 is abutted and fixed on the sliding seat H152 at the same time to obtain the stable sliding when being driven, so that the pressing module H3 has elastic buffering by the elastic elements H155 at the upper and lower sides of the second rail seat H15 when moving upwards and downwards in the Z-axis direction.
Referring to fig. 10, the pressing module H3 is provided with a seat frame H33 for the first pressing assembly H31 and the second pressing assembly H32 to be disposed in parallel in the Z-axis direction, respectively; wherein, the first pressing component H31 includes:
a driving member H311, which is fixed on the seat frame H33 by a fixing seat H3111 and is linked by the seat frame H33, the driving member H311 drives a connecting seat H3112 below the driving member to move up and down along the Z-axis, and one side of the connecting seat H3112 is fixed with a side seat H3113 linked with the connecting seat H3112;
an adjusting component H312, the upper end of which is fixedly arranged with the upper surface of a first adjusting seat H3121 and the bottom of the connecting seat H3112 of the driving part H311, and is fixed with the front side of the lower end of the side seat H3113 by the side surface of the first adjusting seat H3121;
a coupling seat H313, the upper end of which is fixedly connected with a second adjusting seat H3122 at the lower end of the adjusting component H312, a heating hole H3131 is arranged in the coupling seat H313, a temperature switch H3135 is arranged at one side of the coupling seat H313, and the heating can be stopped when the detected temperature is higher than a preset value; a temperature measuring hole H3132 communicated with the heating hole H3131 is respectively arranged on two oblique angle surfaces on the front side of the coupling seat H313; the lower end of the coupling seat H313 is convexly provided with a mounting and dismounting part H3133, and a mounting and dismounting hole H3134 is arranged on the mounting and dismounting part H3133;
a heating member H314, which is an elongated rod-shaped body and is inserted into the heating hole H3131 of the coupling seat H313, and is monitored by a temperature switch H3135;
a pressing seat H315, which is arranged below the adjusting component H312 and can move up and down along the Z axis under the linkage of the connecting seat H3112, and is provided with a U-shaped assembling and disassembling head H3151 and a moving and wiping head H3152 positioned at the lower end of the assembling and disassembling part H3151, the assembling and disassembling head H3151 can be embedded and sleeved on the assembling and disassembling part H3133 positioned at the lower end of the connecting seat H313, and a bolt-shaped connecting piece H3154 linked with a push handle H3153 is inserted into an assembling and disassembling hole H3134 of the assembling and disassembling part H3133 for connection; the wiping head H3152 is a square body, and the lower end of the wiping head is provided with a square plane wiping part H3155; the bottom end of the heating element H314 is contacted with the wiping head H3152 and conducts the heat source to the wiping part H3155 of the wiping head H3152; a magnetic part H3156 is arranged on one side of the push handle H3153, which can be absorbed with the coupling seat H313 when the connecting part H3154 is inserted into the assembling and disassembling hole H3134 of the assembling and disassembling part H3133, so that the push handle H3153 is not easy to slip;
the heating element H314 heats the coupling seat H313 to transfer the heat to the wiping part H3155 of the wiping head H3152 pressing against the seat H315, and the assembling and disassembling head H3151 and the wiping head H3152 are made of copper materials;
the adjusting component H312 is used for finely adjusting and linking the horizontal heights of the moving wiping part H3155 of the moving wiping head H3152 below the pressing and abutting seat H315 on the two sides of the X axial direction and the Y axial direction so as to conform to and correspond to the surface wiped below;
the second pressing component H32 has the same structure as the first pressing component H31, and only the heating element H314 and the temperature switch H3135 are not provided, which is not repeated herein.
Referring to fig. 11, a third adjusting seat H3123 is disposed between the first adjusting seat H3121 and the second adjusting seat H3122 of the adjusting assembly H312; wherein, the first adjusting seat H3121 positioned at the upper part and the third adjusting seat H3123 positioned at the lower part form a group of X-axis horizontal adjusting components, and two sides of the X-axis are respectively fixed by the sheet-shaped fixing pieces H3124; the third adjusting seat H3123 at the upper part and the second adjusting seat H3122 at the lower part form a group of Y-axis horizontal adjusting components, and two sides of the Y-axis between the Y-axis horizontal adjusting components are respectively fixed by a sheet fixing piece H3125;
taking the example that the first adjusting seat H3121 located above and the third adjusting seat H3123 located below form a set of horizontal adjusting assemblies in the X-axis direction, a set of screw joints H316 are screwed between the first adjusting seat H3121 located above and the third adjusting seat H3123 located below, and the set of screw joints H316 includes: a fine adjustment screw connecting piece H3161 which is arranged at one side of the X axis of the first adjusting seat H3121 positioned at the upper part and is used for being screwed between the first adjusting seat H3121 positioned at the upper part and the third adjusting seat H3123 positioned at the lower part from top to bottom, four fixed screw connecting pieces H3182 which are arranged outside the fixing pieces H3124 at the two sides and are used for respectively fixing the upper end of the fixing piece H3124 at the two sides and the first adjusting seat H3121 positioned at the upper part, and four adjustable screw connecting pieces H3163 which are arranged outside the fixing piece H3124 at the one side and are used for fixing the lower end of the fixing piece H3124 and the third adjusting seat H3123 positioned at the lower;
wherein, the hole diameter of the lower end perforation H3164 of the fixing piece H3124 that the adjustable screw joint member H3163 passes through is slightly larger than the external diameter of the screw thread part of the adjustable screw joint member H3163, make it leave the space of the displacement between them, but the two adjustable screw joint members H3163 located on one side adopt and locate at the third adjusting seat H3123 of the lower side and screw fixedly in a normal state, another two adjustable screw joint members H3163 located on the same side with fine adjustment screw joint member H3161 adopt and locate at the third adjusting seat H3123 of the lower side and can be loosened or screwed fixedly at random as required;
a second pin member H3171 inserted through the lower end of the fixing member H3124 and a third adjusting seat H3123 positioned below is arranged outside the fixing member H3124 on the same side as the fine adjustment screw member H3161; two elastic elements H3172 formed by springs with intervals in the Y-axis direction are arranged between a first adjusting seat H3121 positioned above and a third adjusting seat H3123 positioned below on the same side as the fine adjustment screw joint H3161;
the two pin members H3171 are inserted into a normal standard positioning, once the inclined state needs to be adjusted, because the two fixing members H3124 are arranged at intervals on two sides in the X axial direction, the two pin members H3171 can be firstly pulled out, the two adjustable screw members H3163 on the same side as the fine adjustment screw member H3161 are released, because a movable margin is left between the aperture of the through hole H3164 and the outer diameter of the thread part of the adjustable screw member H3163, the two elastic members H3172 on the same side as the fine adjustment screw member H3161 are fixed on the first adjusting seat H3121 on the upper side, a driving force for expanding and pushing against the third adjusting seat H3123 on the lower side and moving downwards on the same side as the fine adjustment screw member H3161 is carried out, the driving force for expanding and pushing against the elastic members H3172 is used for expanding and pushing against the third adjusting seat H3123 on the lower side and the side of the fine adjustment screw member H3161 on the same side, so as the third adjusting seat H3125 on the lower side is horizontally pushed against the side of the fine adjustment seat H3125 on the same side, after the adjustment and the positioning, the two adjustable screw connectors H3163 on the same side with the fine adjustment screw connector H3161 are screwed and locked;
the adjustment of the horizontal heights at two sides in the Y axis direction between the Y axis direction horizontal adjustment assemblies composed of the third adjustment seat H3123 located above and the second adjustment seat H3122 located below is the same as the adjustment method of the horizontal heights at two sides in the X axis direction, but the installation directions are symmetrically arranged in the Y axis direction, which can be understood from fig. 11 and will not be described again.
Referring to fig. 8 and 12, one side of the first hollow-out region H411, which is open and recessed, is disposed below the u-shaped fixing frame H41 of the wiper assembly H4, and the other side of the first hollow-out region H411 is disposed with a material releasing region H414, a liquid dipping region H416 is disposed below the same side as the material releasing region H414, a pulling region H417 is disposed below the same side as the pulling region H412, and a wiping region H418 is formed between the liquid dipping region H416 and the pulling region H417; a temperature sensor H419 is fixedly arranged on a sliding seat H4193 by a fixing seat H4192 at the upper end of an extension rod H4191, the sliding seat H4193 is arranged on an X-axis sliding rail H4194 of the hollow hollowed-out second section H412 bottom edge above the fixing frame H41, the temperature sensor H419 can be embedded in a temperature measuring hole H3132 communicated with the heating hole H3131 at two oblique angle surfaces at the front side of the coupling seat H313 (please refer to fig. 7 and 10), detect the temperature of the heating element H314 and synchronously make X-axis displacement along with the first pressing component H31; wherein,
the material releasing area H414 is provided with a rolling wheel H4142 which is arranged in the Y-axis direction and is driven by a driving piece H4141 at the back side of a fixed frame H41 for winding the wiping material, a first steering wheel H4143 and a second steering wheel H4144 which are arranged in the Y-axis direction at intervals in the X-axis direction are arranged below the rolling wheel H4142, a counterweight wheel H4145 which is arranged in the Y-axis direction is arranged below the space between the first steering wheel H4143 and the second steering wheel H4144, the counterweight wheel H4145 is positioned at a Z-axis long slotted hole H4146 on a fixed frame H41 in the material releasing area H414, the wheel shaft of the counterweight wheel H4145 extends through the long slotted hole H4146 and is linked with a counterweight H4147 at the back side of the fixed frame H41, the counterweight H4147 is arranged on a Z-axis sliding rail H4148 which is parallel to the long slotted hole H4146, and the counterweight wheel H4145 can do up-and-down displacement in the Z-axis direction, and the stroke of the up and down displacement is monitored and controlled by a group of sensing pieces at intervals and a;
the furling area H415 is provided with an empty reel H4152 which has an axle arranged in the Y-axis direction and is driven by a driving piece H4151 at the back side of a fixed frame H41 for winding the wiping material, a third steering wheel H4153 and a fourth steering wheel H4154 which are arranged in the Y-axis direction at intervals in the X-axis direction are arranged below the reel H4152, a counterweight wheel H4155 which is arranged in the Y-axis direction is arranged below the third steering wheel H4153 and the fourth steering wheel H4154, the counterweight wheel H4155 is positioned at a Z-axis long slotted hole H4156 on the fixed frame H41 in the furling area H415, the axle of the counterweight wheel H4155 extends through the long slotted hole H4156 and is linked with a counterweight H4157 at the back side of the fixed frame H41, the counterweight H4157 is arranged on a Z-axis sliding rail H4158 which is arranged at the side of the long slotted hole H4156 and is parallel with the long slotted hole H4156, and the wheel H4155 can make up-and down displacement in the Z-axis direction, and the stroke of the counterweight wheel H4155 is monitored and the lower;
the liquid dipping area H416 is provided with a cleaning liquid container H4161 which is arranged on a rack H42 fixed at the lower end of a fixed rack H41 and is connected with a liquid supply mechanism F in the figure 1 through a pipeline (not shown) and can obtain the supply of the cleaning liquid from the liquid supply mechanism F; the cleaning liquid container H4161 is provided with a roller H4162, the wheel shaft of the roller H4162 is arranged in the cleaning liquid container H4161 in the Y-axis direction, one part of the circumference of the roller H4162 is dipped in the cleaning liquid container H4161, one part of the circumference is exposed outside the cleaning liquid container H4161, and the circumference surface is annularly arranged in the Y-axis embedded groove shape at equal intervals; the liquid soaking area H416 is provided with a near rotating wheel H4163 with a wheel shaft arranged in the Y-axis direction, the near rotating wheel is close to the cleaning liquid container H4161, a first movable wheel H4165 and a second movable wheel H4166 which are arranged in a group by two and are arranged on a swinging frame H4164 at intervals are arranged above the space between the near rotating wheel H4163 and a roller H4162 of the cleaning liquid container H4161, the first movable wheel H4165 and the second movable wheel H4166 are arranged at a Z-axis long slotted hole H4167 on a fixed frame H41 in the liquid soaking area H416, a shaft lever H4168 arranged at the rear side of the swinging frame H4164 extends through the long slotted hole H4167 and is driven by a rotary driving piece H4169 at the back side of the fixed frame H41, so that the swinging frame H4164 can swing to enable the first movable wheel H4165 to be downwards abutted against the upper peripheral edge of the roller H4162 on the cleaning liquid container H4161;
the drawing area H417 is provided with a rotatable drawing wheel H4172 which is driven by a driving piece H4171 at the back side of the fixing frame H41 and the wheel shaft of which is arranged in the Y-axis direction, and the circumferential surface of the drawing wheel H4172 is arranged in a Y-axis embedded groove shape at equal intervals in an annular arrangement; the adjacent side of the pulling wheel H4172 is provided with an embedded wheel H4173 with a wheel axle arranged in the Y-axis direction, the circumferential surface of the embedded wheel H4173 is also arranged in a Y-axis embedded groove shape in an equally spaced annular array, the embedded wheel H4173 is arranged on a swing arm H4175 pivoted on a fixing frame H41 by taking a pivot H4174 as a fulcrum, the adjacent side of the embedded wheel H4173 on the swing arm H4174 is further provided with a pivot pin H4176 inserted and pivoted on the fixing frame H41, the other side of the swing arm H4174 opposite to the embedded wheel H4173 of the pivot pin H4176 is pulled by an elastic element H4177 (figure 13) formed by a spring on the fixing frame H41, and after the pivot pin H4176 inserted and pivoted on the fixing frame H41 is pulled, the swing arm H4175 is pulled by the elastic element H4177 to be embedded and abutted against the circumference of the pulling wheel;
the wiping area H418 is provided with a first guide arm H4181 which is fixedly arranged by a fixed frame H41 of the liquid soaking area H416 and extends downwards in an inclined way, and a second guide arm H4182 which is fixedly arranged by a fixed frame H41 of a pulling area H417 and extends downwards in an inclined way, the lower ends of the first guide arm H4181 and the second guide arm H4182 are close to each other to keep an operation interval H4183, and the tail ends of the first guide arm H4181 and the second guide arm H4182 are respectively provided with a first support wheel H4184 and a second support wheel H4185 of which the wheel shafts are arranged in the Y-axis direction; the bottom edges of the first supporting wheel H4184 and the second supporting wheel H4185 maintain the same horizontal height in the X axial direction; wherein, a guide wheel H4186 with a wheel axle arranged in the Y-axis direction is arranged above the second guide arm H4182 and adjacent to the drawing wheel H4172 of the drawing area H417.
Referring to fig. 12 and 13, in the wiping and cleaning of the residual glue, the rolled strip-shaped wiping material L sequentially winds from the winding wheel H4142 of the material releasing region H414 around the first turning wheel H4143, the counterweight wheel H4145 and the second turning wheel H4144; entering the liquid dipping area H416, winding the liquid dipping area through a near rotating wheel H4163, a first movable wheel H4165, a second movable wheel H4166 and a roller H4162, then winding the liquid dipping area through a first supporting wheel H4184, a second supporting wheel H4185 and a guiding wheel H4186 of the wiping area H418, entering the pulling area H417, winding the liquid dipping area through a pulling wheel H4172, entering the winding area H415, winding the liquid dipping area through a third steering wheel H4153, a counterweight wheel H4155 and a fourth steering wheel H4154, and winding the liquid dipping area H415 by an empty winding wheel H4152; wherein, when the wiping material L winds around the second movable wheel H4166, the second movable wheel H4166 can be driven to press the wiping material L which winds around the second movable wheel H4166 to contact the roller H4162 of the cleaning liquid container H4161 which is contacted with the cleaning liquid to contact the cleaning liquid; when the wiper L winds around the drawing wheel H4172, the embedded wheel H4173 is clamped against the wiper L in the winding area H418, so that the drawing wheel H4172 can pull the wiper L in the winding area H418 to displace when being driven by the driving piece H4171, and after the wiper L in the winding area H418 is pulled to the weight wheel H4145 in the material releasing area H414 to be forced to move upwards to the weight H4147 to touch the sensing piece H4149 at the upper position, the driving piece H4141 is promoted to drive the winding wheel H4142 to release the wiper L until the weight H4147 touches the sensing piece H4149 at the lower position; when the wiper L is pulled by the pulling wheel H4172 to the sensor H4159 which makes the wiper L in the roll-up region H415 loose until the weight H4157 interlocked with the weight wheel H4155 touches the lower position, the driving member H4151 will drive the empty roll wheel H4152 to roll up the wiper L until the weight H4157 touches the upper position sensor H4159, thereby adjusting the degree of tightness of the pulling of the wiper L in the whole flow path;
the pressing module H3 can be selectively operated by the first pressing module H31 or the second pressing module H32, and respectively presses the wiping portion H3155 of the wiping head H3152 at the lower end of the pressing seat H315 against the wiping material L wound between the first supporting wheel H4184 and the second supporting wheel H4185 in the wiping area H418.
The method for cleaning the residual wafer glue comprises the following steps:
a feeding step, loading the workpiece W to be processed into the pick-and-place mechanism D and being clamped by two embedding clamp pieces D3 on two clamp seats D1 in a horizontal state; the Load operation can be taken out and executed by a robot (not shown) from a Load/Unload device (not shown);
a material taking step, namely enabling a carrying platform G to pass through a gantry rail frame B from a second working area A5 through a Y-axis linear displacement flow path to be displaced in a first working area A4, move into the lower part of a workpiece W to be worked between two clamping seats D1 in a taking and placing mechanism D, and receive the workpiece W to be worked from two clamping blocks D3 on the taking and placing mechanism D; when the workpiece W is received by the carrier G, it is adsorbed by the negative pressure in the air holes G53 on the carrier G2, positioned on the carrier G2, and heated by the heating element G4;
a step of residual glue inspection, in which the carrying platform G moves back along the Y-axis linear displacement flow path, and when the carrying platform is moved out of the pick-and-place mechanism D in the first working area A4, the detection mechanism C on the gantry rail frame B of the workpiece W to be worked can inspect the residual glue condition of each tube core W4 on the workpiece W one by one;
a zone changing step, namely enabling the workpiece W to be processed which finishes the residual glue condition to pass through the gantry rail frame B along the original Y-axis linear displacement flow path by the carrying platform G to be displaced back to the second working zone A5;
a die wiping step of bringing the pressing seat frame H1 of the wiping mechanism H into linkage with the wiper member assembly H4, pressing the wiper member L against the wiper member L by the wiper portion H3155 of the wiper head H3152 of the first pressing member H31 provided with a heat source (see FIG. 14), and wiping the individual die W4 detected to have adhesive residue by the wiper member L pulling the wheel H4172 and wiping between the bottom surface of the wiper portion H3155 of the wiper head H3152 and the upper surface of the die W4; the area of the wiping part H3155 with the square-shaped lower end square plane of the wiping head H3152 is approximately equal to the area of the tube core W4, so the wiping range can cover the whole tube core; after the wiping of the die W4 detected with the residual adhesive on the workpiece W is finished, the wiping material L is pressed and attached by the wiping part H3155 of the wiping head H3152 of the second pressing component H32 without a heat source to wipe the die W4 detected with the residual adhesive; when the wiping part H3155 of the wiping head H3152 presses the sticking material L against the die W4 on the workpiece W, the downward pressure of the wiping head H3152 is measured by the load measuring element G23 in the stage G, and once the set load value is reached, the wiping head H3152 stops pressing to avoid damaging the die W4;
a cleaning and checking step, in which the workpiece W to be processed is displaced by the carrier G along the Y-axis linear displacement flow path toward the pick-and-place mechanism D, and a linear laser beam H21 projected by a linear laser height indicator H2 under the back side of a fixed seat H11 of the seat H1 is pressed against a second working area a5 under the gantry rail B to check the die W4 which is originally detected to have residual glue (see fig. 15); when it is detected that there is still a die which is not cleaned to the desired degree, the work W to be worked is wiped by the stage G again by the wiping step of the die W4 along the Y-axis linear displacement flow path; when all the dies W4 originally detected to have residual glue are inspected to the expected degree, the cleaning is determined to be completed;
and a workpiece changing step, wherein the cleaned workpiece W to be worked is moved by the carrying platform G along a linear displacement flow path in the Y-axis direction to the direction of the picking and placing mechanism D in the first working area A4 through the lower part of the gantry rail frame B, and is moved into a position between two clamping seats D1 in the picking and placing mechanism D, so that the two clamping embedding pieces D3 on the picking and placing mechanism D bear the workpiece W to be worked for a robot to pick, unload, store and place in the material supplying and receiving device, and the next cycle of loading the workpiece W to be worked is executed.
According to the wafer residual glue cleaning method and device, the die W4 are cleaned one by one, so that the die W4 with the detected residual glue can be cleaned independently, and the cleaning of the residual glue on the whole wafer can be performed efficiently besides a better cleaning effect; under the condition that the workpiece W to be processed is heated by the heating element G4 on the carrying table G so that the residual glue is heated to perform a first pyrolysis procedure on the whole workpiece W to be processed from the bottom, the wiping mechanism H performs a second pyrolysis procedure aiming at the single tube core W4 from the top to the bottom by the first pressing component H31 with a heat source, the residual glue on the tube core W4 subjected to glue wiping is melted into a liquid diluted state and then is wiped by the second pressing component H32 without the heat source, so that the residual glue cleaning can be performed more easily, and the glue wiping effect is checked by the linear laser beam H21 projected by the matching line laser height measuring device H2, so that the cleaning of each tube core can be completed more completely; the wiper component H4 of the wiping mechanism H releases the wiper L to the hollow winding wheel H4152 in the winding area H415 by the winding wheel H4142 in the release area H414 to wind the wiper, so that the wiper L can be continuously and automatically cleaned by the roller H4162 on the cleaning liquid container H4161 to be attached with the cleaning liquid, and the balance weight wheels H4145 and H4155 are used for adjusting the degree of tightness of the pulling of the wiper L in the whole flow path, so that the wiping and cleaning operation can be circularly and automatically carried out, and the cleaning performance is greatly improved; meanwhile, the pressing module H3 has elastic buffer when the elastic elements H155 on the upper and lower sides of the second rail seat H15 move up and down in the Z-axis direction, so that when the first pressing component H31 or the second pressing component H32 on the pressing module H3 presses the wiping material against the die surface, the pressing force itself has buffer in addition to the monitoring of the lower pressure path by the load measuring element G23 on the loading platform G, and the damage of the die W4 on the workpiece W to be processed can be reduced.
However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention should not be limited thereby, and all the simple equivalent changes and modifications made according to the claims and the description of the present invention are still within the scope of the present invention.
[ notation ] to show
A machine platform A1 machine platform surface
A2 pedestal A21 upper surface
A3 transfer interval A4 first working area
Gantry rail frame of A5 second working area B
B1 upright post B2 crossbeam
B3 first driving element B4 slide rail
B5 slide rail B6 slide carriage
B7 second driving piece C detection mechanism
D1 clamp seat of D taking and placing mechanism
D3 embedded clamping piece of D2 clamping part
D4 pivot D5 fixing seat
D6 driving piece E rail seat
E1 rail seat driving piece F liquid supply mechanism
G carrier G1 fixing base
G2 carrying disc G21 upper surface
G23 load measuring element for G22 supporting rack
G3 fixing frame of G24 positioning piece
G31 side of the seat surface G311
G32 foot G33 positioning range
G4 heating element G41 heating rod
G51 groove of G5 positioning disc
G52 groove G53 air hole
H wiping mechanism H1 presses against seat frame
H11 fixing seat H12 driving piece
H13 first rail seat H131 sliding seat
H14 linkage seat H15 second rail seat
H151 sliding rail H152 sliding seat
H153 rail H154 driving piece
H155 elastic element H2 laser height indicator
H21 line laser beam H3 pressing module
H31 first pressing component H311 driving piece
H3111 fixed seat H3112 connecting seat
H3113 side seat H312 adjusting component
H3121 first adjusting seat H3122 second adjusting seat
H3123 third adjusting seat H3124 fixed part
H3125 fixed part H313 connecting seat
H3131 heating hole H3132 temperature measuring hole
H3133 mounting/dismounting hole of mounting/dismounting part H3134
H3135 temperature switch H314 heating element
H315 press against seat H3151 assembling and disassembling head
H3152 moving head H3153 pushing handle
H3154 coupling member H3155 moving and wiping part
H3156 magnetic attraction piece H316 screw joint piece
H3161 trimming screw H3162 fixing screw
H3163 adjustable screw H3164 perforation
H3171 pin member H3172 elastic element
H32 second pressing component H33 seat frame
H41 fixed frame of H4 wiper component
H411 first interval H412 second interval
H413 fixed part H414 material releasing area
H4141 driving element H4142 winding wheel
H4143 first steerable wheel H4144 second steerable wheel
H4145 counterweight wheel H4146 long slotted hole
H4147 counterweight H4148 slide rail
H4149 sensor H415 furling zone
H4151 driving piece H4152 winding wheel
H4153 first steerable wheel H4154 second steerable wheel
H4155 counterweight wheel H4156 long slotted hole
H4157 counter weight H4158 slide rail
H4159 sensor H416 liquid-contacting area
H4161 cleaning liquid container H4162 gyro wheel
H4163 near-rotating wheel H4164 swing frame
H4165 first movable wheel H4166 second movable wheel
H4167 long slot hole H4168 axostylus axostyle
H4169 Rotary drive H417 Pull zone
H4171 driving element H4172 pulling wheel
H4173 embedded wheel H4174 pivot
H4175 swing arm H4176 pivot pin
H4177 elastomeric element H418 wiping area
H4181 first guide arm H4182 second guide arm
H4183 operating spacing H4184 first support wheel
H4185 second support wheel H4186 guide wheel
H419 temperature lever sensor H4191 extension rod
H4192 fixed seat H4193 slide
H4194 slide rail W workpiece to be worked
W2 glue film with W1 steel frame
W4 die of W3 wafer
Claims (13)
1. A wafer adhesive residue cleaning method comprises the following steps:
an inspection step, the workpiece to be processed is inspected by a detection mechanism on a carrying platform;
a wiping step of wiping the pair of wiping materials by a wiping mechanism;
wherein the workpiece to be processed is a wafer, the inspecting step and the wiping step are performed on the wafer on the same stage on the same machine, the inspecting mechanism inspects the residual glue condition of each die on the wafer one by one, and the wiping mechanism wipes the material one by one to perform individual die inspected with residual glue.
2. The wafer residue cleaning method of claim 1, wherein the workpiece to be processed is received by the carrier and is positioned on a carrier plate of the carrier by being absorbed by negative pressure.
3. The wafer residue cleaning method of claim 1, wherein the workpiece to be worked is heated by the heating element on the stage to warm the residue and perform a pyrolysis process on the entire workpiece to be worked.
4. The wafer residue cleaning method of claim 1, wherein the workpiece to be worked is subjected to a pyrolysis process for individual dies from top to bottom by the wiping mechanism by a first pressing member having a heat source.
5. The method as claimed in claim 1, wherein the force of the wiping head is measured by a load measuring device when the workpiece is pressed against the die on the workpiece by a first pressing component of the wiping mechanism.
6. The method of claim 1, wherein after the wiping step of the work piece, a cleaning inspection step of inspecting the die for cleaning to a desired degree by a linear laser beam projected by a linear laser height gauge is performed.
7. The method as claimed in claim 1, wherein when the workpiece to be processed is pressed against the upper die of the workpiece to be processed by a first pressing component of the wiping mechanism with a wiping head, the pressing force is buffered by an elastic element.
8. A wafer residue cleaning apparatus using the wafer residue cleaning method according to any one of claims 1 to 7, comprising:
the machine table is provided with a machine table top, and a transfer area is arranged on the machine table top;
the gantry rail frame divides the machine station into a first working area and a second working area;
the detection mechanism is arranged on one side of the gantry rail frame facing the first working area and is used for detecting the workpiece to be processed in the first working area;
the pick-and-place mechanism is arranged in the first working area of the machine table and comprises two clamping seats arranged at intervals;
the carrying platform is arranged on the machine table, can be driven by the second working area to move between the first working area and the second working area, and is used for carrying a workpiece to be worked from the taking and placing mechanism or delivering the workpiece to be worked to the taking and placing mechanism;
the wiping mechanism is arranged on one side of the gantry rail frame facing the second working area and is provided with a pressing seat frame and a wiping material component; the pressing seat frame is provided with a first pressing component, and the wiping material component provides a wiping material to wind on the first pressing component;
the first pressing and pushing assembly can be driven to press and push the material to clean the residual glue of the workpiece to be processed on the carrying platform.
9. The wafer residue cleaning apparatus of claim 8, wherein the machine has a liquid supply mechanism containing cleaning liquid, and a pipe for delivering the cleaning liquid to a cleaning liquid container of the cleaning mechanism, the cleaning liquid container being passed around by the wiper of the wiper assembly.
10. The wafer residue cleaning apparatus of claim 8, wherein the wiping mechanism comprises a second pressing component, and wherein the first pressing component comprises a heat source, which can switch the pressing and wiping material to clean the residue on the workpiece on the carrier.
11. The wafer residue cleaning apparatus of claim 8, wherein the first pressing member has an adjusting member for finely adjusting and interlocking a horizontal height of a wiper head of the first pressing member at both sides of the X-axis and the Y-axis.
12. The wafer residue cleaning apparatus of claim 8, wherein the wiper assembly has a weight for adjusting the tightness of the wiper.
13. A wafer cull cleaning device, comprising: apparatus for performing the wafer residue cleaning method as claimed in any one of claims 1 to 7.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105114522A TWI680019B (en) | 2016-05-11 | 2016-05-11 | Wafer adhesive cleaning method and device |
| TW105114522 | 2016-05-11 |
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| Publication Number | Publication Date |
|---|---|
| CN107369609A CN107369609A (en) | 2017-11-21 |
| CN107369609B true CN107369609B (en) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710059923.8A Active CN107369609B (en) | 2016-05-11 | 2017-01-24 | Wafer residual glue cleaning method and device |
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| CN (1) | CN107369609B (en) |
| TW (1) | TWI680019B (en) |
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| CN110538837B (en) * | 2018-07-10 | 2021-11-12 | 蓝思科技（长沙）有限公司 | Glue removing and recycling process for assembly |
| TWI700134B (en) * | 2018-12-07 | 2020-08-01 | 萬潤科技股份有限公司 | Cutting knife cleaning method, device and cutting equipment |
| CN111359934A (en) * | 2020-04-10 | 2020-07-03 | 厦门柯尔自动化设备有限公司 | Wafer cleaning device and wafer cleaning method |
| CN111790695A (en) * | 2020-08-12 | 2020-10-20 | 扬州扬杰电子科技股份有限公司 | Plastic package residual glue removing device suitable for frame type semiconductor |
| TWI738508B (en) * | 2020-09-15 | 2021-09-01 | 致茂電子股份有限公司 | Optical inspection system for inspecting residue remained on wafer chuck and optical inspection method for the same |
| CN114538107B (en) * | 2022-01-17 | 2024-07-30 | 东莞市安动半导体科技有限公司 | Automatic chip tray moving device and tray moving method thereof |
| CN114653638B (en) * | 2022-04-14 | 2023-09-15 | 乐山高测新能源科技有限公司 | Silicon wafer degumming treatment method, treatment system and degumming device |
| CN114559571B (en) * | 2022-04-14 | 2022-09-23 | 乐山高测新能源科技有限公司 | Silicon wafer production system |
| CN114602917B (en) * | 2022-04-14 | 2023-09-15 | 乐山高测新能源科技有限公司 | Degumming device |
| CN114570684A (en) * | 2022-04-14 | 2022-06-03 | 乐山高测新能源科技有限公司 | Silicon wafer degumming treatment method, treatment system and degumming device |
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| TWM387365U (en) * | 2009-11-06 | 2010-08-21 | Gallant Prec Machining Co Ltd | Die bonding apparatus |
| TWM435712U (en) * | 2012-03-09 | 2012-08-11 | Marketech Int Corp | A remaining glue wafer cleaning apparatus |
| TWI503183B (en) * | 2013-09-16 | 2015-10-11 | All Ring Tech Co Ltd | Cleaning equipment and cleaning methods |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US5493237A (en) * | 1994-05-27 | 1996-02-20 | The Whitaker Corporation | Integrated circuit chip testing apparatus |
| US6677770B2 (en) * | 2001-07-17 | 2004-01-13 | Infineon Technologies | Programmable test socket |
| KR100845979B1 (en) * | 2006-11-28 | 2008-07-11 | 미래산업 주식회사 | Test tray transfer of handler |
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| TWM387365U (en) * | 2009-11-06 | 2010-08-21 | Gallant Prec Machining Co Ltd | Die bonding apparatus |
| TWM435712U (en) * | 2012-03-09 | 2012-08-11 | Marketech Int Corp | A remaining glue wafer cleaning apparatus |
| TWI503183B (en) * | 2013-09-16 | 2015-10-11 | All Ring Tech Co Ltd | Cleaning equipment and cleaning methods |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201739524A (en) | 2017-11-16 |
| TWI680019B (en) | 2019-12-21 |
| CN107369609A (en) | 2017-11-21 |
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